LED packaging structure with large light-emitting angle

Abstract

The utility model relates to the technical field of LED packaging structures, and provides an LED packaging structure with a large light-emitting angle, which comprises support hardware, a light-emitting mechanism is arranged on the support hardware, the support hardware provides electrical connection for the light-emitting mechanism, a reflection mechanism is sleeved outside the light-emitting mechanism, and the reflection mechanism is provided with a light-emitting groove. The reflecting mechanism comprises a reflecting cup fixedly connected with the support hardware and / or a reflecting mechanism arranged in the reflecting cup, the reflecting cup is made of transparent or semitransparent injection molding materials, the reflecting mechanism comprises reflecting glue, the reflecting glue is arranged at the top of the light-emitting mechanism, and reflecting particles and the like are mixed in the reflecting glue. According to the LED lamp bead, the reflective glue and the reflective particles are arranged, when the LED lamp bead emits light, the light can directly penetrate through the transparent reflective cup to be emitted, and can also penetrate through the reflective cup to be emitted after being reflected by the reflective particles, so that the light-emitting angle of the LED lamp bead is improved, and in conclusion, the problem that the light-emitting angle of an existing LED lamp bead is small is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging structures, in particular to an LED packaging structure with a large light-emitting angle. Background Art

[0002] With the rapid development of lighting technology, LED (Light Emitting Diodes), as a new generation of efficient and environmentally friendly light sources, has been widely used in various lighting scenarios, from home lighting to commercial displays to outdoor lighting, and its influence is growing day by day. With its advantages of energy saving, high efficiency, long life and rapid response, LED lamp beads have gradually replaced traditional lighting equipment and become an important part of the lighting industry. However, despite the significant progress of LED technology, its limitation in light emission angle is still one of the challenges in some specific applications.

[0003] Most common LED lamp beads on the market are designed with a beam angle of about 120°. This design can provide satisfactory lighting effects in most general lighting scenarios, but for applications that require wider light coverage, reduce shadow areas, or achieve soft and uniform lighting effects, the existing beam angle is not ideal. Especially in professional fields such as commercial displays, museum lighting, and plant growth lighting, a larger beam angle can significantly improve lighting quality and create a more comfortable and professional visual experience.

[0004] The purpose of the utility model is to solve the problem that the existing LED lamp beads have a small light emitting angle. Utility Model Content

[0005] The purpose of the utility model is to solve the problem of small light emitting angle of existing LED lamp beads. The utility model adopts the following technical solutions:

[0006] An LED packaging structure with a large light-emitting angle comprises bracket hardware, a light-emitting mechanism is mounted on the bracket hardware, the bracket hardware provides electrical connection for the light-emitting mechanism, a reflective mechanism is arranged on the outer cover of the light-emitting mechanism, the reflective mechanism comprises a reflective cup fixedly connected to the bracket hardware and / or a reflective mechanism arranged in the reflective cup, the reflective cup is made of a transparent or translucent injection-molded material, the reflective mechanism comprises reflective glue, the reflective glue is arranged on the top of the light-emitting mechanism, and reflective particles are mixed in the reflective glue.

[0007] As described above, an LED packaging structure with a large light-emitting angle, the light-emitting mechanism includes packaging glue, the packaging glue is fixedly connected in a reflective cup, an LED chip is arranged in the packaging glue, the bottom of the LED chip is coated with a crystal-bonding glue, the LED chip is fixedly connected to a bracket hardware through the crystal-bonding glue, the positive and negative electrodes of the LED chip are welded with bonding wires, one end of the bonding wire is fixedly connected to the bracket hardware, and the bracket hardware is electrically connected to the LED chip through the bonding wire.

[0008] In the LED packaging structure with a large light-emitting angle as described above, the material of the reflective adhesive is the same as that of the packaging adhesive, and the material of the reflective adhesive is a combination of one or more of silicone, epoxy resin, and modified epoxy silicone resin.

[0009] In the LED packaging structure with a large light-emitting angle as described above, the material of the reflective cup is a combination of one or more of PC material, PCT material, epoxy resin, silicone, transparent silicone filled with transparent glass fiber, and epoxy resin filled with transparent glass fiber.

[0010] In the LED packaging structure with a large light-emitting angle as described above, the color of the reflective particles is white, and the material of the reflective particles is titanium dioxide.

[0011] In the LED packaging structure with a large light-emitting angle as described above, the top surface of the reflective adhesive is flush with the top of the reflective cup.

[0012] In the LED packaging structure with a large light-emitting angle as described above, the inner wall of the reflective cup is an inclined surface that gradually extends from top to bottom toward the center of the bottom of the reflective cup.

[0013] In the LED packaging structure with a large light-emitting angle as described above, the LED chip is a front-mounted LED chip or a vertical LED chip.

[0014] In the LED packaging structure with a large light-emitting angle as described above, the orthogonal projection of the reflective cup is a basic geometric figure.

[0015] In the LED packaging structure with a large light-emitting angle as described above, the material of the bracket hardware is one of copper, iron, aluminum, aluminum alloy, and tin.

[0016] Implementing the embodiments of the utility model has the following beneficial effects:

[0017] In the utility model, reflective glue and reflective particles are provided. When the LED lamp bead emits light, the light can directly pass through the transparent reflective cup and then be emitted, or it can be reflected by the reflective particles and then pass through the reflective cup and then be emitted, thereby improving the light emission angle of the LED lamp bead.

[0018] In summary, the utility model solves the problem of small light emitting angle of existing LED lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 The utility model is a structural schematic diagram of an LED packaging structure with a large light-emitting angle.

[0021] Figure 2 It is a cross-sectional view of an LED packaging structure with a large light-emitting angle according to the utility model.

[0022] Figure 3 It is a structural schematic diagram of an existing LED packaging structure.

[0023] Figure 4 It is a cross-sectional view of an existing LED packaging structure. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figure 1 to Figure 2 As shown, the utility model proposes an LED packaging structure with a large light-emitting angle, including a bracket hardware 1, a light-emitting mechanism 5 is installed on the bracket hardware 1, the bracket hardware 1 provides electrical connection for the light-emitting mechanism 5, and a reflective mechanism is arranged on the outer cover of the light-emitting mechanism 5, the reflective mechanism includes a reflective cup 2 fixedly connected to the bracket hardware 1 and / or a reflective mechanism arranged in the reflective cup 2, the reflective cup 2 is made of a transparent or translucent injection moldable material, the reflective mechanism includes a reflective glue 3, the reflective glue 3 is arranged on the top of the light-emitting mechanism 5, and reflective particles 4 are mixed in the reflective glue 3. When the light is powered on, the light can directly pass through the reflective cup 2 and then be emitted. The reflective cup 2 helps to refract and scatter the light, so that the light-emitting angle of the LED lamp bead can be increased to more than 150°. The function of the reflective particles 4 is to further enhance the reflection effect of the light. The combination of the two can effectively improve the utilization efficiency and the light output angle of the light.

[0026] Optionally, in some embodiments, the reflective cup 2 is made of a transparent injection-molded material. The transparent material allows more light to penetrate directly, thereby increasing the brightness and distance of direct lighting.

[0027] Optionally, in some embodiments, the reflective cup 2 is made of a translucent, injectable material. The translucent material can scatter light, reduce the intensity of direct light, and make the light distribution more uniform and soft, which is suitable for creating a warm and comfortable lighting environment. Through diffuse reflection, the translucent reflective cup can effectively reduce glare.

[0028] Optionally, in some embodiments, the reflective cup 2 is made of PC material, that is, polycarbonate.

[0029] Optionally, in some embodiments, the reflective cup 2 is made of PCT material, ie, poly (1,4-cyclohexane dimethanol terephthalate).

[0030] Optionally, in some embodiments, the reflective cup 2 is made of epoxy resin.

[0031] Optionally, in some embodiments, the reflective cup 2 is made of silicone.

[0032] Optionally, in some embodiments, the reflective cup 2 is made of transparent silicone filled with transparent glass fiber.

[0033] Optionally, in some embodiments, the reflective cup 2 is made of epoxy resin filled with transparent glass fiber.

[0034] Furthermore, as a preferred embodiment of the present utility model but not a limitation, the light-emitting mechanism 5 includes a packaging glue 504, the packaging glue 504 is fixedly connected in the reflective cup 2, an LED chip 501 is arranged in the packaging glue 504, a solid crystal glue 503 is coated on the bottom of the LED chip 501, the LED chip 501 is fixedly connected to the bracket hardware 1 through the solid crystal glue 503, the positive and negative electrodes of the LED chip 501 are welded with bonding wires 502, one end of the bonding wire 502 is fixedly connected to the bracket hardware 1, the material of the bracket hardware 1 is one of copper, iron, aluminum, aluminum alloy, and tin, the bracket hardware 1 is electrically connected to the LED chip 501 through the bonding wire 502, when the external power supply provides electrical energy to the LED lamp bead, the current is transmitted to the LED chip 501 through the bracket hardware 1 and the bonding wire 502, the LED chip 501 is powered on and emits light, and the packaging glue 504 plays a role in fixing and protecting the LED chip.

[0035] Optionally, in some embodiments, the LED chip 501 is a front-mounted LED chip. When matching the front-mounted chip, the die-bonding adhesive 503 is silicone, epoxy resin, or silicone doped with alumina.

[0036] Optionally, in some embodiments, the LED chip 501 is a vertical LED chip, and when matching the vertical chip, the die-bonding glue 503 is a conductive silver glue or solder paste.

[0037] Furthermore, as a preferred embodiment of the present invention but not a limitation, the material of the reflective adhesive 3 is the same as the material of the encapsulation adhesive 504, and the material of the reflective adhesive 3 is a combination of one or more of silicone, epoxy resin, and modified epoxy silicone resin. The same material means that the reflective adhesive 3 and the encapsulation adhesive 504 are consistent in physical and chemical properties. This helps to ensure the stability of the performance of the LED lamp beads during light emission, heat dissipation, and long-term use. The reflective adhesive 3 and the encapsulation adhesive 504 have the same optical properties such as refractive index and light transmittance, and the refraction and scattering effects of light when passing through these two materials will be more coordinated. This helps to optimize the light distribution and uniformity of the LED lamp beads and improve the lighting effect.

[0038] Optionally, in some embodiments, the material of the reflective adhesive 3 is different from the material of the packaging adhesive 504.

[0039] Optionally, in some embodiments, the reflective adhesive 3 is made of silicone.

[0040] Optionally, in some embodiments, the reflective adhesive 3 is made of epoxy resin.

[0041] Optionally, in some embodiments, the reflective adhesive 3 is made of modified epoxy silicone resin.

[0042] Furthermore, as a preferred embodiment of the present invention but not a limitation, the color of the reflective particles 4 is white, which is a color with high reflectivity, so that the reflective particles 4 can more effectively reflect the light emitted by the LED chip, and the light caused by the white reflection is soft and does not produce additional color deviation.

[0043] Optionally, in some embodiments, the reflective particles 4 are made of titanium dioxide, which is a substance with very high reflectivity. Its white particles can effectively reflect and scatter light. In LED lamp beads, this high reflectivity property enables the titanium dioxide particles to enhance the utilization rate of light.

[0044] Furthermore, as a preferred embodiment of the present invention but not limitation, the top surface of the reflective tape 3 is flush with the top of the reflective cup 2 , and the flat top surface structure enables the reflective tape 3 and the reflective cup 2 to form a smooth transition appearance.

[0045] Optionally, in some embodiments, the top surface of the reflective tape 3 is higher than the top of the reflective cup 2. By designing the top surface of the reflective tape 3 to be higher than the top of the reflective cup 2, the contact area between the light and the surface of the reflective tape can be further increased, thereby more effectively scattering the light and making the light distribution more uniform.

[0046] Optionally, in some embodiments, the top surface of the reflective tape 3 is lower than the top of the reflective cup 2. Since the top surface of the reflective tape 3 is lower than the top of the reflective cup 2, there is no need to impose excessively high precision requirements on the reflective tape 3 during the manufacturing process, thereby reducing manufacturing difficulty and cost.

[0047] Furthermore, as a preferred embodiment of the present invention but not a limitation, the inner wall of the reflector cup 2 is an inclined surface that gradually extends from top to bottom toward the center of the bottom circle of the reflector cup 2. The inclined inner wall facilitates the flow and distribution of glue during glue dispensing, so that the glue can be more evenly distributed on the bottom and side walls of the reflector cup 2, reducing glue accumulation or uneven flow.

[0048] Optionally, in some embodiments, the inner wall of the reflective cup 2 is an inclined surface that gradually extends from bottom to top toward the center of the top circle of the reflective cup 2. This design of being wider at the bottom and narrower at the top is conducive to fixing the packaging glue 504 in the reflective cup 2 and preventing the packaging glue 504 from escaping from the reflective cup 2.

[0049] Optionally, in some embodiments, the inner wall of the reflective cup 2 is designed to be perpendicular to the bracket hardware 1 .

[0050] Further, as a preferred embodiment of the present invention but not limitation, the orthogonal projection of the reflective cup 2 is a basic geometric figure.

[0051] Optionally, in some embodiments, the orthogonal projection of the reflective cup 2 is a circle.

[0052] Optionally, in some embodiments, the orthogonal projection of the reflective cup 2 is a rectangle.

[0053] like Figure 1 to Figure 2 As shown, the implementation method of Example 1 is as follows:

[0054] The invention discloses an LED packaging structure with a large light-emitting angle, comprising a bracket hardware 1, a light-emitting mechanism 5 installed on the bracket hardware 1, the bracket hardware 1 providing electrical connection for the light-emitting mechanism 5, a reflective mechanism disposed on the outer cover of the light-emitting mechanism 5, the reflective mechanism comprising a reflective cup 2 fixedly connected to the bracket hardware 1 and a reflective mechanism disposed in the reflective cup 2, the reflective cup 2 being made of a transparent injection-moldable epoxy resin material, the reflective mechanism comprising a reflective adhesive 3 disposed on the top of the light-emitting mechanism 5, a plurality of reflective particles 4 made of white titanium dioxide being mixed in the reflective adhesive 3, when the light is powered on, the light can directly pass through the reflective cup 2 and then be emitted, the transparent material allows more light to directly penetrate, and can increase the brightness and distance of direct lighting, the reflective cup 2 helps to refract and scatter the light, and thus the light-emitting angle of the LED lamp bead can be increased to more than 150 degrees, the reflective particles 4 function to further enhance the reflection effect of the light, and the combination of the two can effectively improve the utilization efficiency and light output angle of the light.

[0055] The light-emitting mechanism 5 includes a packaging glue 504, which is fixedly connected to the reflective cup 2. A properly mounted LED chip 501 is arranged in the packaging glue 504. A solid crystal glue 503 is coated on the bottom of the LED chip 501. The LED chip 501 is fixedly connected to the bracket hardware 1 through the solid crystal glue 503. The positive and negative electrodes of the LED chip 501 are welded with bonding wires 502. One end of the bonding wire 502 is fixedly connected to the bracket hardware 1. The bracket hardware 1 is made of copper. The bracket hardware 1 is electrically connected to the LED chip 501 through the bonding wire 502. When an external power supply provides electrical energy to the LED lamp bead, the current is transmitted to the LED chip 501 through the bracket hardware 1 and the bonding wire 502. The LED chip 501 is powered on to emit light. The packaging glue 504 plays a role in fixing and protecting the LED chip.

[0056] The material of the reflective adhesive 3 is the same as that of the encapsulation adhesive 504, and the material of the reflective adhesive 3 is epoxy resin. The reflective adhesive 3 and the encapsulation adhesive 504 have the same optical properties such as refractive index and light transmittance, and the refraction and scattering effects of light passing through these two materials will be more coordinated. This helps to optimize the light distribution and uniformity of the LED lamp beads and improve the lighting effect.

[0057] like Figure 1 to Figure 2 As shown, the implementation method of the second embodiment is as follows:

[0058] The difference between the second embodiment and the first embodiment is that the reflective mechanism includes a reflective cup 2 fixedly connected to the bracket hardware 1 and a reflective mechanism arranged in the reflective cup 2, the reflective cup 2 is made of an opaque injection-molded material, and the reflective mechanism includes a reflective adhesive 3, which is arranged on the top of the light-emitting mechanism 5, and a plurality of reflective particles 4 made of white titanium dioxide are mixed in the reflective adhesive 3. The presence of the reflective adhesive 3 and the reflective particles 4 can effectively scatter the light emitted by the LED chip, and even when the reflective cup is opaque, the optical effect of these materials can cause the light to be reflected and scattered multiple times inside the reflective cup, thereby expanding the distribution range of the light and increasing the light-emitting angle.

[0059] Comparative Example 1:

[0060] Prior art CN 211858676 U proposes an LED packaging device, in which a transparent bowl cup is provided, and its function is similar to that of the reflective cup 2 in the present invention. However, it is worth noting that although the transparent bowl cup is designed to transmit light, its effect is limited by the light-emitting angle of the LED chip. Specifically, since the light-emitting angle of the LED chip is only about 120°, this means that although the transparent bowl cup can allow part of the light to pass through, due to the light-emitting characteristics of the LED chip itself, the light emitted by it cannot be evenly diffused in a larger range, thereby limiting the further improvement of the overall lighting effect.

[0061] The utility model is provided with reflective adhesive 3 and reflective particles 4. When the LED lamp bead emits light, the light can directly pass through the transparent reflective cup 2 and then be emitted, or it can be reflected by the reflective particles 4 and then pass through the transparent reflective cup 2 and then be emitted. In this way, the light emitting angle of the LED lamp bead can be increased to more than 150°.

[0062] In summary, the utility model solves the problem of small light emitting angle of existing LED lamp beads.

[0063] It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information. In addition, the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0064] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.

Claims

1. An LED packaging structure with a large light-emitting angle, characterized in that: The invention comprises a bracket hardware (1), a light-emitting mechanism (5) being mounted on the bracket hardware (1), the bracket hardware (1) providing electrical connection for the light-emitting mechanism (5), a reflective mechanism being arranged on the outer cover of the light-emitting mechanism (5), the reflective mechanism comprising a reflective cup (2) fixedly connected to the bracket hardware (1), and a reflective mechanism arranged in the reflective cup (2), the reflective cup (2) being made of a transparent or translucent injection-molded material, the reflective mechanism comprising a reflective adhesive (3), the reflective adhesive (3) being arranged on the top of the light-emitting mechanism (5), and reflective particles (4) being mixed in the reflective adhesive (3); The light-emitting mechanism (5) comprises a packaging glue (504), the packaging glue (504) is fixedly connected in the reflective cup (2), an LED chip (501) is arranged in the packaging glue (504), a crystal-fixing glue (503) is applied to the bottom of the LED chip (501), the LED chip (501) is fixedly connected to the bracket hardware (1) via the crystal-fixing glue (503), the positive and negative electrodes of the LED chip (501) are welded with bonding wires (502), one end of the bonding wire (502) is fixedly connected to the bracket hardware (1), and the bracket hardware (1) is electrically connected to the LED chip (501) via the bonding wire (502); The material of the reflective adhesive (3) is the same as the material of the packaging adhesive (504), and the material of the reflective adhesive (3) is a combination of one or more of silicone, epoxy resin, and modified epoxy silicone resin; The color of the reflective particles (4) is white, and the material of the reflective particles (4) is titanium dioxide; The LED chip (501) is either a front-mounted LED chip or a vertical LED chip; The top surface of the reflective adhesive (3) is higher than the top of the reflective cup (2).

2. The LED packaging structure with a large light-emitting angle according to claim 1, characterized in that: The material of the reflective cup (2) is one or more combinations of PC material, PCT material, epoxy resin, silicone, transparent silicone filled with transparent glass fiber, and epoxy resin filled with transparent glass fiber.

3. The LED packaging structure with a large light-emitting angle according to claim 1, characterized in that: The inner wall of the reflector cup (2) is an inclined surface that gradually extends from top to bottom toward the center of the bottom circle of the reflector cup (2), or the inner wall of the reflector cup (2) is an inclined surface that gradually extends from bottom to top toward the center of the top circle of the reflector cup (2).

4. The LED packaging structure with a large light-emitting angle according to claim 1, characterized in that: When the LED chip (501) is a normal-mounted LED chip, the solid crystal glue (503) is one of silicone, epoxy resin, or silicone doped with aluminum oxide; when the LED chip (501) is a vertical LED chip, the solid crystal glue (503) is conductive silver glue or solder paste.

5. The LED packaging structure with a large light-emitting angle according to claim 1, characterized in that: The orthogonal projection of the reflective cup (2) is circular or rectangular.

6. The LED packaging structure with a large light-emitting angle according to claim 1, characterized in that: The material of the bracket hardware (1) is one of copper, iron, aluminum, aluminum alloy and tin.

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