Polishing device based on thinning and scribing process

Abstract

The utility model relates to the technical field of polishing based on a thinning and scribing process, in particular to a polishing device based on the thinning and scribing process. The technical problems that a common polishing device based on the thinning scribing technology only has a polishing function, but lacks a polishing solution recycling function and a multi-station polishing function, the wafer angle cannot be changed, resources are wasted, and the working efficiency is low are solved. According to the technical scheme, the polishing device based on the thinning and scribing process comprises a polishing solution recycling box. According to the polishing device, the underwater water suction pump is arranged, polishing liquid can be recycled, multi-station operation can be achieved through the arrangement of the multiple containing plates, the wafer angle can be changed through the arrangement of the angle adjusting plate, and therefore the problems that a common polishing device based on the thinning and scribing technology only has the polishing function, and the polishing effect is poor are solved. In the prior art, a polishing solution recovery function, a multi-station polishing function and a wafer angle changing function are lacked, resources are wasted, the angle of a wafer cannot be changed, and the working efficiency is low.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing based on a thinning and scribing process, in particular to a polishing device based on a thinning and scribing process. Background Art

[0002] After the wafer has gone through the previous process, the chip preparation is completed, and it needs to be cut to separate the chips on the wafer, and finally packaged. The wafer cutting process selected for wafers of different thicknesses is also different. Wafers with a thickness of more than 100um are generally cut with blades, and wafers with a thickness of less than 100um are generally cut with lasers. Laser cutting can reduce the problems of peeling and cracking, but when it is above 100um, the production efficiency will be greatly reduced. Wafers with a thickness of less than 30um use plasma cutting. Plasma cutting has a fast speed and will not damage the wafer surface, thereby improving the yield, but its process is more complicated.

[0003] Common polishing devices based on thinning and scribing processes only include a polishing function and can polish wafers, but lack the functions of recovering the polishing liquid, multi-station polishing, and changing the angle of the wafer. The used polishing liquid can only be recovered and discarded, which is a great waste of resources. It is impossible to change the angle of the wafer for polishing according to the thickness and shape of the wafer, and only one wafer can be polished at a time, resulting in low work efficiency.

[0004] Therefore, the polishing device for the above-mentioned thinning and dicing process lacks the functions of recovering the polishing liquid, multi-station polishing, and changing the angle of the wafer. The used polishing liquid can only be recovered and discarded, which is a great waste of resources. It is impossible to change the angle of the wafer for polishing according to the thickness and shape of the wafer, and only one wafer can be polished at a time. This problem urgently needs to be solved to improve the use scenario of the polishing device for the thinning and dicing process. Utility Model Content

[0005] In order to overcome the common polishing device based on thinning and scribing process, there is a lack of polishing liquid recovery function, multi-station polishing function and wafer angle change function. The used polishing liquid can only be recycled and discarded, which is a great waste of resources. It is impossible to change the wafer angle for polishing according to the wafer thickness and shape, and only one wafer can be polished at a time, resulting in low work efficiency.

[0006] The technical solution of the utility model is: a polishing device based on a thinning and scribing process, including a polishing liquid recovery box, a filter plate is arranged inside the polishing liquid recovery box, the inner bottom end of the polishing liquid recovery box is rectangular and welded with sixteen support rods, the top ends of the support rods pass through the filter plate and are placed on the top of the filter plate, four placement plates are arranged on the top ends of the support rods, L-shaped support plates are welded at the four corners of the top of the polishing liquid recovery box, a top plate is welded on the top of the L-shaped support plate, a hydraulic pump is arranged in the middle of the top of the top plate, a telescopic rod is arranged in the middle of the bottom of the top plate corresponding to the position of the hydraulic pump, a fixed frame is arranged at the bottom end of the telescopic rod, a motor is arranged in the middle of the fixed frame, a connecting rod is arranged at the bottom of the fixed frame corresponding to the position of the motor, and a polishing disc is arranged at the bottom of the connecting rod.

[0007] Preferably, by providing an underwater water pump, the filtered polishing liquid can flow to the polishing plate again through the water pipe, and by providing multiple placement plates, multiple wafers can be polished at a time, and by providing an angle adjustment plate, the angle of the wafer can be adjusted, so as to solve the problem that the common polishing device based on the thinning and dicing process only includes a polishing function and can polish the wafer, but lacks the function of recovering the polishing liquid, the function of multi-station polishing and the function of changing the wafer angle. The used polishing liquid can only be recovered and discarded, which is a great waste of resources. The angle of the wafer cannot be changed according to the thickness and shape of the wafer for polishing, and only one wafer can be polished at a time, resulting in low work efficiency.

[0008] Preferably, the four sides of the filter plate are welded to the inner wall of the polishing liquid recovery box, and the top of the filter plate is rectangular with filter holes. The polishing liquid flowing out of the water pipe is filtered through the filter holes on the filter plate and then enters the interior of the polishing liquid recovery box again.

[0009] Preferably, a placement groove is provided on the top of the placement plate, and four latch rods are welded in a rectangular shape at the bottom of the placement plate corresponding to the position of the support rod. The bottom ends of the latch rods are inserted into the interior of the support rods, and the placement plate is fixed by inserting the latch rods into the interior of the support rods. The wafer is placed inside the placement groove to achieve multi-station polishing, thereby preventing the problem of only one wafer being polished at a time, which affects work efficiency.

[0010] Preferably, the top end of the telescopic rod passes through the top plate and is connected to the output end of the hydraulic pump, and the bottom end of the telescopic rod is welded to the top of the fixed frame. When the hydraulic pump is started, the hydraulic pump drives the telescopic rod to move downward, and the telescopic rod drives the fixed frame to move downward.

[0011] Preferably, the top end of the connecting rod passes through the fixed frame and is connected to the output end of the motor, and the bottom end of the connecting rod is welded to the top of the polishing disk. When the motor is started, the motor drives the connecting rod to rotate, and the connecting rod drives the polishing disk to rotate.

[0012] Preferably, an underwater water pump is arranged on the side of the bottom end of the polishing liquid recovery box, and a water pipe is arranged on the side of the polishing liquid recovery box corresponding to the position of the underwater water pump. When the underwater water pump is started, the underwater water pump pumps the polishing liquid in the polishing liquid recovery box into the water pipe.

[0013] Preferably, the bottom end of the water pipe passes through the polishing liquid recovery box and is connected to the output end of the underwater water pump, and the top end of the water pipe extends to the top of the top plate. The top end of the water pipe corresponds to the position of the polishing disk and passes through the top plate from top to bottom and is placed above the polishing disk. The polishing liquid is transported upward through the water pipe until the polishing liquid flows onto the polishing disk, thereby realizing the recycling of the polishing liquid and preventing the polishing liquid from being directly recycled and discarded after use, thereby wasting resources.

[0014] Preferably, a number of fixing grooves are arranged at equal intervals at the inner bottom end of the placement groove, and an angle adjustment plate is arranged at the position of the fixing groove at the inner bottom end of the placement groove corresponding to the position of the fixing groove. A connecting block is welded at the bottom of the angle adjustment plate, and the angle adjustment plate is inserted into the interior of the fixing groove through the connecting block and fixed. When the angle of the wafer needs to be adjusted according to the thickness and shape of the wafer, the angle adjustment plate with the appropriate angle is placed inside the placement groove, and the angle adjustment plate is inserted into the interior of the fixing groove through the connecting block and fixed. The wafer is lifted up by the angle adjustment plate, thereby realizing the function of changing the angle of the wafer and preventing the wafer from being polished without being able to change the angle according to the thickness and shape of the wafer.

[0015] Beneficial effects of the utility model:

[0016] 1. By setting up an underwater pump, the filtered polishing liquid can flow to the polishing plate again through the water pipe, and by setting up multiple placement plates, multiple wafers can be polished at a time, so as to solve the problem that the common polishing device based on the thinning and scribing process only includes a polishing function and can polish the wafer, but lacks the function of recycling the polishing liquid and the function of multi-station polishing. The used polishing liquid can only be recycled and discarded, which is a great waste of resources, and can only polish one wafer at a time, which has low work efficiency;

[0017] 2. Insert the four placement plates into the support rods through the latch rods and fix them. The wafers are placed inside the placement slots. The area of ​​the polishing disc can cover the wafers in the four placement slots. During processing, the four wafers can be polished at the same time to achieve multi-station polishing.

[0018] 3. The underwater water pump draws the polishing liquid in the polishing liquid recovery box into the water pipe, and the polishing liquid is transported upward through the water pipe until it flows onto the polishing disc. The used polishing liquid is filtered through the filter holes on the filter plate and then enters the polishing liquid recovery box again, thus realizing the recycling of the polishing liquid.

[0019] 4. When the angle of the wafer needs to be adjusted according to the thickness and shape of the wafer, place the angle-adapting angle adjustment plate inside the placement slot, and insert the angle adjustment plate into the fixed slot through the connecting block to fix it. The wafer is lifted up by the angle adjustment plate, thereby realizing the function of changing the wafer angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 What is shown is a three-dimensional structural schematic diagram of a polishing device based on a thinning and scribing process of the utility model;

[0021] Figure 2 What is shown is a schematic diagram of a three-dimensional cross-sectional structure of a polishing device based on a thinning and scribing process of the utility model;

[0022] Figure 3 What is shown is a schematic diagram of the three-dimensional structure of a polishing liquid recovery box of a polishing device based on a thinning and scribing process of the utility model;

[0023] Figure 4 What is shown is a schematic diagram of a three-dimensional structure of a polishing device placement plate based on a thinning and scribing process of the utility model;

[0024] Figure 5 What is shown is a schematic diagram of the three-dimensional structure of an angle adjustment plate of a polishing device based on a thinning and scribing process of the utility model.

[0025] In the figure: 1. polishing liquid recovery box; 2. filter plate; 3. filter hole; 4. support rod; 5. placement plate; 6. placement slot; 7. latch rod; 8. underwater water pump; 9. L-shaped support plate; 10. top plate; 11. hydraulic pump; 12. telescopic rod; 13. fixed frame; 14. motor; 15. connecting rod; 16. polishing disc; 17. water pipe; 18. fixed slot; 19. angle adjustment plate; 20. connecting block. DETAILED DESCRIPTION

[0026] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0027] See also Figure 1-5The utility model provides an embodiment: a polishing device based on a thinning and scribing process, comprising a polishing liquid recovery box 1, a filter plate 2 is arranged inside the polishing liquid recovery box 1, the inner bottom end of the polishing liquid recovery box 1 is rectangular and welded with sixteen support rods 4, the top ends of the support rods 4 pass through the filter plate 2 and are placed on the top thereof, four placement plates 5 are arranged on the top ends of the support rods 4, L-shaped support plates 9 are welded at the four corners of the top of the polishing liquid recovery box 1, a top plate 10 is welded on the top of the L-shaped support plate 9, a hydraulic pump 11 is arranged in the middle of the top of the top plate 10, a telescopic rod 12 is arranged in the middle of the bottom of the top plate 10 corresponding to the position of the hydraulic pump 11, a fixed frame 13 is arranged at the bottom end of the telescopic rod 12, a motor 14 is arranged in the middle of the fixed frame 13, a connecting rod 15 is arranged at the bottom of the fixed frame 13 corresponding to the position of the motor 14, and a polishing disc 16 is arranged at the bottom of the connecting rod 15.

[0028] See also Figure 1-5 In this embodiment, the four sides of the filter plate 2 are welded to the inner wall of the polishing liquid recovery box 1, and the top of the filter plate 2 is rectangular and provided with a filter hole 3. The personnel insert the four placement plates 5 into the interior of the support rod 4 through the latch rod 7 for fixing, and the wafer is placed in the interior of the placement groove 6. When the angle of the wafer needs to be adjusted according to the thickness and shape of the wafer, the angle adjustment plate 19 with an angle adaptation is placed in the interior of the placement groove 6, and the angle adjustment plate 19 is inserted into the interior of the fixing groove 18 through the connecting block 20 for fixing, and the wafer is lifted up by the angle adjustment plate 19. After the angle adjustment of the wafer is completed, the hydraulic pump 11 is started, and the hydraulic pump 11 drives The telescopic rod 12 is moved downward, and the telescopic rod 12 drives the fixed frame 13 to move downward until the polishing disc 16 is in contact with the wafer, and the motor 14 is started. The motor 14 drives the connecting rod 15 to rotate, and the connecting rod 15 drives the polishing disc 16 to rotate, and the wafer is polished by the rotating polishing disc 16. At the same time, the underwater water pump 8 is started, and the underwater water pump 8 pumps the polishing liquid in the polishing liquid recovery box 1 to the water pipe 17. The polishing liquid is transported upward through the water pipe 17 until the polishing liquid flows onto the polishing disc 16. The used polishing liquid is filtered through the filter hole 3 on the filter plate 2 and then enters the interior of the polishing liquid recovery box 1 again to complete the polishing work.

[0029] See also Figure 1-5In this embodiment, the four sides of the filter plate 2 are welded to the inner wall of the polishing liquid recovery box 1, the top of the filter plate 2 is rectangular and provided with a filter hole 3, the top of the placement plate 5 is provided with a placement groove 6, the bottom of the placement plate 5 corresponds to the position of the support rod 4 and is welded with four latch rods 7 in a rectangular shape, the bottom end of the latch rod 7 is inserted into the interior of the support rod 4, an underwater water pump 8 is provided on the side of the bottom end of the interior of the polishing liquid recovery box 1, and a water pipe 17 is provided on the side of the polishing liquid recovery box 1 corresponding to the position of the underwater water pump 8. The bottom end of the water pipe 17 passes through the polishing liquid recovery box 1 and is connected to the output end of the underwater water pump 8. The top end of the water pipe 17 extends to the top of the top plate 10, and the top end of the water pipe 17 passes through the top plate 10 from top to bottom corresponding to the position of the polishing disk 16 and is placed above the polishing disk 16. The four placement plates 5 are fixed by inserting the latch rods 7 into the interior of the support rod 4, and the inner bottom end of the placement groove 6 is provided with a plurality of fixed grooves 18 at equal intervals, and the inner bottom end of the placement groove 6 is provided with a fixed groove 18 at the position corresponding to the fixed groove 18. Angle adjustment plate 19, a connecting block 20 is welded at the bottom of the angle adjustment plate 19, and the angle adjustment plate 19 is inserted into the interior of the fixing groove 18 through the connecting block 20 for fixing. The wafer is placed inside the placement groove 6 to realize multi-station polishing, and prevent the problem of only polishing one wafer at a time, which affects the work efficiency. When the angle of the wafer needs to be adjusted according to the thickness and shape of the wafer, the angle-adapted angle adjustment plate 19 is placed inside the placement groove 6, and the angle adjustment plate 19 is inserted into the interior of the fixing groove 18 through the connecting block 20 for fixing. The wafer is lifted up by the angle adjustment plate 19, and the function of changing the angle of the wafer is realized, and it is prevented that the angle of the wafer cannot be changed according to the thickness and shape of the wafer for polishing. The underwater water pump 8 draws the polishing liquid in the polishing liquid recovery box 1 to the water pipe 17, and the polishing liquid is transported upward through the water pipe 17 until the polishing liquid flows to the polishing disk 16, so as to realize the recycling of the polishing liquid and prevent the polishing liquid from being directly recycled and discarded after use, which wastes resources.

[0030] When working, personnel insert the four placement plates 5 into the support rod 4 through the latch rod 7 to fix them, and place the wafer in the placement slot 6. When the angle of the wafer needs to be adjusted according to the thickness and shape of the wafer, the angle adjustment plate 19 with the appropriate angle is placed in the placement slot 6, and the angle adjustment plate 19 is inserted into the fixing slot 18 through the connecting block 20 to fix it. The wafer is lifted up by the angle adjustment plate 19 to achieve the function of changing the wafer angle. After the angle adjustment of the wafer is completed, the hydraulic pump 11 is started, and the hydraulic pump 11 drives the telescopic rod 12 to move downward, and the telescopic rod 12 drives the fixed The frame 13 moves downward until the polishing disk 16 is in contact with the wafer, and the motor 14 is started. The motor 14 drives the connecting rod 15 to rotate, and the connecting rod 15 drives the polishing disk 16 to rotate. The wafer is polished by the rotating polishing disk 16 to achieve multi-station polishing. At the same time, the underwater water pump 8 is started, and the underwater water pump 8 pumps the polishing liquid in the polishing liquid recovery box 1 to the water pipe 17. The polishing liquid is transported upward through the water pipe 17 until the polishing liquid flows onto the polishing disk 16. The used polishing liquid is filtered through the filter hole 3 on the filter plate 2 and then enters the interior of the polishing liquid recovery box 1 again to achieve the recycling of the polishing liquid.

[0031] Through the above steps, by setting up an underwater water pump 8, the filtered polishing liquid can flow to the polishing plate 16 again through the water pipe 17, and by setting up multiple placement plates 5, multiple wafers can be polished at a time, and by setting up an angle adjustment plate 19, the angle of the wafer can be adjusted, so as to solve the problem that the common polishing device based on the thinning and dicing process only includes a polishing function and can polish the wafer, but lacks the function of recovering the polishing liquid, the function of multi-station polishing and the function of changing the wafer angle. The used polishing liquid can only be recycled and discarded, which is a great waste of resources. It is impossible to change the angle of the wafer for polishing according to the thickness and shape of the wafer, and only one wafer can be polished at a time, resulting in low work efficiency.

[0032] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A polishing device based on a thinning and scribing process, comprising a polishing liquid recovery box (1), characterized in that: A filter plate (2) is arranged inside the polishing liquid recovery box (1). The bottom end of the interior of the polishing liquid recovery box (1) is welded with sixteen support rods (4) in a rectangular shape. The top ends of the support rods (4) penetrate the filter plate (2) and are placed on the top of the filter plate. Four placement plates (5) are arranged on the top ends of the support rods (4). L-shaped support plates (9) are welded at the four corners of the top of the polishing liquid recovery box (1). A top plate (10) is welded on the top of the L-shaped support plate (9). A hydraulic pump (11) is arranged in the middle of the top of the top plate (10). A telescopic rod (12) is arranged in the middle of the bottom of the top plate (10) corresponding to the position of the hydraulic pump (11). A fixed frame (13) is arranged at the bottom end of the telescopic rod (12). A motor (14) is arranged in the middle of the interior of the fixed frame (13). A connecting rod (15) is arranged at the bottom of the fixed frame (13) corresponding to the position of the motor (14). A polishing disc (16) is arranged at the bottom of the connecting rod (15).

2. A polishing device based on a thinning and scribing process according to claim 1, characterized in that: The four side surfaces of the filter plate (2) are welded to the inner wall of the polishing liquid recovery box (1), and the top of the filter plate (2) is rectangular and provided with filter holes (3).

3. The polishing device based on the thinning and scribing process according to claim 1, characterized in that: A placement groove (6) is provided on the top of the placement plate (5), and four latch rods (7) are welded in a rectangular shape at the bottom of the placement plate (5) corresponding to the position of the support rod (4), and the bottom ends of the latch rods (7) are inserted into the interior of the support rod (4).

4. The polishing device based on the thinning and scribing process according to claim 3 is characterized in that: The top end of the telescopic rod (12) passes through the top plate (10) and is connected to the output end of the hydraulic pump (11), and the bottom end of the telescopic rod (12) is welded to the top of the fixed frame (13).

5. The polishing device based on the thinning and scribing process according to claim 4 is characterized in that: The top end of the connecting rod (15) passes through the fixed frame (13) and is connected to the output end of the motor (14), and the bottom end of the connecting rod (15) is welded to the top of the polishing plate (16).

6. The polishing device based on the thinning and scribing process according to claim 1, characterized in that: An underwater pump (8) is arranged on the side of the bottom end of the polishing liquid recovery box (1), and a water pipe (17) is arranged on the side of the polishing liquid recovery box (1) at a position corresponding to the underwater pump (8).

7. The polishing device based on the thinning and scribing process according to claim 6, characterized in that: The bottom end of the water pipe (17) passes through the polishing liquid recovery box (1) and is connected to the output end of the underwater water pump (8), and the top end of the water pipe (17) extends to the top of the top plate (10). The top end of the water pipe (17) corresponds to the position of the polishing plate (16) and passes through the top plate (10) from top to bottom and is placed above the polishing plate (16).

8. The polishing device based on the thinning and scribing process according to claim 3, characterized in that: A plurality of fixing grooves (18) are arranged at equal intervals at the inner bottom end of the placement groove (6); an angle adjustment plate (19) is arranged at the position of the fixing groove (18) at the inner bottom end of the placement groove (6); a connecting block (20) is welded to the bottom of the angle adjustment plate (19); and the angle adjustment plate (19) is inserted into the fixing groove (18) and fixed via the connecting block (20).

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