Photoelectric integrated ceramic heat dissipation lamp module and lamp

Abstract

The utility model provides a photoelectric integrated ceramic heat dissipation lamp module and a lamp, the photoelectric integrated ceramic heat dissipation lamp module comprises a lamp panel assembly, the lamp panel assembly comprises a lamp panel and a ceramic heat dissipation substrate fixed on the lamp panel, and the ceramic heat dissipation substrate is provided with a plurality of light-emitting elements and a constant current power conversion chip; the power supply box assembly comprises a power supply box and a power supply board arranged in the power supply box, the power supply box is fixed to the lamp panel, and the power supply board is electrically connected with the ceramic heat dissipation substrate; the power supply board supplies electric energy needed by the ceramic heat dissipation substrate, specific voltage and current needed by the light-emitting element are obtained through processing of the power conversion chip, heat generated by the light-emitting element and the constant-current power conversion chip is dissipated through the ceramic heat dissipation substrate, and temperature rise in the power supply box is greatly reduced. According to the utility model, the problem that the failure rate is increased due to heat accumulation of the power supply box caused by the split design of the lamp driving part and the light source plate in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the field of lighting fixture technology, and in particular to an optoelectronic integrated ceramic heat dissipation lighting module and a lighting fixture. Background Technology

[0002] LED lighting technology has made significant progress in recent years, not only in its energy efficiency and brightness, but also in its environmental adaptability and extended lifespan. Consumers have increasingly diversified demands for lighting products; they seek not only durable and long-lasting products, but also cost-competitive ones. Against this backdrop, lighting products based on ceramic heat dissipation technology stand out due to their unique advantages.

[0003] Ceramic heat dissipation technology, with its high insulation, efficient heat dissipation performance, and tolerance to harsh environments, is gradually becoming a favorite in the lighting field. This technology can effectively and evenly distribute the heat generated by LED chips, thereby extending the lifespan of LEDs and reducing the failure rate caused by overheating. In addition, the high insulation properties of ceramic materials also ensure the safety of lighting products, enabling them to operate stably in harsh environments such as humid or dusty conditions.

[0004] However, despite the numerous benefits that ceramic heat dissipation technology brings to LED lighting, some shortcomings still exist in the design and manufacturing of lighting fixtures on the market. Many lighting fixtures have complex structures, leading to high production costs. The power driver and LED light source board are often designed separately, which not only increases assembly difficulty but also, because the power driver, like the LED, generates a significant amount of heat during light emission, this heat significantly reduces the temperature rise within the power control chamber, thus increasing the failure rate of the power driver and consequently the overall failure rate. The power supply typically requires a separate power supply box and is connected to the lamp panel via wires; this design not only occupies space but also increases the possibility of electromagnetic interference. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the technical problem to be solved by this utility model is to provide an optoelectronic integrated ceramic heat dissipation lamp module and lamp, which solves the problem of heat accumulation in the power box caused by the separate design of the lamp driver and the light source board in the prior art, thus increasing the failure rate.

[0006] To solve the above-mentioned technical problems, this utility model provides an optoelectronic integrated ceramic heat dissipation lamp module, comprising:

[0007] A lamp panel assembly, comprising a lamp panel and a ceramic heat dissipation substrate fixed on the lamp panel, wherein a plurality of light-emitting elements and a constant current power conversion chip are disposed on the ceramic heat dissipation substrate.

[0008] A power supply box assembly includes a power supply box and a power supply board disposed within the power supply box. The power supply box is fixed to the lamp panel, and the power supply board is electrically connected to the ceramic heat sink substrate. The power supply board supplies the ceramic heat sink substrate with the required electrical energy, which is processed by the power conversion chip to obtain the specific voltage and current required by the light-emitting element, and then supplied to the light-emitting element to make it emit light. The heat generated by the light-emitting element and the constant current power conversion chip is dissipated through the ceramic heat sink substrate, which greatly reduces the temperature rise inside the power supply box.

[0009] As a more preferred embodiment, the lamp panel assembly further includes a lens cover mounted on a ceramic heat sink substrate, wherein the lens cover is provided with lenses corresponding one-to-one with the light-emitting elements, and the light emitted by the light-emitting elements is redistributed by the lenses before being emitted.

[0010] As a more preferred embodiment, the power supply box assembly also includes a power cord electrically connected to the power supply board for connecting to an external power source.

[0011] As a more preferred embodiment, the power supply box assembly has a power through hole, through which the power cable passes and the gap between the power cable and the power through hole is sealed by a waterproof connector.

[0012] As a more preferred approach, the optoelectronic integrated ceramic heat dissipation lamp module also includes a module adjustment bracket, and the module adjustment bracket and the lamp panel are respectively provided with module adjustment holes. The adjustment bracket and the lamp panel are fixed by passing the module adjustment screw through the corresponding module adjustment hole.

[0013] As a more preferred approach, the power supply box is also provided with a vent hole, which is sealed with a waterproof vent valve to keep the power supply box sealed while allowing air to circulate, thereby maintaining the air pressure balance inside and outside the power supply box.

[0014] To address the aforementioned problems, this application also provides a lighting fixture, comprising:

[0015] Mounting bracket;

[0016] Two or more of the above-mentioned optoelectronic integrated ceramic heat dissipation lamp modules are fixed side by side on the mounting bracket.

[0017] As a more preferred approach, two or more of the aforementioned optoelectronic integrated ceramic heat dissipation lamp modules are powered by the same power supply box assembly. The power supply box is fixed to the lamp panel of one of the optoelectronic integrated ceramic heat dissipation lamp modules, and power supply cables are led out from the power supply box and electrically connected to the ceramic heat dissipation substrates of the other optoelectronic integrated ceramic heat dissipation lamp modules.

[0018] As a more preferred embodiment, the lamp also includes a lamp adjustment assembly, which includes a lamp adjustment bracket, a turntable structure, and lamp adjustment screws. The lamp adjustment bracket, the turntable structure, and the mounting bracket have corresponding lamp adjustment holes. The lamp adjustment screws are passed through the corresponding lamp adjustment holes to press and fix the lamp adjustment bracket, the turntable structure, and the mounting bracket. The turntable structure allows the lamp adjustment bracket to rotate at a certain angle relative to the mounting bracket.

[0019] As a more preferred embodiment, the turntable structure includes two turntables, which are respectively fixed to the lamp adjustment bracket and the mounting bracket. The two turntables are provided with matching annular teeth on their opposite edges. Rotating the turntables causes relative rotation between the two turntables, thereby realizing the angle adjustment between the lamp adjustment bracket and the mounting bracket.

[0020] As described above, the optoelectronic integrated ceramic heat dissipation lamp module and lamp of this utility model have the following beneficial effects: When the optoelectronic integrated ceramic heat dissipation lamp module of this utility model is working, the power supply board supplies the ceramic heat dissipation substrate with the required electrical energy. After processing by the power conversion chip, the specific voltage and current required by the light-emitting element are obtained and supplied to the light-emitting element to make it emit light. The heat generated by the light-emitting element and the constant current power conversion chip is dissipated through the ceramic heat dissipation substrate, which greatly reduces the temperature rise in the power supply box. At the same time, this integrated design effectively reduces the module size and makes the structure more compact. Moreover, since the constant current power conversion chip is separated from the power supply board, electromagnetic interference to the constant current power conversion chip is reduced.

[0021] The lamp of this utility model uses the above-mentioned optoelectronic integrated ceramic heat dissipation lamp module, which reduces the temperature rise of the power box. Especially for high-power lamps that require multiple modules, this design greatly improves heat dissipation capacity, reduces failure rate, and extends the service life of the lamp.

[0022] This utility model discloses an optoelectronic integrated ceramic heat dissipation lamp module and lamp. By integrating a constant current power conversion chip on a heat dissipation ceramic substrate, it significantly reduces the temperature rise inside the power supply box, lowers the failure rate, and extends the service life. It solves the problem of heat accumulation in the power supply box caused by the separate design of the lamp driver and the light source board in the prior art, which leads to an increased failure rate. Attached Figure Description

[0023] Figure 1 The diagram shown is an exploded view of the optoelectronic integrated ceramic heat dissipation lamp module of this utility model.

[0024] Figure 2 The diagram shown is an exploded view of the lamp of this utility model;

[0025] Figure 3 The diagram shows that the lamp of this utility model includes three optoelectronic integrated ceramic heat dissipation lamp modules;

[0026] Figure 4 The diagram shows that the lamp of this utility model includes two optoelectronic integrated ceramic heat dissipation lamp modules;

[0027] Figure 5 The diagram shows that the lamp of this utility model includes four optoelectronic integrated ceramic heat dissipation lamp modules;

[0028] Figure 6 The diagram shown is an installation schematic of the lamp of this utility model.

[0029] Component designation explanation

[0030] 1. Optoelectronic integrated ceramic heat dissipation lamp

[0031] Module

[0032] 11. Light panel assembly

[0033] 111 light panel

[0034] 111a Fixed Ear

[0035] 112 Ceramic heat dissipation substrate

[0036] 113 Lens housing

[0037] 12 Power Supply Box Assembly

[0038] 121 Power Supply Box

[0039] 121a Power Through Hole

[0040] 121b Vent

[0041] 121c Waterproof and breathable valve

[0042] 122 Power Supply Board

[0043] 123 Power cord

[0044] 123a Waterproof Connector

[0045] 13 Module Adjustment Bracket

[0046] 131 Washer

[0047] 132 Module Adjustment Holes

[0048] 133 Module mounting holes

[0049] 14 Module Adjustment Screws

[0050] 2. Mounting bracket

[0051] 21 graduations

[0052] 3. Lighting adjustment components

[0053] 31 Lighting Fixture Adjustment Bracket

[0054] 311 Lighting adjustment hole

[0055] 312 Lighting fixture mounting holes

[0056] 32 Turntable Structure

[0057] 321 turntable

[0058] 321a Ring Gear

[0059] 33 Lighting adjustment screws

[0060] 4 Expansion bolts Detailed Implementation

[0061] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0062] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this utility model, should still fall within the scope of the technical content disclosed in this utility model. The following detailed description should not be considered restrictive, and the scope of the embodiments of this application is limited only by the claims of the published patents. The terminology used herein is for describing specific embodiments only and is not intended to limit this application. Spatial terms such as "upper," "lower," "left," "right," "below," "below," "lower part," "above," "upper part," etc., may be used in the text to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0063] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "holding" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0064] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition arise only when combinations of elements, functions, or operations are inherently mutually exclusive in some manner.

[0065] like Figure 1 As shown, this utility model provides an integrated optoelectronic ceramic heat dissipation lamp module 1, comprising:

[0066] The lamp panel assembly 11 includes a lamp panel 111 and a ceramic heat dissipation substrate 112 fixed on the lamp panel 111. The ceramic heat dissipation substrate 112 is provided with a plurality of light-emitting elements and a constant current power conversion chip.

[0067] The power supply box assembly 12 includes a power supply box 121 and a power supply board 122 disposed within the power supply box 121. The power supply box 121 is fixed to the lamp panel 111, and the power supply board 122 is electrically connected to the ceramic heat dissipation substrate 112. The power supply board 122 supplies the ceramic heat dissipation substrate 112 with the required electrical energy. After processing by the power conversion chip, the specific voltage and current required by the light-emitting element are obtained and supplied to the light-emitting element to make it emit light. The heat generated by the light-emitting element and the constant current power conversion chip is dissipated through the ceramic heat dissipation substrate 112, which greatly reduces the temperature rise inside the power supply box 121.

[0068] To better illustrate the optoelectronic integrated ceramic heat dissipation lamp module 1 of this utility model, the following specific application will be used as an example: When the optoelectronic integrated ceramic heat dissipation lamp module 1 of this utility model is in operation, the power supply board 122 supplies the ceramic heat dissipation substrate 112 with the required electrical energy. After processing by the power conversion chip, the specific voltage and current required by the light-emitting element are obtained and supplied to the light-emitting element to make it emit light. The heat generated by the light-emitting element and the constant current power conversion chip is dissipated through the ceramic heat dissipation substrate 112, which greatly reduces the temperature rise in the power supply box 121. At the same time, this integrated design effectively reduces the module size and makes the structure more compact. Moreover, since the constant current power conversion chip is separated from the power supply board 122, electromagnetic interference to the constant current power conversion chip is reduced.

[0069] In this embodiment, the light-emitting element is an LED lamp bead. LED lamp beads have become an indispensable core component in modern lighting technology due to their significant advantages such as high brightness, low energy consumption, long life, environmental protection and pollution-free, fast response, rich colors, small size and light weight, easy control and shock and vibration resistance. They are widely used in many fields such as indoor and outdoor lighting, traffic signals, and decorative lighting. They not only improve the lighting effect, but also reduce maintenance costs, while meeting the requirements of environmental protection and energy saving.

[0070] Furthermore, in this embodiment, as Figure 1 As shown, the lamp panel assembly 11 includes three ceramic heat dissipation substrates 112. Countersunk screws are used to pass through the ceramic heat dissipation substrates 112 and fix the ceramic heat dissipation substrates 112 side by side on the lamp panel 111. Furthermore, in this embodiment, the light-emitting element and the constant current power conversion chip are surface-mounted onto the ceramic heat dissipation substrates 112 using SMT technology.

[0071] In this embodiment, as Figure 1 As shown, the lamp panel assembly 11 also includes a lens cover 113 covering the ceramic heat dissipation substrate 112. The lens cover 113 is provided with lenses that correspond one-to-one with the light-emitting elements. The light emitted by the light-emitting elements is redistributed by the lenses and then emitted.

[0072] In this embodiment, as Figure 1 As shown, the power supply box assembly 12 also includes a power line 123 electrically connected to the power supply board 122, the power line 123 being used to connect to an external power source.

[0073] In this embodiment, as Figure 1 As shown, the power box assembly 12 has a power through hole 121a. The power cord 123 passes through the power through hole 121a and the gap between the power cord 123 and the power through hole 121a is sealed by a waterproof connector 123a. In this embodiment, the waterproof connector 123a is a nylon waterproof connector 123a, which is fastened with a corresponding nylon nut.

[0074] In this embodiment, as Figure 1As shown, the optoelectronic integrated ceramic heat dissipation lamp module 1 also includes a module adjustment bracket 13. The module adjustment bracket 13 and the lamp disk 111 are respectively provided with module adjustment holes 132. Module adjustment screws 14 are used to pass through the corresponding module adjustment holes 132 to fix the adjustment bracket and the lamp disk 111. Further, in this embodiment, there are two module adjustment brackets 13. The lamp disk 111 has two fixing ears 111a at both ends. Each fixing ear 111a has a washer mounting groove, and the module adjustment hole 132 is located at the bottom of the washer mounting groove. The washer mounting groove is used to place the washer 131 to ensure the tightness of the connection between the fixing ear 111a and the module adjustment bracket 13 and the uniformity of the force. The module adjustment bracket 13 is composed of two plates vertically combined. The module adjustment hole 132 is opened at the end of one of the plates, and the other plate has a module mounting hole 133 for installing and fixing the optoelectronic integrated ceramic heat dissipation lamp module 1. In specific adjustment, loosen the module adjustment screw 14, rotate the module adjustment bracket 13 as needed, and tighten the module adjustment screw 14 after the angle is adjusted.

[0075] In this embodiment, as Figure 1 As shown, the power box 121 is also provided with a vent 121b. The vent 121b is sealed by a waterproof vent valve 121c, which keeps the power box 121 sealed while allowing air to circulate, thereby maintaining the air pressure balance inside and outside the power box 121.

[0076] To solve the above problems, such as Figures 2 to 6 As shown, this application also provides a lighting fixture, including:

[0077] Mounting bracket 2;

[0078] Two or more of the aforementioned optoelectronic integrated ceramic heat dissipation lamp modules 1 are fixed side by side on the mounting bracket 2.

[0079] To better illustrate the present invention, the following specific application will be used as an example: The present invention uses the aforementioned optoelectronic integrated ceramic heat dissipation lamp module 1, which reduces the temperature rise of the power supply box 121. This is especially beneficial for high-power lamps requiring multiple modules. This design significantly improves heat dissipation capacity, reduces the failure rate, and extends the lifespan of the lamp. It can be seen that by integrating a constant current power conversion chip on the heat dissipation ceramic substrate, the temperature rise inside the power supply box 121 is significantly reduced, the failure rate is lowered, and the lifespan is extended. This solves the problem of heat accumulation in the power supply box 121 caused by the separate design of the lamp driver and the light source board in the prior art, which leads to an increased failure rate.

[0080] In this embodiment, as Figure 2As shown, the mounting bracket 2 includes two brackets, and the two ends of the optoelectronic integrated ceramic heat dissipation lamp module 1 are respectively fixed to the corresponding mounting bracket 2. Furthermore, the optoelectronic integrated ceramic heat dissipation lamp module 1 is fixed to the mounting bracket 2 through the fixing ear 111a on its lamp plate 111.

[0081] In this embodiment, as Figure 2 As shown, two or more of the optoelectronic integrated ceramic heat dissipation lamp modules 1 are powered by the same power supply box assembly 12. The power supply box 121 is fixed to the lamp panel 111 of one of the optoelectronic integrated ceramic heat dissipation lamp modules 1, and a power supply cable is led out from the power supply box 121 and electrically connected to the ceramic heat dissipation substrate 112 of the other optoelectronic integrated ceramic heat dissipation lamp modules 1.

[0082] In this embodiment, as Figure 2 As shown, the lamp also includes a lamp adjustment assembly 3, which includes a lamp adjustment bracket 31, a turntable structure 32, and a lamp adjustment screw 33. The lamp adjustment bracket 31, the turntable structure 32, and the mounting bracket 2 are provided with lamp adjustment holes 311 at corresponding positions. The lamp adjustment screw 33 passes through the corresponding lamp adjustment hole 311 to press and fix the lamp adjustment bracket 31, the turntable structure 32, and the mounting bracket 2. The turntable structure 32 allows the lamp adjustment bracket 31 to rotate relative to the mounting bracket 2 by a certain angle.

[0083] In this embodiment, as Figure 2 As shown, the turntable structure 32 includes two turntables 321. The two turntables 321 are fixed to the lamp adjustment bracket 31 and the mounting bracket 2 respectively. The two turntables 321 have matching annular teeth 321a on their opposite edges. Rotating the turntables 321 causes relative rotation between the two turntables 321, thereby realizing the angle adjustment between the lamp adjustment bracket 31 and the mounting bracket 2.

[0084] Furthermore, in this embodiment, as Figure 2 As shown, the lamp adjustment assembly 3 includes two lamp adjustment brackets 31 and two corresponding turntable structures 32. Each lamp adjustment bracket 31 is formed by vertically combining two plates. A lamp adjustment hole 311 is located at the end of one of the plates, and a lamp mounting hole 312 is provided on the other plate. Expansion bolts 4 are passed through the mounting holes to fix the lamp to the foundation structure. Figure 6 As shown; further, in this embodiment, the mounting bracket 2 is also provided with a scale 21 for indicating the rotation angle, and an indicator protrusion is provided on the edge of the turntable 321. The indicator protrusion and the corresponding scale 21 are used to indicate the current rotation angle of the turntable 321.

[0085] Furthermore, in this embodiment, as Figure 2 as well as Figure 3 As shown, the lamp includes three optoelectronic integrated ceramic heat dissipation lamp modules 1; similarly, two, four, or even more optoelectronic integrated ceramic heat dissipation lamp modules 1 can be set on the lamp as needed, such as... Figure 4 as well as Figure 5 As shown, with the addition of the optoelectronic integrated ceramic heat dissipation lamp module 1, the power of the lamp will also increase, and the types and distribution of components on the power supply board 122 will be adjusted accordingly.

[0086] In summary, the optoelectronic integrated ceramic heat dissipation lamp module and lamp of this utility model have the following advantages:

[0087] 1. High-efficiency heat dissipation: The use of ceramic heat dissipation substrate 112 improves heat dissipation efficiency and reduces the operating temperature of light-emitting elements and power conversion chips.

[0088] 2. Optoelectronic integrated design: The integrated design of optoelectronic components and heat dissipation components in the lighting module reduces the module size and improves the structural compactness.

[0089] 3. Reduced electromagnetic interference: The spatial separation between the constant current power conversion chip and the power supply board 122 reduces electromagnetic interference and improves system stability.

[0090] 4. LED lamp bead application: The use of LED lamp beads provides advantages such as high brightness, low energy consumption, and long lifespan, which meet the needs of modern lighting.

[0091] 5. Lens housing 113 optimization: The lens housing 113 redistributes the light from the light-emitting element, improving the lighting effect.

[0092] 6. Waterproof connector 123a for power cord 123: The power cord 123 is connected to the power box 121 through the waterproof connector 123a, which improves the waterproof performance of the lamp.

[0093] 7. Ventilation hole 121b design: Ventilation hole 121b, together with waterproof vent valve 121c, maintains the air pressure balance inside and outside the power box 121, while keeping the power box 121 sealed.

[0094] 8. Module Adjustment Bracket 13: The use of module adjustment bracket 13 facilitates the installation and adjustment of the lighting module.

[0095] 9. Multi-module power supply: Multiple lighting modules can share a single power supply box assembly 12, simplifying the power supply design.

[0096] 10. Lamp Adjustment Component 3: The presence of lamp adjustment component 3 allows users to adjust the illumination angle of the lamp as needed.

[0097] 11. Mounting bracket 2 design: Mounting bracket 2 allows for stable fixation of the lighting modules and facilitates adjustment of the lighting layout.

[0098] 12. Angle adjustment markings: The scale 21 and indicator protrusions on the turntable structure 32 make it convenient for users to accurately adjust the angle of the lamp.

[0099] This patent's optoelectronic integrated ceramic heat dissipation lamp module 1 achieves high-efficiency heat dissipation by integrating the light-emitting element and constant current power conversion chip onto a ceramic heat dissipation substrate 112. This effectively reduces the temperature rise within the power supply box 121, improving the lamp's lifespan and reliability. Simultaneously, the compact integrated design reduces space occupation and optimizes the overall structure of the lamp. The use of LED beads, combined with the light distribution of the lens housing 113, provides excellent lighting effects. The waterproof connector 123a and vent 121b design of the power cord 123, along with the application of the module adjustment bracket 13, further enhance the lamp's ease of installation and environmental adaptability. Furthermore, the multi-module power supply design and the addition of the lamp adjustment component 3 allow the lamp to be flexibly adjusted according to different application scenarios, meeting diverse lighting needs. Overall, this patent's lamp module design, through technological innovation, solves problems such as lamp heat dissipation and electromagnetic interference in existing technologies, providing a highly efficient, reliable, and easy-to-install and adjust lighting solution.

[0100] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0101] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A photoelectric integrated ceramic heat dissipation lamp module (1), characterized in that: include: A lamp panel assembly (11), the lamp panel assembly (11) comprising a lamp panel (111) and a ceramic heat dissipation substrate (112) fixed on the lamp panel (111), wherein a plurality of light-emitting elements and a constant current power conversion chip are arranged on the ceramic heat dissipation substrate (112); A power box assembly (12), the power box assembly (12) comprising a power box (121) and a power supply board (122) arranged in the power box (121), the power box (121) being fixed to the lamp panel (111), the power supply board (122) being electrically connected to the ceramic heat dissipation substrate (112); the power supply board (122) supplies the ceramic heat dissipation substrate (112) with the electric energy required by the ceramic heat dissipation substrate (112), obtains the specific voltage and current required by the light-emitting element after being processed by a power conversion chip, and supplies the light-emitting element with the electric energy required to emit light, and the heat generated by the light-emitting element and the constant current power conversion chip is dissipated via the ceramic heat dissipation substrate (112), thereby significantly reducing the temperature rise in the power box (121).

2. The optoelectronic integrated ceramic heat dissipation lamp module (1) according to claim 1, characterized in that: The lamp panel assembly (11) further comprises a lens cover (113) which is covered on the ceramic heat dissipation substrate (112); lenses corresponding to the light-emitting elements are arranged on the lens cover (113); and the emitted light of the light-emitting elements is redistributed by the lenses before being emitted.

3. The optoelectronic integrated ceramic heat dissipation lamp module (1) according to claim 1, characterized in that: The power box assembly (12) further comprises a power line (123) electrically connected to the power supply board (122), and the power line (123) is used to connect to an external power source.

4. The optoelectronic integrated ceramic heat dissipation lamp module (1) according to claim 3, characterized in that: The power box assembly (12) is provided with a power through hole (121a), the power line (123) passes through the power through hole (121a), and a waterproof joint (123a) is used to seal the gap between the power line (123) and the power through hole (121a).

5. The optoelectronic integrated ceramic heat dissipation lamp module (1) according to claim 1, characterized in that: The optoelectronic integrated ceramic heat dissipation lamp module (1) further comprises a module adjustment bracket (13), the module adjustment bracket (13) and the lamp panel (111) are provided with module adjustment holes (132) correspondingly, and the adjustment bracket and the lamp panel (111) are fixed by means of module adjustment screws (14) passing through the corresponding module adjustment holes (132).

6. The optoelectronic integrated ceramic heat dissipation lamp module (1) according to claim 1, characterized in that: The power box (121) is also provided with an air vent (121b), and the air vent (121b) is sealed with a waterproof air vent valve (121c).

7. A lamp, characterized in that: include: Mounting bracket (2); Two or more optoelectronic integrated ceramic heat dissipation lamp modules (1) according to any one of claims 1 to 6 fixed side by side on the mounting bracket (2).

8. The lamp according to claim 7, characterized in that: Two or more of the optoelectronic integrated ceramic heat dissipation lamp modules (1) are powered by the same power box assembly (12); the power box (121) is fixed to the lamp panel (111) of one of the optoelectronic integrated ceramic heat dissipation lamp modules (1), and a power supply cable is led out of the power box (121) and electrically connected to the ceramic heat dissipation substrate (112) of the other optoelectronic integrated ceramic heat dissipation lamp modules (1).

9. The lamp according to claim 7, characterized in that: The lamp further comprises a lamp adjustment component (3), wherein the lamp adjustment component (3) comprises a lamp adjustment bracket (31), a turntable structure (32) and a lamp adjustment screw (33); lamp adjustment holes (311) are provided at corresponding positions of the lamp adjustment bracket (31), the turntable structure (32) and the mounting bracket (2); the lamp adjustment screw (33) is passed through the corresponding lamp adjustment hole (311) to press and fix the lamp adjustment bracket (31), the turntable structure (32) and the mounting bracket (2); and the turntable structure (32) allows the lamp adjustment bracket (31) to rotate at a certain angle relative to the mounting bracket (2).

10. The lamp according to claim 9, characterized in that: The turntable structure (32) comprises two turntables (321), the two turntables (321) being fixed to the lamp adjustment bracket (31) and the mounting bracket (2) respectively, and the edges of the two turntables (321) on opposite sides are provided with mutually matching annular teeth (321a), and the turntables (321) are rotated so that the two turntables (321) rotate relative to each other, thereby realizing the angle adjustment between the lamp adjustment bracket (31) and the mounting bracket (2).

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