Gold bonding wire resistance testing device

Abstract

The utility model discloses a gold bonding wire resistance testing device, and relates to the technical field of gold bonding wire production, the gold bonding wire resistance testing device comprises a testing rack and a strip rail, the testing rack is a U-shaped structure with a notch facing the front surface, a fixed length ruler is arranged on the side surface of the testing rack, scale marks are distributed on the fixed length ruler at equal intervals along the extension direction, and the strip rail is arranged on the testing rack. The strip rail is fixed in the middle of the testing rack, and a sliding block slides on the front face of the strip rail. According to the gold bonding wire resistance testing device provided by the invention, a laser diameter measuring instrument slides on a strip rail in the middle of a testing rack through a back sliding block and is fixed through an adjusting screw, so that a tested gold bonding wire penetrates through a measuring area of the laser diameter measuring instrument to obtain the cross sectional area of the tested gold bonding wire, and the resistance of the tested gold bonding wire is measured according to the formula that resistance = resistivity * length / cross sectional area, namely R = pl / s. The resistivity can be calculated according to a formula, the resistivity reflects the doping amount of the gold bonding wire to a certain extent, the quality of the tested gold bonding wire can be synchronously detected, and the functionality of the test rack is enriched.

Description

Technical Field

[0001] The utility model relates to the technical field of gold bonding wire production, in particular to a gold bonding wire resistance testing device. Background Art

[0002] With the development of large-scale and ultra-large-scale integrated circuits, the requirements for gold bonding wire materials used for packaging are getting higher and higher. Not only must the mechanical properties meet the welding requirements, but the requirements for various properties such as electrochemistry are also becoming more and more stringent. Among them, resistance is an important indicator of the electrical properties of gold bonding wire. Resistance can not only affect the signal transmission speed of electronic components after packaging, but also guide the formulation of bonding materials to a certain extent.

[0003] In the current market and testing institutions, there is no device that can accurately measure the resistance of gold bonding wires with a diameter of only a dozen microns. This is because the gold bonding wires produced are very thin, only a dozen microns in diameter. A slight change in length has a very large impact on the accuracy of resistance and fusing current. Therefore, how to accurately measure the length of the gold bonding wire is the primary consideration.

[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a bonding wire resistance testing device is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a bonding wire resistance testing device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a bonding wire resistance testing device, comprising a test frame and a rail, the test frame is a "U"-shaped structure with a notch facing the front, and a fixed-length ruler is arranged on the side of the test frame, and the fixed-length ruler has scale markings distributed at equal intervals along the extension direction, the rail is fixed in the middle of the test frame, and a slider is slidable on the front of the rail.

[0007] Furthermore, the position of the slider on the rail is fixed by adjusting screws, and a laser diameter measuring instrument is fixed by screws on the front side of the slider.

[0008] Furthermore, a slot recessed inwards is provided on the top end surface of the test rack, and a fastening screw is threadedly matched on the side surface of the slot.

[0009] Furthermore, a DC low resistance tester is arranged on the side of the test rack, and a display area is arranged on the upper left side of the DC low resistance tester.

[0010] Furthermore, an indicator light is provided on the upper right side of the DC low resistance tester, and a power switch is provided on the lower left side of the DC low resistance tester.

[0011] Furthermore, a button is arranged on the right side below the DC low resistance tester, and a test port is arranged in the middle part below the DC low resistance tester.

[0012] Furthermore, the test port is externally connected to two data lines, and the ends of the two data lines are connected to crocodile clips. The crocodile clip on one side is fixed inside the slot by a fastening screw and clamped on one end of the bonding wire, and the crocodile clip on the other side is clamped on the other end of the bonding wire.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. When the utility model is in use, one side of the crocodile clip is fixed inside the slot by a fastening screw and clamped on one end of the bonding gold wire, and the other side of the crocodile clip is clamped on the other end of the bonding gold wire. While the resistance value of the measured bonding gold wire is obtained by a DC low resistance tester, the crocodile clip located below acts as a suspended weight, relying on gravity to ensure that the bonding gold wire is vertical, corresponding to the scale mark on the surface of the fixed length ruler, so as to obtain the accurate length.

[0015] 2. When the utility model is in use, the laser diameter gauge slides on the rail in the middle of the test frame through the slider on the back and is fixed in position by adjusting screws, so that the measured bonding gold wire passes through the measuring area of ​​the laser diameter gauge to obtain the cross-sectional area of ​​the measured bonding gold wire. According to resistance = resistivity * length / cross-sectional area, that is, R = pl / s, the resistivity can be calculated according to the formula. The resistivity reflects the doping amount of the bonding gold to a certain extent, and the quality of the measured bonding gold wire can be synchronously detected to enrich the functionality of the test frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall combined structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the test rack structure of the utility model;

[0018] Figure 3 The figure is a schematic diagram of the structure of the DC low resistance tester of the utility model.

[0019] In the figure: 1. Test rack; 2. Fixed-length ruler; 3. Scale mark; 4. Rail; 5. Slider; 6. Adjustment screw; 7. Laser diameter gauge; 8. Slot; 9. Fastening screw; 10. DC low resistance tester; 11. Display area; 12. Indicator light; 13. Power switch; 14. Button; 15. Test port; 16. Data cable; 17. Alligator clip. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0021] like Figure 1 to Figure 2 As shown, a bonding gold wire resistance testing device comprises a testing frame 1 and a rail 4, wherein the testing frame 1 is a "U"-shaped structure with a notch facing the front, and a fixed-length ruler 2 is arranged on the side of the testing frame 1, and the fixed-length ruler 2 has scale marks 3 distributed at equal intervals along the extension direction, the rail 4 is fixed in the middle of the testing frame 1, and a slider 5 is slidably arranged on the front of the rail 4, and the slider 5 is fixed on the position of the rail 4 by adjusting screws 6, and a laser diameter gauge 7 is fixed by screws on the front of the slider 5, and an inwardly recessed slot 8 is provided on the top end face of the testing frame 1, and a fastening screw 9 is threadedly matched on the side of the slot 8, and the laser diameter gauge 7 is located in the middle of the testing frame 1 through the rear slider 5, and the rail 4 slides and is fixed in position by adjusting screws 6, so that the measured bonding gold wire passes through the measuring area of ​​the laser diameter gauge 7 to obtain the measured cross-sectional area of ​​the bonding gold wire, and the resistivity can be calculated according to the formula, and the resistivity reflects the doping amount of the bonding gold to a certain extent, and the quality of the measured bonding gold wire can be synchronously detected, thereby enriching the functionality of the testing frame 1;

[0022] like Figures 1 to 3 As shown, a DC low resistance tester 10 is arranged on the side of the test rack 1, and a display area 11 is arranged on the upper left side of the DC low resistance tester 10, an indicator light 12 is arranged on the upper right side of the DC low resistance tester 10, and a power switch 13 is arranged on the lower left side of the DC low resistance tester 10, a button 14 is arranged on the lower right side of the DC low resistance tester 10, and a test port 15 is arranged in the middle of the lower part of the DC low resistance tester 10, and the test port 15 is externally connected to two data lines 16, and the ends of the two data lines 16 are connected to alligator clips 17, one side of the alligator clip 17 is fixed to the inside of the slot 8 by a fastening screw 9 and clamped on one end of the bonding gold wire, and the other side of the alligator clip 17 is clamped on the other end of the bonding gold wire. While the resistance value of the measured bonding gold wire is obtained by the DC low resistance tester 10, the alligator clip 17 located at the bottom acts as a suspended weight, relying on gravity to ensure that the bonding gold wire is vertical, corresponding to the scale mark 3 on the surface of the fixed length ruler 2 to obtain the accurate length;

[0023] It is worth noting that the specific model of the DC low resistance tester 10 of the present application is Nanjing Changsheng CS5733S, and the specific model of the laser diameter meter 7 is Santi ETB-05B.

[0024] Working principle: When using the bonding gold wire resistance testing device, when using it, fix the crocodile clip 17 on one side to the inside of the slot 8 through the fastening screw 9 and clamp it on one end of the bonding gold wire, and then clamp the crocodile clip 17 on the other side to the other end of the bonding gold wire. While obtaining the resistance value of the measured bonding gold wire through the DC low resistance tester 10, the crocodile clip 17 located below acts as a suspended weight, relying on gravity to ensure that the bonding gold wire is vertical, and the corresponding scale mark 3 on the surface of the fixed length ruler 2 is used to obtain the accurate length. The laser diameter gauge 7 slides on the rail 4 in the middle of the test frame 1 through the back slider 5 and is fixed in position by the adjusting screw 6, so that the measured bonding gold wire passes through the measuring area of ​​the laser diameter gauge 7 to obtain the cross-sectional area of ​​the measured bonding gold wire. According to resistance = resistivity * length / cross-sectional area, that is, R = pl / s, the resistivity can be calculated according to the formula. The resistivity reflects the doping amount of the bonding gold to a certain extent, and the quality of the measured bonding gold wire can be synchronously detected to enrich the functionality of the test frame 1.

[0025] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A bonding wire resistance test device, characterized in that: The invention comprises a test rack (1) and a rail (4); the test rack (1) is a "U"-shaped structure with a notch facing the front, a fixed-length ruler (2) is arranged on the side of the test rack (1), and scale marks (3) are distributed at equal intervals along the extension direction of the fixed-length ruler (2), the rail (4) is fixed in the middle of the test rack (1), and a slider (5) is slidably provided on the front of the rail (4).

2. The bonding wire resistance testing device according to claim 1, characterized in that: The position of the slider (5) on the rail (4) is fixed by means of an adjusting screw (6), and a laser diameter measuring instrument (7) is fixed by screws on the front face of the slider (5).

3. The bonding wire resistance testing device according to claim 1, characterized in that: The top end surface of the test frame (1) is provided with an inwardly recessed slot (8), and a fastening screw (9) is threadedly matched on the side surface of the slot (8).

4. The bonding wire resistance testing device according to claim 3, characterized in that: A DC low resistance tester (10) is arranged on the side of the test frame (1), and a display area (11) is arranged on the upper left side of the DC low resistance tester (10).

5. The bonding wire resistance testing device according to claim 4, characterized in that: An indicator light (12) is arranged on the upper right side of the DC low resistance tester (10), and a power switch (13) is arranged on the lower left side of the DC low resistance tester (10).

6. The bonding wire resistance testing device according to claim 5, characterized in that: A button (14) is provided on the right side below the DC low resistance tester (10), and a test port (15) is provided in the middle part below the DC low resistance tester (10).

7. The bonding wire resistance testing device according to claim 6, characterized in that: The test port (15) is externally connected to two data cables (16), and the ends of the two data cables (16) are connected to crocodile clips (17), one side of the crocodile clip (17) is fixed inside the slot (8) by a fastening screw (9) and clamped on one end of the bonding gold wire, and the other side of the crocodile clip (17) is clamped on the other end of the bonding gold wire.

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