Laser processing head and laser processing system for long-focal-depth annular light spot punching
By using a telephoto deep annular laser beam with uniform radial energy distribution to shoot annular modified areas in the material and obtaining through holes through chemical etching, the problems of microcracks and long etching time in traditional laser hole drilling technology are solved, and efficient and precise glass hole drilling is achieved.
Patent Information
- Application Number
- CN202421517838.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-30
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-06-30
AI Technical Summary
Traditional laser hole drilling technology is prone to microcracks in sensitive materials such as glass, and the etching time is long, making it difficult to achieve efficient and precise hole drilling.
A telephoto deep annular laser beam with uniform radial energy distribution is used to produce annular modified areas with a certain depth and uniform distribution in the material, and through holes of different diameters are obtained through subsequent chemical etching.
It is achieved that microcracks are not easy to occur in glass and other materials, with high porosity and short etching and processing time, and can achieve ultrafast laser high-speed glass precision drilling.
Smart Images
Figure CN222830963U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser processing systems, in particular to a laser processing head and a laser processing system for long-focus deep annular spot drilling. Background Art
[0002] Laser drilling technology has been widely used in modern industry, especially in the fields of electronic products and optical devices. Due to its non-contact processing advantage, laser drilling has gradually become an important means in industrial processing. Traditional laser drilling technology usually uses a single-focus long-focus deep beam for drilling. The disadvantage is that it is easy to cause microcracks in sensitive materials such as glass, and subsequent chemical etching is easy to form elliptical holes, and the etching time is long.
[0003] Therefore, it is very important to provide a laser processing head that can solve the above problems. Utility Model Content
[0004] In order to solve the above problems, the purpose of the utility model is to provide a laser processing head and a laser processing system for long-focus deep annular spot drilling.
[0005] The utility model uses a long-focus-depth annular laser beam with uniform radial energy distribution to punch an annular modified area with a certain depth and uniform distribution in the material. After subsequent corresponding chemical etching, combined with different etching times, through holes of different diameters can be obtained. When the laser processing head of the utility model is used to process the workpiece, microcracks are not easily generated, the porosity is high, and the etching processing time is short. Ultrafast laser high-speed glass precision drilling can be achieved.
[0006] The purpose of the utility model can be achieved through the following technical solutions:
[0007] The first object of the utility model is to provide a laser processing head for long-focus deep annular spot drilling, which includes a hollow shell and a first optical element, a second optical element and a third optical element sequentially arranged in the inner cavity of the shell in a spaced manner along the emission direction of the laser beam;
[0008] Wherein, the central axes of the first optical element, the second optical element and the third optical element are the same;
[0009] The first optical element is selected from one of a diffractive optical element and a refractive optical element;
[0010] The second optical element is a focusing lens;
[0011] The third optical element is a focusing lens;
[0012] The first optical element is used to adjust the laser beam into a long-focus deep annular beam with uniform radial energy distribution;
[0013] The second optical element and the third optical component are used to modulate the long focal depth annular light beam into a long focal depth annular light spot.
[0014] In the utility model, when the first optical element is a diffractive optical element, since the diffractive optical element has a unique phase distribution design and can modulate the energy distribution of the incident light beam, when the laser beam passes through the diffractive optical element, the diffractive optical element can modulate the energy distribution of the laser beam to obtain a long-focus depth annular laser beam with uniform radial energy distribution;
[0015] When the first optical element is a refractive optical element, based on the design of a multi-structure refractive optical element, when the laser beam passes through the refractive optical element, the refractive optical element can distribute and modulate the energy of the laser beam to obtain a long-focus depth annular laser beam with uniform radial energy distribution;
[0016] The long-focus-depth annular laser beam can be focused on the workpiece to form a long-focus-depth annular light spot after passing through the second optical element and the third optical element.
[0017] In one embodiment of the present invention, the central axis of the first optical element is the same as the central axis of the laser beam.
[0018] In one embodiment of the present invention, a plurality of annular grooves for adjusting the positions of the first optical element, the second optical element and the third optical element are arranged in the housing.
[0019] In the utility model, the diameter (D) and focal depth (L) of the final light spot can be controlled by changing the focal lengths of the second optical element and the third optical element.
[0020] In one embodiment of the present invention, the focal length of the second optical element is 35 mm to 300 mm.
[0021] In one embodiment of the present invention, the focal length of the third optical element is 4 mm to 25 mm.
[0022] In one embodiment of the present invention, the outer diameter of the long focal depth annular light spot is 1 μm to 1000 μm.
[0023] In one embodiment of the present invention, the focal depth of the long focal depth annular spot is 100 μm to 5000 μm.
[0024] In one embodiment of the present invention, the laser beam is selected from one of an ultrafast laser beam with different wavelengths or a continuous laser beam with different wavelengths.
[0025] The second object of the utility model is to provide a laser processing system, wherein the laser processing system comprises the above-mentioned laser processing head for long-focus deep annular spot drilling.
[0026] In one embodiment of the utility model, the laser processing system is arranged on an external stage when in use and is connected to an external computer to realize the processing of a workpiece placed on the surface of the stage. The laser processing system includes a laser emitter,
[0027] The laser emitter is used to emit a laser beam. Along the emission direction of the laser beam, a first reflector, a second reflector, a laser beam expander, a third reflector and a fourth reflector are sequentially arranged between the laser emitter and the laser processing head;
[0028] The laser beam emitted by the laser emitter is at an angle to the laser beam reflected by the first reflector, and is parallel to the laser beam reflected by the second reflector;
[0029] The central axis of the laser beam passing through the laser beam expander is the same as the optical axis of the laser beam reflected by the second reflector, has an angle with the laser beam reflected by the third reflector, and is perpendicular to the laser beam reflected by the fourth reflector;
[0030] The laser transmitter and the stage are both connected to a computer.
[0031] The third object of the utility model is to provide a method for using a laser processing system, comprising the following steps:
[0032] The laser emitter is controlled by a computer to emit a laser beam, the laser beam is collimated to enter the first reflector, then collimated by the first reflector and the second reflector to enter the laser beam expander for laser beam expansion, then collimated to enter the third reflector, and then collimated by the third reflector and the fourth reflector to enter the laser processing head, the laser beam is adjusted to a long-focus depth annular beam with uniform radial energy distribution after passing through the first optical element, and then forms a long-focus depth annular light spot on the workpiece to be processed through the second optical element and the third optical component;
[0033] The computer adjusts the position of the workpiece being processed by controlling the movement of the stage.
[0034] After being processed by the laser processing system, the processed workpiece is subjected to subsequent chemical etching and other processing steps, and finally a small circular hole is formed on the processed workpiece.
[0035] In the utility model, the laser processing system has the advantages of high efficiency, high quality and high precision drilling processing by integrating various optical elements and automatic control systems;
[0036] The laser processing system of the utility model can be applied to ultrafast laser processing, etc., and significantly improves the accuracy and efficiency of laser drilling, such as high-speed glass drilling.
[0037] Compared with the prior art, the utility model has the following beneficial effects:
[0038] (1) The laser processing head for drilling a long focal depth annular spot of the utility model can control the outer diameter and focal depth of the long focal depth annular spot by changing the focal length of the second optical element and the third optical element. The long focal depth annular spot forms an annular modified area with a certain depth and uniform distribution in the processed sample.
[0039] (2) When the workpiece to be processed is a glass substrate, a corresponding glass through hole can usually be obtained through subsequent chemical etching treatment. By changing the chemical etching time, glass through holes with different apertures can be obtained. When the glass substrate is processed by the laser processing head of the utility model, the glass substrate is not prone to microcracks, the hole roundness is high, the hole depth-to-diameter ratio is high, the porosity is high, and the etching processing time is short, so that ultrafast laser high-speed glass precision drilling can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] Figure 1 This is a schematic structural diagram of a laser processing head for long-focus deep annular spot drilling as described in Example 1;
[0041] Figure 2 A schematic diagram of a focused light spot obtained by a laser processing head for drilling a long-focus deep annular light spot as described in Example 1;
[0042] Figure 3 A schematic diagram of the structure of a laser processing system described in Example 2;
[0043] Numbers in the figure: 1, housing; 2, first optical element; 3, second optical element; 4, third optical element; 5, motor; 100, laser processing head; 200, laser emitter; 300A, first reflector; 300B, second reflector; 300C, third reflector; 300D, fourth reflector; 400, laser beam expander; 500, laser beam; 600, workpiece to be processed; 700, stage; 800, computer; 900, long-focus deep annular spot. DETAILED DESCRIPTION
[0044] The utility model is described in detail below with reference to the accompanying drawings and specific embodiments.
[0045] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0046] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0047] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0048] In the following embodiments, unless otherwise specified, all components used are conventional commercially available components in the art, and they only need to be able to achieve corresponding functions.
[0049] Example 1
[0050] This embodiment provides a laser processing head for long-focus deep annular spot drilling, such as Figure 1 As shown, along the emission direction of the laser beam 500, it includes a hollow shell 1 and a first optical element 2, a second optical element 3 and a third optical element 4 sequentially arranged in the inner cavity of the shell 1; wherein the central axis of the first optical element 2, the second optical element 3 and the third optical element 4 are the same, which is the same as the central axis of the laser beam 500;
[0051] The first optical element 2 is selected from one of a diffractive optical element and a refractive optical element; the second optical element 3 is a focusing lens; the third optical element 4 is a focusing lens;
[0052] The first optical element 2 is used to adjust the laser beam 500 into a long-focus deep annular beam with uniform radial energy distribution;
[0053] The second optical element 3 and the third optical component are used to modulate the long-focus-depth annular light beam into a long-focus-depth annular light spot 900 .
[0054] In the utility model, when the first optical element 2 is a diffractive optical element, since the diffractive optical element has a unique phase distribution design that can modulate the energy distribution of the incident light beam, when the laser light beam 500 passes through the diffractive optical element, the diffractive optical element can modulate the energy distribution of the laser light beam 500 to obtain a long-focus depth annular laser light beam 500 with uniform radial energy distribution; when the first optical element 2 is a refractive optical element, based on the multi-structure refractive optical element design, when the laser light beam 500 passes through the refractive optical element, the refractive optical element can modulate the energy distribution of the laser light beam 500 to obtain a long-focus depth annular laser light beam 500 with uniform radial energy distribution;
[0055] After passing through the second optical element 3 and the third optical element 4, the long focal depth annular laser beam 500 can be focused on the workpiece 600 to form a long focal depth annular light spot 900 (eg Figure 2 As shown), the workpiece 600 is subjected to modification processing.
[0056] Furthermore, the laser beam 500 is selected from one of an ultrafast laser beam 500 with different wavelengths or a continuous laser beam 500 with different wavelengths.
[0057] Furthermore, a plurality of annular grooves for adjusting the positions of the first optical element 2, the second optical element 3 and the third optical element 4 are provided in the housing 1. By changing the focal lengths of the second optical element 3 and the third optical element 4, the diameter D and the focal depth L of the final light spot can be controlled; wherein, the focal length of the second optical element 3 is 35 mm to 300 mm, and the focal length of the third optical element 4 is 4 mm to 25 mm; the outer diameter of the obtained long focal depth annular light spot 900 is 1 μm to 1000 μm, and the focal depth is 100 μm to 5000 μm; wherein, an annular modified area with a certain depth and a diameter not less than D is obtained on the processed workpiece 600, and a small hole with a diameter not less than D can be obtained after subsequent chemical etching.
[0058] Example 2
[0059] This embodiment provides a laser processing system, such as Figure 3As shown, when in use, it is arranged on an external stage 700 and connected to an external computer 800, and is used to realize the processing of a workpiece 600 placed on the upper surface of the stage 700. The laser processing system includes a laser emitter 200 and a laser processing head 100. The laser processing head 100 described in Example 1, the laser emitter 200 is used to emit a laser beam 500, and along the emission direction of the laser beam 500, a first reflector 300A, a second reflector 300B, a laser beam expander 400, a third reflector 300C and a fourth reflector 300D are sequentially arranged between the laser emitter 200 and the laser processing head 100;
[0060] The laser processing head 100 can also be connected to an external motor 5, and the motor 5 is used to drive the laser processing head 100 to move up and down;
[0061] The laser beam 500 emitted by the laser emitter 200 is at an angle to the laser beam 500 reflected by the first reflector 300A, and is parallel to the laser beam 500 reflected by the second reflector 300B;
[0062] Furthermore, the central axis of the laser beam 500 passing through the laser beam expander 400 is the same as the optical axis of the laser beam 500 reflected by the second reflector 300B, is at an angle to the laser beam 500 reflected by the third reflector 300C, and is perpendicular to the laser beam 500 reflected by the fourth reflector 300D; the laser emitter 200 and the stage 700 are both connected to the computer 800.
[0063] The computer 800 is used to control the laser emitter 200 to emit laser, and is also used to control the movement of the stage 700 in the front, back, left and right directions, and is also used to control the motor 5 to drive the laser processing head 100 to move up and down.
[0064] Example 3
[0065] This embodiment provides a method for using the laser processing system described in Embodiment 2 of the laser processing system, comprising the following steps:
[0066] The laser emitter 200 is controlled by the computer 800 to emit a laser beam 500. The laser beam 500 is collimated and enters the first reflector 300A, and then collimated by the first reflector 300A and the second reflector 300B to enter the laser beam expander 400 for beam expansion, and then collimated to enter the third reflector 300C, and then collimated by the third reflector 300C and the fourth reflector 300D to enter the laser processing head 100. The laser beam 500 is adjusted into a long focal depth annular beam with uniform radial energy distribution after passing through the first optical element 2, and then forms a long focal depth annular beam on the processed workpiece 600 through the second optical element 3 and the third optical component, and is modulated into a long focal depth annular spot 900;
[0067] The computer 800 adjusts the position of the workpiece 600 by controlling the movement of the stage 700 , and can also assist in the processing of the workpiece 600 by moving the motor 5 .
[0068] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the interpretation of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.
Claims
1. A laser processing head for long-focus deep annular spot drilling, characterized in that: Along the emission direction of the laser beam (500), it comprises a hollow housing (1) and a first optical element (2), a second optical element (3) and a third optical element (4) which are sequentially arranged in an inner cavity of the housing (1) at intervals; Wherein, the central axes of the first optical element (2), the second optical element (3) and the third optical element (4) are the same; The first optical element (2) is selected from one of a diffractive optical element and a refractive optical element; The second optical element (3) is a focusing lens; The third optical element (4) is a focusing lens; The first optical element (2) is used to adjust the laser beam (500) into a long-focus depth annular beam with uniform radial energy distribution; The second optical element (3) and the third optical component are used to modulate the long focal depth annular light beam into a long focal depth annular light spot (900).
2. A laser processing head for long-focus deep annular spot drilling according to claim 1, characterized in that: The central axis of the first optical element (2) is the same as the central axis of the laser beam (500).
3. The laser processing head for long-focus deep annular spot drilling according to claim 1, characterized in that: A plurality of annular grooves for adjusting the positions of the first optical element (2), the second optical element (3) and the third optical element (4) are arranged in the housing (1).
4. The laser processing head for long-focus deep annular spot drilling according to claim 1, characterized in that: The focal length of the second optical element (3) is 35 mm to 300 mm.
5. The laser processing head for long-focus deep annular spot drilling according to claim 1, characterized in that: The focal length of the third optical element (4) is 4 mm to 25 mm.
6. The laser processing head for long-focus deep annular spot drilling according to claim 1, characterized in that: The outer diameter of the long-focus deep annular light spot (900) is 1 μm to 1000 μm.
7. The laser processing head for long-focus deep annular spot drilling according to claim 1, characterized in that: The focal depth of the long focal depth annular light spot (900) is 100 μm to 5000 μm.
8. A laser processing system, characterized in that: The invention comprises a laser processing head for long-focus deep annular spot drilling as described in any one of claims 1 to 7.
9. A laser processing system according to claim 8, characterized in that: When in use, it is arranged on an external stage (700) and connected to an external computer (800) to realize the processing of a workpiece (600) placed on the upper surface of the stage (700). The laser processing system comprises a laser emitter (200), The laser emitter (200) is used to emit a laser beam (500), and along the emission direction of the laser beam (500), a first reflector (300A), a second reflector (300B), a laser beam expander (400), a third reflector (300C) and a fourth reflector (300D) are sequentially arranged between the laser emitter (200) and the laser processing head (100); The laser transmitter (200) and the stage (700) are both connected to a computer (800).
10. A laser processing system according to claim 9, characterized in that: The laser beam (500) emitted by the laser emitter (200) is at an angle to the laser beam (500) reflected by the first reflector (300A), and is parallel to the laser beam (500) reflected by the second reflector (300B); The central axis of the laser beam (500) passing through the laser beam expander (400) is the same as the optical axis of the laser beam (500) reflected by the second reflector (300B), is at an angle with the laser beam (500) reflected by the third reflector (300C), and is perpendicular to the laser beam (500) reflected by the fourth reflector (300D).