PCB inductor vertical installation structure

By designing the pin surround pad in the installation structure of the PCB board inductor, the stability problem caused by pin dangling is solved, and a higher welding path and contact area is achieved, which enhances the vertical fixation effect of the inductor on the PCB board.

CN222827434UActive Publication Date: 2025-05-02HEFEI JINGSIWEI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421333771.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-12
Publication Date
2025-05-02
Estimated Expiration
2034-06-12

AI Technical Summary

Technical Problem

In the prior art, when the inductor pin passes through the mounting hole, some pins are suspended, resulting in a decrease in contact area, which is prone to loosening or breaking under vibration or impact of the PCB board, affecting the effect of vertical fixation of the inductor.

Method used

A PCB board inductance vertical installation structure is designed. By opening a mounting hole on the circuit board, the pin sleeve is placed in the mounting hole and is slidably connected to it. The pad is cylindrical in shape and is held at the bottom of the circuit board and is connected in a coordinated manner with the pins. As the pin passes through the mounting hole, the pad holds the pin and wraps the pin around the surface of the pad, applying melted solder to increase contact area and stability.

Benefits of technology

Through the design of pin surround the pad, the welding path and contact area are increased, the pin stability is improved, loosening or breaking caused by pin drifting is avoided, and the vertical fixation effect of the inductor on the PCB board is enhanced.

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Abstract

The utility model discloses a PCB inductor vertical installation structure, and relates to the technical field of PCB inductor installation. An inductance element is connected to the top end of a circuit board in an abutting mode, two sets of installation holes are longitudinally formed in the circuit board, pins are fixedly connected to the two sides of the bottom end of the inductance element respectively, the pins are arranged in the installation holes in a sleeved mode and connected with the installation holes in a sliding mode, and a bonding pad is in a cylindrical shape and connected to the bottom end of the circuit board in an abutting mode and connected with the pins in a matched mode. When the welding flux is solidified, the pin is fully fixed on the bonding pad, the welding path of the pin and the bonding pad is increased by surrounding the pin on the bonding pad, so that the solidification effect of the welding flux on the pin is improved, and when the bonding pad abuts against the part, close to the mounting hole, of the pin, the effect of positioning the pin by the bonding pad is achieved. And the effect that the pins cannot be fixed by the bonding pad when the welding flux fails is avoided.
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