Passive heat dissipation case with variable heat dissipation air duct

Abstract

A passive heat dissipation case with a variable heat dissipation air duct comprises a case body, a containing partition plate is arranged in the case body, the interior of the case body is divided into an upper space and a lower space by the containing partition plate, and the passive heat dissipation case has the functions of delaying heat transfer, blocking dust invasion and dividing the space to form negative pressure while bearing the carrier function; in conclusion, the heat dissipation environment can be changed according to the use condition of the case, when efficient heat dissipation needs to be provided, the heat dissipation fan is started, negative pressure air draft is conducted, hot air flow is exhausted outwards in an accelerated mode through the fan by means of a chimney air channel on the inner heat dissipation plate, when noiseless passive heat dissipation is needed, the first blocking strip shields the active heat dissipation opening, the magnetic attraction heat dissipation fan is removed, and the heat dissipation efficiency is improved. Hot air flow is discharged outwards from the inner heat dissipation plate and the outer heat dissipation plate by utilizing the chimney effect; in addition, a hollowed-out support, heat dissipation ribs and an ultra-thin VC vapor chamber are further designed, so that the heat dissipation performance of the case is further improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of computer case heat dissipation, and in particular relates to a passive heat dissipation case with variable heat dissipation air ducts. Background Art

[0002] The biggest heat sources of a computer are the graphics card and the CPU mounted on the motherboard, both of which require a radiator, motor, and fan to achieve the heat dissipation effect. This solution will accumulate a lot of dust on the motherboard components in a short period of time, which will affect the lifespan and increase the cost of use, causing damage to the motherboard components. In addition, the dust accumulation caused by the operation of the fan will also cause the computer equipment to overheat, resulting in performance degradation and increased failure probability, which poses a challenge to computer stability. Currently, the chassis only serves as a carrier for various components, and relies on multiple fans for forced convection to assist in heat dissipation to achieve the heat dissipation effect. The core problem is that stability cannot be guaranteed and regular cleaning and maintenance are required. In addition, there is a long-standing noise problem, which is not enough to support its stable and quiet operation in dusty and inconvenient maintenance scenarios. Utility Model Content

[0003] The utility model aims to provide a passive heat dissipation case with variable heat dissipation ducts, which solves the technical problems of dust accumulation, frequent failures, performance degradation, regular maintenance, poor stability and obvious noise in existing computer cases.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] A passive heat dissipation chassis with a variable heat dissipation duct comprises a chassis body, wherein a storage partition is arranged inside the chassis body, and the storage partition divides the inside of the chassis body into an upper space and a lower space. The storage partition not only bears the function of carrying the carrier but also has the functions of delaying heat transfer, blocking dust intrusion, and dividing the space to form a negative pressure.

[0006] The chassis body is composed of a front box plate, a rear box plate, a top plate, a bottom plate and two side box plates. The inner wall of each side box plate is provided with an outer heat dissipation plate and an inner heat dissipation plate. Both the outer heat dissipation plate and the inner heat dissipation plate are double-layer structures, and a plurality of vertical shaft-shaped chimney air ducts are provided inside the outer heat dissipation plate and the inner heat dissipation plate. An active heat dissipation port is provided on the upper end side wall of the inner heat dissipation plate. The active heat dissipation port is connected with all the chimney air ducts of the inner heat dissipation plate. The upper end of the chimney air duct on the inner heat dissipation plate is a passive heat dissipation port.

[0007] The chassis body is provided with two first baffles and two second baffles, the two first baffles are respectively used to block the active heat dissipation openings of the two inner heat dissipation plates, and the two second baffles are respectively used to block the passive heat dissipation openings of the two inner heat dissipation plates, and both the first baffles and the second baffles can be removed from the chassis body;

[0008] At least one group of cooling fans connected with the upper space is installed on the upper part of the rear box plate.

[0009] Furthermore, the surfaces of the top plate and the front box plate are evenly provided with heat dissipation ribs to provide additional heat dissipation performance and at the same time provide passive heat dissipation for other heat-generating components.

[0010] Furthermore, the bottom plate has a hollow structure, and a hollow bracket is fixed to the bottom surface of the bottom plate, which ensures heat dissipation and makes transportation more convenient.

[0011] Furthermore, a first slot structure is provided at the active heat dissipation port, and a second slot structure is provided at the passive heat dissipation port;

[0012] The upper part of the rear box plate is provided with two first holes and two second holes, the two first holes respectively correspond to the first slot structures of the two inner heat dissipation plates, the two first baffles are respectively inserted into the first slot structures of the two inner heat dissipation plates from the two first holes; the two second baffles are respectively inserted into the second slot structures of the two inner heat dissipation plates from the two second holes.

[0013] Furthermore, the lower end of one of the side box panels is mounted on the front box panel and the rear box panel through a hinge structure, and the upper part of the side box panel is mounted on the front box panel and the rear box panel through a screw and a buckle structure. This design not only ensures the convenience of early installation, but also reduces the complex operations of later maintenance, repair, expansion and upgrade.

[0014] Furthermore, the chassis body is inclined with the front higher and the back lower. This design effectively improves the problem of heat transfer medium reflux in the temperature equalizer, makes the temperature equalizer performance stronger, conducts heat more rapidly, enhances the heat dissipation performance of the chassis, and lays a solid foundation for the stable operation of the noiseless passive heat dissipation mode. Ultra-thin VC temperature equalizers are arranged on the inner wall of the front box panel, the inner wall of the rear box panel, the inner wall of the top plate, and between the inner heat sink and the outer heat sink.

[0015] Furthermore, the inner walls of the front box panel and the rear box panel are correspondingly provided with sliding grooves, which are composed of an inclined section and a straight section. Two guide members are provided on the front and rear sides of the storage partition. The guide members on both sides of the storage partition are slidably installed in the sliding grooves of the front box panel and the rear box panel. The storage partition can move along the sliding grooves to improve the user's installation experience.

[0016] Furthermore, a protective top cover is installed on the CPU inside the chassis body, liquid metal thermal conductive paste is arranged on the protective top cover, and protective foam is installed on the top of the protective top cover.

[0017] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model can change the heat dissipation environment according to the use of the chassis. When efficient heat dissipation is required, the heat dissipation fan is started, negative pressure exhaust is performed, and the hot air flow is discharged outwardly using the chimney air duct on the inner heat dissipation plate. When passive heat dissipation is required, the first baffle blocks the active heat dissipation port, and the hot air flow is discharged outwardly from the inner heat dissipation plate and the outer heat dissipation plate using the chimney effect. In addition, the utility model is also designed with a hollow bracket, heat dissipation ribs and an ultra-thin VC temperature equalizing plate to further improve the heat dissipation performance of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the structure of a passive heat dissipation chassis with variable heat dissipation ducts according to the utility model;

[0020] Figure 2 It is a structural diagram showing that the side box panels are mounted on the front box panels and the rear box panels through hinges;

[0021] Figure 3 This is a schematic diagram of the installation of the storage partition;

[0022] Figure 4 It is a top view of the side box plate, the inner heat sink and the outer heat sink;

[0023] Figure 5 This is the axonometric view of the side box panel;

[0024] Figure 6 This is a schematic diagram of the installation of the first stopper and the second stopper;

[0025] Figure 7 This is an active heat dissipation mode of a passive heat dissipation chassis with a variable heat dissipation air duct according to the utility model;

[0026] Figure 8 This is a passive heat dissipation mode of a passive heat dissipation chassis with a variable heat dissipation air duct according to the utility model;

[0027] Fig. 9 This is a schematic diagram of the installation of the hollow bracket and the ultra-thin VC temperature plate;

[0028] Fig.10 Schematic diagram of installing a protective top cover on the CPU in the chassis. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] The present invention is further described in detail below in conjunction with the embodiments.

[0031] A specific embodiment 1 of a passive heat dissipation chassis with variable heat dissipation duct provided by the utility model:

[0032] like Figure 1-8 As shown, a passive heat dissipation chassis with variable heat dissipation ducts includes a chassis body, a storage partition 1 is arranged inside the chassis body, and the storage partition 1 divides the interior of the chassis body into an upper space and a lower space. The storage partition 1 is used as a carrier for installing a power supply and a hard disk. In order to facilitate users to install the power supply and hard disk thereon, and the storage partition 1 has the functions of delaying heat transfer, blocking dust from entering, and dividing the space to form a negative pressure while serving as a carrier, the storage partition 1 can be further optimized. For example, the chassis body is composed of a front box plate 2, a rear box plate 3, a top plate 4, a bottom plate 5 and two side box plates 6, and the inner walls of the front box plate 2 and the rear box plate 3 are correspondingly opened. A slide groove 7 is provided, which consists of an inclined section 8 and a straight section 9. Two guide members 10 are provided on the front and rear sides of the storage partition 1. The guide members 10 on both sides of the storage partition 1 are slidably installed in the slide grooves 7 of the front box plate 2 and the rear box plate 3. The storage partition 1 can move along the slide groove 7. When the power supply and hard disk need to be installed, the storage partition 1 can be slid to one side so that two of the guide members 10 of the storage partition 1 slide into the inclined section 8. At this time, the storage partition 1 is in a tilted state, so that the installation space is in an open state, and the power supply and hard disk can be quickly disassembled or installed, which greatly improves the installation experience of the whole machine. After the installation is completed, the storage partition 1 can be pushed back to a horizontal state.

[0033] In order to facilitate the installation of internal components of the chassis, the lower end of one of the side box panels 6 of the present embodiment is installed on the front box panel 2 and the rear box panel 3 through a hinge structure 11 (pin shaft), and the upper part of the side box panel 6 is installed on the front box panel 2 and the rear box panel 3 through screws and a snap-on structure. When the internal components need to be installed, the side box panel 6 can be opened.

[0034] like Figure 5 and Figure 6As shown, the inner wall of each side box plate 6 is provided with an outer heat dissipation plate 12 and an inner heat dissipation plate 13, the side box plate 6, the outer heat dissipation plate 12 and the inner heat dissipation plate 13 adopt an integrated structure, the outer heat dissipation plate 12 and the inner heat dissipation plate 13 are both double-layer structures, and the inner parts of the outer heat dissipation plate 12 and the inner heat dissipation plate 13 are provided with a plurality of vertical shaft-shaped chimney air ducts 14 that pass through from top to bottom, so as to maximize the heat dissipation area while compressing the overall volume as much as possible, reduce the weight of the whole machine, and improve the heat dissipation performance, and the upper end side wall of the inner heat dissipation plate 13 is provided with an active heat dissipation port 15, which is connected with all the chimney air ducts 14 of the inner heat dissipation plate 13, and the upper end of the chimney air duct 14 on the inner heat dissipation plate 13 is a passive heat dissipation port 16;

[0035] A first slot structure 17 is provided at the active heat dissipation port 15, and a second slot structure 18 is provided at the passive heat dissipation port 16; two first plug holes 19 and two second plug holes 20 are provided on the upper part of the rear box plate 3, and the two first plug holes 19 correspond to the first slot structures 17 of the two inner heat dissipation plates 13 respectively, and the two first baffles 25 are respectively inserted from the two first plug holes 19 into the first slot structures 17 of the two inner heat dissipation plates 13, so that the first baffles 25 are used to block the active heat dissipation port 15; the two second baffles 26 are respectively inserted from the two second plug holes 20 into the second slot structures 18 of the two inner heat dissipation plates 13, so that the second baffles 26 are used to block the passive heat dissipation port 16.

[0036] At least one group of cooling fans 21 connected to the upper space is installed on the upper part of the rear box plate 3.

[0037] The heat dissipation of the utility model mainly relies on the inner heat dissipation plate 13 and the outer heat dissipation plate 12 on the side box plate 6. The chimney air duct 14 of the inner heat dissipation plate 13 and the outer heat dissipation plate 12 adopts a stacking design to ensure the maximum heat dissipation surface while compressing the overall volume as much as possible to reduce the weight of the whole machine.

[0038] In addition, the heat dissipation of the utility model adopts a variable structure, namely active heat dissipation and passive heat dissipation, which can be adjusted according to the usage scenario and user habits, such as Figure 7 As shown, when the chassis is running at full power and requires extreme heat dissipation, the first baffle 25 is pulled out and the second baffle 26 is inserted. At this time, the active heat dissipation port 15 is opened, the passive heat dissipation port 16 is blocked, the heat dissipation fan 21 is started, and negative pressure is formed in the upper space. The airflow is sucked into the upper space after passing through the chimney duct 14 of the inner heat dissipation plate 13 and the active heat dissipation port 15, and finally discharged by the heat dissipation fan 21; Figure 8 As shown, when the chassis is running at low power or the user is sensitive to noise, the second baffle 26 is pulled out, the first baffle 25 is inserted or pulled out, and the cooling fan stops working. At this time, the hot air flow is discharged outward through the chimney air duct 14, the active heat dissipation port 15 and the passive heat dissipation port 16 under the action of the chimney effect, that is, passive heat dissipation.

[0039] Specific embodiment 2 of a passive heat dissipation chassis with variable heat dissipation duct provided by the utility model:

[0040] like Figure 1 and Fig. 9 As shown, the difference between this embodiment and specific embodiment 1 is that: in order to further improve the heat dissipation effect of the chassis, heat dissipation ribs 22 are evenly distributed on the surface of the top plate 4 and the surface of the front box plate 2. The heat dissipation ribs 22 increase the heat dissipation area to provide additional heat dissipation performance, while providing passive heat dissipation for other heat-generating components.

[0041] In addition, the bottom plate 5 is a hollow structure, and a hollow bracket 23 is fixed to the bottom surface of the bottom plate 5. With the support of the hollow bracket 23, cold air from the bottom can enter more easily, forming heat convection, making the operation more stable, and at the same time acting as a handle for easy moving; further, the chassis body is in a tilted state with the front higher and the back lower, and an ultra-thin VC temperature averaging plate 24 is arranged between the inner wall of the front box plate 2, the inner wall of the rear box plate 3, the inner wall of the top plate 4, the inner heat sink 13 and the outer heat sink 12. The ultra-thin VC temperature averaging plate 24 can provide heat dissipation for the chip power supply, and the heat dissipation distribution of the whole machine is more uniform, the performance is stronger, and the chassis is in an upward posture, which effectively improves the problem of reflux of the heat conducting medium of the temperature averaging plate. The ultra-thin VC temperature averaging plate 24 is a heat conducting medium. The ultra-thin VC temperature averaging plate 24 is made of aluminum and is obtained by an extrusion die. The interior is evacuated and filled with heat conducting medium. The inner wall has a capillary structure, and the two ends are sealed by extrusion or extrusion welding.

[0042] In addition, if Fig.10 As shown, the CPU in the chassis can also be optimized by removing the original top cover on the CPU and then installing a protective top cover 27. The protective top cover 27 is provided with liquid metal thermal paste 28, and a protective foam 29 is installed on top to reduce thermal resistance and improve thermal conductivity.

[0043] It should be noted that, in this article, terms such as "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0044] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A passive heat dissipation chassis with variable heat dissipation duct, characterized in that: The chassis body comprises a storage partition plate, wherein the storage partition plate divides the interior of the chassis body into an upper space and a lower space; The chassis body is composed of a front box plate, a rear box plate, a top plate, a bottom plate and two side box plates. The inner wall of each side box plate is provided with an outer heat dissipation plate and an inner heat dissipation plate. Both the outer heat dissipation plate and the inner heat dissipation plate are double-layer structures, and a plurality of vertical shaft-shaped chimney air ducts are provided inside the outer heat dissipation plate and the inner heat dissipation plate. An active heat dissipation port is provided on the upper end side wall of the inner heat dissipation plate. The active heat dissipation port is connected with all the chimney air ducts of the inner heat dissipation plate. The upper end of the chimney air duct on the inner heat dissipation plate is a passive heat dissipation port. The chassis body is provided with two first baffles and two second baffles, the two first baffles are respectively used to block the active heat dissipation openings of the two inner heat dissipation plates, and the two second baffles are respectively used to block the passive heat dissipation openings of the two inner heat dissipation plates, and both the first baffles and the second baffles can be removed from the chassis body; At least one group of cooling fans connected with the upper space is installed on the upper part of the rear box plate.

2. The passive heat dissipation chassis with variable heat dissipation duct according to claim 1, characterized in that: The surfaces of the top plate and the front box plate are evenly covered with heat dissipation ribs.

3. The passive heat dissipation chassis with variable heat dissipation duct according to claim 1, characterized in that: The bottom plate is a hollow structure, and a hollow bracket is fixed to the bottom surface of the bottom plate.

4. The passive heat dissipation chassis with variable heat dissipation duct according to claim 1, characterized in that: A first slot structure is provided at the active heat dissipation port, and a second slot structure is provided at the passive heat dissipation port; The upper part of the rear box plate is provided with two first holes and two second holes, the two first holes respectively correspond to the first slot structures of the two inner heat dissipation plates, the two first baffles are respectively inserted into the first slot structures of the two inner heat dissipation plates from the two first holes; the two second baffles are respectively inserted into the second slot structures of the two inner heat dissipation plates from the two second holes.

5. The passive heat dissipation chassis with variable heat dissipation duct according to claim 1, characterized in that: The lower end of one of the side box panels is mounted on the front box panel and the rear box panel through a hinge structure, and the upper part of the side box panel is mounted on the front box panel and the rear box panel through a screw and buckle structure.

6. The passive heat dissipation chassis with variable heat dissipation duct according to claim 3, characterized in that: The chassis body is in an inclined state with the front higher and the back lower, and ultra-thin VC temperature averaging plates are arranged between the inner wall of the front box plate, the inner wall of the rear box plate, the inner wall of the top plate, the inner heat sink and the outer heat sink.

7. The passive heat dissipation chassis with variable heat dissipation duct according to claim 1, characterized in that: The inner walls of the front box plate and the rear box plate are correspondingly provided with sliding grooves, which are composed of an inclined section and a straight section. Two guide pieces are provided on the front and rear sides of the storage partition. The guide pieces on both sides of the storage partition are slidably installed in the sliding grooves of the front box plate and the rear box plate, and the storage partition can move along the sliding grooves.

8. The passive heat dissipation chassis with variable heat dissipation duct according to claim 1, characterized in that: A protective top cover is installed on the CPU inside the chassis body, liquid metal thermal conductive paste is arranged on the protective top cover, and protective foam is installed above the protective top cover.

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