Electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to electronic equipment, which comprises a shell, the interior of the shell is hollow to form a first accommodating space, and the shell comprises a first shell located above the first accommodating space and a second shell located below the first accommodating space. And the main circuit board is arranged in the first accommodating space, the main circuit board comprises a substrate, a circuit and an electronic element, the circuit and the electronic element are arranged on the substrate, a second accommodating space can be formed between the main circuit board and the second shell, and the second accommodating space is located in the first accommodating space. And the radiator is used for radiating electronic components on the main circuit board, the radiator is arranged in the second accommodating space and fixed on one surface, facing the second shell, of the substrate, and the radiator can be communicated with a circuit on the main circuit board to receive power supply. The thickness of the electronic equipment is small.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] Electronic devices are devices that can process information.

[0003] Electronic devices generally include a processing module and a heat dissipation component. The processing module can be used to receive, process and output information, and the heat dissipation component is used to promptly dissipate the heat generated by the working process of the processing module.

[0004] In the related art, the heat dissipation component is relatively thick and occupies space inside the electronic device. Utility Model Content

[0005] In view of this, the present application provides an electronic device to reduce its thickness.

[0006] Specifically, the following technical solutions are included:

[0007] The present application provides an electronic device, including:

[0008] The outer shell is hollow inside to form a first accommodating space, and the outer shell comprises a first shell body located above the first accommodating space and a second shell body located below the first accommodating space.

[0009] A main circuit board is arranged in the first accommodating space. The main circuit board includes a substrate and circuits and electronic components arranged on the substrate. A second accommodating space can be formed between the main circuit board and the second shell. The second accommodating space is located in the first accommodating space.

[0010] A radiator is used to dissipate heat for electronic components on the main circuit board. The radiator is arranged in the second accommodating space and fixed to a side of the substrate facing the second shell. The radiator can be connected to the circuit on the main circuit board to receive power.

[0011] Optionally include:

[0012] The second shell is provided with an air inlet at a position corresponding to the radiator, and the second shell is provided with an air outlet at a surface perpendicular to the lower surface of the second shell and at a position corresponding to the radiator.

[0013] Optionally, the heat sink includes a fan body and a fan side wall, the fan side wall is arranged between the main circuit board and the second shell, and the fan side wall, the main circuit board and the second shell together form a fan accommodating chamber for accommodating the fan body.

[0014] Optionally, the height of the fan body is slightly lower than the height of the fan side wall, and the height of the fan side wall is equal to the distance between the main circuit board and the second shell.

[0015] Optionally, the fan body includes a fan main shaft and an impeller drivingly connected to the fan main shaft, the fan side wall is arranged on the outer periphery of the impeller, the fan side wall is formed into a U-shape or a roughly U-shape, one side of the U-shaped opening of the fan side wall is used for air outlet, and one side of the U-shaped opening of the fan side wall is provided with cooling fins.

[0016] Optionally, the electronic device further includes: a central processing unit CPU (Central Processing Unit), the main circuit board includes a central processing unit CPU circuit interface, and the central processing unit CPU is electrically connected to the main circuit board via the central processing unit CPU circuit interface.

[0017] Optionally, the electronic device further includes: a display interface card, the main circuit board includes a display interface card circuit interface, and the display interface card is electrically connected to the main circuit board via the display interface card circuit interface.

[0018] Optionally, the electronic device also includes: a keyboard assembly, the keyboard assembly is arranged in the first accommodating space, the keyboard assembly includes a plurality of keycaps, and the upper surface of the first shell is provided with keycap holes corresponding to the plurality of keycaps one by one, so that when the keyboard assembly is installed in the first accommodating space, the tops of the plurality of keycaps of the keyboard assembly can be exposed to the first shell through the keycap holes.

[0019] Optionally, the electronic device also includes: a touchpad assembly, the touchpad assembly is arranged in the first accommodating space, and the upper surface of the first shell is provided with a touchpad opening corresponding to the touchpad assembly, so that when the touchpad assembly is installed in the first accommodating space, the upper surface of the touchpad assembly can be exposed to the first shell through the touchpad opening.

[0020] Optionally, the electronic device further includes: a display, and the display is electrically connected to the main circuit board.

[0021] The beneficial effects of the technical solution provided by the embodiment of the present application include at least: the first accommodation space of the housing can accommodate and support the main circuit board. The main circuit board and the second housing form a second accommodation space, which is conducive to the arrangement of the radiator on the one hand, and can also form a channel for the airflow generated by the radiator to pass through on the other hand. By using the second housing and the main circuit board to provide space for the radiator, the thickness of the radiator can be reduced, which is conducive to reducing the thickness of the electronic device of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic diagram of a partial structural decomposition of an electronic device provided in an embodiment of the present application;

[0024] Figure 2 A partial side view schematic diagram of an electronic device provided in an embodiment of the present application;

[0025] Figure 3 A partial front view schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application;

[0026] Figure 4 for Figure 3 Schematic cross-sectional view along the AA direction;

[0027] Figure 5 A cross-sectional schematic diagram of a heat dissipation assembly provided in an embodiment of the present application;

[0028] Figure 6 A schematic front view of an electronic device provided in an embodiment of the present application;

[0029] Figure 7 A schematic diagram of a central processing unit (CPU) and a display interface card of an electronic device provided in an embodiment of the present application being electrically connected to a main circuit board respectively.

[0030] The reference numerals in the figures represent respectively:

[0031] 1. Shell; 101. First accommodating space; 102. Second accommodating space; 11. First shell; 12. Second shell; 1201. Air inlet;

[0032] 2. Main circuit board; 21. Base board; 211. Central processing unit CPU circuit interface; 212. Display interface card circuit interface;

[0033] 3. Radiator; 31. Fan body; 311. Main shaft; 312. Impeller; 32. Fan side wall; 33. Cooling fins; 301. Fan accommodating chamber;

[0034] 4. Central Processing Unit (CPU);

[0035] 5. Display interface card;

[0036] 6. Keyboard assembly;

[0037] 7. Touchpad assembly;

[0038] 8. Display.

[0039] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] The directional nouns involved in the embodiments of the present application, such as "upper", "lower", "side", etc., are generally represented by Figure 1 The relative relationship of the orientation shown in the figure is used as the basis, and these orientation terms are used only to more clearly describe the relationship between structures, not to describe absolute orientation. When the product is placed in different postures, the orientation may change, for example, "up" and "down" may be interchangeable.

[0042] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those of ordinary skill in the art.

[0043] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0044] The present application provides an electronic device, such as Figure 1 and Figure 2 As shown, including:

[0045] The housing 1 is hollow inside to form a first accommodating space 101 . The housing 1 includes a first shell 11 located above the first accommodating space 101 and a second shell 12 located below the first accommodating space 101 .

[0046] The main circuit board 2 is arranged in the first accommodating space 101. The main circuit board 2 includes a substrate 21 and circuits and electronic components arranged on the substrate 21. A second accommodating space 102 can be formed between the main circuit board 2 and the second shell 12. The second accommodating space 102 is located in the first accommodating space 101.

[0047] The heat sink 3 is used to dissipate heat for the electronic components on the main circuit board 2. The heat sink 3 is arranged in the second accommodation space 102 and fixed to the side of the substrate 21 facing the second shell 12. The heat sink 3 can be connected to the circuit on the main circuit board 2 to receive power.

[0048] In the related art, when the fan is working, a certain relatively closed space is required as an air duct for air flow to pass through. Therefore, the first housing 11 generally surrounds the fan to form an air duct. The first housing 11, the main circuit board 2 and the fan are generally stacked in the thickness direction of the heat dissipation component. After stacking, the thickness of the heat dissipation component increases, and more space is occupied.

[0049] It can be understood that the first accommodation space 101 of the housing 1 can accommodate and support the main circuit board 2. The main circuit board 2 and the second housing 12 enclose the second accommodation space 102, which is conducive to the arrangement of the radiator 3 on the one hand, and can also enclose the second housing 12 to form a channel for the airflow generated by the radiator 3 to pass through on the other hand. By using the second housing 12 and the main circuit board 2 to provide space for the radiator 3, the thickness of the radiator 3 can be reduced, which is conducive to reducing the thickness of the electronic device of the present application.

[0050] In the embodiment of the present application, the main circuit board 2 can change the parameters such as the speed of the fan by adjusting the current parameters supplied to the radiator 3. The technology of adjusting the current parameters of the main circuit board 2 belongs to the prior art and will not be described in detail here.

[0051] In the embodiment of the present application, the radiator 3 can drive the surrounding air to flow by rotating, thereby forming an airflow, and the airflow is guided by the second accommodating space 102 to blow on the component to be cooled, thereby achieving a heat dissipation effect.

[0052] In the embodiment of the present application, the main circuit board 2 can be connected to the first housing 11 by bonding. A sealing ring or other structure can also be provided between the main circuit board 2 and the first housing 11 to seal the first opening.

[0053] In the embodiment of the present application, in addition to dissipating heat for the electronic components of the main circuit board 2, the heat sink 3 can also dissipate heat for other components of the electronic device.

[0054] In the embodiment of the present application, the electronic device may be a laptop computer, a desktop computer, or the like.

[0055] In the embodiment of the present application, the electronic components of the main circuit board 2 and the heat sink 3 can be located on the same surface of the substrate 21, so as to facilitate the heat sink 3 to dissipate heat for the electronic components of the main circuit board 2.

[0056] In some of the embodiments of this application, Figure 2 , Figure 3 , Figure 4and Figure 5 As shown, including:

[0057] The second shell 12 is provided with an air inlet 1201 at a position corresponding to the radiator 3 , and the second shell 12 is provided with an air outlet at a surface perpendicular to the lower surface of the second shell 12 and at a position corresponding to the radiator 3 .

[0058] It is understandable that the air inlet 1201 is conducive to the air forming an airflow under the guidance of the radiator 3 and entering the second accommodation space 102. The air outlet can allow the airflow leaving the second accommodation space 102 to blow on the components to be cooled, thereby achieving a heat dissipation effect.

[0059] In the embodiment of the present application, the position of the second housing 12 corresponding to the radiator 3 may refer to the position of the air inlet of the radiator 3 on the second housing 12. Exemplarily, the orthographic projection of the air inlet hole 1201 on the projection plane is located within the orthographic projection of the radiator 3 on the projection plane, and the projection plane is a projection plane perpendicular to the thickness direction of the electronic device.

[0060] In some of the embodiments of this application, Figure 4 As shown, the radiator 3 includes a fan body 31 and a fan side wall 32. The fan side wall 32 is arranged between the main circuit board 2 and the second shell 12. The fan side wall 32, the main circuit board 2 and the second shell 12 together form a fan accommodating chamber 301 for accommodating the fan body 31.

[0061] It is understandable that the fan side wall 32 can guide the airflow generated by the fan body 31. The fan accommodating chamber 301 surrounded by the fan side wall 32, the main circuit board 2 and the second housing 12 can guide the airflow generated by the fan body 31 to the components to be cooled to achieve heat dissipation.

[0062] In the embodiment of the present application, the fan side wall 32 can be connected to the second shell 12 by bolt connection, bonding, etc.

[0063] In the embodiment of the present application, the fan side wall 32 and the main circuit board 2 can be connected by bolt connection, bonding, etc.

[0064] In some of the embodiments of this application, Figure 2 As shown, the height of the fan body 31 is slightly lower than the height of the fan side wall 32 , and the height of the fan side wall 32 is equal to the distance between the main circuit board 2 and the second housing 12 .

[0065] It can be understood that the fan side wall 32 is used to enclose the fan accommodating chamber 301 with the main circuit board 2 and the second housing 12, and its height is higher than the height of the fan body 31, which is conducive to reducing the interference of the second housing 12 when the fan body 31 is working. The height of the fan side wall 32 is equal to the distance between the main circuit board 2 and the second housing 12, which is conducive to improving the compactness of the electronic device of the present application.

[0066] In some of the embodiments of this application, Figure 4 and Figure 5 As shown, the fan body 31 includes a fan main shaft 311 and an impeller 312 drivingly connected to the fan main shaft 311, and the fan side wall 32 is arranged on the outer periphery of the impeller 312. The fan side wall 32 is formed into a U-shape or a roughly U-shape. One side of the U-shaped opening of the fan side wall 32 is used for air outlet, and a heat dissipation fin 33 is arranged on one side of the U-shaped opening of the fan side wall 32.

[0067] It is understandable that the fan main shaft 311 can drive the impeller 312 to rotate. The rotating impeller 312 drives the air to flow to form an airflow, and the airflow passes through the opening of the fan side wall 32 and leaves the fan accommodating chamber 301 to complete heat dissipation.

[0068] In the embodiment of the present application, the fan main shaft 311 and the impeller 312 can be connected to each other through key connection, welding, etc. to achieve transmission connection.

[0069] In the embodiment of the present application, the heat dissipation fins 33 can be connected to the fan side wall 32 by welding, bonding, etc.

[0070] The fan main shaft 311 may be acted upon by the alternating magnetic field to rotate, thereby driving the fan blades to rotate.

[0071] The fan main shaft 311 may extend along the thickness direction of the electronic device.

[0072] The fan blades and the fan main shaft 311 may be connected via an integrated molding process.

[0073] In some of the embodiments of this application, Figure 7 As shown, the electronic device further includes: a central processing unit CPU4 , and the main circuit board 2 includes a central processing unit CPU circuit interface 211 , and the central processing unit CPU4 is electrically connected to the main circuit board 2 via the central processing unit CPU circuit interface 211 .

[0074] It is understandable that the central processing unit CPU4 can receive various current signals and voltage signals from the main circuit board 2 through the circuit interface. By processing these current signals and voltage signals, the central processing unit CPU4 can complete the functions of the electronic device.

[0075] In the embodiment of the present application, the central processing unit CPU4 can be electrically connected to the central processing unit CPU circuit interface 211 by means of card connection, plug-in connection, etc.

[0076] In the embodiment of the present application, the central processing unit CPU4 is located in the first accommodation space 101 .

[0077] In some of the embodiments of this application, Figure 7 As shown, the electronic device further includes: a display interface card 5 , and the main circuit board 2 includes a display interface card circuit interface 212 , and the display interface card 5 is electrically connected to the main circuit board 2 via the display interface card circuit interface 212 .

[0078] It is understandable that the display interface card circuit interface 212 can be used to form an electrical connection between the display interface card 5 and the main circuit board 2. The display interface card 5 electrically connected to the main circuit board 2 can process image information from the main circuit board 2 to complete the function of the electronic device.

[0079] In the embodiment of the present application, the display interface card 5 may be located in the first accommodation space 101 .

[0080] In some of the embodiments of this application, Figure 6 As shown, the electronic device also includes: a keyboard assembly 6, the keyboard assembly 6 is arranged in the first accommodating space 101, the keyboard assembly 6 includes a plurality of keycaps, and the upper surface of the first shell 11 is provided with keycap holes corresponding to the plurality of keycaps one by one, so that when the keyboard assembly 6 is installed in the first accommodating space 101, the tops of the plurality of keycaps of the keyboard assembly 6 can be exposed to the first shell 11 through the keycap holes.

[0081] It is understandable that the keycap hole can be used for the keycap to extend out. The keycap can trigger the corresponding input instruction on the keyboard assembly 6 when pressed by the user, which is conducive to the interaction between the electronic device and the user.

[0082] In some of the embodiments of this application, Figure 6 As shown, the electronic device also includes: a touchpad assembly 7, which is arranged in the first accommodating space 101, and a touchpad opening corresponding to the touchpad assembly 7 is opened on the upper surface of the first shell 11, so that when the touchpad assembly 7 is installed in the first accommodating space 101, the upper surface of the touchpad assembly 7 can be exposed to the first shell 11 through the touchpad opening.

[0083] It is understandable that the touch panel assembly 7 can be slided on the surface by the user, and the touch panel assembly 7 can generate a corresponding signal during the sliding, and transmit the signal to the circuit board to complete the input of the instruction.

[0084] In some embodiments of the present application, the electronic device further includes: a display 8 , which is electrically connected to the main circuit board 2 .

[0085] It is understandable that the display 8 can convert the image information transmitted by the main circuit board 2 into images and present them to the user.

[0086] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0087] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0088] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: include: A shell (1) having a hollow interior forming a first accommodating space (101), the shell (1) comprising a first shell (11) located above the first accommodating space (101) and a second shell (12) located below the first accommodating space (101); A main circuit board (2) is arranged in the first accommodating space (101), the main circuit board (2) comprising a substrate (21) and circuits and electronic components arranged on the substrate (21), a second accommodating space (102) can be formed between the main circuit board (2) and the second housing (12), and the second accommodating space (102) is located in the first accommodating space (101); A heat sink (3) is used to dissipate heat for electronic components on the main circuit board (2); the heat sink (3) is arranged in the second accommodating space (102) and fixed to a side of the substrate (21) facing the second shell (12); the heat sink (3) can be connected to the circuit on the main circuit board (2) to receive power.

2. The electronic device according to claim 1, characterized in that: include: The second shell (12) is provided with an air inlet hole (1201) at a position corresponding to the radiator (3); The second shell (12) is provided with an air outlet on a surface perpendicular to the lower surface of the second shell (12) and at a position corresponding to the radiator (3).

3. The electronic device according to claim 1, characterized in that: The heat sink (3) comprises a fan body (31) and a fan side wall (32); The fan side wall (32) is arranged between the main circuit board (2) and the second shell (12); the fan side wall (32), the main circuit board (2) and the second shell (12) together form a fan accommodating chamber (301) for accommodating the fan body (31).

4. The electronic device according to claim 3, characterized in that: The height of the fan body (31) is slightly lower than the height of the fan side wall (32); The height of the fan side wall (32) is equal to the distance between the main circuit board (2) and the second housing (12).

5. The electronic device according to claim 3, characterized in that: The fan body (31) comprises a fan main shaft (311) and an impeller (312) drivingly connected to the fan main shaft (311); The fan side wall (32) is arranged on the outer periphery of the impeller (312), and the fan side wall (32) is formed into a U-shape or a substantially U-shape. One side of the U-shaped opening of the fan side wall (32) is used for air outlet, and one side of the U-shaped opening of the fan side wall (32) is provided with a heat dissipation fin (33).

6. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises: a central processing unit CPU (4); The main circuit board (2) comprises a central processing unit (CPU) circuit interface (211); The central processing unit CPU (4) is electrically connected to the main circuit board (2) via the central processing unit CPU circuit interface (211).

7. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises: a display interface card (5); The main circuit board (2) comprises a display interface card circuit interface (212); The display interface card (5) is electrically connected to the main circuit board (2) via the display interface card circuit interface (212).

8. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises: a keyboard assembly (6), the keyboard assembly (6) being arranged in the first accommodation space (101), the keyboard assembly (6) comprising a plurality of key caps; The upper surface of the first shell (11) is provided with key cap holes corresponding to the multiple key caps one by one, so that when the keyboard assembly (6) is installed in the first accommodating space (101), the tops of the multiple key caps of the keyboard assembly (6) can be exposed to the first shell (11) through the key cap holes.

9. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises: a touch panel assembly (7), wherein the touch panel assembly (7) is arranged in the first accommodating space (101); The upper surface of the first shell (11) is provided with a touchpad opening corresponding to the touchpad assembly (7), so that when the touchpad assembly (7) is installed in the first accommodating space (101), the upper surface of the touchpad assembly (7) can be exposed to the first shell (11) through the touchpad opening.

10. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises: a display (8); The display (8) is electrically connected to the main circuit board (2).

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