Heat dissipation structure and cleaning equipment

Abstract

The embodiment of the utility model discloses a heat dissipation structure and cleaning equipment, the heat dissipation structure comprises a shell, a heat conduction part and a heat dissipation part, in the use process, a device to be subjected to heat dissipation is used for being arranged on an assembly position of the shell, heat energy generated by the device to be subjected to heat dissipation can be transmitted through the heat conduction part, and the heat energy can be transmitted to an expected position through the heat conduction part; the heat energy can be transmitted to the surface, deviating from the assembly position, of the shell, that is, the heat energy can be transmitted to the outside of the shell, finally heat dissipation is conducted through the heat dissipation piece, the heat energy can be discharged to the expected position, the heat energy does not need to be stored in the shell, the heat dissipation efficiency can be greatly improved, and the working safety and stability of the device to be subjected to heat dissipation are guaranteed. Taking the heat dissipation structure provided by the embodiment of the utility model applied to the cleaning equipment as an example, the mainboard of the cleaning equipment can be arranged on the assembly position, heat energy generated by the mainboard during working can be transferred to the heat dissipation piece through the heat conduction piece, the heat energy can be quickly discharged out of the shell, and the heat dissipation efficiency can be greatly improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of cleaning equipment, and in particular to a heat dissipation structure and a cleaning equipment. Background Art

[0002] As the functions of various cleaning products become more and more powerful, the power of chips is also increasing, resulting in a surge in heat near the motherboard of the whole machine. Excessive heat cannot meet safety requirements and poses certain safety hazards. How to dissipate heat more efficiently and protect heat dissipation in key positions have become key research issues. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technology.

[0004] To this end, a first aspect of the utility model provides a heat dissipation structure.

[0005] A second aspect of the utility model provides a cleaning device.

[0006] In view of this, according to a first aspect of an embodiment of the present application, a heat dissipation structure is proposed, comprising:

[0007] A housing, wherein an assembly position is formed on the housing, and the assembly position is used to arrange a device to be cooled;

[0008] A heat conducting member, at least part of which is disposed in the housing, and one end of the heat conducting member is disposed close to the assembly position;

[0009] A heat sink is disposed on the housing and connected to the heat conducting member.

[0010] In a feasible implementation manner, the other end of the heat conducting member extends out of the housing.

[0011] In a feasible implementation manner, the housing includes:

[0012] a first shell;

[0013] a second shell, the first shell being connected to the second shell, and the heat dissipation device being arranged between the first shell and the second shell;

[0014] The heat conducting member is arranged in the second shell, and the heat dissipating member is connected to the second shell.

[0015] In a feasible implementation manner, a device installation position is formed in the second shell, the heat conducting member is arranged to fit the inner wall of the device installation position, and the device installation position is arranged close to the assembly position.

[0016] In a feasible implementation manner, the device to be cooled includes a mainboard;

[0017] The device installation position includes a power supply installation position.

[0018] In a feasible implementation manner, the material for preparing the heat conducting member includes a graphite sheet; and / or

[0019] The material used to prepare the heat sink includes a metal piece or a graphite sheet.

[0020] In a feasible embodiment, the heat conductor includes a plurality of bending sections, some of which are bent for abutting against the inner wall of the shell, and some of which are bent for abutting against a device installed in the shell.

[0021] In a feasible implementation manner, the heat dissipation structure further includes:

[0022] A thermally conductive silicone layer, wherein the heat sink is connected to the thermally conductive element via the thermally conductive silicone layer.

[0023] According to a second aspect of an embodiment of the present application, a cleaning device is provided, comprising:

[0024] A heat dissipation structure as described in any of the above technical solutions.

[0025] In a feasible embodiment, the cleaning device further comprises:

[0026] A mainboard, the mainboard being arranged on the assembly position;

[0027] A power supply component is arranged in the shell, and the heat conductive component wraps a partial area of ​​the power supply component.

[0028] In a feasible embodiment, the cleaning device further comprises:

[0029] A cover body is connected to the shell and covers the power supply component.

[0030] Compared with the prior art, the present invention has at least the following beneficial effects:

[0031] The heat dissipation structure provided in the embodiment of the present application includes a shell, a heat conductor and a heat sink. During use, the heat dissipation device is used to be set on the assembly position of the shell. The heat energy generated by the heat dissipation device can be transferred through the heat conductor. The heat energy can be transferred to the expected position through the heat conductor, such as being transferred to the surface of the shell away from the assembly position, that is, the heat energy can be transferred to the outside of the shell. Finally, the heat is dissipated through the heat sink, and the heat energy can be discharged to the expected position. The heat energy does not need to be stored in the shell, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the work of the heat dissipation device. Taking the application of the heat dissipation structure provided in the embodiment of the present application on the cleaning equipment as an example, the mainboard of the cleaning equipment can be set on the assembly position, and the heat energy generated by the mainboard can be transferred to the heat sink through the heat conductor. The heat energy can be quickly discharged outside the shell, which can greatly improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0033] Figure 1 A schematic structural diagram of a disassembled state of a heat dissipation structure of an embodiment provided in the present application;

[0034] Figure 2 A schematic structural diagram of a cleaning device in a disassembled state according to an embodiment of the present application;

[0035] Figure 3 A schematic structural diagram of a cleaning device according to an embodiment of the present application.

[0036] in, Figures 1 to 3 The corresponding relationship between the reference numerals and the component names is as follows:

[0037] 110 housing, 120 heat conducting component, 130 heat dissipating component, 140 heat conducting silicone layer;

[0038] 111 a first shell, 112 a second shell;

[0039] 210 main board, 220 power supply component, 230 cover body. DETAILED DESCRIPTION

[0040] In order to better understand the above-mentioned technical scheme, the technical scheme of the embodiments of the present application is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical scheme of the embodiments of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present application and the technical features in the embodiments may be combined with each other.

[0041] The embodiments of the present application take into account that the heat dissipation scheme of the mainboard of automatic cleaning equipment including but not limited to sweeping robots in the traditional technology is basically to transfer local heat to the heat dissipation aluminum extrusion through thermal conductive silicone, and the heat dissipation aluminum extrusion disperses the heat through high thermal conductivity and larger cross-sectional area. For example, in some schemes, the heat dissipation system includes an upper shell component, a heat dissipation aluminum extrusion, a shielding cover, a thermal conductive silicone, a mainboard and a lower shell component; the mainboard is screwed to the lower shell component by screws, the thermal conductive silicone is pasted on the mainboard, the shielding cover is clamped on the mainboard by the clips on the mainboard and presses the thermal conductive silicone, the heat dissipation aluminum extrusion is also screwed to the mainboard and is directly above the shielding cover, and finally the upper shell component is locked to the lower shell component. In this way, the heat on the mainboard is dispersed in turn through the thermal conductive silicone, the shielding cover, and the heat dissipation aluminum extrusion, but the heat dissipation aluminum extrusion is still inside the whole machine and has a gap with the upper shell component, and the heat is not directly exported to the outside of the whole machine, resulting in low heat dissipation efficiency. At the same time, the heat dissipation scheme related to aluminum extrusion occupies a large space and has relatively large limitations.

[0042] like Figure 1 As shown, in view of this, according to the first aspect of an embodiment of the present application, a heat dissipation structure is proposed, including: a shell 110, an assembly position is formed on the shell 110, and the assembly position is used to set the device to be dissipated; a heat conductor 120, at least a part of the heat conductor 120 is arranged in the shell 110, and one end of the heat conductor 120 is arranged close to the assembly position; a heat sink 130, the heat sink 130 is arranged on the shell 110, and the heat sink 130 is connected to the heat conductor 120.

[0043] The heat dissipation structure provided in the embodiment of the present application includes a housing 110, a heat conductor 120 and a heat sink 130. During use, the heat dissipation device is used to be arranged on the assembly position of the housing 110. The heat energy generated by the heat dissipation device can be transferred through the heat conductor 120. The heat energy can be transferred to the expected position through the heat conductor 120, such as being transferred to the surface of the housing 110 away from the assembly position, that is, the heat energy can be transferred to the outside of the housing 110. Finally, the heat is dissipated through the heat sink 130, and the heat energy can be discharged to the expected position. The heat energy does not need to be stored in the housing 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the work of the heat dissipation device. Taking the application of the heat dissipation structure provided in the embodiment of the present application on the cleaning equipment as an example, the mainboard 210 of the cleaning equipment can be arranged on the assembly position, and the heat energy generated by the mainboard 210 can be transferred to the heat sink 130 through the heat conductor 120. The heat energy can be quickly discharged to the outside of the housing 110, which can greatly improve the heat dissipation efficiency.

[0044] It can be understood that the heat conductor 120 is arranged close to the assembly position. The heat conductor 120 and the assembly position may be separated, or part of the heat conductor 120 may be located inside the assembly position, or there may be a certain distance between the heat conductor 120 and the assembly position. The present application intends to enable the heat energy generated by the device to be cooled to be transferred to the heat conductor 120. The specific layout and distance between the heat conductor 120 and the assembly position are not limited by the application, as long as the heat energy of the device to be cooled can be transferred to the heat conductor 120.

[0045] The heat dissipation structure provided in the embodiment of the present application utilizes the heat conductor 120 and the heat sink 130 to transfer heat energy to the outside of the housing 110, thereby improving the heat dissipation efficiency. At the same time, the heat conductor 120 can be located inside the housing 110, and the heat sink 130 is connected to the heat conductor 120, which can reduce the space occupied by the heat dissipation components, thereby helping to reduce the volume of the heat dissipation structure and the electrical appliance equipped with the heat dissipation structure.

[0046] like Figure 1 As shown, in a feasible implementation manner, the other end of the heat conducting member 120 extends out of the housing 110 .

[0047] In this technical solution, a layout method of the heat conductor 120 is further provided. One end of the heat conductor 120 is arranged close to the assembly position, and the other end extends out of the shell 110. In this arrangement, when the heat dissipation component 130 generates heat energy, the heat energy can be first transferred to the heat conductor 120, and then transferred to the outside of the shell 110 through the heat conductor 120, which can greatly improve the heat dissipation efficiency, avoid the accumulation of heat energy in the shell 110, and can reduce the operating temperature of the heat dissipation component, thereby improving performance and service life.

[0048] like Figure 1As shown, in a feasible embodiment, the shell 110 includes: a first shell 111; a second shell 112, the first shell 111 is connected to the second shell 112, and the heat dissipation device is used to be arranged between the first shell 111 and the second shell 112; the heat conductor 120 is arranged in the second shell 112, and the heat dissipation member 130 is connected to the second shell 112.

[0049] In this technical solution, a structural composition of a shell 110 is further provided. The shell 110 may include a first shell 111 and a second shell 112. The device to be cooled can be first connected to the second shell 112, and then the first shell 111 is connected to the second shell 112. Based on this, the device to be cooled can be fixed between the first shell 111 and the second shell 112. Such a configuration facilitates the packaging of the device to be cooled and can make the fixation of the device to be cooled more reliable.

[0050] In this technical solution, the heat conductor 120 is arranged inside the second shell 112, and the heat sink 130 is further connected to the second shell 112. Based on this, the heat conductor 120 and the heat sink 130 can be used to transport heat energy to the desired area, thereby avoiding the accumulation of heat energy inside the shell 110, especially avoiding the accumulation between the first shell 111 and the second shell 112, which can greatly improve the heat dissipation efficiency.

[0051] In some examples, the heat sink 130 can be attached to the surface of the second shell 112. Such a configuration can, on the one hand, transfer heat energy to the outside of the second shell 112 to further improve the heat dissipation effect; on the other hand, it can have a larger heat dissipation area and improve the heat dissipation efficiency.

[0052] In a feasible implementation, a device installation position is formed in the second shell 112 , the heat conducting member 120 is arranged to fit the inner wall of the device installation position, and the device installation position is arranged close to the assembly position.

[0053] In this technical solution, considering that setting the heat conductor 120 inside the second shell 112 may have certain processing difficulties, the current structure of the second shell 112 can be used to arrange the heat conductor 120, and a device mounting position can be provided inside the second shell 112, and the device mounting position is used to set the device. In this case, the wall surface of the device mounting position can be used to fix the heat conductor 120. Such a setting facilitates the assembly of the heat conductor 120 and can reduce the assembly difficulty and production cost.

[0054] In this technical solution, considering that there may be multiple device mounting positions inside the second shell 112 to assemble different devices, in this case, the device mounting position closest to the assembly position can be selected among the multiple device mounting positions to fix the heat conductor 120, so that the heat energy generated by the device to be cooled can be transferred to the heat conductor 120 as soon as possible.

[0055] like Figure 2 and Figure 3 As shown, in a feasible implementation manner, the device to be cooled includes a mainboard 210 .

[0056] In this technical solution, the device to be cooled may include a mainboard 210. This configuration is based on the consideration that the mainboard 210 will generate relatively high heat energy during operation. Cooling the mainboard 210 through the heat conductor 120 and the heat sink 130 can ensure the stability of the operation of the mainboard 210.

[0057] In a feasible implementation manner, the component mounting position includes a power supply mounting position.

[0058] In this technical solution, the device mounting position may include a power supply mounting position, that is, a power supply 220 is arranged within the power supply mounting position, and the power supply 220 may be a battery. During use, the heat conductor 120 may also be arranged in contact with or adjacent to the battery. Based on this, the heat energy generated by the battery may also be transferred through the heat conductor 120, and finally discharged through the heat sink 130, which can dissipate heat for the battery and ensure the stability of the battery operation.

[0059] Considering that heat is only conducted from high temperature to low temperature, during the operation of the mainboard 210 and the power supply 220, the temperature of the battery will be higher than that of the heat conductor 120. Therefore, the thermal energy of the battery will be transferred to the heat conductor 120, so that the heat conductor 120 can dissipate heat for the battery without causing the battery temperature to rise.

[0060] In a feasible embodiment, the material for preparing the heat conductor 120 includes a graphite sheet. In this way, the graphite sheet has a unique grain orientation and uniformly conducts heat in two directions. Its lamellar structure can adapt well to any surface. The graphite sheet has an ultra-high thermal conductivity in the range of 150 to 1500W / mK in the plane, and is light in weight, 25% lighter than aluminum and 75% lighter than copper. The high thermal conductivity of the graphite sheet mainly comes from its lamellar structure and the presence of covalent bonds and free electrons. This makes the graphite have an extremely high thermal conductivity in the layer. Although the thermal conductivity perpendicular to the plane direction is low, due to its small thickness, the thermal conductivity effect is not particularly poor. This characteristic gives the graphite sheet a unique application advantage in the field of heat conduction and heat dissipation, which can smooth hot spots and improve heat dissipation efficiency. At the same time, it is easy to process, easy to install, and can be smoothly attached to any plane and curved surface. Any form of cutting can be made according to demand to ensure that the heat conductor 120 can better fit the inner wall of the housing 110.

[0061] In a feasible implementation manner, the material used to prepare the heat sink 130 includes a metal piece or a graphite sheet.

[0062] In this technical solution, the heat sink 130 may also be made of a graphite sheet material or a metal material, and such a configuration can also ensure heat dissipation efficiency.

[0063] In a feasible embodiment, the heat conductor 120 includes a plurality of bending sections, some of which are bent for abutting against the inner wall of the shell 110 , and some of which are bent for abutting against the components installed in the shell 110 .

[0064] In this technical solution, a style of the heat conductor 120 is further provided. The heat conductor 120 may include multiple bending sections, and some of the bending sections are bent to abut against the inner wall of the shell 110, and some of the bending sections are bent to abut against the device installed in the shell 110. With such a configuration, on the one hand, the heat conductor 120 can be better fitted to the inner wall of the shell 110; on the other hand, the heat conductor 120 can have more contact area with the shell 110 and the heat sink 130, which can improve the heat dissipation efficiency; on another hand, the heat conductor 120 can be conformally bonded to the device mounting position on the second shell 112, which can minimize the additional installation space of the device, making the heat dissipation structure more compact and conducive to reducing the volume.

[0065] like Figure 1 As shown, in a feasible implementation manner, the heat dissipation structure further includes: a thermally conductive silicone layer 140, and the heat dissipation element 130 is connected to the thermally conductive element 120 via the thermally conductive silicone.

[0066] In this technical solution, the heat dissipation structure may further include a thermally conductive silicone layer 140, and the heat sink 130 is connected to the thermally conductive member 120 via the thermally conductive silicone. In this way, the heat sink 130 can be connected to the thermally conductive member 120 by bonding, which facilitates the establishment of a connection relationship between the heat sink 130 and the thermally conductive member 120, and at the same time can improve the heat transfer efficiency between the thermally conductive member 120 and the heat sink 130, thereby improving the heat dissipation efficiency.

[0067] like Figure 2 and Figure 3 As shown, according to the second aspect of an embodiment of the present application, a cleaning device is proposed, including: a heat dissipation structure as in any of the above technical solutions.

[0068] Since the cleaning device provided in the embodiment of the present application includes a heat dissipation structure such as any of the above technical solutions, the cleaning device has all the beneficial effects of the above heat dissipation structure.

[0069] The heat dissipation structure of the cleaning equipment provided in the embodiment of the present application includes a housing 110, a heat conductor 120 and a heat sink 130. During use, the heat dissipation device is used to be arranged on the assembly position of the housing 110. The heat energy generated by the heat dissipation device can be transferred through the heat conductor 120. The heat energy can be transferred to the expected position through the heat conductor 120, such as being transferred to the surface of the housing 110 away from the assembly position, that is, the heat energy can be transferred to the outside of the housing 110. Finally, the heat is dissipated through the heat sink 130, and the heat energy can be discharged to the expected position. The heat energy does not need to be stored in the housing 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the work of the heat dissipation device. Taking the application of the heat dissipation structure provided in the embodiment of the present application on the cleaning equipment as an example, the mainboard 210 of the cleaning equipment can be arranged on the assembly position, and the heat energy generated by the mainboard 210 can be transferred to the heat sink 130 through the heat conductor 120. The heat energy can be quickly discharged outside the housing 110, which can greatly improve the heat dissipation efficiency.

[0070] like Figure 2 and Figure 3 As shown, in a feasible implementation, the cleaning device further includes: a main board 210 , which is disposed on the assembly position; a power supply 220 , which is disposed in the shell 110 , and the heat conducting member 120 wraps a partial area of ​​the power supply 220 .

[0071] In this technical solution, the cleaning device may also include a mainboard 210 and a power supply 220. The power supply 220 may be a battery. During operation, the power supply 220 powers on the cleaning device and the mainboard 210 performs control. The mainboard 210 is disposed above the assembly position. The generated heat energy may be transferred to the heat conductor 120. The heat energy may be transferred to a desired position through the heat conductor 120, such as to a surface of the shell 110 that is away from the assembly position. That is to say, the heat energy may be transferred to the outside of the shell 110. Finally, the heat may be dissipated through the heat sink 130 to discharge the heat energy to a desired position. The heat energy does not need to be stored in the shell 110, which may greatly improve the heat dissipation efficiency and ensure the safety and stability of the operation of the mainboard 210.

[0072] In this technical solution, the cleaning equipment may also include a power supply 220, and the heat conductor 120 wraps a partial area of ​​the power supply 220. Based on this, the heat energy generated by the power supply 220 can also be transmitted through the heat conductor 120, and finally discharged through the heat dissipation element 130, which can dissipate heat for the power supply 220 and ensure the working stability of the power supply 220.

[0073] It is understandable that heat will only be conducted from high temperature to low temperature. Therefore, during the operation of the mainboard 210 and the power supply component 220, the temperature of the power supply component 220 will be higher than that of the heat conductor 120. Therefore, the heat energy of the electrical component will be transferred to the heat conductor 120, so that the heat conductor 120 can dissipate heat for the battery without causing the temperature of the power supply component 220 to increase.

[0074] like Figure 2 and Figure 3 As shown, in a feasible implementation manner, the cleaning device further includes: a cover body 230 , which is connected to the housing 110 and covers the power supply 220 .

[0075] In this technical solution, the cleaning device may further include a cover body 230 , through which the power supply 220 may be stored, so that the power supply 220 is in a relatively closed environment, thereby protecting the power supply 220 .

[0076] It can be understood that the heat sink 130 can be located between the cover 230 and the power supply 220. Based on this, the heat energy generated by the mainboard 210 and the power supply 220 can be transferred to the heat conductor 120, and then the heat conductor 120 transfers the heat energy through the heat sink 130. Finally, the heat energy on the heat sink 130 can be transferred to the outside of the cleaning device through the cover 230.

[0077] Example

[0078] like Figures 1 to 3 As shown, the cleaning device provided in the embodiment of the present application includes: a first shell 111, a main board 210, a second shell 112, a power supply 220, a heat conductor 120, a heat conductive silicone layer 140, a heat sink 130 and a cover 230.

[0079] The mainboard 210 is screwed to the second shell 112, and then the first shell 111 is screwed to the second shell 112. The heat conductor 120 includes three bends distributed as an A end, a B end and a C end. The adhesive backing of the A end and the B end of the heat conductor 120 is attached to the A end surface and the B end surface of the power supply installation position of the second shell 112. Then the power supply 220 is also placed in the power supply installation position of the second shell 112. The C end of the heat conductor 120 is folded back and covered on the power supply 220 (the graphite sheet is a flexible material and is conformally bonded to the power supply installation position). The thermal conductive silicone layer 140 is naturally placed on the C end of the heat conductor 120. The heat sink 130 is glued to the cover 230 by the adhesive backing. Finally, the components of the heat sink 130 and the cover 230 are screwed to the second shell 112.

[0080] When the cleaning device is working, the mainboard 210 generates a lot of heat, and the power supply 220 is just below the mainboard 210. There is only a layer of the wall thickness of the second shell 112 between the power supply 220 and the mainboard 210. In this way, a lot of heat from the mainboard 210 will be transferred to the power supply 220. However, we have designed a heat conductor 120 here. The heat conductor 120 is made of graphite material. Through the lateral heat conduction characteristics of the graphite sheet, the A end of the heat conductor 120 will quickly transfer the heat to the C end, and then transfer the heat to the cover 230 through the thermal conductive silicone layer 140 and the heat sink 130. Finally, the cover 230 dissipates the heat into the air outside the entire machine, completing efficient heat dissipation while protecting key components such as batteries.

[0081] The cleaning device provided in the embodiment of the present application can transfer heat energy to the outside of the cleaning device through the setting of the heat dissipation structure, which can improve the heat dissipation efficiency, ensure the working stability of the mainboard 210, and protect the power supply 220.

[0082] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0083] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0084] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0085] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: A housing, wherein an assembly position is formed on the housing, and the assembly position is used to arrange a device to be cooled; A heat conducting member, at least part of which is disposed in the housing, and one end of the heat conducting member is disposed close to the assembly position; A heat sink is disposed on the housing and connected to the heat conducting member.

2. The heat dissipation structure according to claim 1, characterized in that: The other end of the heat conducting member extends out of the housing.

3. The heat dissipation structure according to claim 1, characterized in that: The housing comprises: a first shell; a second shell, the first shell being connected to the second shell, and the heat dissipation device being arranged between the first shell and the second shell; The heat conducting member is arranged in the second shell, and the heat dissipating member is connected to the second shell.

4. The heat dissipation structure according to claim 3, characterized in that: A device installation position is formed in the second shell, the heat conducting member is arranged in contact with the inner wall of the device installation position, and the device installation position is arranged close to the assembly position.

5. The heat dissipation structure according to claim 4, characterized in that: The device to be cooled includes a mainboard; The device installation position includes a power supply installation position.

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The material used to make the thermal conductor includes graphite sheet; and / or The material used to prepare the heat sink includes a metal piece or a graphite sheet.

7. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The heat conducting member comprises a plurality of bending sections, some of which are bent to abut against the inner wall of the shell, and some of which are bent to abut against the device installed in the shell.

8. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: Also includes: A thermally conductive silicone layer, wherein the heat sink is connected to the thermally conductive element via the thermally conductive silicone layer.

9. A cleaning device, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 8.

10. The cleaning device according to claim 9, characterized in that Also includes: A mainboard, the mainboard being arranged on the assembly position; A power supply component is arranged in the shell, and the heat conductive component wraps a partial area of ​​the power supply component.

11. The cleaning device according to claim 10, characterized in that Also includes: A cover body is connected to the shell and covers the power supply component.

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