Atomization refrigeration assembly of air conditioner fan

Abstract

The utility model relates to the technical field of refrigeration assemblies, and discloses an air conditioner fan atomization refrigeration assembly which comprises a water tank, an atomizer and a semiconductor refrigeration module, the water tank comprises a tank body and a bottom plate, the bottom plate is installed at the bottom of the tank body, a cavity is formed between the tank body and the bottom plate, a water inlet is formed in the tank body, the atomizer is installed on the bottom face of the bottom plate, and the semiconductor refrigeration module is installed on the atomizer. The atomizer communicates with the cavity, and the semiconductor refrigeration module is installed on the bottom face of the bottom plate. Water on the bottom layer of the cavity is cooled through the semiconductor refrigeration module, the cooled water enters the atomizer to be atomized, low-temperature water mist cools surrounding air, meanwhile, the water mist is easy to diffuse, and rapid cooling of the surrounding air is conveniently achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration components, in particular to an air-conditioning fan atomization refrigeration component. Background Art

[0002] An air conditioning fan is essentially a fan that uses water as a medium. It can deliver wind at the same temperature as water in a short period of time, and can be either cold or warm. Compared with electric fans, air conditioning fans can also humidify the air, but their power is much higher than that of traditional fans, about 60-80W, but much lower than that of air conditioners. The price is very friendly. But after all, it generally does not have a compressor and cannot be cooled. It is necessary to use a water pump to extract and spray water to continuously obtain wind at the required temperature. Existing air conditioning fans use ice cubes or water as a cold source, and the wind passes through a water curtain to cool the passing air. When using ice cubes as a cold source, ice cubes need to be added regularly, and the use process is cumbersome. When using water as a cold source, the temperature of the water is easily affected by the temperature of the surrounding air, and the cooling effect is ineffective. Utility Model Content

[0003] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0004] The utility model is an air-conditioning fan atomizing refrigeration component, comprising:

[0005] A water tank, the water tank comprising a box body and a bottom plate, the bottom of the box body is installed with the bottom plate, and a chamber is formed between the box body and the bottom plate;

[0006] The box body is provided with a water inlet;

[0007] an atomizer, the atomizer being mounted on the bottom surface of the bottom plate and being in communication with the chamber;

[0008] A semiconductor refrigeration module, wherein the semiconductor refrigeration module is installed on the bottom surface of the base plate;

[0009] The water at the bottom of the chamber is cooled by a semiconductor refrigeration module, and the cooled water enters the atomizer for atomization. The low-temperature water mist cools the surrounding air. At the same time, the water mist is easy to diffuse, which is convenient for rapid cooling of the surrounding air. After being applied to the air-conditioning fan, the water mist is transported to different positions through the air supply component of the air-conditioning fan, which is convenient for rapid cooling of the surrounding air.

[0010] Furthermore, the box body includes a water storage shell and a partition, the water storage shell and the bottom plate form an integral part, the partition divides the chamber into an upper chamber and a lower chamber, the lower chamber includes a first cavity and a second cavity, the first cavity is located on the upper side of the semiconductor refrigeration module, the atomizer is located on the lower side of the second cavity, the second cavity is connected to the water inlet end of the atomizer, and the first cavity is connected to the upper chamber.

[0011] Furthermore, the bottom opening of the water storage shell is provided with an outer edge body, the outer edge body is provided with a plurality of evenly distributed mounting holes, the side of the bottom plate is provided with a plurality of circular holes, the circular holes correspond to the mounting holes one by one, and bolts are installed in the corresponding circular holes and mounting holes;

[0012] Bolts are installed in the corresponding circular holes and mounting holes to press the outer edge body against the bottom plate to achieve a sealed connection, and water is injected into the chamber through the water inlet.

[0013] Furthermore, a sponge layer is installed on the bottom surface of the bottom plate, and the semiconductor refrigeration module contacts the bottom plate through the sponge layer;

[0014] By installing a sponge layer on the peripheral side of the semiconductor refrigeration module, the bottom surface of the bottom plate is insulated by the sponge layer, thereby reducing the overflow of the cold source to the outside.

[0015] Furthermore, at least one set of heat dissipation components is installed on the lower side of the semiconductor refrigeration module, and the semiconductor refrigeration module is cooled by the installed heat dissipation components.

[0016] Furthermore, the heat dissipation component includes a fan and a fin, one side of the fin is in contact with the semiconductor refrigeration module, the fan is installed on one side of the fin, the fin is made of aluminum plate, and the fin is in contact with the semiconductor refrigeration module to achieve heat transfer. The fan installed on one side of the fin drives the air flow when the fan is started to take away the heat on the fin.

[0017] Furthermore, the surface of the bottom plate is provided with a plurality of side plates, the side plates are distributed corresponding to the semiconductor refrigeration modules, and the side plates are located in the first cavity;

[0018] The side panels are in contact with the water inside the first cavity, thereby increasing the contact area and achieving a cooling effect.

[0019] Furthermore, a slope is provided in the middle of the bottom plate;

[0020] The slope surface facilitates the flow of water in the first cavity into the second cavity.

[0021] The utility model has the following beneficial effects:

[0022] The utility model cools down the water at the bottom of the chamber through a semiconductor refrigeration module, and the cooled water enters the atomizer for atomization, and the low-temperature water mist cools down the surrounding air. Meanwhile, the water mist is easy to diffuse, so as to realize the rapid cooling of the surrounding air.

[0023] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0026] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0027] Figure 3 For this utility model Figure 1 A schematic diagram of the cross-sectional structure of;

[0028] Figure 4 This is a schematic diagram of the box structure of the utility model;

[0029] Figure 5 This is a schematic diagram of the structure of the box body of the utility model when viewed from above;

[0030] Figure 6 This is a schematic diagram of the structure of the bottom plate embodiment of the utility model;

[0031] Figure 7 This is a schematic diagram of the structure of the bottom plate embodiment of the utility model;

[0032] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0033] In the figure: 1. box body; 11. water storage shell; 12. partition; 13. outer edge body; 14. water inlet; 15. mounting hole; 2. bottom plate; 21. through hole; 22. slope; 23. side plate; 3. atomizer; 4. semiconductor refrigeration module; 5. sponge layer; 6. fan; 7. fin; 8. first cavity; 9. second cavity. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] Embodiment 1,

[0036] like Figure 1-Figure 5 As shown, the utility model is an air-conditioning fan atomizing refrigeration component, comprising:

[0037] The water tank comprises a box body 1 and a bottom plate 2. The bottom plate 2 is installed at the bottom of the box body 1, and a chamber is formed between the box body 1 and the bottom plate 2;

[0038] The box body 1 is provided with a water inlet 14, and the outer surface of the water storage shell 11 is provided with a water inlet 14, and the water inlet is connected to the chamber;

[0039] Atomizer 3, which is mounted on the bottom surface of the bottom plate 2, and is connected to the chamber, and a through hole 21 is passed between the chamber and the atomizer 3;

[0040] The semiconductor refrigeration module 4 is installed on the bottom surface of the bottom plate 2, and the semiconductor refrigeration module 4 is located at the lower side of the chamber;

[0041] The water at the bottom of the chamber is cooled by the semiconductor refrigeration module 4, and the cooled water enters the atomizer 3 for atomization. The low-temperature water mist cools the surrounding air. At the same time, the water mist is easy to diffuse, which is convenient for achieving rapid cooling of the surrounding air. After being applied to the air-conditioning fan, the water mist is transported to different positions through the air supply component of the air-conditioning fan, which is convenient for achieving rapid cooling of the surrounding air.

[0042] The box body 1 includes a water storage shell 11 and a partition 12. The water storage shell 11 and the bottom plate 2 form an integral part. The partition 12 divides the chamber into an upper chamber and a lower chamber. The lower chamber includes a first chamber 8 and a second chamber 9. The first chamber 8 is located on the upper side of the semiconductor refrigeration module 4, and the atomizer 3 is located on the lower side of the second chamber 9. The second chamber 9 is connected to the water inlet end of the atomizer 3, and the first chamber 8 is connected to the upper chamber.

[0043] The upper chamber is used for water discharge. The water in the upper chamber enters the first cavity 8 and is cooled by the semiconductor refrigeration module 4 , then flows into the second cavity 9 and is atomized and discharged by the atomizer 3 .

[0044] The bottom opening of the water storage housing 11 is provided with an outer body 13, and a plurality of evenly distributed mounting holes 15 are provided on the outer body 13. A plurality of circular holes are provided on the side of the bottom plate 2, and the circular holes correspond to the mounting holes 15 one by one, and bolts are installed in the corresponding circular holes and mounting holes 15;

[0045] The outer body 13 is pressed against the bottom plate 2 by bolts installed in the corresponding circular holes and the mounting holes 15 to achieve a sealed connection, and water is injected into the chamber through the water inlet 14 .

[0046] A sponge layer 5 is installed on the bottom surface of the bottom plate 2, and the semiconductor refrigeration module 4 passes through the sponge layer 5 and contacts the bottom plate 2. The semiconductor refrigeration module 4 is in direct contact with the bottom plate 2 to reduce the loss in the cold source transmission process;

[0047] By installing a sponge layer 5 on the peripheral side of the semiconductor refrigeration module 4, the sponge layer 5 is used to insulate the bottom surface of the bottom plate 2, thereby reducing the overflow of the cold source to the outside.

[0048] At least one set of heat dissipation components is installed on the lower side of the semiconductor refrigeration module 4, and the semiconductor refrigeration module 4 is cooled by the installed heat dissipation components.

[0049] The heat dissipation component includes a fan 6 and a fin 7. One side of the fin 7 is in contact with the semiconductor refrigeration module 4. The fan 6 is installed on one side of the fin 7. The fin 7 is made of aluminum plate. The fin 7 is in contact with the semiconductor refrigeration module 4 to achieve heat transfer. The fan 6 installed on one side of the fin 7 drives the air flow when the fan 6 is started to take away the heat on the fin 7.

[0050] Embodiment 2,

[0051] like Figure 6 As shown, the surface of the bottom plate 2 is provided with a plurality of side plates 23, the side plates 23 are distributed corresponding to the semiconductor refrigeration modules 4, and the side plates 23 are located in the first cavity 8;

[0052] The side plate 23 is in contact with the water inside the first cavity 8 to increase the contact area, thereby achieving a cooling effect.

[0053] Embodiment 3,

[0054] like Figure 7 As shown, a slope 22 is provided in the middle of the bottom plate 2 , and the slope 22 facilitates the water in the first cavity 8 to flow into the second cavity 9 .

[0055] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An air-conditioning fan atomizing refrigeration component, characterized in that: include: A water tank, the water tank comprising a box body (1) and a bottom plate (2), the bottom of the box body (1) being mounted with the bottom plate (2), a chamber being formed between the box body (1) and the bottom plate (2); The box body (1) is provided with a water inlet (14); an atomizer (3), the atomizer (3) being mounted on the bottom surface of the bottom plate (2), the atomizer (3) being in communication with the chamber; A semiconductor refrigeration module (4) is installed on the bottom surface of the base plate (2).

2. The air-conditioning fan atomizing refrigeration assembly according to claim 1, characterized in that: The box body (1) comprises a water storage shell (11) and a partition (12), wherein the water storage shell (11) and the bottom plate (2) form an integral part; The partition (12) divides the chamber into an upper chamber and a lower chamber; The lower chamber comprises a first cavity (8) and a second cavity (9), the first cavity (8) is located on the upper side of the semiconductor refrigeration module (4), the atomizer (3) is located on the lower side of the second cavity (9), and the second cavity (9) is connected to the water inlet end of the atomizer (3); The first cavity (8) is communicated with the upper cavity.

3. The air-conditioning fan atomizing refrigeration assembly according to claim 2, characterized in that: The bottom opening of the water storage housing (11) is provided with an outer edge body (13), and the outer edge body (13) is provided with a plurality of evenly distributed mounting holes (15); A plurality of circular holes are provided on the side of the bottom plate (2), and the circular holes correspond to the mounting holes (15) one by one; Bolts are installed in the corresponding circular holes and the mounting holes (15).

4. The air-conditioning fan atomizing refrigeration assembly according to claim 3, characterized in that: A water inlet (14) is provided on the outer side surface of the water storage shell (11), and the water inlet is communicated with the chamber.

5. The air-conditioning fan atomizing refrigeration assembly according to claim 1, characterized in that: A sponge layer (5) is installed on the bottom surface of the bottom plate (2); The semiconductor refrigeration module (4) passes through the sponge layer (5) and contacts the bottom plate (2).

6. The air-conditioning fan atomizing refrigeration assembly according to claim 1, characterized in that: At least one set of heat dissipation components is installed on the lower side of the semiconductor refrigeration module (4).

7. The air-conditioning fan atomizing refrigeration assembly according to claim 6, characterized in that: The heat dissipation component comprises a fan (6) and a fin (7), one side of the fin (7) is in contact with the semiconductor refrigeration module (4), and the fan (6) is installed on one side of the fin (7).

8. The air-conditioning fan atomizing refrigeration assembly according to claim 1, characterized in that: A plurality of side plates (23) are provided on the surface of the bottom plate (2), the side plates (23) are distributed corresponding to the semiconductor refrigeration modules (4), and the side plates (23) are located in the first cavity (8).

9. The air-conditioning fan atomizing refrigeration assembly according to claim 1, characterized in that: A slope (22) is provided in the middle of the bottom plate (2).

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