Wafer grinding table
By separating the negative and positive pressure channels on the wafer grinding table, the pit phenomenon caused by silicon chips and particulate residues in the prior art is solved, and higher quality wafer grinding and more efficient equipment operation are achieved.
Patent Information
- Application Number
- CN202421742952.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-22
AI Technical Summary
In the semiconductor 2.5D packaging production line, existing grinding equipment shares a pipeline because the negative pressure and positive pressure channels share, resulting in silicon chips and particulate matter residues, resulting in pitting during wafer grinding, affecting quality and increasing costs.
Design a wafer grinding table with two separate negative pressure channels and positive pressure channels. The negative pressure channels are used for vacuum positioning and thinning, and the positive pressure channels are used for blowing and discharge to avoid cross-contamination and ensure clean pipelines.
By separating the negative and positive pressure channels, cross-contamination of silicon chips and particulate matter is avoided, pitting phenomenon is reduced, and the quality of wafer grinding and equipment effectiveness are improved.
Smart Images
Figure CN222831541U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a wafer grinding table. Background Art
[0002] In the semiconductor 2.5D packaging production line, the wafer needs to be thinned. The structure of the wafer is glass, glue, copper pillars, and silicon. The glass surface will be in close contact with the suction cup. When the grinding wheel thins the entire silicon on the upper layer of the wafer, the grinding wheel presses down to closely contact the wafer and grinds the wafer surface step by step.
[0003] Existing grinding equipment needs to realize unloading and loading through positive pressure channels and negative pressure channels, and the vacuum suction and blowing actions use the same pipeline. During the thinning process, the grinding equipment will first vacuum suck the wafer through the negative pressure channel to achieve positioning. After the thinning is completed, the grinding equipment continues to use the positive pressure channel of the same vacuum suction pipeline to blow upwards to lift the wafer for easy unloading.
[0004] When the material is sucked and thinned, silicon chips and dirty water will be sucked into the pipeline. There will be some silicon chips and particles in the pipeline. After grinding, the same pipeline is used for blowing, which will blow out the silicon chips remaining in the pipeline and drop them on the surface of the grinding disc. When thinning the next wafer, the silicon chips and particles will lift up the back of the wafer. During grinding, the grinding wheel presses down, and the wafer is partially squeezed between the particles and the grinding wheel. Over-grinding and pits will appear at the lifted position. The pit size is greater than 10um, which will cause copper leakage from the wafer. The entire wafer will be scrapped after copper leakage, resulting in serious quality abnormalities and cost waste of raw materials. Utility Model Content
[0005] The utility model aims to provide a wafer grinding table, which can avoid the wafer pit phenomenon during the wafer grinding process.
[0006] In order to achieve the above-mentioned utility model object, the utility model provides a wafer grinding table, including a table body, a negative pressure channel, and a positive pressure channel;
[0007] The negative pressure channels and the positive pressure channels are alternately arranged on the platform.
[0008] As a further improvement of the utility model, the negative pressure channel and the positive pressure channel are alternately arranged in a ring shape on the platform.
[0009] As a further improvement of the utility model, the platform is alternately provided with a plurality of grooves and protrusions, the grooves and the protrusions are both annular, the grooves are the negative pressure channels, and the grooves are interconnected; the protrusions are the positive pressure channels, the protrusions are provided with a plurality of ventilation holes, and the plurality of ventilation holes are interconnected.
[0010] The utility model provides a wafer grinding table, wherein the negative pressure channel and the positive pressure channel are separated into two paths. The negative pressure channel absorbs vacuum to tightly adsorb the wafer on the table body and perform thinning work, while the positive pressure channel blows air to blow the wafer that needs to be unloaded upwards, so as to facilitate the removal of the wafer from the table body. The negative pressure and positive pressure paths are designed separately to avoid cross contamination. Even if some silicon chips remain in the pipeline when the negative pressure channel absorbs vacuum, the pipeline will not perform air blowing action, so the silicon chips remaining in the pipeline will not be blown onto the surface of the table body, thereby avoiding residual particles and avoiding the phenomenon of wafer pits caused by lifting of particles. After the wafer is separated from the table body, it can ensure that the positive pressure channel is clean, and silicon chips will not contaminate the surface of the table body, thereby fundamentally solving the source of foreign matter.
[0011] Compared with the prior art, the wafer grinding table of the utility model has the following advantages:
[0012] The negative pressure channel and the positive pressure channel are designed separately to avoid contamination of the grinding table caused by silicon chips in the pipeline during air blowing, avoid quality accidents caused by abnormal pits, make the machine more efficient, and ensure quality and safe production. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the structure of a wafer grinding table of the utility model;
[0014] Figure 2 Schematic diagram of the structure of negative pressure channel and positive pressure channel. DETAILED DESCRIPTION
[0015] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.
[0016] like Figure 1 As shown, a wafer grinding table of the utility model includes a table body 1, a negative pressure channel 2, and a positive pressure channel 3;
[0017] The negative pressure channels 2 and the positive pressure channels 3 are alternately arranged on the platform 1 .
[0018] The utility model provides a wafer grinding table, wherein the negative pressure channel 2 and the positive pressure channel 3 are separated into two paths. The negative pressure channel 2 absorbs vacuum to tightly adsorb the wafer 4 on the table 1 and perform thinning work, and the positive pressure channel 3 blows air to blow the wafer 4 that needs to be unloaded upwards, so as to facilitate the removal of the wafer 4 from the table 1. The negative pressure and positive pressure paths are designed separately to avoid cross contamination. Even if some silicon chips remain in the pipeline when the negative pressure channel 2 absorbs vacuum, the pipeline will not perform air blowing action, and the silicon chips remaining in the pipeline will not be blown onto the surface of the table 1, thereby avoiding the residue of particles and avoiding the phenomenon of wafer pits caused by the lifting of particles. After the wafer 4 is separated from the table 1, it can ensure that the positive pressure channel 3 is clean, and no silicon chips will contaminate the surface of the table 1, thereby fundamentally solving the source of foreign matter.
[0019] The negative pressure channel 2 and the positive pressure channel 3 are alternately arranged in a ring shape on the table 1. The alternating arrangement in a ring shape can make the negative pressure airflow and the positive pressure airflow generated on the wafer 4 more evenly distributed, thereby improving the adsorption effect and the blowing effect of the wafer 4, so that during the thinning process of the wafer 4, the wafer can be flat, stable and close to the surface of the table 1.
[0020] The platform 1 is alternately provided with a plurality of grooves and protrusions, the grooves 2 and protrusions 3 are both annular, the grooves are negative pressure channels 2, and the grooves are interconnected; the protrusions are positive pressure channels 3, and the protrusions 3 are provided with a plurality of vents 31, and the plurality of vents 31 are interconnected. Figure 2 As shown, the negative pressure channel 2 sucks the wafer 4 downward. Since the negative pressure channel 2 is a groove, the silicon chips generated by grinding the wafer 4 will only be retained in the groove, which is convenient for regular cleaning of the groove. The positive pressure channel 3 is a bump, and the air flow is transmitted through the vent 31 to blow up the wafer 4. The structure of several vents 31 can realize point-type blowing, which has a greater pressure on the wafer 4 and a more stable blowing.
[0021] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.
Claims
1. A wafer grinding station, characterized in that: It includes a platform body, a negative pressure channel, and a positive pressure channel; The negative pressure channels and the positive pressure channels are alternately arranged on the platform.
2. A wafer grinding station as claimed in claim 1, characterized in that: The negative pressure channels and the positive pressure channels are alternately arranged in an annular manner on the platform.
3. A wafer grinding station as claimed in claim 1, characterized in that: The platform body is alternately provided with a plurality of grooves and protrusions, both of which are annular, the grooves are the negative pressure channels, and the grooves are interconnected; the protrusions are the positive pressure channels, the protrusions are provided with a plurality of ventilation holes, and the plurality of ventilation holes are interconnected.