Pressurizing heat conduction plate and heat dissipation device thereof
By setting up a pressurized partition bar in the heat conducting plate of the heat dissipation device, separating multiple chambers and pressurizing the steam, the problem of low heat dissipation efficiency in the existing heat dissipation device is solved, and efficient and orderly steam conduction and heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202421437268.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-06-21
AI Technical Summary
The steam in the thermal conductor plate of the existing heat dissipation device is in a disordered state, resulting in low heat dissipation efficiency.
A pressurized heat conduction plate is designed, by providing a pressurized partition bar in the steam cavity to separate a plurality of first partition chambers and a second partition chamber. The pressurized partition bar separates at least two first partition chambers from the steam cavity, and pressurizes the steam through these partition chambers to efficiently and orderly conduct the steam to the heat dissipation fins.
The steam is pressurized by the pressurized separator, which improves the steam circulation speed and achieves efficient and orderly conduction of steam to the heat dissipation fins, thereby improving the heat dissipation efficiency of the heat conducting plate and the heat dissipation device.
Smart Images
Figure CN222827542U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a pressurized heat conducting plate and a heat dissipation device thereof. Background Art
[0002] With the development of technology, the performance of electronic components in electronic products has been significantly improved. However, with the significant improvement in the performance of electronic components, the speed at which electronic components generate heat during operation is also getting faster and faster. Therefore, the requirements for the heat dissipation performance of electronic products are also getting higher and higher.
[0003] In the prior art, a method for dissipating heat for electronic products is to conduct the heat generated by electronic components through a heat conducting plate, and the heat conducting plate then conducts the heat to heat dissipation fins for dissipation.
[0004] However, in the existing heat dissipation device, there is only one large steam cavity in the heat conduction plate. The steam generated by the heat conduction plate after absorbing the heat of the heating device can move both longitudinally and transversely in the steam cavity of the heat conduction plate. Therefore, the steam in the steam cavity is in a chaotic state; thus, it is difficult for the steam to achieve efficient heat dissipation. Therefore, the existing heat dissipation device has a low heat dissipation efficiency. Utility Model Content
[0005] In view of the deficiencies in the prior art, the utility model provides a pressurized heat conductive plate and a heat dissipation device thereof, which ensure that the steam in the pressurized heat conductive plate flows out quickly, thereby improving the heat dissipation efficiency of the pressurized heat conductive plate and further improving the heat dissipation efficiency of the heat dissipation device.
[0006] The purpose of this utility model is achieved through the following technical solutions:
[0007] The pressurized heat-conducting plate comprises a plate body and a cover body arranged on the plate body; one side of the plate body is concave to form a steam cavity; the cover body is arranged on the side of the plate body where the steam cavity is opened;
[0008] The plate body is provided with at least one pressurization separation rib, and the pressurization separation rib separates at least two first separation chambers from the steam chamber;
[0009] One end of the pressurization separation rib is connected to one side wall of the steam chamber, and the other end extends into the steam chamber and has a gap with the other side wall of the steam chamber, so that the pressurization separation rib also separates a second separation chamber from the steam chamber; the second separation chamber is respectively connected to each of the first separation chambers;
[0010] The pressurization separation rib is gradually narrowed from one end connected to the side wall of the steam chamber to the other end, so that the first separation chamber is gradually narrowed from one end close to the second separation chamber to the other end.
[0011] Preferably, the number of the boost separation ribs is two or more and they are distributed side by side with a spacing.
[0012] Preferably, one side of the pressurization separation rib is connected to the bottom of the steam chamber, and the other side is in contact with the cover body; a plurality of conductive support columns are arranged in the steam chamber; one end of the conductive support column is connected to the bottom of the steam chamber, and the other end is in contact with the cover body.
[0013] Preferably, at least one of the conductive support columns is integrally arranged with the boost separation rib.
[0014] Preferably, a fin locking groove is provided at one end of the first partition chamber connected to the side wall of the steam chamber.
[0015] Preferably, the cover body is provided with at least two through grooves, and the first partition cavity is communicated with at least one of the through grooves.
[0016] A heat dissipation device includes the pressurized heat conductive plate; the heat dissipation device also includes at least two heat dissipation fins, the heat dissipation fins pass through the through slots and extend into the first partition chamber; and each of the first partition chambers corresponds to at least one heat dissipation fin.
[0017] The utility model discloses a pressurized heat conductive plate and a heat dissipation device thereof, wherein a first separation chamber is separated from a steam chamber of the pressurized heat conductive plate, and the steam in the pressurized heat conductive plate is pressurized through the first separation chamber to accelerate the circulation speed of the steam in the first separation chamber, so that the steam is efficiently and orderly conducted to the heat dissipation fins, thereby improving the heat dissipation efficiency of the heat conductive plate, and further improving the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 It is a schematic diagram of the exploded state of the pressurized heat conducting plate of the utility model;
[0020] Figure 2 for Figure 1 The structural schematic diagram of the plate body shown in (a);
[0021] Figure 3 for Figure 1 The structural schematic diagram of the plate body shown (II);
[0022] Figure 4 for Figure 2 A magnified view at point A;
[0023] Figure 5 for Figure 1 The structural schematic diagram of the cover body shown;
[0024] Figure 6 for Figure 5 Enlarged view at B;
[0025] Figure 7 This is a schematic diagram of the structure of the heat dissipation device of the utility model (I);
[0026] Figure 8 This is a schematic diagram of the structure of the heat dissipation device of the utility model (II);
[0027] Fig. 9 for Figure 7 The schematic diagram of the disassembled state of the heat dissipation device after the heat conducting plate is removed is shown;
[0028] Fig.10 for Fig. 9 Enlarged view at C;
[0029] Fig.11 for Figure 7 A schematic diagram of the structure of the heat sink fins shown;
[0030] Fig.12 for Fig.11 Enlarged view at D;
[0031] Fig.13 for Figure 7 A schematic diagram of the structure of the fixing strip shown;
[0032] Fig.14 for Fig.13 Enlarged view at E. DETAILED DESCRIPTION
[0033] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. People familiar with this technology can easily understand other advantages and effects of the utility model from the content disclosed in this specification. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that can be produced by the utility model and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the utility model. At the same time, the terms such as "upper", "lower", "left", "right" and "middle" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the utility model, and the change or adjustment of their relative relationship. Without substantially changing the technical content, it should also be regarded as the scope of the implementation of the utility model.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0035] like Figure 1 As shown, the utility model discloses a pressurized heat conducting plate 1, comprising a plate body 10 and a cover body 20 disposed on the plate body 10. Figure 2 , Figure 3 and Figure 4 As shown, one side of the plate body 10 is concave to form a steam chamber 100; the cover body 20 is disposed on the side of the plate body 10 where the steam chamber 100 is formed. Figure 2 and Figure 3 As shown, the plate body 10 is provided with at least one pressurizing partition rib 200, and the pressurizing partition rib 200 partitions at least two first partition chambers 300 from the steam chamber 100. One end of the pressurizing partition rib 200 is connected to a side wall of the steam chamber 100, and the other end extends into the steam chamber 100 and has a gap with the other side wall of the steam chamber 100, so that the pressurizing partition rib 200 also partitions a second partition chamber 500 from the steam chamber 100; the second partition chamber 500 is respectively connected to each first partition chamber 300. The pressurizing partition rib 200 gradually narrows from one end connected to the side wall of the steam chamber 100 to the other end, so that the first partition chamber 300 gradually narrows from one end close to the second partition chamber 520 to the other end. It should be noted that the shape of the pressurizing partition rib 200 can be any shape, as long as its shape can make the first partition chamber 300 gradually narrow from one end close to the second partition chamber 520 to the other end.
[0036] like Figure 3 and Figure 4As shown, in this embodiment, there are multiple pressurization separation ribs 200, and the multiple pressurization separation ribs 200 are distributed side by side at equal intervals. The working fluid in the pressurized heat-conducting plate 1 is heated to change from liquid to steam; the steam enters each first partition chamber 300 from the second partition chamber 500; the steam flows from one end close to the second partition chamber 500 to the other end in the first partition chamber 300; in this process, since the first partition chamber 300 gradually narrows from one end close to the second partition chamber 500 to the other end, the cross-sectional area of the first partition chamber 300 along the extension direction of the first partition chamber 300 gradually decreases; when the cross-sectional area of the first partition chamber 300 gradually decreases, if the input power is constant, the amount of steam generated is constant, and when the steam flows through the first partition chamber 300, when the cross-sectional area of the first partition chamber 300 decreases, the flow rate of the steam increases; thereby, the steam in the steam chamber 100 flows to the heat sink fins 30 more efficiently, thereby accelerating the phase change cycle, thereby improving the heat dissipation efficiency of the pressurized heat-conducting plate 1, and then improving the heat dissipation efficiency of the heat dissipation device 2.
[0037] like Figure 3 and Figure 4 As shown, in this embodiment, one end of the pressurized partition rib 200 is connected to one side wall of the steam chamber 100, and the other end extends into the steam chamber 100 and has a gap 400 with the other side wall of the steam chamber 100, so that the pressurized partition rib 200 also separates a second partition chamber 500 from the steam chamber 100; the second partition chamber 500 is respectively connected to each first partition chamber 300. When the working fluid in the second partition chamber 500 is heated to form steam, the steam quickly flows from the second partition chamber 500 to the first partition chamber 300, and the steam in the first partition chamber 300 is pressurized by the first partition chamber 300 and then quickly flows to the heat sink fins 30.
[0038] like Figure 4 As shown, in this embodiment, a fin locking groove 310 is provided at one end of the first partition chamber 300 connected to the side wall of the steam chamber 100. Figure 5 and Figure 6 As shown, the cover body 20 is provided with at least two through slots 600 , and the first partition cavity 300 is communicated with at least one of the through slots 600 .
[0039] like Figure 7 and Figure 8 As shown, the utility model also discloses a heat dissipation device 2, which includes a pressurized heat conducting plate 1 and at least two heat dissipation fins 30. The heat dissipation fins 30 pass through the through slot 600 and extend into the first partition cavity 300; and each first partition cavity 300 corresponds to at least one heat dissipation fin 30. In this embodiment, the first partition cavity 300 and the heat dissipation fins 30 correspond to each other.
[0040] like Fig.12As shown, in this embodiment, the heat sink 30 is provided with at least one plug-in ridge 301, and the plug-in ridge 301 corresponds to the through groove 600; the plug-in ridge 301 passes through its corresponding through groove 600 and communicates with the steam chamber 100. Specifically, at least one plug-in ridge 301 of each heat sink 30 passes through its corresponding through groove 600 and extends to the first partition chamber 300; the plug-in ridge 301 is provided with at least one communication port 302. When the heat sink 30 is plugged into the boost heat conductive plate 1, the communication port 302 extends into the first partition chamber 300; in this embodiment, the number of the heat sink fins 30 is the same as the number of the first partition chamber 300, and the heat sink fins 30 and the first partition chamber 300 correspond to each other. In this embodiment, each heat sink fin 30 is provided with two corresponding plug-in ridges 301.
[0041] like Fig.12 As shown, in this embodiment, the plug-in ridge 301 is provided with at least one connecting portion 303, the connecting portion 303 protrudes in the vertical direction of the plug-in ridge 301, and the connecting port 302 is opened in the connecting portion 303. Figure 6 As shown, correspondingly, the through groove 600 is recessed toward both sides along the vertical direction of its extension to form an escape groove 610; the escape groove 610 corresponds to the connecting portion 303. When the plug-in ridge 301 is inserted into the through groove 600, the connecting portion 303 is aligned with the escape groove 610 and passes through the escape groove 610. After the connecting portion 303 passes through the escape groove 610, the heat dissipation fin 30 is connected to the first partition chamber 300 through the connecting port 302.
[0042] In this embodiment, after the plug-in rib 301 is inserted into the first partition cavity 300, the fin locking groove 310 of the first partition cavity 300 locks and limits the end of the plug-in rib 301. The fin locking groove 310 locks and limits the heat sink fins 30 by locking and limiting the plug-in rib 301, thereby improving the stability of the connection between the heat sink fins 30 and the boost heat conductive plate 1 and preventing the heat sink fins 30 from falling off.
[0043] like Figure 4As shown, in this embodiment, a plurality of conductive support columns 700 are arranged in the steam chamber 100; one end of the conductive support column 700 is connected to the bottom of the steam chamber 100, and the other end is in contact with the cover body 20. At least one conductive support column 700 is integrally arranged with the pressurization separation rib 200. Preferably, the conductive support columns 700 are evenly distributed in the steam chamber 100, and some conductive support columns 700 are integrally arranged with the pressurization separation rib 200. As a preferred embodiment, the conductive support column 700 is a circular cylinder. Of course, the conductive support column 700 can also be designed in other shapes. On the one hand, the conductive support column 700 provides support for the cover body 20 to prevent the cover body 20 from deforming under the pressure of the heat dissipation fins 30; on the other hand, the conductive support column 700 conducts the heat absorbed by the plate body 10 to the cover body 20, and the cover body 20 conducts the heat to the heat dissipation fins 30 for heat dissipation. The heat dissipation device 2 of the utility model adopts both the refrigerant heat dissipation method and the conduction heat dissipation method, and the heat dissipation efficiency is greatly improved, and the heat dissipation effect is stable. In addition, the integral arrangement of some of the conduction support columns 700 and the boost separation ribs 200 enables the boost separation ribs 200 and the conduction support columns 700 to support the cover body 20 to prevent the cover body 20 from being deformed by force while quickly conducting the heat absorbed by the plate body 10 to the heat dissipation fins 30. The integral arrangement of the conduction support columns 700 and the boost separation ribs 200 optimizes the supporting effect on the cover body 20, while also increasing the heat conduction path, further improving the heat dissipation efficiency of the boost heat conductive plate 1, and further improving the heat dissipation efficiency of the heat dissipation device 2.
[0044] like Fig.11 , Fig.13 and Fig.14 As shown, in this embodiment, the heat dissipation device 2 also includes at least one fixing bar 40; the fixing bar 40 is provided with at least two first card slots 401, and the heat dissipation fins 30 are correspondingly connected to the first card slots 401. Specifically, the heat dissipation fins 30 are also provided with at least two second card slots 304, and the first card slots 401 correspond to the second card slots 304 one by one. The fixing bar 40 fixes the heat dissipation fins 30, so that the heat dissipation fins 30 remain in a stable state and are not prone to loosening, falling off, etc. As a preferred embodiment, the number of fixing bars 40 is three, and the three fixing bars 40 are fixed to at least two surfaces of the heat dissipation fins 30, which has a better fixing effect on the heat dissipation fins 30.
[0045] like Figure 7 and Figure 8 As shown, in this embodiment, the heat dissipation device 2 further includes a fin protection member 50, which is a mesh structure and is connected to a side of the heat dissipation fin 30 away from the pressurized heat conducting plate 1. The fin protection member 50 protects the heat dissipation fin 30 without affecting the heat dissipation effect of the heat dissipation fin 30.
[0046] The heat dissipation device 2 of the present invention is provided with a pressurized partition rib 200 on the pressurized heat conductive plate 1, and the pressurized partition rib 200 gradually narrows from one end connected to the side wall of the steam chamber 100 to the other end, so that the first partition 300 chamber gradually narrows from one end close to the second partition chamber 520 to the other end. The gradually narrowed first partition chamber 300 pressurizes the steam, thereby accelerating the circulation speed of the steam, so that the steam in the pressurized heat conductive plate 1 is quickly conducted to the heat dissipation fins 30 along the first partition chamber 300, thereby improving the heat dissipation efficiency of the pressurized heat conductive plate 1, and further improving the heat dissipation efficiency of the heat dissipation device 2.
[0047] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A pressurized heat-conducting plate, comprising a plate body and a cover body disposed on the plate body, one side of the plate body is concave to form a steam chamber, characterized in that: The plate body is provided with at least one pressurization separation rib, and the pressurization separation rib separates at least two first separation chambers from the steam chamber; One end of the pressurization separation rib is connected to one side wall of the steam chamber, and the other end extends into the steam chamber and has a gap with the other side wall of the steam chamber, so that the pressurization separation rib also separates a second separation chamber from the steam chamber; the second separation chamber is respectively connected to each of the first separation chambers; The pressurization separation rib is gradually narrowed from one end connected to the side wall of the steam chamber to the other end, so that the first separation chamber is gradually narrowed from one end close to the second separation chamber to the other end.
2. The pressurized heat conducting plate according to claim 1, characterized in that: The number of the boost separation ribs is more than two and is distributed side by side at equal intervals.
3. The pressurized heat conducting plate according to claim 1, characterized in that: One side of the pressurized separation rib is connected to the bottom of the steam chamber, and the other side is in contact with the cover body. A plurality of conductive support columns are arranged in the steam chamber; one end of the conductive support column is connected to the bottom of the steam chamber, and the other end is in contact with the cover body.
4. The pressurized heat conducting plate according to claim 3, characterized in that: At least one of the conductive support columns is integrally arranged with the boost separation rib.
5. The pressurized heat conducting plate according to claim 1, characterized in that: A fin locking groove is provided at one end of the first partition chamber connected to the side wall of the steam chamber.
6. The pressurized heat conducting plate according to claim 1, characterized in that: The cover body is provided with at least two through grooves, and the first partition cavity is communicated with at least one of the through grooves.
7. A heat dissipation device, characterized in that: The pressurized heat conducting plate comprising the pressurized heat conducting plate according to claim 6; The heat dissipation device further includes at least two heat dissipation fins, which pass through the through slots and extend into the first partition chambers; and each of the first partition chambers corresponds to at least one heat dissipation fin.
8. The heat dissipation device according to claim 7, characterized in that: The heat dissipation fin is provided with at least one plug-in ridge, and the plug-in ridge corresponds to the through groove; the plug-in ridge extends to the first partition cavity after passing through the corresponding through groove; the plug-in ridge is provided with at least one connecting port; when the heat dissipation fin is plugged into the heat conductive plate, the connecting port extends into the first partition cavity.
9. The heat dissipation device according to claim 8, characterized in that: The plug-in ridge is provided with at least one connecting portion, the connecting portion protrudes along the vertical direction of the plug-in ridge, and the connecting port is opened in the connecting portion; the through groove is recessed toward both sides along the vertical direction of its extension to form an avoidance groove; the avoidance groove corresponds to the connecting portion.
10. The heat dissipation device according to claim 9, characterized in that: It also includes at least one fixing strip; the fixing strip is provided with at least two slots, and the heat dissipation fins are correspondingly connected to the slots.
11. The heat dissipation device according to claim 9, characterized in that: It also includes a fin protection piece, which is a mesh structure, and the fin protection piece is connected to a side of the heat dissipation fin away from the heat conduction plate.