Automatic turn-over device for integrated chip production line
By designing an automatic flip device in the integrated chip production line, and automatically adjusting the chip direction using the photoinductor head and the driving motor, the problem of high manual direction adjustment and non-standardized operation is solved, efficient and standardized chip direction adjustment is achieved, and labor costs are reduced.
Patent Information
- Application Number
- CN202421590399.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-05
AI Technical Summary
The method of manually adjusting the chip direction in an integrated chip production line has problems such as high labor costs, unstandardized operations and may damage the chip structure.
An automatic flip device is designed to identify the position of the integrated chip using a photoinductor head, transmit the signal to the driving motor through a signal transmission cable, drive the flip frame to rotate, and automatically adjust the reverse entry chip direction.
Automatic adjustment of the direction of integrated chips is achieved, manual operation intensity is reduced, labor costs are saved, and chip structure integrity and subsequent processing quality are ensured.
Smart Images
Figure CN222833578U_ABST
Abstract
Description
Technical Field
[0001] The utility model discloses an automatic flipping device for an integrated chip production line, belonging to the technical field of mechanical manufacturing. Background Art
[0002] Integrated chips are semiconductor core particles with exquisite size and large batches. One step in their production process is to adjust the direction of all integrated chips on the production line to the positive direction to facilitate the glazing operation in the subsequent process. Currently, enterprises mainly use the method of manual flipping to adjust the direction of integrated chips in the production line, which greatly consumes labor costs. In addition, as an integrated chip is a precise semiconductor structure, it is difficult to achieve standardized operation by manual operation, which may damage the structure of the integrated chip and affect the subsequent processing quality of the integrated chip. Summary of the invention
[0003] In order to solve many problems in the current integrated chip production line such as high labor intensity and high production cost in the direction adjustment operation, the purpose of the utility model is to provide an automatic flipping device for an integrated chip production line, which identifies the position status of the integrated chip in the production line through a photoelectric sensor head and transmits the signal to the motor to flip the integrated chip entering the production line in the reverse direction, so that all integrated chips in the production line are kept in the forward direction, which is convenient for the subsequent processing operations of the integrated chip and improves the work efficiency of the production line.
[0004] In order to achieve the above-mentioned objectives, the utility model adopts the following technical solutions: an automatic flipping device for an integrated chip production line, comprising a photoelectric sensor head 4, a signal transmission cable 5, a drive motor 6, and a flipping frame 7; one end of the signal transmission cable 5 is connected to the drive motor 6, and the other end is connected to the photoelectric sensor head 4, the sensing end of the photoelectric sensor head 4 corresponds to the position of the integrated chip in the production line, the flipping frame 7 is a semi-I-shaped structure, the middle part of the semi-I-shaped structure is connected to the output shaft of the drive motor 6 by a fastener, and the two ends are horizontally placed in the gap between the conveyor belts.
[0005] The signal transmission cable 5 has an L-shaped plastic hard shell on the outside and a multimode optical fiber on the inside. The numerical aperture of the optical fiber is 0.2±0.02, the core diameter is 50-100 μm, and the outer diameter is 100-200 μm.
[0006] The driving motor 6 is a stepping motor with a torque of 0.42-0.75N, an input voltage of 24-80VAC, a communication rate of 50-70Kbps, and a pulse frequency of 200-300K.
[0007] The photoelectric sensing head 4 adopts laser photoelectric sensing, the spot size is 1×2~2×2mm, the laser wavelength is 600~700nm, and the response speed is 300~500μs.
[0008] The turning frame 7 is made of metal, and the surface roughness Rz is 50-200 μm and Ra is 12.5-50 μm.
[0009] The conveyor belt has a surface roughness Rz of 50 to 200 μm and a surface roughness Ra of 12.5 to 50 μm.
[0010] Through the above technical solution conceived by the utility model, compared with the prior art, the utility model has the following advantages:
[0011] 1) The automatic flipping device uses a photoelectric sensor head to identify the integrated chip in the production line, which can realize the identification of all chips in the production line, solving the problem of missed identification in manual operation in the current production line.
[0012] 2) As an automated mechanical device, the automatic flipping device realizes standardized operation and ensures that no damage is caused to the integrated chip structure.
[0013] 3) The automatic flipping device replaces manual adjustment of the integrated chip quality, and the integrated chip direction adjustment operation is stable, which improves the quality of the subsequent glazing process.
[0014] 4) The automatic flipping device replaces the manual operation of adjusting the direction of the integrated chip, greatly reducing the intensity of manual work and saving the company's labor costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is an overall schematic diagram of the automatic flipping device;
[0016] Figure 2 This is a schematic diagram of the integrated chip entering the production line in the forward direction;
[0017] Figure 3 This is a schematic diagram of the integrated chip entering the production line in reverse;
[0018] Among them: 1-first conveyor belt, 2-integrated chip entering in the forward direction, 3-pulley, 4-photoelectric sensor head, 5-signal transmission cable, 6-driving motor, 7=turning frame, 8-integrated chip entering in the reverse direction, 9-second conveyor belt, 10-third conveyor belt. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. The specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0020] The automatic flipping device is shown in Figure 1, which is an automatic flipping device for an integrated chip production line, including a photoelectric sensor head 4, a signal transmission cable 5, a drive motor 6, and a flip frame 7; one end of the signal transmission cable 5 is connected to the drive motor 6, and the other end is connected to the photoelectric sensor head 4, the sensing end of the photoelectric sensor head 4 corresponds to the position of the integrated chip in the production line, and the flip frame 7 is a semi-I-shaped structure, the middle part of the semi-I-shaped structure is connected to the output shaft of the drive motor 6 by fasteners, and the two ends are horizontally placed in the gap between the conveyor belts.
[0021] The signal transmission cable 5 has an L-shaped plastic hard shell on the outside and a multimode optical fiber on the inside. The numerical aperture of the optical fiber is 0.2±0.02, the core diameter is 50-100 μm, and the outer diameter is 100-200 μm.
[0022] The driving motor 6 is a stepping motor with a torque of 0.42-0.75N, an input voltage of 24-80VAC, a communication rate of 50-70Kbps, and a pulse frequency of 200-300K.
[0023] The photoelectric sensing head 4 adopts laser photoelectric sensing, the spot size is 1×2~2×2mm, the laser wavelength is 600~700nm, and the response speed is 300~500μs.
[0024] The turning frame 7 is made of metal, and the surface roughness Rz is 50-200 μm and Ra is 12.5-50 μm.
[0025] The conveyor belt has a surface roughness Rz of 50 to 200 μm and a surface roughness Ra of 12.5 to 50 μm.
[0026] After the photoelectric sensor head 4 identifies the position status of the integrated chip in the production line, it transmits the signal to the drive motor 6 through the signal transmission cable 5 to drive the turning frame 7 to rotate.
[0027] The state of the integrated chip entering the production line is as follows Figure 2As shown, the first conveyor belt 1, driven by the pulley 3, conveys the integrated chip 2 entering forward to the gap between the first conveyor belt 1 and the second conveyor belt 9. The two tentacles of the integrated chip 2 entering forward first enter the recognition area of the photoelectric sensor head 4. Since there is a gap between the two tentacles of the integrated chip 2 entering forward, the photoelectric sensor head 4 will not recognize the integrated chip 2 entering forward. As the integrated chip 2 entering forward continues to move forward, the semiconductor structure behind the tentacles enters the recognition area of the photoelectric sensor head 4, and the photoelectric signal is transmitted through the signal transmission cable 5. To drive motor 6, and drive flip frame 7 to rotate, and at this time, the integrated chip 2 entering forward has passed through the gap between the first conveyor belt 1 and the second conveyor belt 9, so the flip frame 7 will not come into contact with the integrated chip 2 entering forward, and the direction of the integrated chip 2 entering forward will not be affected. By calculating the length and running speed of the second conveyor belt 9, it can be ensured that the integrated chip 2 entering forward will not pass through the gap between the second conveyor belt 9 and the third conveyor belt 10 when it moves forward, thereby ensuring that the running state of the integrated chip 2 entering forward is not affected.
[0028] The state of the integrated chip entering the production line in reverse is as follows Figure 3 As shown, the first conveyor belt 1, driven by the pulley 3, conveys the reverse-entering integrated chip 8 to the gap between the first conveyor belt 1 and the second conveyor belt 9. The semiconductor structure of the reverse-entering integrated chip 8 first enters the recognition area of the photoelectric sensor head 4. At this time, the photoelectric signal is transmitted to the drive motor 6 through the signal transmission cable 5, driving the flip frame 7 to rotate, making contact with the tentacles of the reverse-entering integrated chip 8, and driving the reverse-entering integrated chip 8 to rotate, realizing the flipping of the reverse-entering integrated chip 8, and achieving the purpose of adjusting the direction of the reverse-entering integrated chip 8. By calculating the length and running speed of the second conveyor belt 9, it can be ensured that the reverse-entering integrated chip 8 will not have the flip frame 7 passing through the gap when the reverse-entering integrated chip 8 moves to the gap between the second conveyor belt 9 and the third conveyor belt 10, ensuring that the running state of the reverse-entering integrated chip 8 is not affected.
[0029] The operating principle of the utility model is as follows:
[0030] Driven by the pulley 3, the first conveyor belt 1 conveys the integrated chip 2 entering in the forward direction and the integrated chip 8 entering in the reverse direction to the gap between the first conveyor belt 1 and the second conveyor belt 9. The photoelectric sensing head 4 will identify the semiconductor structure of the integrated chip 2 entering in the forward direction and the integrated chip 8 entering in the reverse direction, and drive the flip frame 7 to rotate. Since the states of the integrated chip 2 entering in the forward direction and the integrated chip 8 entering in the reverse direction are different when they enter the recognition area of the photoelectric sensing head 4, the automatic flipping device will only adjust the direction of the integrated chip 8 entering in the reverse direction. When the integrated chip 2 entering in the forward direction and the integrated chip 8 entering in the reverse direction are conveyed to the second conveyor belt 9 and the third conveyor belt 10, the directions have all been adjusted correctly.
Claims
1. An automatic flipping device for an integrated chip production line, characterized in that: The invention comprises a photoelectric sensing head (4), a signal transmission cable (5), a driving motor (6), and a turning frame (7); one end of the signal transmission cable (5) is connected to the driving motor (6), and the other end is connected to the photoelectric sensing head (4); the sensing end of the photoelectric sensing head (4) corresponds to the position of the integrated chip in the production line; the turning frame (7) is a semi-I-shaped structure; the middle part of the semi-I-shaped structure is connected to the output shaft of the driving motor (6) by a fastener, and the two ends are horizontally placed in the gap between the conveyor belts.
2. The automatic flipping device for integrated chip production line according to claim 1, characterized in that: The signal transmission cable (5) has an L-shaped plastic hard shell on the outside and a multimode optical fiber on the inside. The numerical aperture of the optical fiber is 0.2±0.02, the core diameter is 50-100 μm, and the outer diameter is 100-200 μm.
3. The automatic flipping device for integrated chip production line according to claim 1, characterized in that: The driving motor (6) is a stepping motor with a torque of 0.42-0.75N, an input voltage of 24-80VAC, a communication rate of 50-70Kbps, and a pulse frequency of 200-300K.
4. The automatic flipping device for integrated chip production line according to claim 1, characterized in that: The photoelectric sensing head (4) adopts laser photoelectric sensing, the spot size is 1×2-2×2 mm, the laser wavelength is 600-700 nm, and the response speed is 300-500 μs.
5. The automatic flipping device for integrated chip production line according to claim 1, characterized in that: The turning frame (7) is made of metal, with a surface roughness Rz of 50 to 200 μm and a surface roughness Ra of 12.5 to 50 μm.
6. The automatic flipping device for integrated chip production line according to claim 1, characterized in that: The conveyor belt has a surface roughness Rz of 50 to 200 μm and a surface roughness Ra of 12.5 to 50 μm.