Power supply integrated control device
By adopting a multi-layer heat dissipation structure and sealing plate design in the power integrated control device, the problems of low heat dissipation efficiency and dust accumulation of existing power integrated control devices are solved, and more efficient heat dissipation and longer working life are achieved.
Patent Information
- Application Number
- CN202421760853.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-24
AI Technical Summary
The existing power integrated control devices have low heat dissipation efficiency, which is prone to high temperature overload risk, and dust accumulates after long-term operation, resulting in damage to the circuit board.
A power integrated control device is designed, adopting a multi-layer heat dissipation structure, including embedding a circuit integrated board case equipped with heat dissipation fins in the outer shell of the device, and adding sealing boards at both ends of the power integrated board to prevent dust from entering. At the same time, multiple fans and heat dissipation fins are equipped on both sides of the device housing to enhance the heat dissipation effect.
Through the multi-layer heat dissipation structure and sealing board design, the probability of dust accumulation on the circuit board surface is significantly reduced, the working life of the circuit board is extended, the heat dissipation efficiency is improved, and the risk of high temperature overload is reduced.
Smart Images
Figure CN222827552U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit control equipment, in particular to a power supply integrated control device. Background Art
[0002] The coordinated control of the power supply system is an important part of the power supply system in the area. It can ensure that each power circuit supplies power to the corresponding area in an orderly manner. Once an unexpected failure occurs, the power integrated control system can quickly control the impact on the power circuit system to the minimum range. Because of its large amount of circuit control load, it usually generates higher heat during operation. At this time, the heat dissipation structure of the control device is particularly important.
[0003] Most of the existing power integrated control devices only rely on heat dissipation holes to achieve air circulation and heat dissipation, and the back side is basically close to the installation surface, so the heat exchange efficiency is low and there is still a risk of high-temperature overload. After long-term operation, dust is easily accumulated on the circuit board, which can easily cause damage to the circuit board.
[0004] In order to solve the above problems, we have made improvements and proposed a power supply integrated control device. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:
[0006] The utility model provides a power supply integrated control device, including a device shell, wherein angle codes are arranged at the left and right ends of the bottom of the front and back surfaces of the device shell and at the left and right ends of the bottom of the left and right sides, the top of each angle code is fixedly welded to the device shell, and the bottom center of the angle code is provided with a threaded hole, a first mounting plate is fixedly welded to the middle of the bottom of the front and back surfaces of the device shell and at the middle of the bottom of the left and right sides, two first heat dissipation boxes are embedded in the middle of the top surface of the device shell, an integrated board outer shell is arranged inside the device shell, a bottom sealing plate is arranged at the bottom of the inside of the device shell, two second heat dissipation boxes are embedded in the middle of the bottom sealing plate, the internal structure of the second heat dissipation box is exactly the same as that of the first heat dissipation box, and the bottom sealing plate is located below the integrated board outer shell.
[0007] As a preferred technical solution of the utility model, ventilation holes are evenly spaced in the middle of the front and back sides of the device housing, and the ventilation holes are distributed in a matrix shape. Wiring port through holes are evenly spaced in the middle of the right side of the device housing.
[0008] As an optimal technical solution of the utility model, the integrated board outer shell is a square tube with openings at both left and right ends. A power circuit integrated board is arranged at the bottom inside the integrated board outer shell. A left sealing plate and a docking sealing plate are respectively fixedly welded at the left and right ends of the top surface of the power circuit integrated board. The left sealing plate and the docking sealing plate are of equal size, and the side area of the docking sealing plate is equal to the opening area at both ends of the integrated board outer shell. A wiring port is arranged on the right side of the docking sealing plate, and the position of each wiring port corresponds to the position of the wiring port through hole of the device housing.
[0009] As a preferred technical solution of the utility model, a small motor is fixedly installed at the bottom center of the first heat dissipation box, a connecting rod is fixedly arranged on the outside of the small motor, the other end of the connecting rod is fixedly connected to the inner wall of the first heat dissipation box, and a fan is arranged at the inner center of the first heat dissipation box, and the central axis of the fan is coaxially fixedly connected to the rotating shaft of the small motor.
[0010] As a preferred technical solution of the utility model, a partition strip is fixedly welded on the top of the side surface of the inner wall of the device shell, and the bottom surface of the partition strip is in contact with the left and right ends of the top surface of the outer surface of the integrated board outer shell. Heat dissipation fins are fixedly welded at equal intervals on the front and back surfaces, the top surface and the bottom surface of the outer surface of the integrated board outer shell. The heat dissipation fins on the top surface of the integrated board outer shell pass through the space enclosed by the partition strips and are close to the first heat dissipation box, and the left and right sides of the heat dissipation fins on the top surface of the integrated board outer shell are in contact with the inner surface of the partition strips.
[0011] As a preferred technical solution of the utility model, a second mounting plate is fixedly welded to the middle of the left and right ends and the middle of the front and rear ends of the bottom surface of the bottom sealing plate, the top surface of the second mounting plate is connected to the first mounting plate, the centers of the first mounting plate and the second mounting plate are provided with threaded holes and are fixedly connected to each other by bolts, the bottom sealing plate is fixedly connected to the device casing through the first mounting plate and the second mounting plate, and the heat dissipation fins on the bottom surface of the integrated board outer casing are close to the second heat dissipation box.
[0012] The beneficial effects of the utility model are as follows: in this power integrated control device, a circuit integrated board shell equipped with a large number of heat dissipation fins is added to the outer shell of the integrated control device, and sealing plates are added at both ends of the power integrated board, which greatly reduces the probability of dust entering the surface of the circuit board, can keep its surface clean for a long time, and extend its service life. At the same time, the device shell is equipped with multiple fans on both sides with a large number of heat dissipation fins, which enhances the heat dissipation effect when the device is running, and further plays a maintenance effect on the power circuit integrated board. The bolts are combined with the plug-in docking structure to make disassembly and assembly more convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0014] Figure 1 It is a structural schematic diagram of a power supply integrated control device of the utility model;
[0015] Figure 2 It is a right side structural schematic diagram of a power supply integrated control device of the utility model;
[0016] Figure 3 It is a schematic diagram of the top view of a power supply integrated control device of the utility model;
[0017] Figure 4 It is a cross-sectional structural schematic diagram of a power supply integrated control device of the utility model;
[0018] Figure 5 It is a schematic diagram of the left side structure of an integrated board outer shell of a power integrated control device of the utility model;
[0019] Figure 6 It is a schematic diagram of the extraction structure of a power circuit integrated board of a power integrated control device of the utility model;
[0020] In the figure: 1. device housing; 2. ventilation holes; 3. wiring port through holes; 4. corner brackets; 5. first mounting plate; 6. first heat sink; 7. small motor; 8. fan; 9. partition slats; 10. integrated board outer housing; 11. heat sink fins; 12. power circuit integrated board; 13. docking sealing plate; 14. bottom sealing plate; 15. second heat sink; 16. second mounting plate. DETAILED DESCRIPTION
[0021] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0022] Example: Figure 1-6As shown, a power integrated control device includes a device shell 1, and angle codes 4 are provided at the left and right ends of the bottom of the front and back sides of the device shell 1 and the left and right ends of the bottom of the left and right sides. The top of each angle code 4 is fixedly welded to the device shell 1, and a threaded hole is opened in the bottom center of the angle code 4. A first mounting plate 5 is fixedly welded to the middle of the bottom of the front and back sides of the device shell 1 and the middle of the bottom of the left and right sides. Two first heat dissipation boxes 6 are embedded in the middle of the top surface of the device shell 1, and an integrated board outer shell 10 is provided inside the device shell 1. A bottom sealing plate 14 is provided at the bottom of the inside of the device shell 1, and two second heat dissipation boxes 15 are embedded in the middle of the bottom sealing plate 14. The internal structure of the second heat dissipation box 15 is exactly the same as that of the first heat dissipation box 6, and the bottom sealing plate 14 is located below the integrated board outer shell 10.
[0023] Ventilation holes 2 are evenly spaced in the middle of the front and back sides of the device housing 1 , and the ventilation holes 2 are distributed in a matrix shape. Wiring port through holes 3 are evenly spaced in the middle of the right side of the device housing 1 .
[0024] The integrated board outer shell 10 is a square tube with openings at both ends. A power circuit integrated board 12 is arranged at the bottom inside the integrated board outer shell 10. The length of the power circuit integrated board 12 is equal to the length of the integrated board outer shell 10. A left sealing plate and a docking sealing plate 13 are fixedly welded on the left and right ends of the top surface of the power circuit integrated board 12 respectively. The left sealing plate and the docking sealing plate 13 are equal in size. The side area of the docking sealing plate 13 is equal to the opening area at both ends of the integrated board outer shell 10. A wiring port is arranged on the right side of the docking sealing plate 13. The position of each wiring port corresponds to the position of the wiring port through hole 3 of the device housing 1.
[0025] A small motor 7 is fixedly installed at the bottom center of the first heat dissipation box 6, a connecting rod is fixedly set on the outside of the small motor 7, and the other end of the connecting rod is fixedly connected to the inner wall of the first heat dissipation box 6. A fan 8 is set at the inner center of the first heat dissipation box 6, and the central axis of the fan 8 is coaxially fixedly connected to the rotating shaft of the small motor 7.
[0026] A partition slat 9 is fixedly welded around the top of the inner wall side surface of the device shell 1, and the bottom surface of the partition slat 9 contacts the left and right ends of the top surface of the outer surface of the integrated board outer shell 10. Heat dissipation fins 11 are fixedly welded at equal intervals on the front and back surfaces, top surface and bottom surface of the outer surface of the integrated board outer shell 10. The heat dissipation fins 11 on the top surface of the integrated board outer shell 10 pass through the space enclosed by the partition slat 9 and are close to the first heat dissipation box 6, and the left and right sides of the heat dissipation fins 11 on the top surface of the integrated board outer shell 10 are in contact with the inner surface of the partition slat 9.
[0027] A second mounting plate 16 is fixedly welded to the middle of the left and right ends and the middle of the front and rear ends of the bottom surface of the bottom sealing plate 14. The top surface of the second mounting plate 16 is connected to the first mounting plate 5. The centers of the first mounting plate 5 and the second mounting plate 16 are provided with threaded holes and are fixedly connected to each other by bolts. The bottom sealing plate 14 is fixedly connected to the device housing 1 through the first mounting plate 5 and the second mounting plate 16. The heat dissipation fins 11 on the bottom surface of the integrated board outer shell 10 are close to the second heat dissipation box 15.
[0028] Working principle: When using this power integrated control device, first align the left side cover plate of the power circuit integrated board 12 with the opening of the integrated board outer shell 10 and insert it until the left side cover plate and the docking cover plate 13 are just aligned with the two openings of the integrated board outer shell 10, then align the heat dissipation fins 11 of the integrated board outer shell 10 with the through openings of the partition slats 9 and insert them against the partition slats 9, then dock the bottom cover plate 14 with the bottom end of the inside of the device shell 1, align the first mounting plates 5 and the second mounting plates 16 and install and tighten the bolts and nuts, then continue to use the bolts and nuts to install the device shell 1 at the required position through the angle code 4, finally dock each connecting wire with the wiring port of the docking cover plate 13 through the wiring port through hole 3, start the small motors 7 of the first heat dissipation box 6 and the second heat dissipation box 15, and drive the fan 8 to start rotating to dissipate heat.
[0029] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A power integrated control device, comprising a device housing (1), characterized in that: Corner codes (4) are provided at the left and right ends of the bottom of the front and back sides of the device shell (1) and at the left and right ends of the bottom of the left and right sides. The top of each corner code (4) is fixedly welded to the device shell (1), and the center of the bottom of the corner code (4) is provided with a threaded hole. A first mounting plate (5) is fixedly welded to the middle of the bottom of the front and back sides of the device shell (1) and at the middle of the bottom of the left and right sides. Two first heat dissipation boxes (6) are embedded in the middle of the top surface of the device shell (1). An integrated board outer shell (10) is provided inside the device shell (1). A bottom sealing plate (14) is provided at the bottom of the inside of the device shell (1). Two second heat dissipation boxes (15) are embedded in the middle of the bottom sealing plate (14). The internal structure of the second heat dissipation box (15) is completely the same as that of the first heat dissipation box (6). The bottom sealing plate (14) is located below the integrated board outer shell (10).
2. A power integrated control device according to claim 1, characterized in that: Ventilation holes (2) are evenly spaced in the middle of the front and back surfaces of the device housing (1), and the ventilation holes (2) are distributed in a matrix shape. Wiring port through holes (3) are evenly spaced in the middle of the right side of the device housing (1).
3. A power integrated control device according to claim 2, characterized in that: The integrated board outer shell (10) is a square tube with openings at both ends. A power circuit integrated board (12) is arranged at the bottom of the integrated board outer shell (10). A left sealing plate and a butt sealing plate (13) are respectively fixedly welded at the left and right ends of the top surface of the power circuit integrated board (12). The left sealing plate and the butt sealing plate (13) are of equal size. The side area of the butt sealing plate (13) is equal to the opening area at both ends of the integrated board outer shell (10). A wiring port is arranged on the right side of the butt sealing plate (13). The position of each wiring port corresponds to the position of the wiring port through hole (3) of the device housing (1).
4. A power integrated control device according to claim 1, characterized in that: A small motor (7) is fixedly installed at the bottom center of the first heat dissipation box (6), a connecting rod is fixedly arranged outside the small motor (7), and the other end of the connecting rod is fixedly connected to the inner wall of the first heat dissipation box (6), and a fan (8) is arranged at the center of the first heat dissipation box (6), and the central axis of the fan (8) is coaxially fixedly connected to the rotating shaft of the small motor (7).
5. A power integrated control device according to claim 1, characterized in that: A partition strip (9) is fixedly welded around the top of the inner wall side surface of the device housing (1), and the bottom surface of the partition strip (9) contacts the left and right ends of the top surface of the outer surface of the integrated board outer shell (10). Heat dissipation fins (11) are fixedly welded at equal intervals on the front and back surfaces, the top surface and the bottom surface of the outer surface of the integrated board outer shell (10). The heat dissipation fins (11) on the top surface of the integrated board outer shell (10) pass through the space enclosed by the partition strip (9) and are close to the first heat dissipation box (6), and the left and right sides of the heat dissipation fins (11) on the top surface of the integrated board outer shell (10) are in contact with the inner surface of the partition strip (9).
6. A power integrated control device according to claim 5, characterized in that: A second mounting plate (16) is fixedly welded at the middle of the left and right ends and the middle of the front and rear ends of the bottom surface of the bottom sealing plate (14); the top surface of the second mounting plate (16) is in contact with the first mounting plate (5); threaded holes are provided at the centers of the first mounting plate (5) and the second mounting plate (16) and are fixedly connected to each other by bolts; the bottom sealing plate (14) is fixedly connected to the device housing (1) through the first mounting plate (5) and the second mounting plate (16); and the heat dissipation fins (11) on the bottom surface of the integrated board outer housing (10) are close to the second heat dissipation box (15).