Heat dissipation structure, power module and electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation structure, a power module and electronic equipment. The heat dissipation structure comprises an upper heat dissipation plate and a lower heat dissipation plate, the upper heat dissipation plate and the lower heat dissipation plate are oppositely arranged, a heat dissipation flow channel is formed between the upper heat dissipation plate and the lower heat dissipation plate, a plurality of upper heat dissipation fin needles are arranged on the face, facing the lower heat dissipation plate, of the upper heat dissipation plate, and a plurality of lower heat dissipation fin needles are arranged on the face, facing the upper heat dissipation plate, of the lower heat dissipation plate. And the upper radiating fin needles and the lower radiating fin needles are staggered with each other. Through the upper heat dissipation plate and the lower heat dissipation plate, the arrangement number of the power elements on the heat dissipation structure is increased, the upper heat dissipation fin needles and the lower heat dissipation fin needles are mutually staggered, the height of the heat dissipation structure can be reduced, the volume utilization rate of the heat dissipation structure is improved, the density of the heat dissipation fin needles on the single upper heat dissipation plate or the single lower heat dissipation plate is reduced, the manufacturing difficulty is reduced, and the product yield is improved; the upper heat dissipation fin needles and the lower heat dissipation fin needles are arranged in a staggered mode, turbulence of cooling liquid in a heat dissipation flow channel is reduced, pressure drop is reduced, and heat exchange efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation structure, a power module and an electronic device. Background Art

[0002] With the development of science and technology, the use of electronic components is increasing, and their applications are becoming more and more extensive. The demand for high-power electronic components is also increasing. The power requirements of power modules are getting higher and higher, and at the same time, they require lightweight and miniaturization, which makes the heat dissipation requirements of power modules higher and higher.

[0003] Due to the large heat dissipation demand, the existing heat sink occupies too large a volume, and in order to improve the heat dissipation efficiency, the density of the fin pins on the heat sink is also relatively large, resulting in great manufacturing difficulty. Utility Model Content

[0004] Based on this, the present application provides a heat dissipation structure, a power module and an electronic device to solve the problem that the heat dissipation plate occupies a large volume and the high density of fin pins causes manufacturing difficulty.

[0005] In one aspect, the present application provides a heat dissipation structure, comprising:

[0006] An upper heat sink and a lower heat sink, the upper heat sink and the lower heat sink are arranged opposite to each other, and a heat dissipation channel is formed between the upper heat sink and the lower heat sink;

[0007] The side of the upper heat sink facing away from the lower heat sink is used to set the power element, and the side of the upper heat sink facing the lower heat sink is provided with a plurality of upper heat sink pins, the side of the lower heat sink facing away from the upper heat sink is used to set the power element, and the side of the lower heat sink facing the upper heat sink is provided with a plurality of lower heat sink pins;

[0008] The upper heat dissipation fin pins and the lower heat dissipation fin pins are interlaced with each other.

[0009] In a possible implementation, there is a gap between the upper heat dissipation fins and the lower heat dissipation plate; and / or,

[0010] There is a gap between the lower heat dissipation fin pins and the upper heat dissipation plate.

[0011] In a possible implementation, the interval ranges from 0.5 mm to 1 mm.

[0012] In a possible implementation, the ends of the upper heat dissipation fins away from the upper heat dissipation plate are located in the same plane; and / or,

[0013] The ends of the lower heat dissipation fin pins away from the lower heat dissipation plate are located in the same plane.

[0014] In a possible implementation, the length of the upper heat dissipation fin pins ranges from 5 mm to 8 mm; and / or,

[0015] The length of the lower heat sink pins ranges from 5mm to 8mm.

[0016] In a possible implementation, on the upper heat dissipation plate, orthographic projections of a plurality of upper heat dissipation fin pins and orthographic projections of a plurality of lower heat dissipation fin pins are evenly arranged.

[0017] In a possible implementation, the spacing between the orthographic projections of the plurality of upper heat dissipating fin pins and the orthographic projections of the plurality of lower heat dissipating fin pins is in a range of 1 mm to 1.5 mm.

[0018] In a possible implementation, the plurality of upper heat dissipating fin pins are parallel to each other; and / or the plurality of lower heat dissipating fin pins are parallel to each other.

[0019] In a possible implementation, the heat dissipation channel includes a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are arranged opposite to each other along the extension direction of the upper heat dissipation plate.

[0020] In a possible implementation, the plurality of upper heat dissipating fin pins form a group, and the plurality of upper heat dissipating fin pins in a group are arranged along a line connecting the liquid inlet and the liquid outlet; and / or,

[0021] A plurality of lower heat dissipating fin pins form a group, and a plurality of lower heat dissipating fin pins in a group are arranged along a line connecting the liquid inlet and the liquid outlet.

[0022] In a possible implementation, a plurality of upper heat dissipating fin pins form a group, the connection direction of a plurality of upper heat dissipating fin pins in a group is perpendicular to the connection direction between the liquid inlet and the liquid outlet, and the plurality of groups of upper heat dissipating fin pins are arranged along the connection direction between the liquid inlet and the liquid outlet; and / or,

[0023] Multiple lower heat sink pins form a group, and the connection direction of multiple lower heat sink pins in a group is perpendicular to the connection direction between the liquid inlet and the liquid outlet. Multiple groups of lower heat sink pins are arranged along the connection direction between the liquid inlet and the liquid outlet.

[0024] In a possible implementation, a plurality of upper heat dissipating fin pins form a group, the angle between the connection direction of a group of the plurality of upper heat dissipating fin pins and the connection direction between the liquid inlet and the liquid outlet is an acute angle, and the plurality of groups of upper heat dissipating fin pins are arranged along the connection direction between the liquid inlet and the liquid outlet; and / or,

[0025] Multiple lower heat sink pins form a group, and the angle between the connection direction of the multiple lower heat sink pins in a group and the connection direction between the liquid inlet and the liquid outlet is an acute angle. Multiple groups of lower heat sink pins are arranged along the connection direction between the liquid inlet and the liquid outlet.

[0026] In a possible implementation, the upper heat dissipation fin pins are in the shape of an elliptical column; and / or the lower heat dissipation fin pins are in the shape of an elliptical column.

[0027] In a possible implementation, the long axis direction of the upper heat dissipating fin pin or the lower heat dissipating fin pin is parallel to the direction of the line connecting the liquid inlet and the liquid outlet.

[0028] In a possible implementation, the long axis length of the upper heat dissipating fin pin or the lower heat dissipating fin pin close to the liquid inlet is greater than the long axis length of the upper heat dissipating fin pin or the lower heat dissipating fin pin close to the liquid outlet.

[0029] In a possible implementation, the upper heat dissipation fin pins are cylindrical; and / or the lower heat dissipation fin pins are cylindrical.

[0030] In a possible implementation, the diameter of the upper heat dissipating fin needle or the lower heat dissipating fin needle close to the liquid inlet is larger than the diameter of the upper heat dissipating fin needle or the lower heat dissipating fin needle close to the liquid outlet.

[0031] In one possible implementation, an upper mounting portion is provided on the upper heat sink, and the upper mounting portion is located on a side of the upper heat sink facing away from the lower heat sink. A lower mounting portion is provided on the lower heat sink, and the lower mounting portion is located on a side of the lower heat sink facing away from the upper heat sink. The upper mounting portion and the lower mounting portion are used to set power components.

[0032] In a possible implementation, the upper mounting portion is opposite to the lower mounting portion; or the upper mounting portion is staggered with the lower mounting portion.

[0033] In a possible implementation, the plurality of upper mounting parts are arranged along a line connecting the liquid inlet and the liquid outlet; and / or,

[0034] A plurality of lower mounting parts are arranged along a line connecting the liquid inlet and the liquid outlet.

[0035] In a possible implementation, the thickness of the upper heat sink is in the range of 2.5 mm to 3.5 mm; and / or,

[0036] The thickness of the lower heat sink ranges from 2.5mm to 3.5mm.

[0037] In a possible implementation, the upper heat dissipation plate and the upper heat dissipation fins are integrally formed; and / or,

[0038] The lower heat sink and the lower heat sink pins are integrally formed.

[0039] In a possible implementation, the upper heat dissipation plate and the lower heat dissipation plate have the same structure.

[0040] On the other hand, the present application provides a power module, including a power element and the above-mentioned heat dissipation structure, wherein the power element is arranged on an upper heat dissipation plate or a lower heat dissipation plate.

[0041] On the other hand, the present application provides an electronic device, comprising the above-mentioned power module.

[0042] The heat dissipation structure, power module and electronic device provided by the present application. By arranging the upper heat dissipation plate and the lower heat dissipation plate relative to each other and arranging power elements on the upper heat dissipation plate and the lower heat dissipation plate, the number of power elements arranged on the heat dissipation structure is increased. At the same time, a plurality of upper heat dissipation fins are arranged on the upper heat dissipation plate, and a plurality of lower heat dissipation fins are arranged on the lower heat dissipation plate, so that the upper heat dissipation fins and the lower heat dissipation fins are staggered with each other, thereby reducing the height of the heat dissipation structure, thereby improving the volume utilization rate of the heat dissipation structure, and the arrangement of the upper heat dissipation fins and the lower heat dissipation fins in the heat dissipation flow channel can be the same as the density of the fins on the existing heat dissipation plate, but the density of the heat dissipation fins on a single upper heat dissipation plate or a lower heat dissipation plate is significantly reduced, which can reduce the manufacturing difficulty and improve the product yield. The staggered arrangement of the upper heat dissipation fins and the lower heat dissipation fins can also reduce the turbulence of the coolant in the heat dissipation flow channel, thereby reducing the pressure drop and improving the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0044] Figure 1 A schematic diagram of the structure of a power module provided in an embodiment of the present application;

[0045] Figure 2 for Figure 1 A schematic diagram of the structure of the upper heat sink in the power module shown;

[0046] Figure 3 for Figure 1 One of the schematic diagrams of the arrangement structure of the upper heat dissipation fin pins and the lower heat dissipation fin pins in the power module shown;

[0047] Figure 4 for Figure 1 The second schematic diagram of the arrangement structure of the upper heat dissipation fin pins and the lower heat dissipation fin pins in the power module shown;

[0048] Figure 5 for Figure 1 The third schematic diagram of the arrangement structure of the upper heat dissipation fin pins and the lower heat dissipation fin pins in the power module shown.

[0049] Description of reference numerals:

[0050] 100-heat dissipation structure; 10-upper heat dissipation plate; 11-upper heat dissipation fins; 12-upper mounting portion; 20-lower heat dissipation plate; 21-lower heat dissipation fins; 22-lower mounting portion; 30-heat dissipation channel; 31-liquid inlet; 32-liquid outlet; 200-power module; 201-power element. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme in the embodiment of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. The embodiments of the present application are described in detail below in conjunction with the drawings.

[0052] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0054] The terms "first", "second" and "third" (if any) in the specification and claims of this application and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0055] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or display comprising a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or display.

[0056] With the development of science and technology, the use of electronic components is increasing, and their applications are becoming more and more extensive. The demand for high-power electronic components is also increasing. The power requirements of power modules are getting higher and higher, and at the same time, they require lightweight and miniaturization, which makes the heat dissipation requirements of power modules higher and higher.

[0057] Due to the large heat dissipation demand, the existing heat sink occupies too large a volume, and in order to improve the heat dissipation efficiency, the density of the fin pins on the heat sink is also relatively large, resulting in great manufacturing difficulty.

[0058] After repeated thinking and verification, the inventor discovered that if the guide plate used in conjunction with the heat sink in the prior art is replaced with another heat sink, power components can be installed on both heat sinks, and the heat sink fins on the two heat sinks can be staggered with each other, thereby reducing the overall thickness. Compared with two heat sinks arranged side by side, the utilization of the heat dissipation structure is improved, and the heat sink fins on the two heat sinks can be used at the same time. While the density of the heat sink fins remains unchanged, the number of heat sink fins on a single heat sink can be reduced, thereby reducing the manufacturing difficulty and improving the product yield.

[0059] In view of this, the present application provides a heat dissipation structure including an upper heat dissipation plate and a lower heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are arranged opposite to each other, and a heat dissipation channel is formed between the upper heat dissipation plate and the lower heat dissipation plate. A side of the upper heat dissipation plate facing away from the lower heat dissipation plate is used to set a power element, and a side of the upper heat dissipation plate facing the lower heat dissipation plate is provided with a plurality of upper heat dissipation fins, and a side of the lower heat dissipation plate facing away from the upper heat dissipation plate is used to set a power element, and a side of the lower heat dissipation plate facing the upper heat dissipation plate is provided with a plurality of lower heat dissipation fins, and the upper heat dissipation fins and the lower heat dissipation fins are staggered with each other.

[0060] The heat dissipation structure of the present invention is simple and can be used for the production of heat dissipation products, and the production process of heat dissipation products is simple and can be used as the production line of the present invention.

[0061] The contents of the present application will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the contents of the present application more clearly and in detail.

[0062] Figure 1A schematic diagram of the structure of a power module provided in an embodiment of the present application. Figure 2 for Figure 1 Schematic diagram of the structure of the upper heat sink in the power module shown. Figure 3 for Figure 1 One of the schematic diagrams of the arrangement structure of the upper heat dissipation fin pins and the lower heat dissipation fin pins in the power module shown. Figure 4 for Figure 1 The second schematic diagram of the arrangement structure of the upper heat dissipation fin pins and the lower heat dissipation fin pins in the power module shown. Figure 5 for Figure 1 The third schematic diagram of the arrangement structure of the upper heat dissipation fin pins and the lower heat dissipation fin pins in the power module shown.

[0063] like Figure 1 and Figure 2 As shown, the heat dissipation structure 100 provided in the embodiment of the present application is used in a power module 200. The heat dissipation structure 100 includes an upper heat dissipation plate 10 and a lower heat dissipation plate 20. The upper heat dissipation plate 10 and the lower heat dissipation plate 20 are respectively used to set a power element 201. The upper heat dissipation plate 10 and the lower heat dissipation plate 20 are arranged opposite to each other. A heat dissipation channel 30 is formed between the upper heat dissipation plate 10 and the lower heat dissipation plate 20. The heat dissipation channel 30 is used for the flow of a heat exchange medium, that is, a coolant, such as cooling water, cooling oil or coolant.

[0064] like Figure 1 As shown, the side of the upper heat sink 10 facing away from the lower heat sink 20 is used to set a power element 201, such as a chip. The side of the upper heat sink 10 facing the lower heat sink 20 is provided with a plurality of upper heat sink fins 11. The upper heat sink fins 11 are located in the heat sink flow channel 30, and the upper heat sink fins 11 are used to contact the heat exchange medium in the heat sink flow channel 30, so as to transfer the temperature of the power element 201 set on the upper heat sink 10 through heat exchange with the heat exchange medium, thereby achieving the heat dissipation function.

[0065] The side of the lower heat sink 20 facing away from the upper heat sink 10 is used to set the power element 201, and the side of the lower heat sink 20 facing the upper heat sink 10 is provided with a plurality of lower heat sink fins 21. The lower heat sink fins 21 are located in the heat sink flow channel 30, and the lower heat sink fins 21 are used to contact the heat exchange medium in the heat sink flow channel 30, so as to transfer the temperature of the power element 201 set on the lower heat sink 20 through heat exchange with the heat exchange medium, thereby realizing the heat dissipation function.

[0066] In the heat dissipation channel 30 , the upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 are interlaced with each other.

[0067] The upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 are staggered with each other, so that the upper heat dissipation plate 10 and the lower heat dissipation plate 20 are arranged close to each other, thereby reducing the height of the heat dissipation structure 100. In addition, the upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 staggered in the heat dissipation channel 30 can also reduce the turbulence of the heat exchange medium such as the coolant in the heat dissipation channel 30, thereby reducing the pressure drop of the heat exchange medium flowing in the heat dissipation channel 30, and can also improve the heat exchange efficiency.

[0068] Please also see Figure 2 In a possible implementation, an upper mounting portion 12 is provided on the upper heat sink 10. The upper mounting portion 12 is located on a side of the upper heat sink 10 facing away from the lower heat sink 20, that is, the upper mounting portion 12 and the upper heat sink fins 11 are located on opposite sides of the upper heat sink 10. The upper mounting portion 12 is used to set the power element 201.

[0069] The lower heat sink 20 is provided with a lower mounting portion 22. The lower mounting portion 22 is located on the side of the lower heat sink 20 away from the upper heat sink 10, that is, the lower mounting portion 22 and the lower heat sink fins 21 are located on the opposite side of the lower heat sink 20. The lower mounting portion 22 is used to mount the power element 201.

[0070] The arrangement of the upper mounting portion 12 and the lower mounting portion 22 can facilitate the design of the connection position with the upper heat sink 10 or the lower heat sink 20 according to the size and shape of the power element 201, thereby improving the stability of the connection.

[0071] like Figure 1 As shown, in a possible implementation, the heat dissipation channel 30 includes a liquid inlet 31 and a liquid outlet 32. The liquid inlet 31 is used for the inflow of heat exchange medium. The liquid outlet 32 ​​is used for the outflow of heat exchange medium. That is, the heat exchange medium, such as cooling water, cooling oil or coolant, flows into the heat dissipation channel 30 of the heat dissipation structure 100 from the liquid inlet 31, and contacts with the upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 in the heat dissipation channel 30, absorbs the heat transferred by the power components 201 arranged on the upper heat dissipation plate 10 and the lower heat dissipation plate 20, and then flows out from the liquid outlet 32 ​​side of the heat dissipation channel 30.

[0072] Optionally, the liquid inlet 31 and the liquid outlet 32 ​​are arranged opposite to each other along the extension direction of the upper heat sink 10. In the embodiment of the present application, the liquid inlet 31 is on the left side of the heat dissipation structure 100, and the liquid outlet 32 ​​is on the right side.

[0073] In a possible implementation, the upper mounting portion 12 and the lower mounting portion 22 are disposed opposite to each other.

[0074] In another possible implementation, the upper mounting portion 12 and the lower mounting portion 22 are arranged alternately.

[0075] like Figure 2As shown, in a possible implementation, a plurality of upper mounting portions 12 are arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0076] Optionally, a plurality of upper mounting portions 12 are evenly arranged in the direction of a line between the liquid inlet 31 and the liquid outlet 32 ​​.

[0077] In a possible implementation, the plurality of lower mounting portions 22 are arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0078] Optionally, a plurality of lower mounting portions 22 are evenly arranged in the direction of a line between the liquid inlet 31 and the liquid outlet 32 ​​.

[0079] In another possible implementation, the plurality of upper mounting portions 12 or the plurality of lower mounting portions 22 are arranged perpendicular to the direction of the line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0080] Optionally, the plurality of upper mounting portions 12 or the plurality of lower mounting portions 22 are evenly arranged in a direction perpendicular to a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0081] In a possible implementation, a plurality of upper mounting portions 12 are evenly disposed on the upper heat dissipation plate 10 , and a plurality of lower mounting portions 22 are evenly disposed on the lower heat dissipation plate 20 .

[0082] The evenly arranged upper mounting portion 12 and lower mounting portion 22 can improve the processing efficiency of the heat sink 100 and can be evenly connected to the power element 201, so that the upper heat sink 10 and the lower heat sink 20 can be stably connected to the power element 201 and provide more even heat dissipation for the power element 201.

[0083] like Figure 1 As shown, in a possible implementation, there is a gap between the upper heat dissipation fin pins 11 and the lower heat dissipation plate 20. There is also a gap between the lower heat dissipation fin pins 21 and the upper heat dissipation plate 10.

[0084] In a possible implementation, the interval ranges from 0.5 mm to 1 mm, thereby reducing the pressure drop caused by the longitudinal flow of the heat exchange medium.

[0085] In a possible implementation, ends of the upper heat dissipating fins 11 away from the upper heat dissipating plate 10 are located in the same plane.

[0086] Optionally, a plane where one end of the upper heat dissipating fin 11 away from the upper heat dissipating plate 10 is located is parallel to the surface of the upper heat dissipating plate 10 or the direction of a line between the liquid inlet 31 and the liquid outlet 32 ​​.

[0087] The ends of the upper heat dissipating fins 11 away from the upper heat dissipating plate 10 are located in the same plane, which can facilitate the processing and manufacturing of the upper heat dissipating fins 11 on the plate body, improve the processing efficiency, and facilitate product management.

[0088] In a possible implementation, the ends of the lower heat dissipating fins 21 away from the lower heat dissipating plate 20 are located in the same plane.

[0089] Optionally, a plane where one end of the lower heat dissipating fin 21 away from the lower heat dissipating plate 20 is located is parallel to the surface of the lower heat dissipating plate 20 or the direction of a line between the liquid inlet 31 and the liquid outlet 32 ​​.

[0090] Optionally, the surface of the upper heat dissipation plate 10 is parallel to the surface of the lower heat dissipation plate 20 .

[0091] In a possible implementation, the length of the upper heat dissipation fin pins 11 ranges from 5 mm to 8 mm.

[0092] Optionally, the lengths of the plurality of upper heat dissipation fin pins 11 on the upper heat dissipation plate 10 are the same, thereby facilitating processing and manufacturing.

[0093] In a possible implementation, the length of the lower heat dissipation fin pin 21 ranges from 5 mm to 8 mm.

[0094] Optionally, the lengths of the plurality of lower heat dissipating fin pins 21 on the lower heat dissipating plate 20 are the same, thereby facilitating processing and manufacturing.

[0095] like Figures 3 to 5 As shown, in a possible implementation, on the upper heat dissipation plate 10 or the lower heat dissipation plate 20 , the orthographic projections of the plurality of upper heat dissipation fin pins 11 and the orthographic projections of the plurality of lower heat dissipation fin pins 21 are evenly arranged.

[0096] The orthographic projection of the upper heat dissipating fin pins 11 and the orthographic projection of the lower heat dissipating fin pins 21 are evenly arranged, that is, in the heat dissipating flow channel 30 , the contact between the heat exchange medium and the heat dissipating fin pins is even.

[0097] In a possible implementation, the spacing between the orthographic projections of the plurality of upper heat dissipating fin pins 11 and the orthographic projections of the plurality of lower heat dissipating fin pins 21 is in a range of 1 mm to 1.5 mm.

[0098] like Figure 1 As shown, in a possible implementation, a plurality of upper heat dissipation fin pins 11 are parallel to each other.

[0099] In a possible implementation, the plurality of lower heat dissipation fin pins 21 are parallel to each other.

[0100] Optionally, the plurality of upper heat dissipating fin pins 11 and the plurality of lower heat dissipating fin pins 21 are parallel to each other.

[0101] Optionally, the extension direction of the upper heat dissipating fin pin 11 or the lower heat dissipating fin pin 21 is perpendicular to the direction of the line between the liquid inlet 31 and the liquid outlet 32, which can reduce the resistance of the coolant when flowing between the upper heat dissipating fin pin 11 or the lower heat dissipating fin pin 21, reduce the formation of vortex, and thus reduce the impact on the pressure drop of the heat exchange medium.

[0102] like Figure 3 As shown, in a possible implementation, a plurality of upper heat dissipating fin pins 11 form a group, and a plurality of upper heat dissipating fin pins 11 in a group are arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0103] Optionally, a group of multiple upper heat dissipation fin pins 11 are evenly arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0104] Two adjacent groups of upper heat dissipating fin pins 11 may be arranged alternately along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0105] In a possible implementation, the plurality of lower heat dissipating fin pins 21 form a group, and the plurality of lower heat dissipating fin pins 21 in a group are arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0106] Optionally, a group of multiple lower heat dissipation fin pins 21 are evenly arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0107] Two adjacent groups of lower heat dissipating fin pins 21 may be arranged alternately along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0108] like Figure 4 As shown, in a possible implementation, a plurality of upper heat dissipating fin pins 11 form a group, and the connection direction of a plurality of upper heat dissipating fin pins 11 in a group is perpendicular to the connection direction between the liquid inlet 31 and the liquid outlet 32. A plurality of groups of upper heat dissipating fin pins 11 are arranged along the connection direction between the liquid inlet 31 and the liquid outlet 32.

[0109] Optionally, a plurality of groups of upper heat dissipating fin pins 11 are evenly arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0110] Optionally, a group of multiple upper heat dissipation fin pins 11 are evenly arranged along a direction perpendicular to a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0111] In a possible implementation, the plurality of lower heat dissipating fin pins 21 form a group, and the connection direction of the plurality of lower heat dissipating fin pins 21 in a group is perpendicular to the connection direction between the liquid inlet 31 and the liquid outlet 32. The plurality of groups of lower heat dissipating fin pins 21 are arranged along the connection direction between the liquid inlet 31 and the liquid outlet 32.

[0112] Optionally, a plurality of groups of lower heat dissipating fin pins 21 are evenly arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0113] Optionally, a group of multiple lower heat dissipation fin pins 21 are evenly arranged along a direction perpendicular to a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0114] like Figure 5 As shown, in a possible implementation, a plurality of upper heat dissipating fin needles 11 form a group, and the angle between the connection direction of a group of upper heat dissipating fin needles 11 and the connection direction between the liquid inlet 31 and the liquid outlet 32 ​​is an acute angle, and the plurality of groups of upper heat dissipating fin needles 11 are arranged along the connection direction between the liquid inlet 31 and the liquid outlet 32.

[0115] Optionally, a plurality of groups of upper heat dissipation fin pins 11 are evenly arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0116] Optionally, a group of multiple upper heat dissipation fin pins 11 are evenly arranged along the connection direction thereof.

[0117] In one possible implementation, multiple lower heat dissipating fin needles 21 form a group, and the angle between the connection direction of a group of multiple lower heat dissipating fin needles 21 and the connection direction between the liquid inlet 31 and the liquid outlet 32 ​​is an acute angle, and multiple groups of lower heat dissipating fin needles 21 are arranged along the connection direction between the liquid inlet 31 and the liquid outlet 32.

[0118] Optionally, a plurality of groups of lower heat dissipating fin pins 21 are evenly arranged along a line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0119] Optionally, a group of multiple lower heat dissipation fin pins 21 are evenly arranged along the connection direction thereof.

[0120] In a possible implementation, the upper heat dissipation fin pin 11 is cylindrical.

[0121] In a possible implementation, the diameter of the upper heat dissipating fin needle 11 close to the liquid inlet 31 is greater than the diameter of the upper heat dissipating fin needle 11 close to the liquid outlet 32 ​​.

[0122] In a possible implementation, the lower heat dissipation fin pin 21 is cylindrical.

[0123] The cylindrical upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 can facilitate the flow of the coolant, thereby reducing the formation of eddy currents.

[0124] In a possible implementation, the diameter of the lower heat dissipating fin pin 21 close to the liquid inlet 31 is greater than the diameter of the lower heat dissipating fin pin 21 close to the liquid outlet 32 ​​.

[0125] In a possible implementation, the upper heat sink pin 11 and the lower heat sink pin 21 are both cylindrical. The diameter of the upper heat sink pin 11 or the lower heat sink pin 21 near the liquid inlet 31 is larger than the diameter of the upper heat sink pin 11 or the lower heat sink pin 21 near the liquid outlet 32.

[0126] By setting the diameters of the upper heat sink fins 11 and the lower heat sink fins 21 to be smaller near the liquid outlet 32, the cross-sectional area of ​​the heat sink channel 30 at the corresponding position can be increased, and the volume of the cavity in the heat sink channel 30 can be increased. This can reduce the fluid pressure drop of the coolant, and help improve the heat dissipation capacity of the area. Therefore, it is possible to reduce the temperature of the power element 201 near the liquid outlet 32 ​​and reduce the temperature difference between the power elements 201.

[0127] It is understandable that in other possible implementations, the shapes of the upper heat dissipating fins 11 and the lower heat dissipating fins 21 are not limited thereto. As long as the volumes of the upper heat dissipating fins 11 and the lower heat dissipating fins 21 on one side of the liquid outlet 32 ​​can be reduced and the volume of the cavity at the corresponding position can be increased, the temperature difference between the power elements 201 can be reduced.

[0128] In a possible implementation, the upper heat dissipation fin pin 11 is in an elliptical column shape.

[0129] In a possible implementation, the long axis direction of the upper heat dissipation fin pin 11 is parallel to the direction of the line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0130] In a possible implementation, the long axis length of the upper heat dissipating fin pin 11 close to the liquid inlet 31 is greater than the long axis length of the upper heat dissipating fin pin 11 close to the liquid outlet 32 ​​.

[0131] In a possible implementation, the lower heat dissipation fin pin 21 is in an elliptical column shape.

[0132] In a possible implementation, the long axis direction of the lower heat dissipation fin pin 21 is parallel to the direction of the line connecting the liquid inlet 31 and the liquid outlet 32 ​​.

[0133] In a possible implementation, the long axis length of the lower heat dissipating fin pin 21 close to the liquid inlet 31 is greater than the long axis length of the lower heat dissipating fin pin 21 close to the liquid outlet 32 ​​.

[0134] In a possible implementation, the upper heat dissipating fin pin 11 and the lower heat dissipating fin pin 21 are both elliptical. The long axis direction of the upper heat dissipating fin pin 11 and the lower heat dissipating fin pin 21 are parallel to the direction of the line between the liquid inlet 31 and the liquid outlet 32. The long axis length of the upper heat dissipating fin pin 11 or the lower heat dissipating fin pin 21 close to the liquid inlet 31 is greater than the long axis length of the upper heat dissipating fin pin 11 or the lower heat dissipating fin pin 21 close to the liquid outlet 32.

[0135] In a possible implementation, the thickness of the upper heat dissipation plate 10 is in the range of 2.5 mm to 3.5 mm.

[0136] In a possible implementation, the thickness of the lower heat dissipation plate 20 is in the range of 2.5 mm to 3.5 mm.

[0137] In a possible implementation, the upper heat sink 10 , the upper heat sink fins 11 , and the upper mounting portion 12 are integrally formed.

[0138] In a possible implementation, the lower heat dissipation plate 20 , the lower heat dissipation fins 21 , and the lower mounting portion 22 are integrally formed.

[0139] The integrally formed upper heat sink 10, upper heat sink fins 11 and upper mounting portion 12, lower heat sink 20, lower heat sink fins 21 and lower mounting portion 22 can be easily processed, and can reduce the temperature transfer loss between the upper heat sink fins 11 and the upper mounting portion 12, and between the lower heat sink fins 21 and the lower mounting portion 22, thereby improving the heat dissipation effect.

[0140] In a possible implementation, the upper heat dissipation plate 10 and the lower heat dissipation plate 20 have the same structure.

[0141] By making the upper heat sink 10 and the lower heat sink 20 have the same structural design, there is no need to process and manufacture them separately using different processing devices, and there is no need to distinguish them during installation, which facilitates assembly and use.

[0142] The heat dissipation structure 100 provided in the embodiment of the present application includes an upper heat dissipation plate 10 and a lower heat dissipation plate 20. The upper heat dissipation plate 10 and the lower heat dissipation plate 20 are arranged opposite to each other. A heat dissipation channel 30 is formed between the upper heat dissipation plate 10 and the lower heat dissipation plate 20. The side of the upper heat dissipation plate 10 facing away from the lower heat dissipation plate 20 is used to set the power element 201. The side of the upper heat dissipation plate 10 facing the lower heat dissipation plate 20 is provided with a plurality of upper heat dissipation fins 11. The side of the lower heat dissipation plate 20 facing away from the upper heat dissipation plate 10 is used to set the power element 201. The side of the lower heat dissipation plate 20 facing the upper heat dissipation plate 10 is provided with a plurality of lower heat dissipation fins 21. The upper heat dissipation fins 11 and the lower heat dissipation fins 21 are staggered with each other.

[0143] By arranging the upper heat sink 10 and the lower heat sink 20 opposite to each other, and arranging the power element 201 on the upper heat sink 10 and the lower heat sink 20, the number of power elements 201 arranged on the heat sink structure 100 is increased. At the same time, a plurality of upper heat sink fins 11 are arranged on the upper heat sink 10, and a plurality of lower heat sink fins 21 are arranged on the lower heat sink 20, so that the upper heat sink fins 11 and the lower heat sink fins 21 are staggered with each other, thereby reducing the height of the heat sink structure 100, thereby improving the volume utilization rate of the heat sink structure 100. In addition, the arrangement of the upper heat sink fins 11 and the lower heat sink fins 21 in the heat sink channel 30 can be the same as the density of the upper heat sink fins on the existing heat sink, but the density of the heat sink fins on a single upper heat sink 10 or lower heat sink 20 is significantly reduced, which can reduce the manufacturing difficulty and improve the product yield. Compared with the existing heat sink, the heat sink structure 100 of the present application reduces the length of the heat sink channel 30, thereby relatively reducing the pressure drop and power loss. The staggered arrangement of the upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 can also reduce the turbulence of the coolant in the heat dissipation channel 30, thereby reducing the pressure drop and improving the heat exchange efficiency. In addition, no guide plate is required, which reduces the types of components used.

[0144] In addition, the embodiment of the present application further provides a power module 200 , including a power element 201 and the above-mentioned heat dissipation structure 100 , wherein the power element 201 is disposed on the upper heat dissipation plate 10 or the lower heat dissipation plate 20 .

[0145] The specific structure, working principle and function of the heat dissipation structure 100 have been described in detail in the above embodiments and will not be repeated here.

[0146] The power element 201 is provided on the upper mounting portion 12 or the lower mounting portion 22 .

[0147] The power element 201 may be a chip, such as a packaged chip, or other electronic components.

[0148] The power module 200 provided in the present application increases the number of power components 201 on the heat dissipation structure 100 by arranging the upper heat dissipation plate 10 and the lower heat dissipation plate 20 opposite to each other, and arranging power components 201 on the upper heat dissipation plate 10 and the lower heat dissipation plate 20. At the same time, a plurality of upper heat dissipation fin pins 11 are arranged on the upper heat dissipation plate 10, and a plurality of lower heat dissipation fin pins 21 are arranged on the lower heat dissipation plate 20, so that the upper heat dissipation fin pins 11 and the lower heat dissipation fin pins 21 are staggered with each other, thereby reducing the height of the heat dissipation structure 100, and further The volume utilization rate of the heat dissipation structure 100 is improved, and the arrangement of the upper heat dissipation fins 11 and the lower heat dissipation fins 21 in the heat dissipation channel 30 can be the same as the density setting of the fins on the existing heat dissipation plate, but the density of the heat dissipation fins on a single upper heat dissipation plate 10 or lower heat dissipation plate 20 is significantly reduced, which can reduce the manufacturing difficulty and improve the product yield. The staggered arrangement of the upper heat dissipation fins 11 and the lower heat dissipation fins 21 can also reduce the turbulence of the coolant in the heat dissipation channel 30, thereby reducing the pressure drop and improving the heat exchange efficiency.

[0149] In addition, an embodiment of the present application further provides an electronic device, including the above-mentioned power module 200.

[0150] The specific structure, working principle and function of the power module 200 have been described in detail in the above embodiments and will not be repeated here.

[0151] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation structure, characterized in that: include: An upper heat sink and a lower heat sink, wherein the upper heat sink is arranged opposite to the lower heat sink, and a heat dissipation channel is formed between the upper heat sink and the lower heat sink; The side of the upper heat sink facing away from the lower heat sink is used to set the power element, the side of the upper heat sink facing the lower heat sink is provided with a plurality of upper heat sink pins, the side of the lower heat sink facing away from the upper heat sink is used to set the power element, and the side of the lower heat sink facing the upper heat sink is provided with a plurality of lower heat sink pins; The upper heat dissipation fin pins and the lower heat dissipation fin pins are staggered with each other.

2. The heat dissipation structure according to claim 1, characterized in that: There is a gap between the upper heat dissipation fins and the lower heat dissipation plate; and / or, There is a gap between the lower heat dissipation fins and the upper heat dissipation plate.

3. The heat dissipation structure according to claim 2, characterized in that: The interval ranges from 0.5 mm to 1 mm.

4. The heat dissipation structure according to claim 1, characterized in that: The ends of the upper heat dissipation fins away from the upper heat dissipation plate are located in the same plane; and / or, One end of the lower heat dissipation fin away from the lower heat dissipation plate is located in the same plane.

5. The heat dissipation structure according to claim 1, characterized in that: The length of the upper heat dissipation fin pins ranges from 5mm to 8mm; and / or, The length of the lower heat dissipation fin pins ranges from 5mm to 8mm.

6. The heat dissipation structure according to claim 1, characterized in that: On the upper heat dissipation plate, the orthographic projections of the plurality of upper heat dissipation fin pins and the orthographic projections of the plurality of lower heat dissipation fin pins are evenly arranged.

7. The heat dissipation structure according to claim 6, characterized in that: The spacing between the orthographic projections of the plurality of upper heat dissipating fin pins and the orthographic projections of the plurality of lower heat dissipating fin pins is in the range of 1 mm to 1.5 mm.

8. The heat dissipation structure according to claim 1, characterized in that: The plurality of upper heat dissipating fin pins are parallel to each other; and / or the plurality of lower heat dissipating fin pins are parallel to each other.

9. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation channel includes a liquid inlet and a liquid outlet, and along the extension direction of the upper heat dissipation plate, the liquid inlet and the liquid outlet are arranged opposite to each other.

10. The heat dissipation structure according to claim 9, characterized in that: The plurality of upper heat dissipating fin pins form a group, and the plurality of upper heat dissipating fin pins in a group are arranged along the line connecting the liquid inlet and the liquid outlet; and / or, The plurality of lower heat dissipating fin pins form a group, and the plurality of lower heat dissipating fin pins in a group are arranged along a line connecting the liquid inlet and the liquid outlet.

11. The heat dissipation structure according to claim 9, characterized in that: A plurality of the upper heat dissipating fin pins form a group, the connection direction of a group of the plurality of the upper heat dissipating fin pins is perpendicular to the connection direction between the liquid inlet and the liquid outlet, and the plurality of groups of the upper heat dissipating fin pins are arranged along the connection direction between the liquid inlet and the liquid outlet; and / or, The multiple lower heat dissipating fins form a group, and the connection direction of the multiple lower heat dissipating fins in a group is perpendicular to the connection direction between the liquid inlet and the liquid outlet. The multiple groups of lower heat dissipating fins are arranged along the connection direction between the liquid inlet and the liquid outlet.

12. The heat dissipation structure according to claim 9, characterized in that: A plurality of the upper heat dissipating fin pins form a group, and the angle between the connection direction of the plurality of the upper heat dissipating fin pins in one group and the connection direction between the liquid inlet and the liquid outlet is an acute angle, and the plurality of groups of the upper heat dissipating fin pins are arranged along the connection direction between the liquid inlet and the liquid outlet; and / or, The multiple lower heat dissipating fins form a group, and the angle between the connection direction of the multiple lower heat dissipating fins in a group and the connection direction between the liquid inlet and the liquid outlet is an acute angle. The multiple groups of lower heat dissipating fins are arranged along the connection direction between the liquid inlet and the liquid outlet.

13. The heat dissipation structure according to claim 9, characterized in that: The upper heat dissipation fin pin is in the shape of an elliptical column; and / or the lower heat dissipation fin pin is in the shape of an elliptical column.

14. The heat dissipation structure according to claim 13, characterized in that: The long axis direction of the upper heat dissipating fin pin or the lower heat dissipating fin pin is parallel to the direction of the line connecting the liquid inlet and the liquid outlet.

15. The heat dissipation structure according to claim 13, characterized in that: The long axis length of the upper heat dissipating fin pin or the lower heat dissipating fin pin close to the liquid inlet is greater than the long axis length of the upper heat dissipating fin pin or the lower heat dissipating fin pin close to the liquid outlet.

16. The heat dissipation structure according to claim 9, characterized in that: The upper heat dissipating fin pins are cylindrical; and / or the lower heat dissipating fin pins are cylindrical.

17. The heat dissipation structure according to claim 16, characterized in that: The diameter of the upper heat dissipation fin needle or the lower heat dissipation fin needle close to the liquid inlet is larger than the diameter of the upper heat dissipation fin needle or the lower heat dissipation fin needle close to the liquid outlet.

18. The heat dissipation structure according to claim 9, characterized in that: An upper mounting portion is provided on the upper heat sink, and the upper mounting portion is located on a side of the upper heat sink facing away from the lower heat sink. A lower mounting portion is provided on the lower heat sink, and the lower mounting portion is located on a side of the lower heat sink facing away from the upper heat sink. The upper mounting portion and the lower mounting portion are used for setting the power element.

19. The heat dissipation structure according to claim 18, characterized in that: The upper mounting portion is opposite to the lower mounting portion; or the upper mounting portion is staggered with the lower mounting portion.

20. The heat dissipation structure according to claim 18, characterized in that: The plurality of upper mounting parts are arranged along a line connecting the liquid inlet and the liquid outlet; and / or, The plurality of lower mounting parts are arranged along a line connecting the liquid inlet and the liquid outlet.

21. The heat dissipation structure according to claim 1, characterized in that: The thickness of the upper heat sink is in the range of 2.5 mm to 3.5 mm; and / or, The thickness of the lower heat sink is in the range of 2.5 mm to 3.5 mm.

22. The heat dissipation structure according to claim 1, characterized in that: The upper heat dissipation plate and the upper heat dissipation fin pins are integrally formed; and / or, The lower heat dissipation plate and the lower heat dissipation fin pins are integrally formed.

23. The heat dissipation structure according to claim 1, characterized in that: The upper heat dissipation plate has the same structure as the lower heat dissipation plate.

24. A power module, characterized in that: It comprises a power element and the heat dissipation structure according to any one of claims 1 to 23, wherein the power element is arranged on the upper heat dissipation plate or the lower heat dissipation plate.

25. An electronic device, characterized in that: Comprising the power module as claimed in claim 24.

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