Welding-free packaging circuit board and packaging structure capable of being quickly disassembled and assembled

Abstract

The utility model provides a welding-free packaging circuit board and a quick disassembly and assembly packaging structure. The welding-free packaging circuit board comprises a circuit board main body, wherein the circuit board main body is provided with a packaging guide connection area and a plurality of fastening areas; the packaging guide connection area is arranged at the center position of the circuit board main body, and the plurality of fastening areas are arranged around the packaging guide connection area at intervals; a plurality of jacks are formed in the packaging guide connection area at intervals, and a layer of guide connection hole copper is arranged on the hole wall of each jack; the jack is used for plugging a guide pin of an electronic component, and the guide hole copper is used for slidably abutting against the peripheral wall of the guide pin of the electronic component. Each fastening area is provided with a threaded screw hole, and each threaded screw hole is used for being in threaded connection with a locking bolt of an electronic element. According to the welding-free packaging circuit board, the guide connection pins of the electronic element are enabled to abut against the guide connection hole copper in the jack in a sliding manner, so that the guide connection pins of the electronic element can be quickly and smoothly plugged in and pulled out of the jack.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit board packaging, and in particular to a solder-free packaging circuit board and a quick-disassembly packaging structure. Background Art

[0002] Circuit board packaging refers to the installation method of setting capacitors, resistors and other electronic components on a printed circuit board (PCB). At present, people usually use solder paste welding to package printed circuit boards. However, because a circuit board usually has multiple electronic components installed on it, when an electronic component on the circuit board fails, it is difficult to replace the failed electronic component because the electronic component is installed on the circuit board by welding. Therefore, some manufacturers have made further research and development.

[0003] For example, Chinese patent document CN206525031U discloses a chip packaging structure for realizing solderless interconnection with a PCB board, including multiple chip bodies and a PCB board, wherein the chip bodies are mounted and fixed on the PCB board, and multiple first screw sleeves and second screw sleeves are symmetrically arranged on the PCB board, and the chip bodies are fixedly mounted on the PCB board through the first screw sleeves and the second screw sleeves. The chip packaging structure also includes multiple locking screws, which respectively cooperate with the first screw sleeves and the second screw sleeves to install and lock the chip body on the PCB board.

[0004] However, the design of the above chip packaging structure has the following problems:

[0005] Although the above-mentioned chip packaging structure can realize detachable assembly by installing electronic components on the circuit board through locking screws, the process of disassembling and assembling the circuit board requires frequent turning of the locking screws, and the locking screws are prone to wear the conductive screw holes on the circuit board during rotation, thereby causing the conductive performance of the electronic components to deteriorate after being installed on the PCB board. Utility Model Content

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a solder-free packaging circuit board and a quick-disassembly packaging structure that are easy to disassemble and assemble.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A solder-free packaging circuit board comprises a circuit board body, wherein the circuit board body is provided with a packaging conductive area and a plurality of fastening areas; the packaging conductive area is arranged at the center of the circuit board body, and a plurality of fastening areas are arranged around the packaging conductive area at intervals; a plurality of insertion holes are arranged at intervals on the packaging conductive area, and a layer of conductive hole copper is arranged on the hole wall of each insertion hole; the insertion holes are used to insert conductive pins of electronic components, and the conductive hole copper is used to slide against the peripheral wall of the conductive pins of the electronic components; each fastening area is provided with a threaded hole, and each threaded hole is used to screw a locking bolt of the electronic component.

[0009] In one embodiment, the thickness of the copper in the conductive via is in a range of 35 μm to 50 μm.

[0010] In one embodiment, two ends of the conductive hole copper extend out of the plug hole respectively and form a buckle portion covering the periphery of the corresponding plug hole.

[0011] In one embodiment, the buckle portion is arranged along the periphery of the corresponding insertion hole.

[0012] In one embodiment, the hole diameter ranges from 0.35 mm to 0.45 mm.

[0013] In one of the embodiments, the fastening area is divided into a pre-positioning area and a screw-tightening area; the threaded hole is opened in the screw-tightening area, and at least one pre-positioning area opens a pre-positioning hole, and the pre-positioning hole is used to pass a guide column of an electronic component.

[0014] In one embodiment, the plurality of insertion holes are divided into a peripheral hole group and a central hole group. The central hole group is disposed at the center of the package conductive area, and the peripheral hole group is disposed around the central hole group.

[0015] In one embodiment, the peripheral hole group has at least two distribution layers.

[0016] In one embodiment, the insertion hole is a round hole or a square hole.

[0017] A quick-disassembly packaging structure comprises an electronic component and a solder-free packaging circuit board of any of the above embodiments; the conductive pin of the electronic component is inserted into the insertion hole and slidably abuts against the conductive hole copper; the locking bolt of the electronic component is screwed into the threaded hole.

[0018] Compared with the prior art, the present invention has at least the following advantages:

[0019] 1) By opening a plurality of jacks on the package conductive area and providing a layer of conductive hole copper on the hole wall of each jack, when the electronic component needs to be installed on the solder-free package circuit board, the conductive pins of the electronic component can be inserted into the jacks, and the conductive pins of the electronic component slide and abut against the conductive hole copper, thereby conducting the solder-free package circuit board. In addition, by providing a plurality of fastening areas around the package conductive area and providing a threaded hole in each fastening area, the locking bolt of the electronic component can be screwed into the threaded hole, thereby enabling the electronic component to be securely installed on the solder-free package circuit board.

[0020] 2) Compared with the chip packaging structure of the prior art, the above-mentioned solderless packaging circuit board enables the conductive pins of the electronic components to slide against the conductive hole copper in the socket, so that the conductive pins of the electronic components can be quickly and smoothly plugged in and out of the socket, and at the same time, the socket is less protected by the conductive hole copper and wears less, and finally can maintain good conduction with the solderless packaging circuit board through the conductive hole copper. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic structural diagram of a solder-free packaging circuit board according to an embodiment of the present disclosure;

[0023] Figure 2 for Figure 1 A cross-sectional view of a socket of a solderless package circuit board shown;

[0024] Figure 3 It is a structural schematic diagram of a solder-free packaging circuit board according to another embodiment of the present disclosure;

[0025] Figure 4 for Figure 1 The actual picture of the solderless package circuit board shown.

[0026] Figure numerals: 10, solderless package circuit board; 100, circuit board body; 110, package conductive area; 1110, jack; 1111, center hole group; 1112, peripheral hole group; 1120, conductive hole copper; 1121, buckle part; 120, fastening area; 1210, screw tightening area; 1211, threaded hole; 1220, pre-positioning area; 1221, pre-positioning hole. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0031] like Figure 1 and Figure 2 As shown, a solderless packaging circuit board 10 of an embodiment of the present disclosure includes a circuit board body 100, and the circuit board body 100 is provided with a packaging conductive area 110 and a plurality of fastening areas 120; the packaging conductive area 110 is arranged at the center of the circuit board body 100, and the plurality of fastening areas 120 are arranged around the packaging conductive area 110 at intervals; a plurality of insertion holes 1110 are arranged at intervals on the packaging conductive area 110, and a layer of conductive hole copper 1120 is arranged on the hole wall of each of the insertion holes 1110; the insertion holes 1110 are used to plug in the conductive pins of the electronic component, and the conductive hole copper 1120 is used to slide against the surrounding wall of the conductive pins of the electronic component; each fastening area 120 is respectively provided with a threaded hole 1211, and each of the threaded hole 1211 is used to screw a locking bolt of the electronic component.

[0032] It can be understood that by opening a plurality of jacks 1110 on the package conductive area 110, and providing a layer of conductive hole copper 1120 on the hole wall of each jack 1110, when it is necessary to install an electronic component on the solder-free package circuit board 10, the conductive pin of the electronic component can be inserted into the jack 1110, and the conductive pin of the electronic component slides against the conductive hole copper 1120 to conduct the solder-free package circuit board 10. In addition, by providing a plurality of fastening areas 120 around the package conductive area 110, and providing a threaded hole 1211 in each fastening area 120, the locking bolt of the electronic component can be screwed into the threaded hole 1211, so that the electronic component can be securely installed on the solder-free package circuit board 10.

[0033] It can be understood that compared with the chip packaging structure of the prior art, the above-mentioned solderless packaging circuit board 10 enables the conductive pins of the electronic component to slide against the conductive hole copper 1120 in the socket 1110, so that the conductive pins of the electronic component can be quickly and smoothly plugged in and out of the socket 1110, and at the same time, the socket 1110 is less protected by the conductive hole copper 1120 and wear is reduced, and finally the socket 1110 can maintain good conduction with the solderless packaging circuit board 10 through the conductive hole copper 1120.

[0034] Combination Figure 2 As shown, in one embodiment, the thickness of the conductive hole copper 1120 ranges from 35 μm to 50 μm. It can be understood that by setting the thickness of the conductive hole copper 1120 within the range of 35 μm to 50 μm, it is possible to avoid the conductive hole copper 1120 being too thin to cause poor contact, or to avoid the conductive hole copper 1120 being too thick to hinder the normal insertion of the conductive pin. Specifically, the thickness of the conductive hole copper 1120 can be 35 μm, 45 μm or 50 μm, etc., which is not limited here, and those skilled in the art can replace it as needed.

[0035] Combination Figure 2 As shown, in one embodiment, the two ends of the conductive hole copper 1120 extend out of the plug hole 1110 respectively, and form a buckle portion 1121 covering the periphery of the corresponding plug hole 1110. It can be understood that since the two ends of the conductive hole copper 1120 extend out of the plug hole 1110 to form the buckle portion 1121, when the conductive pin of the electronic component is plugged in or out of the plug hole 1110, the buckle portion 1121 of the conductive hole copper 1120 can abut against the periphery of the plug hole 1110, thereby preventing the conductive hole copper 1120 from falling out of the plug hole 1110 during the plugging and unplugging process.

[0036] Combination Figure 2As shown, in this embodiment, the buckle portion 1121 is arranged along the periphery of the corresponding plug hole 1110. It can be understood that by arranging the buckle portion 1121 along the periphery of the corresponding plug hole 1110, the contact area between the buckle portion 1121 and the periphery of the plug hole 1110 can be increased, so that the conductive hole copper 1120 is more firmly arranged on the hole wall of the plug hole 1110.

[0037] In one embodiment, the aperture of the jack 1110 ranges from 0.35 mm to 0.45 mm. It can be understood that by setting the aperture of the jack 1110 within the range of 0.35 mm to 0.45 mm, the jack 1110 can be adapted to the conductive pin of the electronic component. The aperture of the jack 1110 can be 0.35 mm, 0.40 mm or 0.45 mm, which is not limited here, and those skilled in the art can also make other choices according to the size of the conductive pin.

[0038] Combination Figure 1 As shown, in one embodiment, the fastening area 120 is divided into a pre-positioning area 1220 and a screw tightening area 1210; the threaded hole 1211 is opened in the screw tightening area 1210, and at least one pre-positioning area 1220 opens a pre-positioning hole 1221, and the pre-positioning hole 1221 is used to penetrate the guide column of the electronic component. It can be understood that by opening the pre-positioning hole 1221 on the pre-positioning area 1220, when installing the electronic component, the guide column of the electronic component can be penetrated through the pre-positioning hole 1221 first, so that the locking bolt of the electronic component can be aligned with the threaded hole 1211, and at the same time, each conductive pin of the electronic component can be aligned with the corresponding socket 1110, which finally facilitates the locking bolt of the electronic component to tighten the threaded hole 1211, and ensures that each conductive pin of the electronic component can be smoothly inserted into the socket 1110.

[0039] Combination Figure 1 As shown, in one embodiment, the plurality of the plug holes 1110 are divided into a peripheral hole group 1112 and a central hole group 1111, the central hole group 1111 is arranged at the center of the package conductive area 110, and the peripheral hole group 1112 is arranged around the central hole group 1111. It can be understood that by arranging the peripheral hole group 1112 around the central hole group 1111, when the electronic component is installed on the solder-free package circuit board 10, the conductive pins on the periphery of the electronic component can be correspondingly plugged into the plug holes 1110 of the peripheral hole group 1112, and the conductive pins at the bottom of the electronic component can be correspondingly plugged into the plug holes 1110 of the central hole group 1111, so as to adapt to the installation of electronic components of different models.

[0040] Combination Figure 1As shown, in this embodiment, the number of distribution layers of the peripheral hole group 1112 is at least two layers. It can be understood that by setting the number of distribution layers of the peripheral hole group 1112 to at least two layers, it is possible to accommodate the conductive pins at more positions on the periphery of the electronic component. Among them, at least two layers of the peripheral hole group 1112 are arranged at intervals, which can disperse the conductive pins of the electronic component to conduct the solder-free packaging circuit board 10, thereby improving the heat dissipation performance.

[0041] Combination Figure 1 and Figure 3 As shown, in one embodiment, the plug hole 1110 is a round hole or a square hole. It can be understood that by setting the plug hole 1110 as a round hole, it can adapt to the conductive pins of electronic components of various shapes, and by setting the plug hole 1110 as a square hole, the edges of the square hole can better guide the conductive pins of the electronic component, thereby improving the plugging and unplugging efficiency of the conductive pins of the electronic component.

[0042] Combination Figure 1 and Figure 4 As shown, the present disclosure also provides a quick-disassembly packaging structure, including an electronic component and a solderless packaging circuit board 10 of any of the above embodiments; the conductive pin of the electronic component is inserted into the socket 1110 and slides against the conductive hole copper 1120; the locking bolt of the electronic component is screwed into the threaded hole 1211. It can be understood that the above solderless packaging circuit board 10 enables the conductive pin of the electronic component to slide against the conductive hole copper 1120 in the socket 1110, so that the conductive pin of the electronic component can be quickly and smoothly plugged in and out of the socket 1110, and at the same time, the socket 1110 is less protected by the conductive hole copper 1120. Wear, and finally, it can maintain good conduction with the solderless packaging circuit board 10 through the conductive hole copper 1120.

[0043] Compared with the prior art, the present invention has at least the following advantages:

[0044] 1) By opening a plurality of plug holes 1110 on the package conductive area 110, and providing a layer of conductive hole copper 1120 on the hole wall of each of the plug holes 1110, when it is necessary to install an electronic component on the solder-free package circuit board 10, the conductive pin of the electronic component can be inserted into the plug hole 1110, and the conductive pin of the electronic component slides against the conductive hole copper 1120 to conduct the solder-free package circuit board 10. In addition, by providing a plurality of fastening areas 120 around the package conductive area 110, and providing a threaded hole 1211 in each fastening area 120, the locking bolt of the electronic component can be screwed into the threaded hole 1211, so that the electronic component can be securely installed on the solder-free package circuit board 10.

[0045] 2) Compared with the chip packaging structure of the prior art, the above-mentioned solderless packaging circuit board 10 enables the conductive pins of the electronic component to slide against the conductive hole copper 1120 in the socket 1110, so that the conductive pins of the electronic component can be quickly and smoothly plugged in and out of the socket 1110. At the same time, the socket 1110 is less worn by the protective conductive hole copper 1120, and finally can maintain good conduction with the solderless packaging circuit board 10 through the conductive hole copper 1120.

[0046] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A solder-free packaging circuit board, characterized in that: It comprises a circuit board body, which is provided with a packaging conductive area and a plurality of fastening areas; the packaging conductive area is arranged at the center of the circuit board body, and a plurality of fastening areas are arranged around the packaging conductive area at intervals; a plurality of insertion holes are arranged at intervals on the packaging conductive area, and a layer of conductive hole copper is arranged on the hole wall of each insertion hole; the insertion holes are used to insert the conductive pins of the electronic components, and the conductive hole copper is used to slide against the surrounding wall of the conductive pins of the electronic components; each fastening area is respectively provided with a threaded hole, and each threaded hole is used to screw the locking bolts of the electronic components.

2. The solder-free packaging circuit board according to claim 1, characterized in that: The thickness of the conductive hole copper is in a range of 35 μm to 50 μm.

3. The solder-free packaging circuit board according to claim 1, characterized in that: The two ends of the copper conductive hole extend out of the plug hole respectively and form a buckle portion covering the periphery of the corresponding plug hole.

4. The solder-free packaging circuit board according to claim 3, characterized in that: The buckle portion is arranged along the periphery of the corresponding insertion hole.

5. The solder-free packaging circuit board according to claim 1, characterized in that: The hole diameter of the jack ranges from 0.35 mm to 0.45 mm.

6. The solder-free packaging circuit board according to claim 1, characterized in that: The fastening area is divided into a pre-positioning area and a screw-tightening area; the threaded holes are provided in the screw-tightening area, and at least one pre-positioning area has a pre-positioning hole, and the pre-positioning hole is used for passing a guide column of an electronic component.

7. The solder-free packaging circuit board according to claim 1, characterized in that: The plurality of insertion holes are divided into a peripheral hole group and a central hole group. The central hole group is arranged at the center of the package conductive area, and the peripheral hole group is arranged around the central hole group.

8. The solder-free packaging circuit board according to claim 7, characterized in that: The number of distribution layers of the peripheral hole group is at least two.

9. The solder-free packaging circuit board according to claim 1, characterized in that: The insertion hole is a round hole or a square hole.

10. A quick-disassembly packaging structure, characterized in that: It comprises an electronic component and a solder-free packaged circuit board as described in any one of claims 1 to 9; the conductive pin of the electronic component is inserted into the socket and slidably abuts against the conductive hole copper; the locking bolt of the electronic component is screwed into the threaded hole.

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