Middle frame assembly for automobile

Abstract

The utility model relates to a middle frame assembly for an automobile, which belongs to the technical field of vehicle-mounted hosts and comprises a middle frame and a cover plate mounted at the top of the middle frame, an arch-shaped heat dissipation boss is mounted on the inner bottom surface of the middle frame, a C-shaped heat dissipation plate is mounted at the joint of one side edge and the inner bottom surface of the middle frame, and a plurality of heat dissipation holes are uniformly formed in the bottom edges and the side edges of the cover plate and the middle frame. The top of the side edge of the middle frame is bent to form an installation plate perpendicular to the side edge, a PCB main board is placed on the installation plate, the PCB main board makes contact with the heat dissipation boss and the top of the C-shaped heat dissipation plate through a heat conduction medium for heat conduction, screw holes are formed in the corresponding positions of the cover plate, the PCB main board and the installation plate, and the cover plate is installed at the top of the middle frame in the mode that screws sequentially penetrate through the screw holes of the cover plate, the PCB main board and the installation plate. The independent hollow arch-shaped heat dissipation boss and the C-shaped heat dissipation plate are adopted, the middle frame and the cover plate are made of iron which is low in price and good in heat conduction performance, materials are saved, cost is reduced, the weight is reduced, and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted host computers, in particular to a middle frame component for automobiles. Background Art

[0002] With the development of automobiles, the functions of vehicle-mounted host computers are increasing, the complexity of PCB motherboards in vehicle computers is increasing, the computing power of chips and other components is becoming stronger, and the heat generated by chip calculations is also increasing.

[0003] Currently, a metal middle frame with good thermal conductivity is usually used to load the PCB motherboard of the vehicle. The existing metal middle frame is made of one-piece all-aluminum. The one-piece all-aluminum middle frame uses more materials and is overall thick, which increases the weight of the vehicle and has a high cost. Therefore, a middle frame assembly for an automobile is proposed. Utility Model Content

[0004] The utility model aims to provide a middle frame assembly for automobiles, which has light weight, low cost and good heat dissipation performance, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A middle frame assembly for an automobile comprises a middle frame and a cover plate installed on the top of the middle frame, an arch-shaped heat dissipation boss is installed on the inner bottom surface of the middle frame, a "C"-shaped heat dissipation plate is installed at the connection between one side of the middle frame and the inner bottom surface, a plurality of heat dissipation holes are evenly opened on the bottom and side of the middle frame, a plurality of heat dissipation holes are evenly opened on the cover plate, a mounting plate perpendicular to the side is bent at the top of the side of the middle frame toward the inner side of the middle frame, a PCB mainboard is placed on the mounting plate, the PCB mainboard contacts the heat dissipation boss and the top of the "C"-shaped heat dissipation plate through a heat-conducting medium for heat conduction, screw holes are arranged at corresponding positions of the cover plate, the PCB mainboard and the mounting plate, and the cover plate is mounted on the top of the middle frame by screws passing through the screw holes of the cover plate, the PCB mainboard and the mounting plate in sequence.

[0007] Preferably, the heat dissipation boss and the "C"-shaped heat dissipation plate are made of aluminum, and the middle frame and the cover plate are made of iron.

[0008] Preferably, the heat dissipation boss is a hollow arch structure, which saves materials and has good heat dissipation effect.

[0009] Preferably, the heat dissipation boss is mounted on the inner bottom surface of the middle frame by riveting.

[0010] Preferably, a plurality of heat dissipation holes are provided at the bottom of the "C"-shaped heat dissipation plate, and a through groove is provided at the bottom edge of the middle frame. The bottom of the "C"-shaped heat dissipation plate extends from the inner bottom surface of the middle frame to the outer bottom surface of the middle frame through the through groove. The bottom of the "C"-shaped heat dissipation plate is fixed to the outer bottom surface of the middle frame by screws, and the side of the "C"-shaped heat dissipation plate is riveted to the inner side edge of the middle frame by rivets.

[0011] Preferably, the sides and top of the "C"-shaped heat sink are provided with heat sink fins protruding outwards.

[0012] Preferably, the cover plate is provided with a groove which is sunken toward the inside of the middle frame, and the groove is used to fix the PCB mainboard.

[0013] Preferably, the mounting plate is provided with a positioning column, and a circular hole matching the positioning column is provided at a corresponding position on the cover plate, and the cover plate is quickly positioned and installed on the top of the middle frame by the positioning column passing through the circular hole.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model adopts an independent hollow arch-shaped heat dissipation boss and a "C"-shaped heat dissipation plate installed in the middle frame. The middle frame and the cover plate are made of iron, which is cheap and has good thermal conductivity, so as to avoid wasting too much material, save materials, reduce costs and reduce weight. In addition, the middle frame and the cover plate are both provided with a plurality of heat dissipation holes, so the heat dissipation effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a view of the internal structure of the middle frame of the utility model;

[0017] Figure 2 This is a structural view of the utility model;

[0018] Figure 3 This is a back view of the cover plate of the utility model;

[0019] Figure 4 This is a structural view of the middle frame of the utility model;

[0020] Figure 5 This is a back structural view of the middle frame of the utility model;

[0021] Figure 6 This is a structural view of the "C" type heat sink of the utility model;

[0022] Figure 7 This is a structural view of the heat dissipation boss of the utility model.

[0023] Reference numerals

[0024] 1. Middle frame, 2. Cover plate, 3. Heat dissipation boss, 4. "C" type heat dissipation plate, 5. Heat dissipation hole, 6. Mounting plate, 7. Screw hole, 8. Rivet, 9. Through slot, 10. Heat dissipation fin, 11. Positioning column, 12. Round hole, 13. Groove. DETAILED DESCRIPTION

[0025] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0026] like Figure 1-2 , Figure 7 As shown, a middle frame assembly for an automobile comprises a middle frame 1 and a cover plate 2 installed on the top of the middle frame 1, an arch-shaped heat dissipation boss 3 is installed on the inner bottom surface of the middle frame 1, a "C"-shaped heat dissipation plate 4 is installed at the connection between one side of the middle frame 1 and the inner bottom surface, the heat dissipation boss 3 is a hollow arch structure, the hollow arch structure saves materials and has a good heat dissipation effect; the heat dissipation boss 3 and the "C"-shaped heat dissipation plate 4 are made of aluminum, the middle frame 1 and the cover plate 2 are made of iron, and the arch-shaped heat dissipation boss 3 is riveted to the inner bottom surface of the middle frame 1 by rivets 8.

[0027] like Figure 4-5 , Figure 6 As shown, a plurality of heat dissipation holes 5 are provided at the bottom of the "C"-shaped heat dissipation plate 4, and a through groove 9 is provided at the bottom edge of the middle frame 1. The bottom of the "C"-shaped heat dissipation plate 4 extends from the inner bottom surface of the middle frame 1 to the outer bottom surface of the middle frame 1 through the through groove 9. The bottom of the "C"-shaped heat dissipation plate 4 is fixed to the outer bottom surface of the middle frame 1 by screws 14, and the side of the "C"-shaped heat dissipation plate 4 is riveted to the inner side edge of the middle frame 1 by rivets 8. The side and top of the "C"-shaped heat dissipation plate 4 are provided with heat dissipation fins 10 formed by outward protrusions, and the heat dissipation fins 10 are provided for better heat dissipation.

[0028] like Figure 1-3 As shown, a plurality of heat dissipation holes 5 are evenly opened on the bottom and side of the middle frame 1, a plurality of heat dissipation holes 5 are evenly opened on the cover plate 2, a mounting plate 6 perpendicular to the side is bent toward the inner side of the middle frame at the top of the side of the middle frame 1, a PCB mainboard is placed on the mounting plate 6, the PCB mainboard contacts the heat dissipation boss 3 and the top of the "C"-shaped heat dissipation plate 4 through a heat-conducting medium for heat conduction, screw holes 7 are provided at corresponding positions of the cover plate 2, the PCB mainboard and the mounting plate 6, and the cover plate 2 is installed on the top of the middle frame 1 by screws 14 passing through the cover plate 2, the PCB mainboard and the screw holes 7 of the mounting plate 6 in sequence.

[0029] The cover plate 2 is provided with a groove 13 which is recessed inwardly of the middle frame 1. The groove 13 is used to fix the PCB mainboard. A positioning column 11 is provided on the mounting plate 6. A circular hole 12 matching the positioning column is provided at a corresponding position on the cover plate 2. The cover plate 2 is quickly positioned and installed on the top of the middle frame 1 by passing the positioning column 11 through the circular hole 12.

[0030] The utility model adopts an independent hollow arch-shaped heat dissipation boss 3 and a "C"-shaped heat dissipation plate 4 to be installed in the middle frame 1. The middle frame 1 and the cover plate 2 are made of iron with low price and good thermal conductivity, which avoids wasting too much material, saves materials, reduces costs, and reduces weight. In addition, the middle frame 1 and the cover plate 2 are both provided with a plurality of heat dissipation holes 5, and the heat dissipation effect is good.

[0031] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A middle frame assembly for an automobile, characterized in that: The invention comprises a middle frame and a cover plate installed on the top of the middle frame, wherein an arch-shaped heat dissipation boss is installed on the inner bottom surface of the middle frame, a "C"-shaped heat dissipation plate is installed at the connection between one side of the middle frame and the inner bottom surface, a plurality of heat dissipation holes are evenly opened on the bottom and side of the middle frame, a plurality of heat dissipation holes are evenly opened on the cover plate, a mounting plate perpendicular to the side is bent at the top of the side of the middle frame toward the inner side of the middle frame, a PCB mainboard is placed on the mounting plate, the PCB mainboard contacts the heat dissipation boss and the top of the "C"-shaped heat dissipation plate through a heat-conducting medium for heat conduction, screw holes are arranged at corresponding positions of the cover plate, the PCB mainboard and the mounting plate, and the cover plate is mounted on the top of the middle frame by screws passing through the screw holes of the cover plate, the PCB mainboard and the mounting plate in sequence.

2. The middle frame assembly for an automobile according to claim 1, characterized in that: The heat dissipation boss and the "C"-shaped heat dissipation plate are made of aluminum, and the middle frame and the cover plate are made of iron.

3. The middle frame assembly for an automobile according to claim 1, characterized in that: The heat dissipation boss is a hollow arch structure, which saves materials and has a good heat dissipation effect.

4. The middle frame assembly for an automobile according to claim 1, characterized in that: The heat dissipation boss is mounted on the inner bottom surface of the middle frame by riveting.

5. The middle frame assembly for an automobile according to claim 1, characterized in that: The bottom of the "C"-shaped heat sink is provided with a plurality of heat dissipation holes, the bottom edge of the middle frame is provided with a through groove, the bottom of the "C"-shaped heat sink extends from the inner bottom surface of the middle frame to the outer bottom surface of the middle frame through the through groove, the bottom of the "C"-shaped heat sink is fixed to the outer bottom surface of the middle frame by screws, and the side of the "C"-shaped heat sink is riveted to the inner side edge of the middle frame by rivets.

6. The middle frame assembly for an automobile according to claim 1, characterized in that: The sides and top of the "C"-shaped heat sink are provided with heat sink fins protruding outwards.

7. The middle frame assembly for an automobile according to claim 1, characterized in that: The cover plate is provided with a groove which is sunken toward the inner direction of the middle frame, and the groove is used to fix the PCB mainboard.

8. The middle frame assembly for an automobile according to claim 1, characterized in that: The mounting plate is provided with a positioning column, and a circular hole matching the positioning column is provided at a corresponding position of the cover plate. The cover plate is quickly positioned and installed on the top of the middle frame by the positioning column passing through the circular hole.

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