After-sale driver IC structure with MIPI line sequence PIN

Abstract

An after-sales driver IC structure with mipi line sequence pins comprises a driver IC which is provided with a plurality of GND pins, a plurality of D0N pins, a plurality of D0P pins and a plurality of enable pins; the GND pin, the D0N pin, the D0P pin and the enable pin are arranged on the same horizontal line of the front face of the driving IC in a mutually staggered mode. According to the after-sales drive IC structure with the MIPI line sequence PIN, the GND pin, the D0N pin, the D0P pin and the enable pin are arranged on the drive IC, so that the enable pin can control the opening and cutting off of a mipi data line, and therefore, information which cannot be identified is cut off, the identification of the after-sales drive IC is prevented from being abnormal, the after-sales drive IC can be compatible with more mobile phone mainboards, and the service life of the after-sales drive IC is prolonged. The number of mobile phone types compatible with the after-sale driver IC is increased, so that the market of the after-sale IC is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of driver ICs, in particular to an aftermarket driver IC structure with a MIPI line sequence PIN. Background Art

[0002] In the mobile phone repair aftermarket, the driver IC used in the aftermarket display screen is usually not the original driver IC. Therefore, when the mobile phone motherboard sends data information to the aftermarket screen, the original startup initialization code data information is sent to the aftermarket driver IC through the mipi data line. Some of the data information may cause the aftermarket IC to be unable to recognize and cause problems that it cannot be used. For this reason, an aftermarket driver IC structure with a mipi line sequence pin is designed, which can control the opening and truncation of the mipi data line through this enable pin. By truncating unrecognizable information, abnormal recognition of the aftermarket driver IC is avoided, so that it can be compatible with more different mobile phone motherboards. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide an aftermarket driver IC structure with a MIPI line sequence PIN.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] An aftermarket driver IC structure with a MIPI line sequence PIN comprises: a driver IC, on which a plurality of GND pins, D0N pins, D0P pins and enable pins are arranged; the GND pins, D0N pins, D0P pins and enable pins are arranged alternately on the same horizontal line on the front side of the driver IC.

[0006] In one of the embodiments, a plurality of the GND pins are horizontally arranged at the center of the bottom of the front side of the driver IC, and the GND pins are arranged on the driver IC in pairs of two.

[0007] In one embodiment, the D0N pin is arranged at the bottom center of the front side of the driver IC, and five D0N pins form a group and are arranged on the left side of the GND pin of the leftmost group on the front side of the driver IC.

[0008] In one of the embodiments, the D0P pins are arranged in a group of five at the center of the bottom of the front side of the driver IC, and are arranged at the center position of the two groups of GND pins at the center of the front side of the driver IC.

[0009] In one embodiment, the enable pins are arranged in pairs at the center of the bottom of the front side of the driver IC, and are arranged between the two groups of GND pins at the center of the front side of the driver IC and close to the right side.

[0010] In one of the embodiments, the GND pin and the front sides of the D0N pin, D0P pin and enable pin are the same in shape and size.

[0011] In one embodiment, the front shape of the GND pin is a rectangle, and its length is 0.2mm-0.3mm, and its width is 0.75mm-0.15mm.

[0012] In one embodiment, a plurality of metal pins are disposed on the left and right sides of the top of the front side of the driver IC, and the plurality of metal pins on the two sides are symmetrical with respect to the center of the driver IC.

[0013] In one embodiment, the front face of the driver IC is in the shape of a rectangle, and four corners of the front face of the driver IC are provided with circular holes.

[0014] In one of the embodiments, a plurality of copper sheets for heat dissipation are fixed to the back of the driver IC.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The after-sales driver IC structure with MIPI line sequence PIN of the utility model can control the opening and cutting off of the mipi data line by the enable pin through the GND pin, D0N pin, D0P pin and enable pin arranged on the driver IC, so as to avoid abnormal recognition of the after-sales driver IC by cutting off the unrecognizable information, so that the after-sales driver IC can be compatible with more mobile phone motherboards, and the mobile phone models that the after-sales driver IC can be compatible with are increased, thereby improving the market of the after-sales IC. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a front overall schematic diagram of the aftermarket driver IC structure with MIPI line sequence PIN of the utility model.

[0019] In the figure: 1, driver IC; 11, GND pin; 12, D0N pin; 13, D0P pin; 14, enable pin. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0021] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] Unless otherwise clearly stipulated and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] like Figure 1As shown, an aftermarket driver IC structure with MIPI line sequence PIN includes: a driver IC1, on which a plurality of GND pins 11, D0N pins 12, D0P pins 13 and enable pins 14 are arranged; the GND pins 11, D0N pins 12, D0P pins 13 and enable pins 14 are arranged alternately on the same horizontal line on the front of the driver IC1. It should be noted that a mipi line is arranged in the driver IC1, and the mipi line is connected to the enable pin 14 through a circuit, so the enable pin 14 can control the opening and closing of the mipi data line.

[0025] like Figure 1 As shown, in one embodiment, a plurality of GND pins 11 are arranged horizontally at the center of the bottom of the front face of the driver IC1, and the GND pins 11 are arranged on the driver IC1 in pairs. The D0N pins 12 are arranged at the center of the bottom of the front face of the driver IC1, and are arranged in a group of five D0N pins 12, and are arranged on the left side of the GND pin 11 of the leftmost group on the front face of the driver IC1. The D0P pins 13 are arranged in a group of five at the center of the bottom of the front face of the driver IC1, and are arranged at the center of the two groups of GND pins 11 in the center of the front face of the driver IC1. The enable pins 14 are arranged in a group of two at the center of the bottom of the front face of the driver IC1, and are arranged between the two groups of GND pins 11 near the right side of the center of the front face of the driver IC1. It should be noted that the pin group composed of the GND pin 11, the D0N pin 12, the D0P pin 13 and the enable pin 14 is located at the bottom of the front face of the driver IC1 near the left side, and this design method can facilitate the electrical connection between the driver IC1 and the motherboard of the mobile phone, thereby facilitating testing.

[0026] like Figure 1 As shown in one embodiment, the GND pin 11 and the front faces of the D0N pin 12, the D0P pin 13 and the enable pin 14 have the same shape and size. It should be noted that this design can facilitate electrical connection between each pin and the mainboard.

[0027] like Figure 1 As shown in one embodiment, the front shape of the GND pin 11 is a rectangle, and its length is 0.2mm-0.3mm, and its width is 0.75mm-0.15mm. It should be noted that the size of the GND pin 11 is not fixed, but is designed accordingly according to the size of the driver IC1.

[0028] like Figure 1As shown in one embodiment, a plurality of metal pins are provided on the left and right sides of the top of the front side of the driver IC 1, and the plurality of metal pins on both sides are symmetrical with the center of the driver IC 1. It should be noted that the plurality of metal pins are all made of brass.

[0029] like Figure 1 As shown, in one embodiment, the front of the driver IC1 is in a rectangular shape, and round holes are provided at the four corners of the front of the driver IC1. It should be noted that this design can facilitate the staff to fix the driver IC1 in the mobile phone.

[0030] like Figure 1 As shown in one embodiment, a plurality of copper sheets for heat dissipation are fixed to the back of the driver IC 1. It should be noted that this design can enhance the heat dissipation capability of the driver IC 1.

[0031] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An aftermarket driver IC structure with MIPI line sequence PIN, characterized in that: include: A driver IC (1), wherein the driver IC (1) is provided with a plurality of GND pins (11), a D0N pin (12), a D0P pin (13) and an enable pin (14); The GND pin (11), the D0N pin (12), the D0P pin (13) and the enable pin (14) are arranged alternately on the same horizontal line on the front side of the driver IC (1).

2. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: A plurality of GND pins (11) are horizontally arranged at the center of the bottom of the front side of the driver IC (1), and the GND pins (11) are arranged on the driver IC (1) in pairs of two.

3. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: The D0N pin (12) is arranged at the center of the bottom of the front side of the driver IC (1), and five D0N pins (12) form a group, and are arranged on the left side of the GND pin (11) in the leftmost group on the front side of the driver IC (1).

4. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: The D0P pins (13) are arranged in a group of five at the center of the bottom of the front side of the driver IC (1), and are arranged at the center position of two groups of GND pins (11) at the center of the front side of the driver IC (1).

5. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: The enable pins (14) are arranged in pairs at the center of the bottom of the front side of the driver IC (1), and are arranged between two groups of GND pins (11) at the center of the front side of the driver IC (1) and close to the right side.

6. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: The front sides of the GND pin (11) and the D0N pin (12), D0P pin (13) and enable pin (14) are the same in shape and size.

7. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: The front shape of the GND pin (11) is a rectangle, and its length is 0.2mm-0.3mm, and its width is 0.75mm-0.15mm.

8. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: A plurality of metal pins are arranged on the left and right sides of the top of the front side of the driver IC (1), and the plurality of metal pins on the two sides are symmetrical with the center of the driver IC (1) as the center.

9. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: The front face of the driving IC (1) is in the shape of a rectangle, and four corners of the front face of the driving IC (1) are provided with circular holes.

10. The aftermarket driver IC structure with MIPI line sequence PIN according to claim 1, characterized in that: A plurality of copper sheets for heat dissipation are fixed to the back of the driver IC (1).

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