Novel printed circuit board capable of preventing unsoldering
By designing the protective frame and buffer mechanism on the printed circuit board, the problem of easy desoldering of the components of the existing printed circuit board when external impact is solved, and higher stability and reliability are achieved.
Patent Information
- Application Number
- CN202420736320.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-04-11
AI Technical Summary
The existing printed circuit boards lack protection functions, which can easily cause internal components to become loose or damaged when external impacts, affecting the normal operation of the system.
A new type of printed circuit board that is anti-desoldered is designed, using fixing strips, connecting strips and top cover to form a protective frame, heat dissipation fins and ventilation strips are provided to improve heat dissipation efficiency, and a buffer mechanism, including a hollow cylinder, a damper and a buffer spring, is installed at the bottom to reduce the impact of external vibration and impact.
Through the design of the protective frame, the circuit board components are effectively prevented from being desoldered, and the stability and reliability of the circuit board are improved; the setting of the buffer mechanism can effectively reduce the impact of external impact on the circuit board and reduce the risk of desoldering.
Smart Images
Figure CN222827461U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a novel printed circuit board capable of preventing soldering from falling off. Background Art
[0002] Printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called "printed" circuit board. Its main function is to connect various electronic components through circuits, play the role of conduction and transmission, and is a key electronic interconnection part of electronic products.
[0003] After searching, the existing Chinese patent publication number is: CN214757073U, which provides a printed circuit board, including a main body and a process edge arranged on the edge of the main body, and direction holes, first positioning holes, second positioning holes, first alignment holes, second alignment holes, third alignment holes, fourth alignment holes, slicing holes, hanging holes, tail holes and material number holes are opened at different positions of the process edge, and the process edge also has a first information printing area and a second information printing area. This patent can conveniently and effectively realize the style distinction of printed circuit boards and the positioning and alignment during use, thereby improving production efficiency and saving costs.
[0004] Although the above patent can distinguish the styles of printed circuit boards and position and align them during use, thereby improving production efficiency and saving costs, the above printed circuit board still has the following problems: lack of protection function, so when the circuit board is subjected to external impact, it is easy to cause internal components to loosen or be damaged, thereby affecting the normal operation of the entire system.
[0005] In view of the above problems, a new type of printed circuit board with anti-soldering function is proposed. Utility Model Content
[0006] The utility model aims to provide a novel printed circuit board with anti-desoldering function, which solves the problem that the background technology lacks protection function, so that when the circuit board is subjected to external impact, the internal components are easily loosened or damaged, thereby affecting the normal operation of the entire system.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new type of anti-soldering printed circuit board, including a circuit board body, fixing strips are fixed at the left and right sides of the top of the circuit board body, connecting strips are fixed at the front and back ends of the top of the circuit board body, and both ends of the connecting strips are fixed to the fixing strips, one side of the two connecting strips are penetrated and installed with heat dissipation fins, and the tops of the two fixing strips are provided with top covers; a buffer mechanism is provided at the bottom of the circuit board body.
[0008] By adopting the above technical solution, the heat generated when the circuit board is working can be more effectively conducted and dissipated through the heat dissipation fins, which helps to maintain the normal operating temperature of the circuit board and improve the overall heat dissipation performance; the top cover is installed on the top of the fixing bar to cover the top part of the circuit board body to play a protective and sealing role. The top cover can protect the internal components of the circuit board from being invaded by the external environment, and also helps to improve the overall aesthetics of the circuit board.
[0009] As a further description of the above technical solution: a plurality of ventilation strips are arranged on the outer sides of the two fixing strips.
[0010] By adopting the above technical solution, air can flow around the circuit board more easily through the ventilation strips to take away heat, thereby reducing the operating temperature of the circuit board and improving performance and reliability.
[0011] As a further description of the above technical solution: the two fixing bars and the connecting bar have the same height, and the top cover is connected to the two fixing bars by four bolts.
[0012] By adopting the above technical solution, the fixing strips and the connecting strips have the same height, which can ensure that the circuit board remains stable and balanced during the installation process and avoid instability caused by inconsistent heights; the top cover is connected to the two fixing strips by four bolts, which can provide a reliable fixing and connection method.
[0013] As a further description of the above technical solution: a base plate is arranged at the bottom of the circuit board body.
[0014] By adopting the above technical solution, the arrangement of the bottom plate can provide additional support for the circuit board body and increase the stability of the entire structure.
[0015] As a further description of the above technical solution: the buffer mechanism includes hollow cylinders arranged at the four corners of the bottom of the circuit board body, dampers are fixed at the bottom of the four hollow cylinders, buffer springs are arranged inside the four hollow cylinders, and the bottom ends of the buffer springs are installed on the end of the damper impact head, and the bottoms of the four dampers are fixed to the bottom plate.
[0016] By adopting the above technical solution, through the combined design of the hollow cylinder, the damper and the buffer spring, the buffering and shock-absorbing effects on the circuit board can be achieved. When the circuit board is subjected to external impact or vibration, the buffer spring can absorb part of the energy and convert it into heat energy through the damper, thereby reducing the impact of the impact on the internal components of the circuit board.
[0017] As a further description of the above technical solution: a sliding disk slides inside the four hollow cylinders, and the sliding disk is located on the top of the buffer spring, a sliding rod passes through and slides at the top center of the four hollow cylinders, and the bottom end of the sliding rod is fixed to the sliding disk.
[0018] By adopting the above-mentioned technical solution, the pressure distribution of the buffer spring can be balanced through the sliding rod fixation, which helps to ensure that the buffer spring can evenly transfer and absorb energy when subjected to external impact, thereby improving the stability and reliability of the entire buffer system. The setting of the sliding disk allows the buffer spring to flexibly move and deform when subjected to force, thereby better achieving the buffering effect against external impact.
[0019] As a further description of the above technical solution: the top ends of the four sliding rods are all fixed with connecting disks, and the tops of the connecting disks are all fixed to the circuit board body.
[0020] By adopting the above technical solution, the slide rod is connected to the circuit board body through the connecting plate, so that the stability of the buffer mechanism can be maintained and it can be prevented from loosening or falling off during operation.
[0021] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0022] 1. The utility model provides a new type of printed circuit board with anti-desoldering function. First, a square protection frame is formed by fixing strips, connecting strips and a top cover, so as to protect the components above the circuit board body, so as to prevent the components above the circuit board body from being desoldered when the circuit board body is impacted or collided, thereby affecting its service life; the setting of heat dissipation fins and ventilation strips can increase a certain heat dissipation effect, improve heat dissipation efficiency, help to reduce temperature, reduce the influence of thermal expansion and contraction on solder joints, and thus reduce the risk of desoldering.
[0023] 2. The utility model provides a new type of anti-desoldering printed circuit board, which can effectively reduce the impact of external vibration and impact on the circuit board body through a buffering mechanism, thereby improving the reliability and stability of the circuit board body; through the buffering and absorption effect of the buffering mechanism, the possibility of desoldering or breaking of solder joints under external impact can be reduced, and the stability and reliability of solder joints can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0025] Figure 2 It is a schematic diagram of the explosion structure of the utility model;
[0026] Figure 3 This is a front view structural schematic diagram of the utility model;
[0027] Figure 4 It is a schematic diagram of the cross-sectional structure of the hollow cylinder of the utility model.
[0028] In the figure: 1. circuit board body; 2. fixing strip; 3. ventilation strip; 4. connecting strip; 5. heat sink fin; 6. top cover; 7. bolt; 8. bottom plate; 9. hollow cylinder; 91. damper; 92. buffer spring; 93. sliding plate; 94. sliding rod; 95. connecting plate. DETAILED DESCRIPTION
[0029] The following will refer to the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0030] In order to further understand the content of the utility model, the utility model is described in detail with reference to the accompanying drawings.
[0031] Reference Figure 1 and Figure 2 The utility model discloses a new type of printed circuit board with anti-soldering, comprising a circuit board body 1, fixing strips 2 are fixed at the left and right sides of the top of the circuit board body 1, connecting strips 4 are fixed at the front and rear ends of the top of the circuit board body 1, and both ends of the connecting strips 4 are fixed to the fixing strips 2, one side of the two connecting strips 4 is penetrated and equipped with heat dissipation fins 5, a top cover 6 is arranged on the top of the two fixing strips 2, a plurality of ventilation strips 3 are arranged on the outer sides of the two fixing strips 2, the two fixing strips 2 have the same height as the connecting strips 4, and the top cover 6 is connected to the two fixing strips 2 by four bolts 7.
[0032] A square protective frame is formed by the fixing strip 2, the connecting strip 4 and the top cover 6, so that the components above the circuit board main body 1 can be protected to prevent the components above the circuit board main body 1 from becoming desoldered when the circuit board main body 1 is impacted or collided, thereby affecting its service life; the installation of the ventilation strip 3 and the heat dissipation fins 5 helps to enhance the heat dissipation effect. When the circuit board main body 1 is working, a certain amount of heat will be generated, and the setting of the heat dissipation fins 5 and the ventilation strip 3 can increase a certain heat dissipation effect, improve the heat dissipation efficiency, help to reduce the temperature, reduce the influence of thermal expansion and contraction on the solder joints, and thus reduce the risk of desoldering.
[0033] Reference Figure 3 and Figure 4A buffer mechanism is provided at the bottom of the circuit board body 1, and a bottom plate 8 is provided at the bottom of the circuit board body 1. The buffer mechanism includes hollow cylinders 9 provided at the four corners of the bottom of the circuit board body 1, and dampers 91 are fixed at the bottom of the four hollow cylinders 9. Buffer springs 92 are provided inside the four hollow cylinders 9, and the bottom ends of the buffer springs 92 are installed on the impact head ends of the dampers 91. The bottoms of the four dampers 91 are fixed to the bottom plate 8, and sliding disks 93 are slidably provided inside the four hollow cylinders 9, and the sliding disks 93 are located on the tops of the buffer springs 92. Sliding rods 94 are passed through and slide at the top centers of the four hollow cylinders 9, and the bottom ends of the sliding rods 94 are fixed to the sliding disks 93, and the tops of the four sliding rods 94 are fixed with connecting disks 95, and the tops of the connecting disks 95 are fixed to the circuit board body 1.
[0034] When the top cover 6 is subjected to external impact or vibration, the slide rod 94 will first generate a downward pressure force and drive the sliding plate 93 to slide downward in the hollow cylinder 9, so that the internal buffer spring 92 will play a role in buffering and absorbing the impact force, reducing the impact of these forces transmitted to the circuit board body 1. Since the bottom end of the buffer spring 92 is installed on the impact head of the damper 91, when the buffer spring 92 is pressed downward and contracted, the damper 91 will absorb part of the impact energy and disperse and buffer the remaining impact force through the buffer spring 92, so that it can effectively reduce the impact of external impact on the circuit board body 1, protect the circuit board from damage, and improve the stability and reliability of the circuit board in harsh environments.
[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A novel printed circuit board for preventing soldering, comprising a circuit board body (1), characterized in that: Fixing strips (2) are fixed on both left and right sides of the top of the circuit board body (1); connecting strips (4) are fixed on both front and rear ends of the top of the circuit board body (1); both ends of the connecting strip (4) are fixed to the fixing strip (2); one side of the two connecting strips (4) is penetrated and equipped with heat dissipation fins (5); top covers (6) are arranged on the tops of the two fixing strips (2); and a buffer mechanism is arranged on the bottom of the circuit board body (1).
2. A novel printed circuit board with anti-soldering according to claim 1, characterized in that: A plurality of ventilation strips (3) are arranged on the outer sides of the two fixing strips (2).
3. A novel printed circuit board with anti-soldering properties according to claim 1, characterized in that: The two fixing bars (2) and the connecting bar (4) have the same height, and the top cover (6) is connected to the two fixing bars (2) via four bolts (7).
4. A novel printed circuit board with anti-soldering properties according to claim 1, characterized in that: A bottom plate (8) is provided at the bottom of the circuit board body (1).
5. The novel printed circuit board with anti-soldering properties according to claim 1, characterized in that: The buffer mechanism comprises hollow cylinders (9) arranged at the four corners of the bottom of the circuit board body (1); dampers (91) are fixed at the bottom of the four hollow cylinders (9); buffer springs (92) are arranged inside the four hollow cylinders (9); the bottom ends of the buffer springs (92) are installed on the impact head ends of the dampers (91); and the bottoms of the four dampers (91) are fixed on the bottom plate (8).
6. A novel printed circuit board for preventing soldering according to claim 5, characterized in that: A sliding plate (93) is slidably mounted inside each of the four hollow cylinders (9), and the sliding plate (93) is located on the top of each of the buffer springs (92). A sliding rod (94) passes through and slides at the center of the top of each of the four hollow cylinders (9), and the bottom end of each of the sliding rods (94) is fixed to the sliding plate (93).
7. A novel printed circuit board with anti-soldering properties according to claim 6, characterized in that: A connecting plate (95) is fixed to the top of each of the four sliding rods (94), and the top of each of the connecting plates (95) is fixed to the circuit board body (1).