Silicon optical integration device

Abstract

The utility model relates to the technical field of optical communication, in particular to a silicon optical integration device. Comprising a PCBA board and a coherent optical module, and a bonding pad, a groove and at least one electronic chip are arranged on the PCBA board; the coherent optical module is arranged in the groove and is electrically connected with the PCBA board through a bonding pad; the coherent optical module comprises an adjustable laser chip, an optical transmission piece, an optical fiber, a coherent receiving chip and an optical detector, after an optical signal emitted by the adjustable laser chip passes through the optical transmission piece, part of the optical signal is transmitted into the optical fiber, and the other part of the optical signal is respectively reflected into the coherent receiving chip and the optical detector; the coherent optical module is assembled in the groove of the PCBA board, the bonding pad is arranged on the PCBA board, and the coherent optical module is connected with the bonding pad through the wire so as to be connected to the circuit of the PCBA board, so that the optoelectronic device of the COB packaging structure applied to coherent optical communication is formed, the design is more compact, extra packaging materials are not needed, and the cost is reduced. And chip packaging can be simplified, so that the manufacturing cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to a silicon optical integrated device. Background Art

[0002] Silicon photonics integration refers to the technology of using silicon-based materials to manufacture optical devices and integrate them into microelectronic chips. It combines optics and electronics, allowing the integration of optical and electronic functions on a single chip, thereby realizing a highly integrated optoelectronic system.

[0003] In the field of coherent optical communications, the technology of using silicon photonic integrated chips is becoming more and more widespread and mature. However, in the existing high-speed optical module products of coherent optical communications, not only is the packaging structure complex and the packaging cost high, but the assembly process is also very complicated.

[0004] Therefore, it is very important for those skilled in the art to design a silicon photonic integrated device which is applied in the field of coherent optical communication and has simple assembly and low packaging cost. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a silicon photonic integrated device to solve the problems of high packaging cost and complex assembly process in the prior art.

[0006] The utility model discloses a silicon photonic integrated device, which comprises a PCBA board and a coherent optical module, wherein the PCBA board is provided with a soldering pad, a groove and at least one electronic chip; the coherent optical module is arranged in the groove and is electrically connected to the PCBA board through the soldering pad; the coherent optical module comprises an adjustable laser chip, an optical transmission component, an optical fiber, a coherent receiving chip and an optical detector, and the optical signal emitted by the adjustable laser chip is partially transmitted to the optical fiber after passing through the optical transmission component, and the other part is respectively reflected to the coherent receiving chip and the optical detector.

[0007] Optionally, the coherent optical module further includes a chip control unit, an input end of the chip control unit is connected to the PCBA board through the pad, and an output end of the chip control unit is connected to the adjustable laser chip.

[0008] Optionally, the optical transmission component is a trapezoidal mirror, which includes a first transmission and reflection surface, a second transmission and reflection surface and a reflection surface; after the optical signal emitted by the adjustable laser chip is incident on the first transmission and reflection surface, a part of it is transmitted into the optical fiber, and the other part is reflected to the second transmission and reflection surface; a part of the optical signal incident on the second transmission and reflection surface is reflected to the coherent receiving chip, and the other part is transmitted to the reflection surface and reflected to the optical detector through the reflection surface.

[0009] Optionally, a collimating lens is provided between the adjustable laser chip and the trapezoidal mirror, and the optical signal emitted by the adjustable laser chip is collimated by the collimating lens and then incident on the first transmission and reflection surface.

[0010] Optionally, an optical isolator and a coupling lens are provided between the trapezoidal mirror and the optical fiber, and the optical signal transmitted through the first transmission and reflection surface is isolated by the optical isolator and then emitted into the coupling lens, and is coupled to the optical fiber through the coupling lens.

[0011] Optionally, a heat-conducting substrate is further included, wherein the heat-conducting substrate is arranged in the trench, and the coherent optical module is assembled on the heat-conducting substrate.

[0012] Optionally, a U-shaped groove and an insert are further provided on the heat-conducting substrate, the insert is fixed in the U-shaped groove, and the optical fiber is fixed in the insert.

[0013] Optionally, the PCBA board is also provided with gold fingers for connecting external devices.

[0014] Optionally, a packaging shell is further included, the packaging shell includes a base plate and a cover plate, the PCBA board is arranged on the base plate, the cover plate covers the PCBA board, and the gold fingers are exposed outside the packaging shell.

[0015] Optionally, the packaging shell is provided with an optical port structure corresponding to the position of the optical fiber.

[0016] Compared with the prior art, the beneficial effect of the silicon photonic integrated device provided by the embodiment of the utility model is that: by assembling the coherent optical module in the groove of the PCBA board and setting the pad on the PCBA board, the coherent optical module is connected to the pad through a wire to connect to the circuit of the PCBA board, thereby forming an optoelectronic device for coherent optical communication with a COB packaging structure. On the one hand, a more compact design can be achieved to be suitable for more space-constrained applications; on the other hand, the chip directly contacts the PCBA board, which can conduct heat more effectively to improve the heat dissipation performance; and, COB packaging omits some steps of traditional chip packaging and does not require additional packaging materials, which not only simplifies chip packaging but also reduces manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0018] In the figure:

[0019] Figure 1 It is a schematic diagram of the structure of a silicon photonic integrated device provided in an embodiment of the utility model;

[0020] Figure 2 It is a structural schematic diagram of a coherent optical module provided by an embodiment of the utility model;

[0021] Figure 3 It is a structural schematic diagram of a trapezoidal mirror provided by an embodiment of the utility model;

[0022] Figure 4 It is a structural schematic diagram of a packaging shell provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0024] like Figure 1 As shown, the utility model provides a specific embodiment of a silicon photonic integrated device.

[0025] A silicon photonic integrated device, referring to Figure 1 The silicon photonic integrated device includes a PCBA board 1 and a coherent optical module 2. The PCBA board 1 is provided with a pad 11, a groove 12 and at least one electronic chip 13; the coherent optical module 2 is arranged in the groove 12 and is electrically connected to the PCBA board 1 through the pad 11; the coherent optical module 2 includes an adjustable laser chip 21, an optical transmission component 22, an optical fiber 23, a coherent receiving chip 24 and a photodetector 25. The optical signal emitted by the adjustable laser chip 21 is partially transmitted to the optical fiber 23 after passing through the optical transmission component 22, and the other part is respectively reflected to the coherent receiving chip 24 and the photodetector 25.

[0026] Specifically, refer to Figure 1 The PCBA board 1 is used to solder electronic components to the printed PCBA board 1 and connect them into a circuit. In this embodiment, at least one electronic chip 13 is soldered on the PCBA board 1. The PCBA board 1 is also provided with a pad 11, which is a gold-plated pad 11 for gold wire bonding. The coherent optical module 2 can be connected to the pad 11 through a wire to connect to the circuit of the PCBA board 1 to form an optoelectronic device with a COB packaging structure. On the one hand, a more compact design can be achieved to be suitable for more space-constrained applications; on the other hand, the chip directly contacts the PCBA board, which can conduct heat more effectively to improve the heat dissipation performance; and, COB packaging omits some steps of traditional chip packaging and does not require additional packaging materials, which not only simplifies chip packaging but also reduces manufacturing costs; further, COB packaging can effectively reduce connection points and possible failure points to improve system reliability.

[0027] Further, refer to Figure 1A groove 12 is also provided on the PCBA board 1, and the coherent optical module 2 is arranged inside the groove 12 and electrically connected to the PCBA board 1. By arranging the coherent optical module 2 inside the groove 12, on the one hand, the position accuracy of the assembly can be higher, and the assembly can be made more convenient and firm, which effectively reduces the time cost; on the other hand, the overall volume of the silicon photonic integrated device can be further reduced, which is more suitable for miniaturization development.

[0028] Further, refer to Figure 1 The tunable laser chip 21 is a silicon-based integrated laser chip. The chip adopts silicon-based semiconductor growth technology inside, and integrates optical resonant cavity, filter combination and output optical waveguide design, and realizes the function of adjustable or optional laser emission and output working wavelength. Among them, the tunable laser chip 21 can output a laser beam of any working wavelength in the range of 1520-1570nm according to demand, and at the same time and under the same working conditions, the tunable laser chip 21 will output a wavelength, and different output wavelengths can be controlled and switched at any time.

[0029] Further, refer to Figure 1 The optical transmission component 22 is arranged at the rear end of the adjustable laser chip 21 to transmit or refract the optical signal emitted by the adjustable laser chip 21 and allow the optical signal to enter different rear-end optical devices respectively; the optical fiber 23 is used to receive the optical signal transmitted through the optical transmission component 22 and emit the optical signal outward.

[0030] Further, refer to Figure 1 The coherent receiving chip 24 is a silicon-based integrated coherent optical receiving chip, and the coherent optical detection technology is used inside the chip to detect the wavelength of light; the optical transmission component 22 can transmit or refract the optical signal emitted by the adjustable laser chip 21 so that the optical signal is emitted into the coherent receiving chip 24 to be received by the coherent receiving chip 24; in this embodiment, in order to adapt to the adjustable laser chip 21, a coherent receiving chip 24 that can detect a wavelength range including 1520-1570nm can be selected.

[0031] Further, refer to Figure 1 The optical detector 25 is used to monitor the emitted optical power of the adjustable laser chip 21 in real time, that is, backlight monitoring. The optical transmission component 22 can transmit or refract the optical signal emitted by the adjustable laser chip 21 so that the optical signal is emitted into the optical detector 25 to be received by the optical detector 25. In this embodiment, for adaptation, a photodetector 25 with a receiving wavelength range of 1520-1570nm can be selected.

[0032] Among them, the operating wavelength range of the adjustable laser chip 21, the coherent receiving chip 24 and the optical detector 25 is selected according to the actual application field of the device. For example, for C-band optical module products, a 1520-1570nm chip can be selected, and for L-band optical module products, a 1565-1620nm chip can be selected.

[0033] Among them, the application end / client can switch and control the wavelength at any time according to the different working wavelengths required in the communication system / equipment at a certain time / different times, and adjust the working conditions of the adjustable laser chip 21 to make it output any wavelength within its output wavelength range, and can switch to output different working wavelengths at any time; because the optical fiber 23 system of the application end / client may not be able to detect the working wavelength, it is necessary to introduce a coherent receiving chip 24 to detect and determine whether the working wavelength of the output light is the required working wavelength.

[0034] In one embodiment, reference Figure 1 and Figure 2 The coherent optical module 2 further includes a chip control unit 26 , an input end of the chip control unit 26 is connected to the PCBA board 1 through a pad 11 , and an output end of the chip control unit 26 is connected to the adjustable laser chip 21 .

[0035] Specifically, refer to Figure 1 and Figure 2 The chip control unit 26 can specifically select an integrated circuit control IC chip, which is used to control and adjust the adjustable laser chip 21 to output a laser beam of a specific working wavelength, and to process the signal / information of the receiving wavelength of the coherent receiving chip 24, and to process the received optical power / photoelectric conversion signal of the light detector 25; and the input end of the chip control unit 26 is connected to the PCBA board 1 through the pad 11 to receive external control instructions, thereby controlling the adjustable laser chip 21.

[0036] In one embodiment, reference Figure 2 and Figure 3 The optical transmission element 22 is a trapezoidal mirror, which includes a first transmission and reflection surface 221, a second transmission and reflection surface 222 and a reflection surface 223; after the optical signal emitted by the adjustable laser chip 21 is incident on the first transmission and reflection surface 221, a part of it is reflected to the optical fiber 23, and the other part is reflected to the second transmission and reflection surface 222; a part of the optical signal incident on the second transmission and reflection surface 222 is reflected to the coherent receiving chip 24, and the other part is transmitted to the reflection surface 223, and reflected to the optical detector 25 through the reflection surface 223.

[0037] Specifically, refer to Figure 2 and Figure 3The trapezoidal mirror includes a first transmission and reflection surface 221, a second transmission and reflection surface 222 and a reflection surface 223, and the second transmission and reflection surface 222 is arranged between the first transmission and reflection surface 221 and the reflection surface 223, and is parallel to the reflection surface 223. When the adjustable laser chip 21 emits an optical signal, the optical signal will be emitted into the first transmission and reflection surface 221, and the first transmission and reflection surface 221 transmits part of the optical signal and emits it into the optical fiber 23, and reflects another part of the optical signal and reflects it onto the second transmission and reflection surface 222. The part of the optical signal reflected onto the second transmission and reflection surface 222 is reflected by the second transmission and reflection surface 222 to the coherent receiving chip 24 to detect the wavelength of the light, and the other part is transmitted by the second transmission and reflection surface 222 to the reflection surface 223. The optical signal transmitted onto the reflection surface 223 will be totally reflected by the reflection surface 223 to the optical detector 25 to detect the optical power.

[0038] Among them, reference Figure 2 and Figure 3 The first transmissive reflective surface 221 realizes its function by coating a partially transmissive and partially reflective film, which may be, but not limited to, a coating design of 90% transmission and 10% reflection; the second transmissive reflective surface 222 also realizes its function by coating a partially transmissive and partially reflective film, which may be, but not limited to, a coating design of 30% transmission and 70% reflection; the reflective surface 223 realizes its function by coating a 100% total reflection film, which can be adjusted according to actual needs. The coating on the same surface only needs to satisfy: the sum of the transmission ratio and the reflection ratio is 100%.

[0039] In one embodiment, reference Figure 2 and Figure 3 A collimating lens 27 is disposed between the adjustable laser chip 21 and the trapezoidal mirror. The optical signal emitted by the adjustable laser chip 21 is collimated by the collimating lens 27 and then incident on the first transmission and reflection surface 221 .

[0040] Specifically, refer to Figure 2 and Figure 3 The collimating lens 27 is arranged on the positive light outlet side of the adjustable laser chip 21, and is used to convert the divergent laser beam emitted by the adjustable laser chip 21 into a collimated laser beam, and output it to the first transmission and reflection surface 221 of the trapezoidal mirror.

[0041] In one embodiment, reference Figure 2 and Figure 3 An optical isolator 28 and a coupling lens 29 are arranged between the trapezoidal mirror and the optical fiber 23. The optical signal transmitted through the first transmission-reflection surface 221 is isolated by the optical isolator 28 and then incident on the coupling lens 29, and is coupled to the optical fiber 23 through the coupling lens 29.

[0042] Specifically, refer to Figure 2 and Figure 3 The optical isolator 28 and the coupling lens 29 are arranged in sequence along the optical path direction. The collimated laser beam is incident on the first transmission and reflection surface 221 of the trapezoidal mirror. The first transmission and reflection surface 221 reflects part of the collimated laser beam to the second transmission and reflection surface 222, and the other part is transmitted to the optical isolator 28. The optical isolator 28 is used to control the transmission direction of the incident optical signal, which can make the optical signal only transmit in one direction, and transmit the optical signal in one direction to the coupling lens 29, effectively preventing the echo of the optical signal to avoid signal interference. The coupling lens 29 is used to transmit the optical signal from the optical isolator 28 to the optical fiber 23. It can adjust the diameter and focal length of the optical signal so that the optical signal matches the optical fiber 23, thereby improving the efficiency and accuracy of optical transmission.

[0043] In one embodiment, reference Figure 1 and Figure 2 The silicon photonic integrated device further includes a heat-conducting substrate 3 , which is disposed in the trench 12 , and the coherent optical module 2 is assembled on the heat-conducting substrate 3 .

[0044] Specifically, refer to Figure 1 and Figure 2 The thermal conductive substrate 3 is made of metal, silicon or ceramic with high thermal conductivity. By assembling the optical devices in the coherent optical module 2 on the same substrate, it is more conducive to improving the accuracy of the assembly position of each optical device. Moreover, when the coherent optical module 2 is assembled with the PCBA board 1, it is only necessary to prevent the thermal conductive substrate 3 from being placed in the groove 12, so that the assembly is simpler and more convenient, and the assembly position is more accurate.

[0045] In one embodiment, reference Figure 2 A U-shaped groove 31 and a core insert 32 are also provided on the heat-conducting substrate 3 . The core insert 32 is fixed in the U-shaped groove 31 , and the optical fiber 23 is fixed in the core insert 32 .

[0046] Specifically, refer to Figure 2 The ferrule 32 is also called the optical fiber 23 plug, which is used to connect the light to an external optical device or other optical fiber connector to achieve the transmission and connection of the optical signal; the U-shaped groove 31 is used to install and position the ferrule 32 to improve the connection stability between the optical fiber 23 and the thermal conductive substrate 3 and the accuracy of the assembly position of the optical fiber 23.

[0047] In one embodiment, reference Figure 1 The PCBA board 1 is also provided with gold fingers 14 for connecting external devices.

[0048] Specifically, refer to Figure 1The gold finger 14 includes a plurality of metal contacts for connecting to external devices to realize the transmission of electrical signals and data. The gold finger 14 can not only provide good electrical signal transmission performance to reduce signal transmission loss, but also has high corrosion resistance to ensure the stability and reliability of the connection.

[0049] In one embodiment, reference Figure 4 The silicon photonic integrated device further includes a packaging shell, which includes a base plate 41 and a cover plate 42 , the PCBA board 1 is arranged on the base plate 41 , the cover plate 42 covers the PCBA board 1 , and the gold finger 14 is exposed outside the packaging shell.

[0050] In one embodiment, reference Figure 4 The packaging shell 4 is provided with an optical port structure 43 at a position corresponding to the optical fiber 23, so as to be used for connecting an external device or an external optical fiber connector.

[0051] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.

Claims

1. A silicon photonic integrated device, characterized in that: The invention comprises a PCBA board and a coherent optical module, wherein the PCBA board is provided with a soldering pad, a groove and at least one electronic chip; the coherent optical module is arranged in the groove and is electrically connected to the PCBA board through the soldering pad; the coherent optical module comprises an adjustable laser chip, an optical transmission component, an optical fiber, a coherent receiving chip and an optical detector, and the optical signal emitted by the adjustable laser chip is partially transmitted to the optical fiber after passing through the optical transmission component, and the other part is respectively reflected to the coherent receiving chip and the optical detector.

2. The silicon photonic integrated device according to claim 1, characterized in that: The coherent optical module further includes a chip control unit, an input end of the chip control unit is connected to the PCBA board through the soldering pad, and an output end of the chip control unit is connected to the adjustable laser chip.

3. The silicon photonic integrated device according to claim 1, characterized in that: The optical transmission component is a trapezoidal mirror, which includes a first transmission and reflection surface, a second transmission and reflection surface, and a reflection surface; after the optical signal emitted by the adjustable laser chip is incident on the first transmission and reflection surface, a part of it is reflected into the optical fiber, and the other part is reflected to the second transmission and reflection surface; a part of the optical signal incident on the second transmission and reflection surface is reflected into the coherent receiving chip, and the other part is transmitted to the reflection surface and reflected to the optical detector through the reflection surface.

4. The silicon photonic integrated device according to claim 3, characterized in that: A collimating lens is arranged between the adjustable laser chip and the trapezoidal mirror. The optical signal emitted by the adjustable laser chip is collimated by the collimating lens and then incident on the first transmission and reflection surface.

5. The silicon photonic integrated device according to claim 3, characterized in that: An optical isolator and a coupling lens are arranged between the trapezoidal mirror and the optical fiber. The optical signal transmitted through the first transmission and reflection surface is isolated by the optical isolator and then incident on the coupling lens, and is coupled to the optical fiber through the coupling lens.

6. The silicon photonic integrated device according to claim 1, characterized in that: It also includes a heat-conducting substrate, which is arranged in the trench, and the coherent optical module is assembled on the heat-conducting substrate.

7. The silicon photonic integrated device according to claim 6, characterized in that: The heat-conducting substrate is also provided with a U-shaped groove and a core insert. The core insert is fixed in the U-shaped groove, and the optical fiber is fixed in the core insert.

8. The silicon photonic integrated device according to claim 1, characterized in that: The PCBA board is also provided with gold fingers for connecting external devices.

9. The silicon photonic integrated device according to claim 8, characterized in that: It also includes a packaging shell, which includes a base plate and a cover plate, the PCBA board is arranged on the base plate, the cover plate covers the PCBA board, and the gold fingers are exposed outside the packaging shell.

10. The silicon photonic integrated device according to claim 9, characterized in that: The packaging shell is provided with an optical port structure corresponding to the position of the optical fiber.

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