Wafer thinning equipment and main shaft inclination angle adjusting mechanism for wafer thinning equipment

Abstract

The utility model discloses wafer thinning equipment and a main shaft inclination angle adjusting mechanism used for the wafer thinning equipment, and relates to the technical field of wafers, the main shaft inclination angle adjusting mechanism used for the wafer thinning equipment comprises a grinding shaft which comprises a main shaft and a boss; a main shaft is arranged in the middle of the fixed flange in a penetrating manner, and a boss is arranged above the fixed flange; the first upper portion of the adjusting supporting assembly is connected with the boss, the first lower portion of the adjusting supporting assembly is connected with the fixing flange, the adjustable screw rod is sleeved with the first upper portion and the first lower portion, and when the adjustable screw rod rotates, the first upper portion ascends and descends relative to the first lower portion; the second upper part of the fixed supporting assembly is connected with the boss, the second lower part of the fixed supporting assembly is connected with the fixed flange, the second upper part and the second lower part are coaxially connected through a connecting piece, and the peripheral part of the second upper part and the peripheral part of the second lower part are in contact through an arc surface. The device can be compatible with workpiece machining errors and assembly errors, so that the parallelism of the grinding shaft and the datum plane meets the requirement.

Description

Technical Field

[0001] The utility model relates to the field of wafer technology, and more specifically, to a spindle tilt angle adjustment mechanism for wafer thinning equipment. In addition, it also relates to a wafer thinning equipment comprising the spindle tilt angle adjustment mechanism for wafer thinning equipment. Background Art

[0002] In the current wafer back-end process, wafer thinning is a crucial link, among which the parallelism of the grinding axis relative to the reference plane plays a vital role in the wafer thinning process. Due to the combined influence of workpiece processing errors and assembly errors, as well as the requirements for the angle of the grinding axis during grinding, based on the above situation, it is urgently necessary to provide an inclination adjustment mechanism that is compatible with workpiece processing errors and assembly errors, so that the parallelism of the grinding axis and the reference plane meets the requirements. Utility Model Content

[0003] In view of this, the purpose of the utility model is to provide a spindle inclination adjustment mechanism for wafer thinning equipment, which is a inclination adjustment mechanism that is compatible with workpiece processing errors and assembly errors, and can make the parallelism of the grinding axis and the reference surface meet the requirements.

[0004] Another object of the utility model is to provide a wafer thinning device comprising the spindle inclination angle adjustment mechanism for wafer thinning device.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A spindle inclination adjustment mechanism for wafer thinning equipment, comprising:

[0007] A grinding shaft, comprising a main shaft and a boss provided on the outer periphery of the main shaft;

[0008] A fixed flange, wherein the main shaft is passed through the middle thereof, and the boss is provided above the fixed flange;

[0009] An adjustable support assembly, wherein the first upper portion is connected to the boss, the first lower portion of the adjustable support assembly is connected to the fixing flange, the first upper portion and the first lower portion are both sleeved on an adjustable screw, and when the adjustable screw rotates, the first upper portion moves up and down relative to the first lower portion;

[0010] A fixed support assembly, wherein the second upper portion is connected to the boss, the second lower portion of the fixed support assembly is connected to the fixed flange, the second upper portion and the second lower portion are coaxially connected via a connecting member, and the periphery of the second upper portion and the periphery of the second lower portion are in contact via an arc surface;

[0011] The adjusting support assembly and the fixing support assembly are arranged at intervals in the circumferential direction of the boss.

[0012] In one embodiment, the first upper portion includes an upper nut seat, the first lower portion includes a lower nut seat and an end face top screw nut arranged below the lower nut seat, the upper nut seat and the lower nut seat are both sleeved on the adjustable screw, and the end face top screw nut is sleeved on the lower nut seat to fix the lower nut seat and the fixing flange;

[0013] The upper nut seat is connected to the boss, and the adjustable screw is provided with two sections of external threads with the same rotation direction but different pitches. The internal threads of the upper nut seat and the lower nut seat are matched with the two sections of the external threads respectively.

[0014] In one embodiment, the lowermost end of the adjustable screw is provided with a flat portion for engaging with a wrench.

[0015] In one embodiment, the second upper portion includes a support seat, and the upper surface of the support seat is a first step surface that cooperates with the boss to position;

[0016] The second lower portion includes a support column, one end of the support column is a spherical surface in contact with the support seat, and the other end of the support column is a second step surface that cooperates with the fixing flange for positioning.

[0017] In one embodiment, a through hole is formed through the middle of the support seat and the support column, and the connecting member includes a bolt, which passes through the through hole to lock the support seat, the support column and the fixing flange.

[0018] In one embodiment, the boss is provided with two adjusting support components and one fixing support component along the circumferential direction, and the two adjusting support components are relatively distributed with the fixing support component as a symmetrical point.

[0019] In one embodiment, assembly bolts are respectively provided on both sides of the two adjustable support assemblies and on both sides of the fixed support assembly, one end of the assembly bolt is inserted into the boss, the other end of the assembly bolt is fixed to the limit platform of the fixed flange, and a disc spring is clamped between the other end of the assembly bolt and the limit platform.

[0020] A wafer thinning device comprises any one of the above-mentioned spindle inclination adjustment mechanisms for wafer thinning devices.

[0021] In one embodiment, a detection device for detecting the inclination angle of the main shaft is also included.

[0022] In one embodiment, the detection device comprises a dial gauge.

[0023] When using the spindle inclination adjustment mechanism for wafer thinning equipment provided by the utility model, a spindle is passed through the middle of the fixed flange, and the boss is located above the fixed flange, and then the fixed support assembly and the adjustable support assembly can be installed between the fixed flange and the boss. For example, the second upper part of the fixed support assembly can be connected to the boss, the second lower part of the fixed support assembly can be connected to the fixed flange, and the second upper part and the second lower part can be rotatably connected, that is, the second upper part and the second lower part can move relative to each other under external force. Afterwards, the first upper part of the adjustable support assembly is connected to the boss, the first lower part of the adjustable support assembly is connected to the fixed flange, and the first upper part and the first lower part are both sleeved on the adjustable screw. Finally, the adjustable screw of a certain adjustable support assembly is rotated to make the first upper part move up and down relative to the first lower part.

[0024] When the first upper part moves up and down, it can drive the boss to move, but because the fixed support component has not moved at this time, the boss will flip around a certain point, and the movement of the boss will cause the spindle to tilt. At the same time, when the boss flips, a rollover force is applied to the second upper part, and because the second upper part and the second lower part are in contact through the arc surface, the second upper part will be subjected to the rollover force, which will cause the second upper part and the second lower part to move relative to each other to adapt to the flipping process of the boss and the tilting process of the spindle. When the spindle is tilted in place, the rotation operation of the adjustable screw is stopped so that the parallelism of the grinding axis and the reference surface meets the requirements to accommodate the workpiece processing error and assembly error.

[0025] In summary, the spindle inclination adjustment mechanism for wafer thinning equipment provided by the utility model is an inclination adjustment mechanism that is compatible with workpiece processing errors and assembly errors, and can make the parallelism of the grinding axis and the reference surface meet the requirements.

[0026] In addition, the utility model also provides a wafer thinning device including the above-mentioned spindle inclination angle adjustment mechanism for wafer thinning equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of a spindle tilt angle adjustment mechanism for a wafer thinning device provided by the utility model;

[0029] Figure 2 A schematic diagram of the layout of the adjustable support assembly and two mounting bolts;

[0030] Figure 3 A schematic diagram of the layout of the fixed support assembly and two assembly bolts;

[0031] Figure 4 It is a schematic diagram of the structure of the fixed support assembly;

[0032] Figure 5 for Figure 4 sectional view of

[0033] Figure 6 A schematic diagram of the structure of the adjustable support assembly;

[0034] Figure 7 for Figure 6 Cross-sectional view of .

[0035] Reference numerals:

[0036] 1-support seat; 11-first step surface; 12-bolt; 2-support column; 21-spherical surface; 22-second step surface; 3-upper nut seat; 4-lower nut seat; 5-end face top screw nut; 6-adjustable screw; 61-flat position; 7-grinding shaft; 71-spindle; 72-boss; 8-fixing flange; 9-disc spring; 91-assembly bolt; A-adjusting support assembly; B-fixing support assembly. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] The core of the utility model is to provide a spindle tilt angle adjustment mechanism for wafer thinning equipment, which is a tilt angle adjustment mechanism that is compatible with workpiece processing errors and assembly errors, and can make the parallelism between the grinding axis and the reference surface meet the requirements. Another core of the utility model is to provide a wafer thinning equipment including the spindle tilt angle adjustment mechanism for wafer thinning equipment.

[0039] Please refer to Figures 1 to 7 .

[0040] This specific embodiment provides a spindle inclination adjustment mechanism for a wafer thinning device, comprising:

[0041] The grinding shaft 7 comprises a main shaft 71 and a boss 72 arranged on the outer periphery of the main shaft 71;

[0042] A fixed flange 8, a main shaft 71 is passed through the middle thereof, and a boss 72 is provided above the fixed flange 8;

[0043] The first upper portion of the adjustable support assembly A is connected to the boss 72, and the first lower portion of the adjustable support assembly A is connected to the fixed flange 8. The first upper portion and the first lower portion are both sleeved on the adjustable screw 6. When the adjustable screw 6 rotates, the first upper portion moves up and down relative to the first lower portion.

[0044] A fixed support assembly B, wherein the second upper portion is connected to the boss 72, the second lower portion of the fixed support assembly B is connected to the fixed flange 8, the second upper portion and the second lower portion are coaxially connected via a connecting member, and the periphery of the second upper portion and the periphery of the second lower portion are in contact via an arc surface;

[0045] Adjustable support components A and fixed support components B are provided at intervals in the circumferential direction of the boss 72 .

[0046] It should be noted that the second upper part and the second lower part are rotatably connected to each other to perform micro-adjustment, rather than specifically referring to the second upper part and the second lower part being hinged or connected by a rotating shaft. In addition, the fixed flange 8 is fixed, and the inclination angle of the main shaft 71 is adjusted by adjusting the support assembly A so that the parallelism between the grinding shaft 7 and the reference surface meets the requirements, thereby compensating for the accumulated processing errors of other components and achieving an ideal assembly state of the components.

[0047] In actual use, the shape, structure, size, etc. of the grinding shaft 7, the fixing flange 8, the adjusting support assembly A and the fixing support assembly B can be determined according to actual conditions and actual needs.

[0048] When using the spindle inclination adjustment mechanism for wafer thinning equipment provided by the utility model, a spindle 71 is passed through the middle of the fixed flange 8, and the boss 72 is located above the fixed flange 8, and then the fixed support assembly B and the adjustable support assembly A can be installed between the fixed flange 8 and the boss 72. For example, the second upper part of the fixed support assembly B can be connected to the boss 72, the second lower part of the fixed support assembly B can be connected to the fixed flange 8, and the second upper part and the second lower part can be rotatably connected, that is, the second upper part and the second lower part can move relative to each other under external force. Afterwards, the first upper part of the adjustable support assembly A is connected to the boss 72, the first lower part of the adjustable support assembly A is connected to the fixed flange 8, and the first upper part and the first lower part are both sleeved on the adjustable screw 6. Finally, the adjustable screw 6 of a certain adjustable support assembly A is rotated to make the first upper part move up and down relative to the first lower part.

[0049] When the first upper part moves up and down, the boss 72 can be driven to move, but since the fixed support assembly B has not moved at this time, the boss 72 will flip around a certain point, and the movement of the boss 72 will cause the spindle 71 to tilt. At the same time, when the boss 72 flips, it applies a rollover force to the second upper part, and since the second upper part and the second lower part are in contact through the arc surface, the second upper part will be subjected to the rollover force, which will cause the second upper part and the second lower part to move relative to each other to adapt to the flipping process of the boss 72 and the tilting process of the spindle 71. When the spindle 71 is tilted in place, the rotation operation of the adjustable screw 6 is stopped so that the parallelism of the grinding shaft 7 and the reference surface meets the requirements to accommodate the workpiece processing error and assembly error.

[0050] In summary, the spindle inclination adjustment mechanism for wafer thinning equipment provided by the utility model is an inclination adjustment mechanism that is compatible with workpiece processing errors and assembly errors, and can make the parallelism of the grinding axis 7 and the reference surface meet the requirements.

[0051] In one embodiment, the first upper part includes an upper nut seat 3, the first lower part includes a lower nut seat 4 and an end face top screw nut 5 arranged below the lower nut seat 4, the upper nut seat 3 and the lower nut seat 4 are both sleeved on the adjustable screw 6, and the end face top screw nut 5 is sleeved on the lower nut seat 4 to fix the lower nut seat 4 and the fixed flange 8; the upper nut seat 3 is connected to the boss 72, and the adjustable screw 6 is provided with two sections of external threads with the same rotation direction but different pitches, and the internal threads of the upper nut seat 3 and the lower nut seat 4 are respectively matched with the two sections of external threads.

[0052] It should be noted that the structure of the adjusting support assembly A is as follows Figure 2 , Figure 6 , Figure 7 As shown, it includes four parts, namely, an upper nut seat 3, a lower nut seat 4, an end face top screw nut 5 and an adjustable screw 6. The upper nut seat 3, the lower nut seat 4 and the end face top screw nut 5 are installed on the adjustable screw 6. The end face top screw nut 5 is used to lock and fix the lower nut seat 4 to the fixing flange 8. The thread on the adjustable screw 6 is two sections of threads with the same rotation direction and different pitches. The threads of the upper nut seat 3 and the lower nut seat 4 are used to match the two sections of threads of the adjustable screw 6.

[0053] Therefore, when the adjustable screw 6 is rotated, the upper nut seat 3 and the lower nut seat 4 will move in the same direction at the same time, but the moving distances of the upper nut seat 3 and the lower nut seat 4 are not equal, and the lower nut seat 4 is connected to the fixed flange 8 and cannot move up and down, so the relative distance of the upper nut seat 3 compared to the lower nut seat 4 (that is, the lifting distance of the upper nut seat 3) is the difference between the two pitches of the adjustable screw 6 multiplied by the number of rotations of the adjustable screw 6. The lifting and lowering movement of the upper nut seat 3 can drive the boss 72 to move, and then adjust the inclination angle of the main shaft 71 to achieve the adjustment operation of the small feed amount.

[0054] In one embodiment, the lowermost end of the adjustable screw 6 is provided with a flat position 61 for engaging with a wrench. Therefore, when it is necessary to drive the adjustable screw 6 to rotate, a wrench tool can be used to engage with the flat position 61, and the adjustable screw 6 can be rotated by turning the wrench. In this process, the operation of the operator is more labor-saving and convenient.

[0055] In one embodiment, the second upper part includes a support seat 1, the upper surface of the support seat 1 is a first step surface 11 that cooperates with the boss 72 for positioning; the second lower part includes a support column 2, one end of the support column 2 is a spherical surface 21 that contacts the support seat 1, and the other end of the support column 2 is a second step surface 22 that cooperates with the fixing flange 8 for positioning.

[0056] It should be noted that the structure of the fixed support assembly B is as follows Figure 3 , Figure 4 , Figure 5 As shown, it includes components such as a support seat 1 and a support column 2, and the support seat 1 and the support column 2 can be connected by bolts 12. The connecting surfaces of the support seat 1 and the support column 2 are in contact in the form of a spherical surface 21. The advantage of this design is that the support seat 1 can rotate slightly around the spherical surface 21, and the upper surface of the support seat 1 is designed as a first step surface 11, so as to facilitate the matching and positioning with the boss 727, one end of the support column 2 is designed as a spherical surface 21 to contact the support seat 1, and the other end of the support column 2 is designed as a second step surface 22 to match and position with the fixing flange 8.

[0057] In one embodiment, a through hole is formed in the middle of the support seat 1 and the support column 2, and the connecting member includes a bolt 12, which passes through the through hole to lock the support seat 1, the support column 2 and the fixing flange 8. That is, the bolt 12 passes through the support seat 1 and the support column 2 and is locked and fixed with the fixing flange 8.

[0058] In one embodiment, the boss 72 is provided with two adjustable support components A and one fixed support component B at intervals along the circumferential direction, and the two adjustable support components A are relatively distributed with the fixed support component B as a symmetrical point.

[0059] It should be noted that the fixed support assembly B can be used as the adjustment reference point of the adjustable support assembly A. The two adjustable support assemblies A are relatively distributed with the fixed support assembly B as the symmetrical point, so that the adjustment operation of the main shaft 71 by each adjustable support assembly A can be uniformly stressed, and the two adjustable support assemblies A can realize the adjustment operation of the main shaft 71 in all directions and angles. That is, this setting can make the structure more stable and the force more uniform when the device performs the inclination adjustment operation, and during use, a certain adjustable support assembly A can be selectively rotated and adjusted according to the actual situation, or both adjustable support assemblies A can be rotated and adjusted, so that the grinding shaft 7 can realize the adjustment operation in multiple directions and angles.

[0060] It should be noted that if only one adjustable support assembly A and one fixed support assembly B are provided, the structural stability may be poor and the force may be uneven during the adjustment process. In this case, the main shaft 71 can only be rotated up and down around the fixed direction of the fixed support assembly B, and it may not be possible to adjust the main shaft 71 to the required inclination angle. In addition, if multiple adjustable support assemblies A and multiple fixed support assemblies B are provided, it is also easy to make the adjustment operation more complicated, and multiple fixed support assemblies B are also easy to cause part of the structure to be fixed, and thus the inclination angle of the main shaft 71 cannot be adjusted.

[0061] Preferably, two adjustable support components A and one fixed support component B may be provided at equal intervals in the circumferential direction of the boss 72, that is, the angle between two adjacent support components is 120°. Figure 1 As shown, when the support assembly A is adjusted, the components are evenly stressed, the structural stability is better, and the processing and manufacturing of the device is convenient.

[0062] In one embodiment, both sides of the two adjustment support assemblies A and both sides of the fixed support assembly B are respectively provided with assembly bolts 91, one end of the assembly bolt 91 is inserted into the boss 72, the other end of the assembly bolt 91 is fixed to the limit platform of the fixed flange 8, and a disc spring 9 is sandwiched between the other end of the assembly bolt 91 and the limit platform, the structure is as follows: Figure 2 and Figure 3 shown.

[0063] It should be noted that the support seat 1 and the boss 72 in the fixed support assembly B are connected and fixed by bolts 12, and a countersunk hole is designed at the corresponding position on the boss 72 to cooperate with the first step surface 11 of the support seat 1 to achieve a positioning effect. The upper nut seat 3 and the boss 72 in the adjustable support assembly A are connected and fixed by bolts 12, and the boss 72 and the fixed flange 8 are locked and connected by 6 assembly bolts 91, among which, disc springs 9 are placed on the two assembly bolts 91 locked on both sides of the adjustable support assembly A, and disc springs 9 are placed on the two assembly bolts 91 locked on both sides of the fixed support assembly B. After pre-tightening, the disc spring 9 can be deformed under the action of external force, so that the boss 72 moves with the adjustable screw 6, thereby driving the main shaft 71 to tilt slightly, rather than the boss 72 and the fixed flange 8 being fixedly connected and unable to move.

[0064] In order to further illustrate the use method of the spindle tilt angle adjustment mechanism for wafer thinning equipment provided by the present invention, an example is given below.

[0065] When the adjustable screw 6 is rotated, the upper nut seat 3 moves to drive the boss 72 to move, and the main shaft 71 is tilted around the fixed support assembly B. In this process, the lower nut seat 4 is fixed, and the compression amount of the disc spring 9 changes, thereby realizing the inclination adjustment of the main shaft 71. And the inclination adjustment operation is very convenient, and only needs to use an open-end wrench to clamp on the flat part 61 of the adjustable screw 6 and rotate it.

[0066] In addition to the above-mentioned spindle inclination adjustment mechanism for wafer thinning equipment, the utility model also provides a wafer thinning equipment including the spindle inclination adjustment mechanism for wafer thinning equipment disclosed in the above-mentioned embodiment. For the structure of other parts of the wafer thinning equipment, please refer to the prior art and will not be repeated in this article.

[0067] In one embodiment, a detection device for detecting the inclination of the main shaft 71 is further included. The detection device can be used to detect the inclination of the main shaft 71. If the inclination of the main shaft 71 reaches the desired angle, there is no need to adjust the inclination. If the inclination of the main shaft 71 does not reach the desired angle, the adjustable screw 6 is continued to be rotated to further adjust the inclination of the main shaft 71.

[0068] In one embodiment, the detection device includes a micrometer. The micrometer is a length measuring instrument that converts general linear displacement (linear motion) into the rotational motion of a pointer through gears or levers, and then reads the length on the dial of the micrometer. Therefore, the micrometer can accurately detect the movement of the spindle 71 and convert it into the tilt angle of the spindle 71, which makes it easier for the operator to determine whether the spindle 71 is leveled.

[0069] It should be noted that the first upper part and the second upper part, the first lower part and the second lower part, the first step surface 11 and the second step surface 22 mentioned in the present invention, wherein the first and the second are only for distinguishing the different positions, and there is no order of precedence.

[0070] In addition, it should be noted that the orientation or position relationship indicated by "up and down" etc. in the present invention is based on the orientation or position relationship shown in the drawings, and is only for the convenience of simplifying the description and facilitating understanding, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0071] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other. Any combination of all embodiments provided by the utility model is within the protection scope of this utility model and will not be described in detail here.

[0072] The wafer thinning equipment and the spindle inclination adjustment mechanism for the wafer thinning equipment provided by the utility model are introduced in detail above. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A spindle inclination adjustment mechanism for wafer thinning equipment, characterized in that: include: A grinding shaft (7), comprising a main shaft (71) and a boss (72) provided on the outer periphery of the main shaft (71); A fixed flange (8), wherein the main shaft (71) is passed through the middle thereof, and the boss (72) is provided above the fixed flange (8); An adjustable support assembly (A), wherein a first upper portion is connected to the boss (72), a first lower portion of the adjustable support assembly (A) is connected to the fixing flange (8), the first upper portion and the first lower portion are both sleeved on an adjustable screw (6), and when the adjustable screw (6) rotates, the first upper portion moves up and down relative to the first lower portion; A fixed support assembly (B), wherein the second upper portion is connected to the boss (72), the second lower portion of the fixed support assembly (B) is connected to the fixed flange (8), the second upper portion and the second lower portion are coaxially connected via a connecting member, and the periphery of the second upper portion and the periphery of the second lower portion are in contact via an arc surface; The boss (72) is provided with the adjusting support assembly (A) and the fixing support assembly (B) at intervals in the circumferential direction.

2. The spindle inclination adjustment mechanism for wafer thinning equipment according to claim 1, characterized in that: The first upper portion comprises an upper nut seat (3), the first lower portion comprises a lower nut seat (4) and an end face top screw nut (5) arranged below the lower nut seat (4), the upper nut seat (3) and the lower nut seat (4) are both sleeved on the adjustable screw (6), and the end face top screw nut (5) is sleeved on the lower nut seat (4) to fixedly connect the lower nut seat (4) and the fixing flange (8); the upper nut seat (3) and the boss (72) are connected, and the adjustable screw (6) is provided with two sections of external threads with the same rotation direction but different pitches, and the internal threads of the upper nut seat (3) and the lower nut seat (4) respectively match the two sections of the external threads.

3. The spindle inclination adjustment mechanism for wafer thinning equipment according to claim 2, characterized in that: The lowermost end of the adjustable screw rod (6) is provided with a flat portion (61) for engaging with a wrench.

4. The spindle inclination adjustment mechanism for wafer thinning equipment according to claim 1, characterized in that: The second upper portion comprises a support seat (1), the upper surface of the support seat (1) being a first step surface (11) for cooperating with the boss (72) for positioning; The second lower portion comprises a support column (2), one end of the support column (2) being a spherical surface (21) in contact with the support seat (1), and the other end of the support column (2) being a second step surface (22) cooperating with the fixing flange (8) for positioning.

5. The spindle inclination adjustment mechanism for wafer thinning equipment according to claim 4, characterized in that: A through hole is formed in the middle of the support seat (1) and the support column (2), and the connecting member comprises a bolt (12), and the bolt (12) passes through the through hole to lock the support seat (1), the support column (2) and the fixing flange (8).

6. The spindle inclination adjustment mechanism for wafer thinning equipment according to any one of claims 1 to 5, characterized in that: The boss (72) is provided with two adjusting support components (A) and one fixed support component (B) along the circumferential direction, and the two adjusting support components (A) are relatively distributed with the fixed support component (B) as a symmetrical point.

7. The spindle inclination adjustment mechanism for wafer thinning equipment according to claim 6, characterized in that: Assembly bolts (91) are respectively provided on both sides of the two adjustable support assemblies (A) and on both sides of the fixed support assembly (B), one end of the assembly bolt (91) is inserted into the boss (72), the other end of the assembly bolt (91) is fixed to the limit platform of the fixed flange (8), and a disc spring (9) is sandwiched between the other end of the assembly bolt (91) and the limit platform.

8. A wafer thinning device, characterized in that: It comprises the spindle inclination adjustment mechanism for wafer thinning equipment as described in any one of claims 1 to 7 above.

9. The wafer thinning equipment according to claim 8, characterized in that: It also includes a detection device for detecting the inclination angle of the main shaft (71).

10. The wafer thinning equipment according to claim 9, characterized in that: The detection device comprises a dial gauge.

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