Monocrystalline silicon wafer grinding machine
By using a rotating mechanism in a single crystal silicon wafer grinder to achieve uninterrupted grinding and setting buffer components in the clamping mechanism, the problems of existing grinders in grinding efficiency and edge damage are solved, and more efficient grinding and better article protection are achieved.
Patent Information
- Application Number
- CN202421652106.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The existing single crystal silicon wafer grinders have shortcomings in grinding efficiency and worker labor intensity, and are prone to edge damage when clamping single crystal silicon wafers.
A single crystal silicon wafer grinder is designed, and a rotating mechanism is used to realize the single crystal silicon wafers above the two grinding frames to perform almost uninterrupted grinding work in succession, and a buffer assembly is provided in the clamping mechanism to prevent edge damage.
Improves grinding efficiency, reduces worker labor intensity, and prevents damage to the edge of single crystal silicon wafers through buffer components.
Smart Images
Figure CN222831538U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of single crystal silicon slice grinding, in particular to a single crystal silicon slice grinding machine. Background Art
[0002] Single crystal silicon wafer refers to a large silicon single crystal made from silicon with a purity of up to 99.99999% through high-temperature melting, wire drawing and crystal growth. It is a type of semiconductor material with the characteristics of stable electrical properties, good chemical stability and repeatable processing. Single crystal silicon wafers need to be ground with a grinder before use.
[0003] However, the existing single crystal silicon wafer grinders usually place the single crystal silicon wafer on the grinder and cooperate with the grinding mechanism to complete the grinding operation, then remove the single crystal silicon wafer after grinding and replace the single crystal silicon wafer to be ground. This method not only increases the labor intensity of the workers to a certain extent, but also reduces the grinding efficiency. In addition, when the single crystal silicon wafer is fixed and clamped, no buffer structure is set. In this way, when the clamping force is too large, it is easy to cause damage to the edge of the single crystal silicon wafer, which is not conducive to people's use. Therefore, the technical personnel in this field provide a single crystal silicon wafer grinder to solve the problems raised in the above background technology. Utility Model Content
[0004] The utility model aims to provide a single crystal silicon wafer grinding machine to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a single crystal silicon wafer grinding machine, comprising a workbench and a support plate welded to one side of the top of the workbench, the top of the workbench is connected to two grinding frames through a rotating mechanism, the tops of the two grinding frames are provided with a clamping mechanism for fixing and clamping the single crystal silicon wafer, and above the clamping mechanism is provided with a grinding mechanism located inside the side wall of the support plate for grinding the single crystal silicon wafer.
[0006] Preferably: waste collection drawers are provided on the inner walls of the bottom ends of the two grinding frames.
[0007] Preferably: the rotating mechanism includes a first motor, a rotating plate, a pillar and a roller, the first motor is fixedly installed on the top of the workbench, the output end of the first motor is fixedly connected to the middle of the bottom surface of the rotating plate through a rotating shaft, pillars are symmetrically welded on both sides of the bottom surface of the rotating plate, the bottom ends of the pillars are rotatably connected to the roller, a circular groove matching the roller is opened on the top of the workbench, one end of the roller away from the pillar extends into the inside of the circular groove and is rotatably connected to the circular groove, and the top ends of the two grinding frames are fixedly installed on both sides of the top surface of the rotating plate.
[0008] Preferably: the clamping mechanism includes a two-way screw, a support rod, a clamping plate and a contact plate, the top ends of the two grinding frames are symmetrically welded with mounting plates, a two-way screw and a support rod are arranged side by side between the side walls of the mounting plates that are close to each other, one end of the two-way screw is rotatably connected to the side wall of one of the mounting plates through a bearing seat, the other end of the two-way screw passes through the other mounting plate and is welded with a torsion block, the two ends of the support rod are welded between the side walls of the mounting plates, clamping plates are symmetrically arranged on the surfaces of the two-way screw and the support plate, one end of the clamping plate is rotatably connected to the two-way screw through a thread, the other end of the clamping plate is slidably connected to the support rod, the side of the clamping plate away from the mounting plate is connected to the contact plate through a buffer assembly, and a grinding mechanism located inside the side wall of the support plate is provided above the contact plate.
[0009] Preferably, the side walls adjacent to the contact plate are bonded and connected with anti-slip pads.
[0010] Preferably: the buffer assembly includes a buffer spring, a guide rod and a limiting block, two buffer springs are welded on the side of the clamping plate away from the mounting plate, the other ends of the two buffer springs are welded to the side wall of the contact plate, and a guide rod penetrating the buffer spring is welded to the side wall of the contact plate, one end of the guide rod away from the contact plate penetrates the clamping plate and the mounting plate and is welded with a limiting block, and the guide rod is slidably connected to the clamping plate and the mounting plate.
[0011] Preferably: the grinding mechanism includes a second motor, a threaded rod, a movable plate, a third motor and a grinding disc, the top surface of the support plate is installed with the second motor by bolts, the output shaft of the second motor is fixedly connected with the threaded rod, the side wall of the support plate is provided with a rectangular groove, one end of the movable plate is slidably connected inside the rectangular groove, the end of the threaded rod away from the second motor passes through the support plate and the movable plate and is rotatably connected to the bottom surface of the inner wall of the rectangular groove through a bearing seat, and the threaded rod is rotatably connected to the movable plate by threads, the other end of the bottom surface of the movable plate is fixedly installed with the third motor located above the contact plate, and the output end of the third motor is fixedly installed with the grinding disc through a rotating shaft.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. In the utility model, the single crystal silicon wafer grinding machine can realize almost uninterrupted grinding of the single crystal silicon wafers on the two grinding frames in sequence by providing a rotating mechanism, which reduces the labor intensity of the workers to a certain extent and improves the grinding efficiency.
[0014] 2. In the utility model, the single crystal silicon wafer grinder can buffer and absorb a part of the excessive clamping force generated by the clamping mechanism during the clamping operation by providing a buffer component in the clamping mechanism, thereby preventing edge damage to the clamped single crystal silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0016] Figure 2 It is a side view of the overall structure of the utility model;
[0017] Figure 3 It is a top view of the overall structure of the utility model;
[0018] Figure 4 for Figure 3 A is an enlarged view of the middle image.
[0019] In the figure: 1. workbench; 2. support plate; 3. grinding frame; 4. waste drawer; 9. mounting plate; 10. rectangular groove; 51. first motor; 52. rotating plate; 53. support; 54. roller; 55. circular groove; 61. bidirectional screw; 62. support rod; 63. clamping plate; 64. resistance plate; 65. torsion block; 66. anti-slip pad; 71. buffer spring; 72. guide rod; 73. limiting block; 81. second motor; 82. threaded rod; 83. moving plate; 84. third motor; 85. grinding disc. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1 to Figure 4In an embodiment of the utility model, a single crystal silicon wafer grinding machine comprises a workbench 1 and a support plate 2 welded to one side of the top of the workbench 1. The top of the workbench 1 is connected with two grinding frames 3 through a rotating mechanism. A single crystal silicon wafer is placed above the grinding frame 3. The rotating mechanism comprises a first motor 51, a rotating plate 52, a pillar 53 and a roller 54. The first motor 51 is fixedly installed on the top of the workbench 1. The output end of the first motor 51 is fixedly connected to the middle part of the bottom surface of the rotating plate 52 through a rotating shaft. Pillars 53 are symmetrically welded on both sides of the bottom surface of the rotating plate 52. The bottom end of the pillar 53 is rotatably connected to the roller 54. A circular groove 55 matching the roller 54 is opened on the top of the workbench 1. One end of the roller 54 away from the pillar 53 extends into the inside of the circular groove 55 and is rotatably connected to the circular groove 55. The top ends of the two grinding frames 3 are fixedly installed on both sides of the top surface of the rotating plate 52.
[0022] When in use, the first motor 51 is started, and when the output end of the first motor 51 rotates, the rotating plate 52 is driven to rotate accordingly, so that the support 53 drives the roller 54 to rotate inside the circular groove 55 through the rotation of the rotating plate 52. When the rotating plate 52 rotates, the two grinding frames 3 also rotate synchronously, thereby realizing almost uninterrupted grinding of the single crystal silicon wafer. The provided support 53 and roller 54 are used to provide a stable support for the rotating plate 52, so that it is more stable when rotating.
[0023] The inner walls of the bottom ends of the two grinding frames 3 are provided with waste collection drawers 4 for collecting the waste chips produced by grinding.
[0024] The tops of the two grinding frames 3 are provided with a clamping mechanism for fixing and clamping the single crystal silicon wafer, and the clamping mechanism includes a bidirectional screw 61, a support rod 62, a clamping plate 63 and a contact plate 64. The tops of the two grinding frames 3 are symmetrically welded with mounting plates 9, and bidirectional screws 61 and support rods 62 are arranged side by side between the adjacent side walls of the mounting plates 9. One end of the bidirectional screw 61 is rotatably connected to the side wall of one of the mounting plates 9 through a bearing seat, and the other end of the bidirectional screw 61 passes through the other mounting plate 9 and is welded with a torsion block 65. The support rod 62 is The two ends are welded between the side walls of the mounting plate 9, and a clamping plate 63 is symmetrically provided on the surface of the bidirectional screw 61 and the support rod 62. One end of the clamping plate 63 is connected to the bidirectional screw 61 by threaded rotation, and the other end of the clamping plate 63 is connected to the support rod 62 by sliding. The side of the clamping plate 63 away from the mounting plate 9 is connected to a resistance plate 64 through a buffer assembly, and the side walls close to the resistance plate 64 are bonded with anti-slip pads 66, which are used to increase the friction between the resistance plate 64 and the single crystal silicon wafer, thereby improving the stability of the single crystal silicon wafer when being clamped.
[0025] The buffer assembly includes a buffer spring 71, a guide rod 72 and a limiting block 73. Two buffer springs 71 are welded to the side of the clamping plate 63 away from the mounting plate 9. The other ends of the two buffer springs 71 are welded to the side wall of the contact plate 64. The side wall of the contact plate 64 is welded with a guide rod 72 that passes through the buffer spring 71. The end of the guide rod 72 away from the contact plate 64 passes through the clamping plate 63 and the mounting plate 9 and is welded with a limiting block 73. The guide rod 72, the clamping plate 63 and the mounting plate 9 are all slidably connected.
[0026] When in use, pick up the single crystal silicon wafer and place it between the contact plates 64, then rotate the torsion block 65 with one hand to make the bidirectional screw 61 rotate and run, and when the bidirectional screw 61 rotates, it drives one end of the clamping plate 63 connected thereto to move closer to each other, and at this time, the other end of the clamping plate 63 slides and moves on the surface of the support rod 62, and under the continuous movement of the clamping plate 63, the buffer spring 71 makes the contact plate 64 drive the anti-skid pad 66 to contact the side wall of the single crystal silicon wafer and fix the single crystal silicon wafer so that it will not easily fall out from between the contact plates 64, and when the anti-skid pad 66 contacts the side wall of the single crystal silicon wafer, the contact plate 64 An extrusion force is applied to the buffer spring 71, causing the buffer spring 71 to be compressed and deformed. At this time, the guide rod 72 slides toward the side away from the mounting plate 9. The provided guide rod 72 can not only prevent the buffer spring 71 from being lateral deformed, but also guide the moving trajectory of the contact plate 64. When the buffer spring 71 is compressed, its own elastic rebound effect allows the single crystal silicon wafer to be stably fixed and clamped between the contact plates 64. At the same time, due to the elastic effect of the buffer spring 71 itself, it can buffer and absorb the excessive clamping force of a part of the contact plate 64, thereby preventing the edge damage of the single crystal silicon wafer.
[0027] A grinding mechanism for grinding single crystal silicon wafers is provided above the contact plate 64 and is located inside the side wall of the support plate 2. The grinding mechanism includes a second motor 81, a threaded rod 82, a movable plate 83, a third motor 84 and a grinding disc 85. The second motor 81 is installed on the top surface of the support plate 2 by bolts, and the output shaft of the second motor 81 is fixedly connected to the threaded rod 82. A rectangular groove 10 is provided on the side wall of the support plate 2, and one end of the movable plate 83 is slidably connected inside the rectangular groove 10. The end of the threaded rod 82 away from the second motor 81 passes through the support plate 2 and the movable plate 83 and is rotatably connected to the bottom surface of the inner wall of the rectangular groove 10 through a bearing seat, and the threaded rod 82 is rotatably connected to the movable plate 83 through a thread. The other end of the bottom surface of the movable plate 83 is fixedly installed with the third motor 84 located above the contact plate 64, and the output end of the third motor 84 is fixedly installed with the grinding disc 85 through a rotating shaft.
[0028] When in use, the second motor 81 is started, and when the output shaft of the second motor 81 rotates, the threaded rod 82 is driven to rotate accordingly, so that one end of the movable plate 83 connected thereto moves downward in the rectangular groove 10, and in the process of the movable plate 83 moving downward, the grinding disc 85 is synchronously moved downward by the third motor 84. When the grinding disc 85 moves down to contact the surface of the single crystal silicon wafer, the third motor 84 is started to make the grinding disc 85 rotate, thereby grinding the surface of the single crystal silicon wafer.
[0029] Working principle: When using the single crystal silicon wafer grinder, first place the single crystal silicon wafer between the contact plates 64, then use the other hand to rotate the torsion block 65 so that the bidirectional screw 61 drives the clamping plate 63 to move toward the side wall of the single crystal silicon wafer. When the clamping plate 63 moves, the contact plate 64 drives the anti-skid pad 66 to contact the side wall of the single crystal silicon wafer through the buffer component and fix the single crystal silicon wafer. When the anti-skid pad 66 contacts the side wall of the single crystal silicon wafer, the contact plate 64 applies an extrusion force to the buffer spring 71, and the buffer spring 71 is compressed and deformed. At the same time, the guide rod 72 slides toward the side away from the mounting plate 9. At this time, the elastic action of the buffer spring 71 itself can not only buffer and absorb a part of the excessive clamping force of the contact plate 64, but also enable the single crystal silicon wafer to be stably clamped on the contact plate 6 4, when the single crystal silicon wafer is fixed between the abutting plates 64 above the two grinding frames 3 in sequence, the second motor 81 is started to rotate the threaded rod 82, thereby enabling the third motor 84 to drive the grinding disc 85 to move downward through the moving plate 83. When the grinding disc 85 contacts the surface of the single crystal silicon wafer, the third motor 84 is started to enable the grinding disc 85 to grind the surface of the single crystal silicon wafer. At this time, the grinding waste falls into the waste collection drawer 4. When one of the single crystal silicon wafers is ground, the first motor 51 is started to control the rotation mechanism to operate, thereby rotating and conveying the other clamped single crystal silicon wafer to the grinding disc 85. At this time, the staff can remove the ground single crystal silicon wafer and replace it with the one to be ground, thereby achieving almost uninterrupted grinding of the single crystal silicon wafer and improving the grinding efficiency.
[0030] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A single crystal silicon wafer grinding machine, comprising a workbench (1) and a support plate (2) welded to one side of the top of the workbench (1), characterized in that: The top of the workbench (1) is connected to two grinding frames (3) via a rotating mechanism, the tops of the two grinding frames (3) are provided with a clamping mechanism for fixing and clamping the single crystal silicon wafer, and a grinding mechanism located inside the side wall of the support plate (2) and used for grinding the single crystal silicon wafer is provided above the clamping mechanism.
2. A single crystal silicon wafer grinding machine according to claim 1, characterized in that: The inner walls of the bottom ends of the two grinding frames (3) are provided with waste collection drawers (4).
3. The single crystal silicon wafer grinding machine according to claim 1, characterized in that: The rotating mechanism comprises a first motor (51), a rotating plate (52), a support (53) and a roller (54); the first motor (51) is fixedly mounted on the top of the workbench (1); the output end of the first motor (51) is fixedly connected to the middle of the bottom surface of the rotating plate (52) through a rotating shaft; the support (53) is symmetrically welded on both sides of the bottom surface of the rotating plate (52); the bottom end of the support (53) is rotatably connected to the roller (54); a circular groove (55) matching the roller (54) is provided on the top of the workbench (1); one end of the roller (54) away from the support (53) extends into the inside of the circular groove (55) and is rotatably connected to the circular groove (55); the top ends of the two grinding frames (3) are fixedly mounted on both sides of the top surface of the rotating plate (52).
4. The single crystal silicon wafer grinding machine according to claim 1, characterized in that: The clamping mechanism comprises a bidirectional screw (61), a support rod (62), a clamping plate (63) and a contact plate (64); the top ends of the two grinding frames (3) are symmetrically welded with mounting plates (9); bidirectional screws (61) and support rods (62) are arranged side by side between adjacent side walls of the mounting plates (9); one end of the bidirectional screw (61) is rotatably connected to the side wall of one of the mounting plates (9) through a bearing seat; the other end of the bidirectional screw (61) passes through the other mounting plate (9) and is welded with a torsion block (65); The two ends of the rod (62) are welded between the side walls of the mounting plate (9), and the surfaces of the bidirectional screw (61) and the support rod (62) are symmetrically provided with clamping plates (63), one end of the clamping plate (63) is rotatably connected to the bidirectional screw (61) by a thread, and the other end of the clamping plate (63) is slidably connected to the support rod (62), and the side of the clamping plate (63) away from the mounting plate (9) is connected to a resistance plate (64) through a buffer component, and a grinding mechanism located inside the side wall of the support plate (2) is provided above the resistance plate (64).
5. A single crystal silicon wafer grinding machine according to claim 4, characterized in that: The side walls adjacent to the contact plate (64) are bonded and connected with anti-skid pads (66).
6. The single crystal silicon wafer grinding machine according to claim 4, characterized in that: The buffer assembly comprises a buffer spring (71), a guide rod (72) and a limiting block (73); two buffer springs (71) are welded to the side of the clamping plate (63) away from the mounting plate (9); the other ends of the two buffer springs (71) are welded to the side wall of the contact plate (64); the side wall of the contact plate (64) is welded with a guide rod (72) penetrating the buffer spring (71); one end of the guide rod (72) away from the contact plate (64) penetrates the clamping plate (63) and the mounting plate (9) and is welded with the limiting block (73); and the guide rod (72) and the clamping plate (63) and the mounting plate (9) are all slidably connected.
7. The single crystal silicon wafer grinding machine according to claim 4, characterized in that: The grinding mechanism comprises a second motor (81), a threaded rod (82), a movable plate (83), a third motor (84) and a grinding disc (85); the second motor (81) is mounted on the top surface of the support plate (2) by means of bolts; the output shaft of the second motor (81) is fixedly connected to the threaded rod (82); a rectangular groove (10) is provided on the side wall of the support plate (2); one end of the movable plate (83) is slidably connected inside the rectangular groove (10); one end of the threaded rod (82) away from the second motor (81) passes through the support plate (2) and the movable plate (83) and is rotatably connected to the bottom surface of the inner wall of the rectangular groove (10) through a bearing seat; the threaded rod (82) is rotatably connected to the movable plate (83) by means of a thread; the other end of the bottom surface of the movable plate (83) is fixedly mounted with the third motor (84) located above the abutment plate (64); and the output end of the third motor (84) is fixedly mounted with the grinding disc (85) through a rotating shaft.