Wafer process machine

Abstract

The utility model provides a wafer process machine. The wafer process machine table comprises a process cavity, wherein a safety door is arranged at an opening of the process cavity; the slide glass disc bracket is positioned in the process cavity and has a rotating function; the plurality of slide glass discs are borne on the surface of the slide glass disc support and used for bearing wafers, and the slide glass discs can be driven by the rotation of the slide glass disc support to rotate; the slide tray support is provided with a gravity sensor, the gravity sensor is used for detecting the weight borne by the slide tray support, and when the safety door is in an open state and the weight detected by the gravity sensor is larger than a preset threshold value, the rotation function of the slide tray support is locked. According to the technical scheme, the gravity sensor is arranged on the wafer carrying disc support to detect the weight of the wafer carrying disc borne on the wafer carrying disc support, and the rotation function of the wafer carrying disc support is locked after all the wafer carrying discs are loaded, so that automatic control of the wafer process machine table is realized; and the problems of wafer fragmentation and machine damage caused by manual rotation of the carrying disc by an operator are avoided.

Description

Technical Field

[0001] The utility model relates to the semiconductor field, in particular to a wafer process machine. Background Art

[0002] The existing wafer process flow includes wafer front side film lamination, wafer back side thinning, wafer front side film stripping, wafer back side silicon etching, wafer back side high energy implantation, wafer back side annealing, wafer back side silicon oxidation etching, and wafer back side metal evaporation. Among them, the wafer front film is used to avoid scratches on the front of the wafer when the wafer is thinned on the back; the wafer back thinning adopts physical mechanical grinding method to grind the back of the wafer to the required target thickness; after completing the back thinning process, the wafer front film is peeled off to remove the wafer front protective film; the wafer back silicon corrosion adopts wet etching (Wet Etching) to remove the rough grinding lines on the back of the wafer, which can effectively reduce the contact resistance; the wafer back metal evaporation refers to the process method of evaporating the coating material (such as titanium (Ti), nickel (Ni), silver (Ag)) and gasifying it under vacuum conditions using an evaporator using a certain heating evaporation method, and the vaporized particles fly to the back of the wafer and condense into a film on the back of the wafer. The metal evaporation process is an earlier and more widely used vapor deposition technology. Compared with the sputtering process, the metal evaporation process has the advantages of simple film formation method, high film purity and density, and unique film structure and performance.

[0003] Specifically, the metal evaporation process further includes the following steps: manually loading the thinned wafer onto the wafer carrier (Dome); manually placing the loaded Dome of the Wafer into the evaporation machine; closing the machine safety door, selecting the corresponding process recipe (Recipe) and clicking to start the process; after the process is completed, opening the safety and manually removing the Wafer. Among them, after manually placing the loaded Dome of the Wafer into the evaporation machine, it is necessary to click the "rotate" button on the surface of the machine to start the rotating motor in the machine, drive the Dome to rotate to check the operating status of the Dome. However, there is no control in the cavity of the existing evaporation process machine. The Dome is installed inside the machine and can be rotated manually at will. The operator may make an incorrect operation and manually rotate the Dome. Due to uneven manual thrust, the Wafer may fall off and fragments may be caused, and the machine may be further damaged.

[0004] Therefore, how to improve the internal structure of the machine to avoid wafer fragmentation caused by manual rotation of the Dome is a problem that needs to be solved at present. Summary of the invention

[0005] The technical problem to be solved by the utility model is how to improve the internal structure of the machine to avoid wafer fragments caused by manual rotation of the Dome, and to provide a wafer process machine.

[0006] In order to solve the above problems, the utility model provides a wafer processing machine, comprising: a process chamber, a safety door is arranged at the opening of the process chamber; a wafer carrier bracket, located in the process chamber, and the wafer carrier bracket has a rotation function; a plurality of wafer carriers, carried on the surface of the wafer carrier bracket, used for carrying wafers, and the wafer carriers can rotate under the rotation of the wafer carrier bracket; it is characterized in that the wafer carrier bracket is provided with a gravity sensor, and the gravity sensor is used to detect the weight carried by the wafer carrier bracket, and when the safety door is open and the weight detected by the gravity sensor is greater than a preset threshold, the rotation function of the wafer carrier bracket is locked.

[0007] In some embodiments, the preset threshold is greater than the weight of a single wafer carrier and less than the sum of the weights of all wafer carriers.

[0008] In some embodiments, the number of the wafer carriers is three, and the three wafer carriers are evenly distributed around the center of the wafer carrier support.

[0009] In some embodiments, the weight of each of the wafer carrier plates is 4 kg; and the preset threshold is 10 kg.

[0010] In some embodiments, the gravity sensor is located at the center of the wafer carrier support.

[0011] In some embodiments, the wafer processing machine further includes a control unit, which is capable of locking the rotation function of the wafer carrier when the weight detected by the gravity sensor is greater than the preset threshold.

[0012] In some embodiments, the wafer processing machine further includes a rotary motor connected to the wafer carrier support for providing power for the rotation of the wafer carrier support.

[0013] In some embodiments, the control unit locks the rotation function of the wafer carrier by locking the rotation motor.

[0014] In some embodiments, the wafer processing machine further includes a rotation button located on the surface of the machine, and the rotation button is used to receive user instructions and control the unlocking of the rotation motor through a control unit.

[0015] In some embodiments, the wafer processing machine is a wafer evaporation machine, and the wafer evaporation machine also includes: a crucible, located in the process chamber and below the wafer carrier, for heating the evaporation material to form an evaporation gas; a vacuum pump, connected to the process chamber, for providing a vacuum environment for the process chamber.

[0016] The above technical solution realizes automatic control of the wafer process machine by arranging a gravity sensor on the wafer carrier holder, detecting the weight of the wafer carrier carried on the wafer carrier holder to determine whether the wafer carrier is fully loaded, and locking the rotation function of the wafer carrier holder after the wafer carrier is fully loaded, thereby avoiding the problem of wafer fragments and machine damage caused by manual rotation of the wafer carrier by the operator.

[0017] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of a top view of the structure of an embodiment of the wafer processing machine of the utility model.

[0020] Figure 2 It is a side view structural schematic diagram of an embodiment of the wafer processing machine described in the utility model.

[0021] Figure 3 It is a side structural schematic diagram of another embodiment of the wafer processing machine of the utility model. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-2 ,in, Figure 1It is a schematic diagram of a top view of the structure of an embodiment of the wafer processing machine of the utility model; Figure 2 FIG. 1 is a schematic diagram of a side view of an embodiment of the wafer processing machine of the utility model. Figure 1-2 As shown, the wafer process machine includes: a process chamber 11, a wafer carrier support 12, and a plurality of wafer carriers 13. A safety door (not shown) is provided at the opening of the process chamber 11. The wafer carrier support 12 is located in the process chamber 11, and the wafer carrier support 12 has a rotation function. The wafer carrier 13 is carried on the surface of the wafer carrier support 12, and is used to carry the wafer 19. The wafer carrier 13 can rotate under the rotation of the wafer carrier support 12. The wafer carrier support 12 is provided with a gravity sensor 14, and the gravity sensor 14 is used to detect the weight carried by the wafer carrier support 12. When the safety door is open and the weight detected by the gravity sensor 14 is greater than a preset threshold, the rotation function of the wafer carrier support 12 is locked.

[0024] The above technical solution realizes automatic control of the wafer process machine by arranging a gravity sensor on the wafer carrier holder, detecting the weight of the wafer carrier carried on the wafer carrier holder to determine whether the wafer carrier is fully loaded, and locking the rotation function of the wafer carrier holder after the wafer carrier is fully loaded, thereby avoiding the problem of wafer fragments and machine damage caused by manual rotation of the wafer carrier by the operator.

[0025] In some embodiments, the preset threshold is greater than the weight of a single wafer tray 13 and less than the sum of the weights of all wafer trays 13. After all wafer trays 13 are loaded onto the wafer tray support 12, the weight carried by the wafer tray support 12 is greater than the preset threshold, and the rotation function of the wafer tray support 12 will be locked, so that the operator cannot manually rotate the wafer tray support 12, thereby avoiding the problem of wafer fragments and machine damage caused by uneven manual thrust.

[0026] In some embodiments, the number of the wafer trays 13 is three, and the three wafer trays 13 are evenly distributed around the center of the wafer tray support 12. In other embodiments, the number of the wafer trays 13 can also be 2, 4 or 5. In some embodiments, the number of the wafers 19 that each wafer tray 13 can carry is 5 to 10.

[0027] In some embodiments, the weight of each wafer tray 13 is 4 kg; the preset threshold is 10 kg. In this embodiment, the number of wafer trays 13 in each wafer tray holder 12 is three, and the weight of each wafer tray 13 is 4 kg, that is, the total weight of the wafer trays 13 in each wafer tray holder 12 is 12 kg; therefore, the preset threshold is set to 10 kg. When the weight detected by the gravity sensor 14 is greater than the preset threshold, that is, when all the wafer trays 13 are loaded onto the wafer tray holder 12, the rotation function of the wafer tray holder 12 is locked, so that the operator cannot manually rotate the wafer tray holder 12, thereby avoiding the problem of wafer fragments and machine damage caused by uneven manual thrust.

[0028] In some embodiments, in order to more accurately detect the weight borne by the wafer carrier bracket 12 , the gravity sensor 14 is located at the center of the wafer carrier bracket 12 .

[0029] In some embodiments, the wafer processing machine further includes a control unit (not shown), which can lock the rotation function of the wafer carrier bracket 12 when the weight detected by the gravity sensor 14 is greater than the preset threshold.

[0030] In some embodiments, the wafer processing machine further includes a rotary motor 15 connected to the wafer carrier 12 to provide power for the rotation of the wafer carrier 12. In this embodiment, the rotary motor 15 is located at the center of the machine, and the wafer processing machine locks the rotation function of the wafer carrier 12 by locking the rotary motor 15. When the weight detected by the gravity sensor 14 is greater than the preset threshold, the rotary motor 15 at the center of the machine is automatically locked, so that the operator cannot manually rotate the wafer carrier 12, thereby avoiding the problem of uneven manual thrust causing wafer fragments and machine damage.

[0031] In some embodiments, the wafer processing machine further includes a rotation button (not shown) located on the surface of the wafer processing machine, and the rotation button is used to receive user instructions and control the unlocking of the rotation motor 15 through the control unit. After the rotation motor 15 is locked, the user can click the rotation button to unlock the rotation motor 15, and drive the wafer carrier bracket 12 to rotate through the rotation motor 15. At this time, the wafer carrier bracket 12 drives the three wafer carriers 13 to revolve around the center of the wafer carrier bracket 12 (as shown by arrow 102), and rotates under the drive of the wafer carrier bracket 12 (as shown by arrow 101), thereby completing the inspection of the operating status of the wafer carrier 13.

[0032] When the above conditions are met, the safety door is closed and the corresponding process recipe is selected before the equipment can start the process.

[0033] See also Figure 3 , which is a side view structural diagram of another embodiment of the wafer processing machine of the utility model. Figure 3 As shown, in this embodiment, the wafer process machine is a wafer evaporation machine, and the wafer evaporation machine further includes: a process chamber 31, a wafer carrier support 32, a plurality of wafer carriers 33, a crucible 37, and a vacuum pump 38. A safety door (not shown) is provided at the opening of the process chamber 31. The wafer carrier support 32 is located in the process chamber 31, and the wafer carrier support 32 has a rotation function. The wafer carrier 33 is carried on the surface of the wafer carrier support 32, and is used to carry the wafer 39. The wafer carrier 33 can rotate under the rotation of the wafer carrier support 32. The wafer carrier support 32 is provided with a gravity sensor 34, and the gravity sensor 34 is used to detect the weight carried by the wafer carrier support 32. When the safety door is open and the weight detected by the gravity sensor 34 is greater than a preset threshold, the rotation function of the wafer carrier support 32 is locked. The crucible 37 is located in the process chamber 31 and below the wafer carrier 33, and is used to heat the evaporation material to form evaporation gas. The vacuum pump 38 is connected to the process chamber 31, and is used to provide a vacuum environment for the process chamber 31.

[0034] The process chamber 31 has multiple crucibles 37 built in, and different metal materials are placed in the multiple crucibles 37. The wafer carrier 33 is located above the crucible 37, and multiple wafers 39 can be placed. By sequentially heating the evaporation materials in the multiple crucibles 37 and depositing them on the wafer 39, the purpose of completing the deposition of multiple evaporation materials in one process chamber 31 is achieved, and finally the wafer 39 is connected to the outside with low impedance. In this embodiment, the evaporation material is a metal material. Specifically, aluminum, titanium, nickel, silver and other metal layers are sequentially deposited on the silicon substrate by a method of high-temperature excitation of a metal target, wherein aluminum metal is directly deposited on the wafer 39, and titanium and nickel metals are generally used as transition layers due to their good adhesion to achieve better connection between aluminum metal and silver metal. Silver metal, as an excellent low-resistance conductive material, realizes the connection between the device and the external circuit.

[0035] In some embodiments, the preset threshold is greater than the weight of a single wafer tray 33 and less than the sum of the weights of all wafer trays 33. After all wafer trays 33 are loaded onto the wafer tray support 32, the weight carried by the wafer tray support 32 is greater than the preset threshold, and the rotation function of the wafer tray support 32 will be locked, so that the operator cannot manually rotate the wafer tray support 12, thereby avoiding the problem of wafer fragments and machine damage caused by uneven manual thrust.

[0036] The above technical solution realizes automatic control of the wafer process machine by arranging a gravity sensor on the wafer carrier holder, detecting the weight of the wafer carrier carried on the wafer carrier holder to determine whether the wafer carrier is fully loaded, and locking the rotation function of the wafer carrier holder after the wafer carrier is fully loaded, thereby avoiding the problem of wafer fragments and machine damage caused by manual rotation of the wafer carrier by the operator.

[0037] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0038] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0039] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0040] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer processing machine, comprising: A process chamber, wherein a safety door is provided at the opening of the process chamber; A wafer carrier support, located in the process chamber, and the wafer carrier support has a rotation function; A plurality of wafer carriers are carried on the surface of the wafer carrier bracket and are used to carry wafers. The wafer carriers can rotate under the rotation of the wafer carrier bracket; It is characterized in that the wafer carrier bracket is provided with a gravity sensor, and the gravity sensor is used to detect the weight carried by the wafer carrier bracket. When the safety door is open and the weight detected by the gravity sensor is greater than a preset threshold, the rotation function of the wafer carrier bracket is locked.

2. The wafer processing machine according to claim 1, characterized in that: The preset threshold is greater than the weight of a single wafer carrier and less than the sum of the weights of all wafer carriers.

3. The wafer processing machine according to claim 1, characterized in that: The number of the wafer carrier plates is three, and the three wafer carrier plates are evenly distributed around the center of the wafer carrier plate bracket.

4. The wafer processing machine according to claim 3, characterized in that: The weight of each of the wafer carrier plates is 4 kg; the preset threshold is 10 kg.

5. The wafer processing machine according to claim 1, characterized in that: The gravity sensor is located at the center of the wafer carrier bracket.

6. The wafer processing machine according to claim 1, characterized in that: The wafer processing machine also includes a control unit, which can lock the rotation function of the wafer carrier when the weight detected by the gravity sensor is greater than the preset threshold.

7. The wafer processing machine according to claim 6, characterized in that: The wafer processing machine also includes a rotary motor connected to the wafer carrier bracket for providing power for the rotation of the wafer carrier bracket.

8. The wafer processing machine according to claim 7, characterized in that: The control unit locks the rotation function of the wafer carrier bracket by locking the rotation motor.

9. The wafer processing machine according to claim 7, characterized in that: The wafer processing machine also includes a rotation button located on the surface of the machine, and the rotation button is used to receive user instructions and control the unlocking of the rotation motor through the control unit.

10. The wafer processing machine according to claim 1, characterized in that: The wafer process machine is a wafer evaporation machine, and the wafer evaporation machine further includes: A crucible, located in the process chamber and below the wafer carrier, for heating the evaporation material to form an evaporation gas; A vacuum pump is connected to the process chamber and is used to provide a vacuum environment for the process chamber.

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