Testing device for chip

Abstract

The utility model discloses a testing device for a chip, and the testing device comprises a testing module which is used for installing the chip; the circuit board is arranged in the test module, and the circuit board is electrically connected with the chip; the input module is connected with one end, in the length direction, of the test module, and the input module is electrically connected with the circuit board; the connecting module is connected with the two opposite sides of the testing module in the width direction of the testing module, and the connecting module is electrically connected with the circuit board; the output ports are arranged at the other end, away from the input module, of the test module, and / or the output ports are arranged on the two opposite sides of the test module in the width direction of the test module, and the output ports are electrically connected with the circuit board. The testing device for the chip disclosed by the utility model can improve the chip testing efficiency and reduce the chip testing cost.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a testing device for chips. Background Art

[0002] With the continuous development of chip technology, the complexity and integration of chips are getting higher and higher. Chip testing has become a key link in ensuring chip performance and is of great significance to improving chip quality.

[0003] Chip testing is an important means to verify whether the chip design meets the expected parameters and functions. The chip can be tested by using a probe station to poke the chip. In the probe test, the test head usually has a micro probe that can contact the surface of the chip pins or pads to perform real-time measurements. This test method requires the probe to poke the chip pads one by one, which requires very delicate operation, otherwise it is easy to damage the chip and the probe.

[0004] However, the chip testing efficiency in the prior art is low and the testing cost is very high. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a chip testing device. The device is easy to operate during chip testing, can effectively improve chip testing efficiency, and reduce chip testing costs.

[0006] The utility model provides a testing device for a chip, comprising:

[0007] A test module, wherein the test module is used to install a chip;

[0008] A circuit board, which is arranged inside the test module and is electrically connected to the chip;

[0009] An input module, the input module is connected to one end of the test module along its length direction, and the input module is electrically connected to the circuit board;

[0010] A connecting module, the connecting module is connected to two opposite sides of the testing module along the width direction thereof, and the connecting module is electrically connected to the circuit board;

[0011] An output port is arranged at the other end of the test module away from the input module, and / or the output port is arranged at two opposite sides of the test module along its width direction, and the output port is electrically connected to the circuit board.

[0012] According to the testing device for chips provided by the utility model, by setting up a testing module, it is convenient to load the chip to be tested into the testing module; by setting up a circuit board, it is convenient to provide mechanical support, fixation and protection for the electronic components on the circuit board, and provide the chip with circuit connection function, so as to realize the input, conversion and output functions of the signal in the circuit, and facilitate the subsequent functional testing of the chip; by setting up an input module, it is convenient to transmit the local oscillator signal to the circuit board by means of electrical connection, and facilitate the subsequent testing of the chip function; by setting up a connection module, it is convenient for the connection module to provide power supply and control to the inside of the testing module by means of external connection; by setting up an output port, it is convenient for different testing instruments to perform different functional tests on the chip inside the testing module.

[0013] In some examples of the present invention, the test module includes:

[0014] A lower cavity, wherein the lower cavity has a mounting groove, the mounting groove is used to mount the chip and the circuit board, and the lower cavity is connected to the input module and the connection module respectively;

[0015] An upper cavity, wherein the upper cavity has a receiving cavity, and the receiving cavity is used to receive the chip and the circuit board;

[0016] Wherein, the output port is arranged in the lower cavity and / or the upper cavity.

[0017] In some examples of the present invention, the circuit board includes:

[0018] a transmission line, wherein the input module is electrically connected to the chip through the transmission line;

[0019] A power transmission line, through which the connection module is electrically connected to the chip;

[0020] A conversion circuit, the output port is electrically connected to the chip through the conversion circuit.

[0021] In some examples of the present invention, the circuit board further includes:

[0022] A pad is connected to one end of the power transmission line, and the pad is connected to the connection module so that the connection module is electrically connected to the power transmission line.

[0023] In some examples of the present invention, the input module includes:

[0024] an insulator, wherein the insulator is disposed at one end of the lower cavity along the length direction of the test module, and one end of the insulator is electrically connected to the transmission line;

[0025] Connectors;

[0026] An input member is connected to the end of the lower cavity through the connecting member, and the input member is electrically connected to the other end of the insulator.

[0027] In some examples of the present invention, the lower cavity has a mounting hole at one end along the length direction of the test module, and the mounting hole is connected to the mounting groove, and the insulator is arranged in the mounting hole.

[0028] In some examples of the present invention, the connection module includes:

[0029] A first connector and a second connector are respectively arranged on opposite sides of the lower cavity along a width direction of the test module, and are both connected to the pad.

[0030] In some examples of the present invention, the output port includes:

[0031] The first port and the second port are both plural in number, and the plural first ports and the plural second ports are respectively arranged in the lower cavity and / or the upper cavity.

[0032] In some examples of the present invention, the test module further includes:

[0033] A positioning assembly is disposed between the lower cavity and the upper cavity, and is used for assembly and positioning of the lower cavity and the upper cavity.

[0034] In some examples of the present invention, the test module further includes:

[0035] A connecting assembly, wherein the lower cavity is connected to the upper cavity via the connecting assembly.

[0036] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a structural schematic diagram of a chip testing device provided according to the utility model;

[0039] Figure 2 It is a structural schematic diagram of the lower cavity in the chip testing device provided according to the utility model;

[0040] Figure 3 It is a front view of the lower cavity in the chip testing device provided according to the utility model;

[0041] Figure 4 A top view of the lower cavity in the chip testing device provided by the utility model;

[0042] Figure 5 It is a right view of the lower cavity in the chip testing device provided according to the utility model;

[0043] Figure 6 It is a left view of the lower cavity in the chip testing device provided according to the utility model;

[0044] Figure 7 The figure is a front view of an upper cavity in a chip testing device provided according to the utility model.

[0045] Description of reference numerals:

[0046] 10-Testing device;

[0047] 100-test module; 110-lower cavity; 111-mounting slot; 112-mounting hole; 120-upper cavity; 121-accommodating cavity; 130-positioning assembly; 131-positioning pin; 132-positioning hole; 140-connecting assembly; 141-countersunk screw; 142-threaded hole;

[0048] 200-circuit board; 210-transmission line; 220-power transmission line; 230-conversion line; 240-solder pad; 241-solder point; 242-chip;

[0049] 300-input module; 310-insulator; 320-connector; 330-input part;

[0050] 400-connection module; 410-first connector; 420-second connector;

[0051] 500 - output port; 510 - first port; 520 - second port. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0053] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0054] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0056] Figure 1 It is a structural schematic diagram of a chip testing device provided according to the utility model; Figure 2 It is a structural schematic diagram of the lower cavity in the chip testing device provided according to the utility model; Figure 3 It is a front view of the lower cavity in the chip testing device provided according to the utility model; Figure 4A top view of the lower cavity in the chip testing device provided by the utility model; Figure 5 It is a right view of the lower cavity in the chip testing device provided according to the utility model; Figure 6 It is a left view of the lower cavity in the chip testing device provided according to the utility model; Figure 7 The figure is a front view of an upper cavity in a chip testing device provided according to the utility model.

[0057] Reference below Figure 1-Figure 7 A test device 10 for a chip 242 according to an embodiment of the utility model is described, comprising: a test module 100, the test module 100 is used to install the chip 242; a circuit board 200, the circuit board 200 is arranged inside the test module 100, and the circuit board 200 is electrically connected to the chip 242; an input module 300, the input module 300 is connected to one end of the test module 100 along its length direction, and the input module 300 is electrically connected to the circuit board 200; a connection module 400, the connection module 400 is connected to the test module 100 along the opposite sides of its width direction, and the connection module 400 is electrically connected to the circuit board 200; an output port 500, the output port 500 is arranged at the other end of the test module 100 away from the input module 300, and / or the output port 500 is arranged at the opposite sides of the test module 100 along its width direction, and the output port 500 is electrically connected to the circuit board 200. It should be noted that the width direction of the test module 100 can be Figure 2 The direction pointed by X.

[0058] Specifically, the test module 100 can be made of plastic material, for example, ABS material. The advantages of ABS material are good impact resistance, good heat resistance, good corrosion resistance, good plasticity, and good plasticity of surface coating, which can meet the user's requirements for the appearance, safety, and stability of the test module 100. The shape of the test module 100 can be set to be rectangular, and the test module 100 can be divided into upper and lower parts, which can facilitate the loading of the chip 242 to be tested into the test module 100 and facilitate the setting and installation of components inside the test module 100.

[0059] The circuit board 200 can be arranged inside the test module 100. As an important component of the test module 100, the circuit board 200 carries the functions of assembling, laying out and connecting the electronic components inside the test module 100. The structure of the circuit board 200 can be set as an irregular sheet structure, so that the electronic components on the circuit board 200 can be provided with mechanical support, fixation and protection, so that the electronic components on the circuit board 200 are not easily affected by external impacts and vibrations. The circuit board 200 can be connected to the chip 242 by means of electrical connection, so that the chip 242 can be provided with a circuit connection function, realize the functions of inputting, converting and outputting the signals in the circuit, and facilitate the subsequent functional testing of the chip 242.

[0060] Part of the input module 300 can be arranged inside the test module 100, part of the input module 300 can be fixedly connected to one end of the test module 100 along its length direction, part of the input module 300 arranged inside the test module 100 can be fixedly connected to the circuit board 200 by electrical connection, and part of the input module 300 arranged outside the test module 100 is movably connected to an external device (not shown in the figure), for example: the external device can be a signal source, the advantages of the signal source are its stable output, flexible frequency adjustment capability, high-precision frequency control, programmable operation interface and wide applicability to a variety of applications. With such a setting, it is convenient to transmit the local oscillator signal of the external device to the circuit board 200 by electrical connection, which is convenient for subsequent testing of the chip 242 function. It should be noted that the length direction of the test module 100 can be Figure 2 The direction pointed by Y.

[0061] The connection module 400 can be arranged on opposite sides of the test module 100 along its width direction. This arrangement can facilitate the connection module 400 to provide power supply and control for the inside of the test module 100 through external connection. The connection module 400 can be two connection modules 400 with different interfaces, which can facilitate the transmission and connection of different signals.

[0062] The output port 500 can be arranged at one end of the test module 100 and away from the input module 300, or at two opposite sides of the test module 100 along its width direction, or at one end away from the input module 300 and at two opposite sides of the test module 100 along its width direction. The number of output ports 500 can be several, and such arrangement can facilitate different test instruments to perform different functional tests on the chip 242 inside the test module 100. The output port 500 can be connected to the circuit board 200 by means of electrical connection, and such arrangement can ensure that the output port 500 can accurately output the signal of the chip 242.

[0063] According to the test device 10 for chip 242 provided by the utility model, by setting the test module 100, the chip 242 to be tested can be easily loaded into the test module 100; by setting the circuit board 200, mechanical support, fixation and protection can be provided for the electronic components on the circuit board 200, and the circuit connection function can be provided for the chip 242, so as to realize the input, conversion and output functions of the signal in the circuit, and facilitate the subsequent functional test of the chip 242; by setting the input module 300, the local oscillator signal of the external device can be easily transmitted to the circuit board 200 by electrical connection, so as to facilitate the subsequent test of the function of the chip 242; by setting the connection module 400, the connection module 400 can provide power supply and control to the inside of the test module 100 by external connection; by setting the output port 500, different test instruments can perform different functional tests on the chip 242 inside the test module 100.

[0064] Please continue to participate Figure 1-Figure 7 As shown, according to one embodiment of the utility model, the test module 100 includes: a lower cavity 110, the lower cavity 110 has a mounting groove 111, the mounting groove 111 is used to install the chip 242 and the circuit board 200, and the lower cavity 110 is respectively connected to the input module 300 and the connection module 400; an upper cavity 120, the upper cavity 120 has a accommodating cavity 121, and the accommodating cavity 121 is used to accommodate the chip 242 and the circuit board 200; wherein, the output port 500 is arranged in the lower cavity 110 and / or the upper cavity 120.

[0065] Specifically, the shape of the lower cavity 110 can be a rectangle with multiple regular concave and convex shapes on the four sides. A mounting groove 111 is provided inside the lower cavity 110, and the shape of the mounting groove 111 can be a rectangle or other irregular shapes, which is not specifically limited in the embodiment of the utility model. The mounting groove 111 can be used to install the chip 242 and the circuit board 200. Such a setting can prevent the chip 242 and the circuit board 200 from moving during the test work, resulting in inaccurate test results. Further, the lower cavity 110 can be fixedly connected to the input module 300 by a threaded connection. Such a setting can ensure that the input module 300 can accurately input signals into the test module 100. The lower cavity 110 can be fixedly connected to the connection module 400 by welding. Such a setting can ensure that the connection module 400 can provide fixed power supply and control for the inside of the test module 100.

[0066] Furthermore, the shape of the upper cavity 120 can also be a rectangle with multiple regular concave and convex shapes on the four sides, and the upper cavity 120 can be completely fitted with the lower cavity 110. Such a configuration can ensure the integrity of the shape of the test module 100. A receiving cavity 121 is provided inside the upper cavity 120, and the shape of the receiving cavity 121 should be arranged in a mirror-symmetrical structure with the shape of the mounting groove 111 of the lower cavity 110, that is, the shape of the receiving cavity 121 can also be a rectangle or other irregular shapes, which can facilitate the rationality of the internal space of the test module 100 after the upper cavity 120 and the lower cavity 110 are integrated. The accommodating cavity 121 can be used to accommodate the chip 242 and the circuit board 200. After the upper cavity 120 and the lower cavity 110 are integrated, the accommodating cavity 121 of the upper cavity 120 and the mounting groove 111 of the lower cavity 110 can form a hollow structure, and the chip 242 and the circuit board 200 can be accommodated in the hollow structure. Such a configuration can prevent the upper cavity 120 and the lower cavity 110 from causing damage to the chip 242 and the circuit board 200 during the integration and installation process.

[0067] It should be noted that the output port 500 can be set on the two side surfaces of the upper cavity 120 or the end surface away from the input module 300, or on the two side surfaces of the lower cavity 110 or the end surface away from the input module 300, or on the two side surfaces of the upper cavity 120 and the lower cavity 110 or the end surface away from the input module 300. In this regard, the embodiment of the utility model does not make specific limitations, and the user can set the output port 500 of the test device 10 according to the convenience of operation of the test device 10. One end of the output port 500 can be electrically connected to the signal output end of the chip 242 in the test device 10 by welding, and the other end of the output port 500 can be connected to the chip 242 test instrument by wired connection. The output port 500 can be a number of different ports. Such a setting can facilitate different test instruments to perform different functional tests on the chip 242, which can increase the practicality of the test device 10.

[0068] Please continue to see Figure 2 As shown, according to another embodiment of the utility model, the circuit board 200 includes: a transmission line 210, and the input module 300 is electrically connected to the chip 242 through the transmission line 210; a transmission line 220, and the connection module 400 is electrically connected to the chip 242 through the transmission line 220; a conversion line 230, and the output port 500 is electrically connected to the chip 242 through the conversion line 230.

[0069] Specifically, the circuit board 200 can be fixedly arranged in the mounting groove 111 of the lower cavity 110 by welding, so that the stability of the circuit board 200 in the test module 100 can be ensured. The transmission line 210 can be fixedly arranged on the circuit board 200 and close to the center position of the end of the connection component 140 by welding. One end of the transmission line 210 can be movably connected to the input module 300 by plugging or other means so that the two are electrically connected, and the other end can be fixedly connected to the chip 242 by welding or other means so that the two are electrically connected. In this way, the local oscillator signal of the external device can be stably transmitted to the chip 242.

[0070] Furthermore, the transmission line 220 can be fixed on the circuit board 200 by welding or the like, one end of the transmission line 220 can be electrically connected to the connection module 400 by welding or the like, and the other end can be electrically connected to the chip 242 by welding or the like. In this way, the connection module 400 can provide power supply and control for the chip 242.

[0071] Furthermore, the conversion circuit 230 can be fixed on the circuit board 200 by welding, one end of the conversion circuit 230 can be electrically connected to the output port 500 by welding or the like, and the other end of the conversion circuit 230 can also be electrically connected to the chip 242 by welding or the like. With such a configuration, the conversion circuit 230 can convert the signal of the chip 242 into a millimeter-wave waveguide signal, and the millimeter-wave waveguide signal can enter the test instrument through the output port 500, which can facilitate the test instrument to test the function of the chip 242.

[0072] Please continue to see Figure 2 As shown, according to another embodiment of the present invention, the circuit board 200 further includes: a pad 240 , the pad 240 is connected to one end of the power transmission line 220 , and the pad 240 is connected to the connection module 400 , so that the connection module 400 is electrically connected to the power transmission line 220 .

[0073] Specifically, the pad 240 can be fixedly arranged on the circuit board 200 on opposite sides of the transmission line 210 along its width direction by welding, and the shape of the pad 240 can be rectangular. Different numbers of solder joints 241 can be arranged on both sides of the pad 240, and the solder joints 241 can be distributed in a strip shape, so that different connection modules 400 can be conveniently welded on the pad 240 through different solder joints 241. One end of the transmission line 220 can be fixedly connected to the pad 240 by welding, so that the connection module 400 and the transmission line 220 can be electrically connected. Connecting the transmission line 220 with the connection module 400 through the pad 240 is a reliable connection method, and the transmission line 220 and the connection module 400 are not easy to loosen or disconnect. In this way, the space inside the test device 10 can be saved, and the installation of the transmission line 220 and the connection module 400 is easy.

[0074] Please continue to see Figure 2 As shown, according to an optional embodiment of the utility model, the input module 300 includes: an insulator 310, which is arranged at one end of the lower cavity 110 along the length direction of the test module 100, and one end of the insulator 310 is electrically connected to the transmission line 210; a connector 320; an input member 330, which is connected to the end of the lower cavity 110 through the connector 320, and the input member 330 is electrically connected to the other end of the insulator 310.

[0075] Specifically, the insulator 310 can be disposed on the circuit board 200 inside the lower cavity 110 by welding, and is disposed at an end away from the output port 500. The shape of the insulator 310 can be rectangular, and pillars are provided at both ends of the rectangle. One end of the insulator 310 can be electrically connected to the transmission line 210 by welding or the like. Such a configuration can ensure that the local oscillator signal of the external device can enter the transmission line 210 safely and stably.

[0076] Further, the connector 320 can be arranged at one end of the lower cavity 110 away from the output port 500, and the connector 320 can fix the input module 300 part components with the lower cavity 110, so as to ensure that the external device stably transmits the local oscillator signal to the chip 242. The connector 320 can be a combined screw structure, for example, it can be a screw, nut and washer combined structure. The material and size of the screw can be selected according to the different test devices 10, and the embodiment of the utility model does not make specific restrictions on this, and the user can choose to use different screws according to different application scenarios. The nut can be an ordinary nut, a thin nut, a self-locking nut, etc., and the embodiment of the utility model does not make specific restrictions on this, and the user can choose to use different types of nuts according to different needs. The washer can be made of materials such as copper, aluminum, steel and plastic, and the embodiment of the utility model does not make specific restrictions on this, and the user can choose to use different types of washers according to different needs. The washer can not only protect the fastening surface from damage, but also increase the friction force to prevent loosening and sliding. It should be noted that screws, nuts and washers should be selected in matching pairs during the selection process to avoid unsuccessful assembly of the combined screw structure.

[0077] Furthermore, the input member 330 can be arranged at the center of the end of the lower cavity 110 away from the output port by means of a movable connection, one end of the input member 330 can be fixedly connected to the lower cavity 110 by means of a connector 320, and the other end of the input member 330 can be electrically connected to an external device by means of a wired connection. The input member 330 can be an SMA connector. As a high-frequency coaxial connector, the SMA connector not only provides reliable signal transmission and connection performance, but also can adapt to complex working environments and application requirements. The SMA connector can be connected to different external devices, so that different local oscillator signals can be transmitted to the chip 242. Such a setting can facilitate the test device 10 to receive different local oscillator signals, and can perform multifunctional tests on the chip 242, thereby improving the practicality of the test device 10.

[0078] Please continue to see Figure 1 and Figure 4 As shown, according to a further embodiment of the present invention, the lower cavity 110 has a mounting hole 112 at one end along the length direction of the test module 100 , and the mounting hole 112 is connected to the mounting groove 111 , and the insulator 310 is disposed in the mounting hole 112 .

[0079] Specifically, the mounting hole 112 can be provided at one end of the lower cavity 110 in the direction of the test module 100, and can be provided at one end of the mounting slot 111 close to the input member 330, the mounting hole 112 can be connected to the mounting slot 111, and the shape of the mounting hole 112 can be circular. The insulator 310 can be provided inside the mounting hole 112, and one end of the insulator 310 is electrically connected to the transmission line 210 by welding or the like, and the other end of the insulator 310 is connected to the input member 330 by a fixed connection method such as welding or the like. With such a configuration, the insulator 310 can be fixedly installed in the middle position between the input member 330 and the transmission line 210, which can effectively prevent the current from being directly transmitted between the external device and the transmission line 210, thereby ensuring the safety of the test device 10, and ensuring the stability and durability of the transmission line 210 and the external device.

[0080] Please continue to see Figure 1 , Figure 5 and Figure 6 As shown, in an optional manner of the present invention, the connection module 400 includes: a first connector 410 and a second connector 420. Along the width direction of the test module 100, the first connector 410 and the second connector 420 are respectively arranged on opposite sides of the lower cavity 110, and are both connected to the solder pad 240.

[0081] Specifically, the first connector 410 may be an 8-core connector, and the second connector 420 may be a 10-core connector. The first connector 410 may be installed on one side of the test module 100 along the width direction by welding with the pad 240, and the second connector 420 may also be installed on the other side of the test module 100 along the width direction by welding with the pad 240. With such a configuration, the first connector 410 and the second connector 420 may power and control the entire module through corresponding sockets (not shown in the figure). Furthermore, the first connector 410 and the second connector 420 may be used selectively, and the user may select different connectors by the number of input signals.

[0082] Please continue to see Figure 1 and Figure 2 As shown, in some examples of the present invention, the output port 500 includes: a first port 510 and a second port 520, the number of the first port 510 and the second port 520 are both multiple, and the multiple first ports 510 and the multiple second ports 520 are respectively arranged in the lower cavity 110 and / or the upper cavity 120.

[0083] Specifically, the first port 510 may be a mounting hole 112, the shape of the first port 510 may be circular, and the first port 510 may be arranged on the two side surfaces of the upper cavity 120 or the end surface away from the input module 300, or the two side surfaces of the lower cavity 110 or the end surface away from the input module 300, or the two side surfaces of the upper cavity 120 or the end surface away from the input module 300 and the two side surfaces of the lower cavity 110 or the end surface away from the input module 300. In this regard, the embodiment of the utility model does not make specific limitations, and the user may set the first port 510 of the test device 10 according to the convenience of operation of the test device 10. The number of the first ports 510 may be several, so that the standard waveguide connector of the test instrument can be easily connected to the test device 10, the function of the test chip 242 can be conveniently tested, and the efficiency of the chip 242 test can be improved.

[0084] The second port 520 may be a millimeter wave waveguide port, and the shape of the second port 520 may be rectangular. The second port 520 may be arranged on the two side surfaces of the upper cavity 120 or the end surface away from the input module 300, or on the two side surfaces of the lower cavity 110 or the end surface away from the input module 300, or on the two side surfaces of the upper cavity 120 or the end surface away from the input module 300 and on the two side surfaces of the lower cavity 110 or the end surface away from the input module 300. In this regard, the embodiment of the utility model does not make specific restrictions, and the user may set the second port 520 of the test device 10 according to the convenience of operation of the test device 10. It should be noted that one or more half shapes of the second port 520 may be opened on one or more surfaces of the upper cavity 120, and the other half shapes of the second port 520 of a corresponding number may be opened on the corresponding surface of the lower cavity 110, and one or more standard millimeter wave waveguide ports are formed after the upper cavity 120 and the lower cavity 110 are integrated and installed. Furthermore, the number of the second ports 520 may be several, so that the standard waveguide connectors of different test instruments can be easily connected to the test device 10, different functions of the chip 242 can be tested, and the practicality of the test device 10 can be improved.

[0085] Please continue to see Figure 4 and Figure 7 As shown, in some examples of the present invention, the test module 100 further includes: a positioning assembly 130 , which is disposed between the lower cavity 110 and the upper cavity 120 , and is used for assembly and positioning of the lower cavity 110 and the upper cavity 120 .

[0086] Specifically, the positioning assembly 130 can be divided into a positioning pin 131 and a positioning hole 132. The positioning pin 131 can be arranged inside the lower cavity 110 and distributed on both sides along the width direction of the test module 100, and the positioning hole 132 can be arranged inside the upper cavity 120 and distributed on both sides along the width direction of the test module 100, or the positioning pin 131 can be arranged inside the upper cavity 120 and distributed on both sides along the width direction of the test module 100, and the positioning hole 132 can be arranged inside the lower cavity 110 and distributed on both sides along the width direction of the test module 100. It should be noted that the position of the positioning hole 132 should match the position of the positioning pin 131, and the positioning pin 131 can be movably connected with the positioning hole 132. Such a setting can make the lower cavity 110 and the upper cavity 120 accurately assembled.

[0087] Please continue to see Figure 1 , Figure 3 and Figure 7 As shown, in some examples of the present invention, the test module 100 further includes: a connecting assembly 140 , and the lower cavity 110 is connected to the upper cavity 120 via the connecting assembly 140 .

[0088] Specifically, the connection component 140 can be a countersunk screw 141 and a corresponding threaded hole 142. The connection component 140 can be used to fix the upper cavity 120 and the lower cavity 110 in a threaded connection. The threaded holes 142 can be arranged on the surface of the upper cavity 120 and the lower cavity 110, and are irregularly distributed. The countersunk screw 141 can be inserted from the upper cavity 120 into the lower cavity 110, or inserted from the lower cavity 110 into the upper cavity 120. It should be noted that the connection component 140 should avoid the installation groove 111 of the lower cavity 110. Such an arrangement can prevent the countersunk screw 141 from damaging the internal components of the test device 10 when connecting the upper cavity 120 and the lower cavity 110. Further, the connection component 140 can be installed after the positioning component 130 is installed, so that the upper cavity 120 and the lower cavity 110 can be fixedly connected after being fully positioned, ensuring that the upper cavity 120 and the lower cavity 110 are installed completely.

[0089] Other components of the chip testing device 10 according to the embodiment of the present invention, such as the chip 242, testing instruments, external devices, etc., and operations are known to those of ordinary skill in the art and will not be described in detail here.

[0090] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0091] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip testing device, characterized in that: include: A test module, wherein the test module is used to install a chip; A circuit board, which is arranged inside the test module and is electrically connected to the chip; An input module, the input module is connected to one end of the test module along its length direction, and the input module is electrically connected to the circuit board; A connecting module, the connecting module is connected to two opposite sides of the testing module along the width direction thereof, and the connecting module is electrically connected to the circuit board; An output port is arranged at the other end of the test module away from the input module, and / or the output port is arranged at two opposite sides of the test module along its width direction, and the output port is electrically connected to the circuit board.

2. The chip testing device according to claim 1, characterized in that: The test module includes: A lower cavity, wherein the lower cavity has a mounting groove, the mounting groove is used to mount the chip and the circuit board, and the lower cavity is connected to the input module and the connection module respectively; An upper cavity, wherein the upper cavity has a receiving cavity, and the receiving cavity is used to receive the chip and the circuit board; Wherein, the output port is arranged in the lower cavity and / or the upper cavity.

3. The chip testing device according to claim 2, characterized in that: The circuit board comprises: a transmission line, wherein the input module is electrically connected to the chip through the transmission line; A power transmission line, through which the connection module is electrically connected to the chip; A conversion circuit, the output port is electrically connected to the chip through the conversion circuit.

4. The chip testing device according to claim 3, characterized in that: The circuit board also includes: A pad is connected to one end of the power transmission line, and the pad is connected to the connection module so that the connection module is electrically connected to the power transmission line.

5. The chip testing device according to claim 3, characterized in that: The input module comprises: an insulator, wherein the insulator is disposed at one end of the lower cavity along the length direction of the test module, and one end of the insulator is electrically connected to the transmission line; Connectors; An input member is connected to the end of the lower cavity through the connecting member, and the input member is electrically connected to the other end of the insulator.

6. The chip testing device according to claim 5, characterized in that: The lower cavity has a mounting hole at one end along the length direction of the test module, and the mounting hole is communicated with the mounting groove, and the insulator is arranged in the mounting hole.

7. The chip testing device according to claim 4, characterized in that: The connection module comprises: A first connector and a second connector are respectively arranged on opposite sides of the lower cavity along a width direction of the test module, and are both connected to the pad.

8. The chip testing device according to claim 2, characterized in that: The output port includes: The first port and the second port are both plural in number, and the plural first ports and the plural second ports are respectively arranged in the lower cavity and / or the upper cavity.

9. The chip testing device according to any one of claims 2 to 8, characterized in that: The test module also includes: A positioning assembly is disposed between the lower cavity and the upper cavity, and is used for assembly and positioning of the lower cavity and the upper cavity.

10. The chip testing device according to any one of claims 2 to 8, characterized in that: The test module also includes: A connecting assembly, wherein the lower cavity is connected to the upper cavity via the connecting assembly.

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