Wafer box gas conveying device and semiconductor process equipment

By designing the box gas delivery device, the gas environment in the box is controlled by using the gas supply and exhaust components, the mixed problems between the box environment and the external environment are solved, the microenvironment quality is improved, and the wafer is protected.

CN222838818UActive Publication Date: 2025-05-06SEVENSTAR SEMICONDUCTOR TECHNOLOGIES CO LTD
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Patent Information

Application Number
CN202420324885.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-21
Publication Date
2025-05-06
Estimated Expiration
2034-02-21

AI Technical Summary

Technical Problem

During the temporary storage process of the wafer box, due to the sealing degree and material breathability, air circulation between the internal and external environments is caused by the air flow of the internal and external environments. The pressure, humidity and oxygen content are the same as that of the external environment, and external particles may enter the wafer box and contaminate the wafer.

Method used

A box gas delivery device is designed, including a gas supply assembly and an exhaust assembly, and the box is connected to the gas source or the factory exhaust end by using a fixed seat and a flexible connection. By feeding clean gas into the box and venting the internal gas, the pressure, humidity and oxygen content in the box are controlled.

Benefits of technology

By controlling the gas environment in the box, the oxygen content and humidity are reduced, and external particles are prevented from entering, thereby improving the microenvironment quality in the box and protecting the wafer.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides a wafer box gas conveying device and semiconductor process equipment, in the device, a fixed seat is used for being installed on a wafer box bearing component, a flexible connecting piece is fixedly connected with the fixed seat, a first connecting channel is arranged in the fixed seat, a second connecting channel is arranged in the flexible connecting piece, and the first connecting channel is communicated with the second connecting channel. One end of the first connecting channel is connected with an air source or a factory exhaust end, and the other end of the first connecting channel is connected with one end of the second connecting channel; under the condition that the wafer box is placed on the bearing surface of the wafer box bearing part, the other end of the second connecting channel is used for being communicated with an air supply port or an air exhaust port in the bottom of the wafer box, and the flexible connecting piece is attached to the bottom surface of the wafer box, is in a compressed state and is used for sealing the joint of the second connecting channel and the air supply port or the air exhaust port. According to the scheme, the oxygen content and humidity in the wafer box can be reduced, external particles are prevented from entering the wafer box, the microenvironment quality in the wafer box can be improved, and wafers in the wafer box are protected.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a chip box gas conveying device and semiconductor process equipment. Background Art

[0002] The cassette containing wafers needs to be temporarily stored on the cassette carrying component (carrying bracket) in the temporary storage device before entering the back-end vertical furnace for back-end processing of the wafers. When the cassette and the wafer inside are needed, the robot takes away the temporarily stored cassette and takes out the wafer from the cassette. The temporary storage device is used to coordinate the work rhythm of the front and back of the production line.

[0003] During the temporary storage of the wafer box containing the wafers on the wafer box carrier, due to the limitation of the sealing degree of the wafer box and the certain air permeability of the material of the wafer box, there is air circulation between the inside of the wafer box and the external environment. As time goes by, the pressure inside the wafer box is equal to the ambient atmospheric pressure, and the humidity and oxygen content are also equal to the external environment (humidity is about 60%, oxygen content is about 21%). At the same time, external particles may enter the wafer box and cause contamination to the wafers. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer box gas delivery device and semiconductor process equipment, which can reduce the oxygen content and humidity inside the wafer box and prevent external particles from entering the wafer box, thereby improving the microenvironment quality inside the wafer box and protecting the wafers in the wafer box.

[0005] In order to achieve the purpose of the utility model, a wafer box gas delivery device is provided, which is applied to semiconductor process equipment, and includes a gas delivery component for delivering gas to the wafer box, and an exhaust component for exhausting the gas in the wafer box, wherein the gas delivery component and the exhaust component both include a fixing seat and a flexible connector, wherein:

[0006] The fixing seat is used to be installed on the film box bearing component, the flexible connecting member is fixedly connected to the fixing seat, and a first connecting channel is provided in the fixing seat, and a second connecting channel is provided in the flexible connecting member, one end of the first connecting channel is used to be connected to an air source or a factory exhaust end, and the other end of the first connecting channel is connected to one end of the second connecting channel;

[0007] When the film box is placed on the bearing surface of the film box bearing component, the other end of the second connecting channel is used to communicate with the air supply port or the exhaust port at the bottom of the film box, and the flexible connecting member is in contact with the bottom surface of the film box and is in a compressed state to seal the connection between the second connecting channel and the air supply port or the exhaust port.

[0008] Optionally, the flexible connecting member includes a flexible bellows, one end of which is fixedly connected to the fixed seat, and when the film box is placed on the bearing surface of the film box bearing component, the other end of the flexible bellows is in contact with the bottom surface of the film box; the interior of the flexible bellows constitutes the second connecting channel.

[0009] Optionally, the flexible bellows comprises a bellows body and a connecting portion provided at one end of the bellows body, the end surface of the other end of the connecting portion away from the bellows body is in contact with the outer surface of the fixing seat and is provided with a threaded column;

[0010] The outer surface of the fixing seat is provided with a first threaded hole, and the threaded column is arranged in the first threaded hole and matched with the first threaded hole;

[0011] Sub-channels communicating with the interior of the bellows body and the first connecting channel are correspondingly provided in the connecting portion and the threaded column, and the sub-channels and the interior of the bellows body together constitute the second connecting channel.

[0012] Optionally, the fixing seat is used to be installed on the bottom of the film box bearing component, and the flexible connecting member passes through the film box bearing component and protrudes relative to the bearing surface of the film box bearing component when in a non-compressed state.

[0013] Optionally, a second threaded hole is provided on the bottom surface of the film box bearing component;

[0014] The air supply assembly and the exhaust assembly each further include a fastening screw and at least one adjusting washer, wherein a mounting groove is provided on the bottom surface of the fixing seat, and a through hole vertically penetrating the fixing seat is provided on the bottom surface of the mounting groove, and the fastening screw passes through the through hole from bottom to top and is threadedly connected with the second threaded hole;

[0015] At least one adjusting washer is sleeved on the fastening screw and is located between the bottom surface of the mounting groove and the screw head of the fastening screw.

[0016] Optionally, the bottom surface of the film box is provided with a plurality of grooves, and the air supply port and the air exhaust port are respectively located on the bottom surfaces of the plurality of grooves;

[0017] When the film box is placed on the bearing surface of the film box bearing component, the flexible connecting member is in contact with the bottom surface of the corresponding groove and is in a compressed state.

[0018] Optionally, the fixing seat is further provided with a plurality of third threaded holes vertically penetrating the fixing seat;

[0019] The air supply component and the exhaust component also include a plurality of adjustment screws, which are arranged in a one-to-one correspondence in the plurality of third threaded holes; and the top ends of the adjustment screws abut against the bottom surface of the film box supporting component, so as to adjust the horizontality of the fixing seat by rotation.

[0020] Optionally, the film box gas delivery device also includes an air supply gas path mechanism, which includes an air supply pipeline and a pressure reducing valve, a flow controller, a first on-off valve and a filter arranged on the air supply pipeline in sequence along the air supply direction of the air supply pipeline; the two ends of the air supply pipeline are respectively connected to the first connecting channel and the air source in the air supply component.

[0021] Optionally, the film box gas conveying device also includes an exhaust gas circuit mechanism, which includes an exhaust pipeline and a second on-off valve arranged on the exhaust pipeline; the two ends of the exhaust pipeline are respectively connected to the first connecting channel in the exhaust component and the factory exhaust end.

[0022] As another technical solution, the utility model further provides a semiconductor process equipment, including a temporary storage device for temporarily storing a film box, the temporary storage device comprising:

[0023] A film box carrying component, used for carrying at least one film box;

[0024] The above-mentioned film box gas conveying device provided by the utility model is used to supply gas to the film box and exhaust the gas in the film box when the film box is placed on the bearing surface of the film box bearing component.

[0025] The utility model has the following beneficial effects:

[0026] The wafer box gas delivery device provided by the utility model can supply gas to the wafer box with the aid of the gas supply component and exhaust the gas in the wafer box with the aid of the exhaust component when the wafer box is placed on the bearing surface of the wafer box bearing component, so that the pressure in the wafer box can be kept at a positive pressure, thereby preventing external particles from entering the wafer box. At the same time, the gas (such as clean nitrogen) introduced into the wafer box can also control the pressure, humidity and oxygen content in the wafer box, thereby improving the microenvironment quality in the wafer box and protecting the wafers in the wafer box. On this basis, the gas supply component and the exhaust component both include a fixed seat and a flexible connector, and the first connecting channel in the fixed seat and the second connecting channel in the flexible connector can respectively connect the interior of the wafer box with the gas source for supplying gas and the factory exhaust end for recovering the gas in the wafer box, and the flexible connector fits the bottom surface of the wafer box and is in a compressed state, so as to seal the connection between the second connecting channel and the gas supply port or exhaust port of the wafer box, thereby ensuring that the gas does not leak.

[0027] The semiconductor process equipment provided by the utility model can reduce the oxygen content and humidity inside the wafer box and prevent external particles from entering the wafer box by adopting the wafer box gas delivery device provided by the utility model, thereby improving the microenvironment quality inside the wafer box and protecting the wafers in the wafer box. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A structural diagram of a temporary storage device for semiconductor process equipment provided by an embodiment of the utility model;

[0029] Figure 2 The bottom structural diagram of the film box used in the embodiment of the utility model;

[0030] Figure 3 A partial cross-sectional view of the film box at the exhaust port used in the embodiment of the utility model;

[0031] Figure 4 A structural diagram of a gas delivery component / exhaust component in a film box gas delivery device provided by an embodiment of the utility model;

[0032] Figure 5 A cross-sectional view of the gas delivery component / exhaust component at the first connecting channel and the second connecting channel in the gas delivery device for the film box provided in an embodiment of the utility model;

[0033] Figure 6 A cross-sectional view of the gas delivery component / exhaust component at the fastening screw in the film box gas delivery device provided by the embodiment of the utility model;

[0034] Figure 7 A structural diagram of the gas delivery device for a tablet box provided by an embodiment of the utility model when the tablet box is not placed on a carrying surface;

[0035] Figure 8 for Figure 7 Enlarged view of the middle I area;

[0036] Fig. 9 A structural diagram of the gas delivery device for a tablet box provided by an embodiment of the utility model when the tablet box is placed on a carrying surface;

[0037] Fig.10 for Fig. 9 Enlarged view of the middle II region;

[0038] Fig.11 This is a schematic diagram of the air supply gas path mechanism and the exhaust gas path mechanism used in the embodiment of the utility model. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solution of the present invention, the wafer box gas conveying device and semiconductor process equipment provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0040] See also Figure 1 The embodiment of the utility model provides a wafer box gas delivery device 300, which is applied to semiconductor process equipment, specifically, for example, a temporary storage device of the semiconductor process equipment, and is used to pass gas (such as clean nitrogen or other inert gas) into the wafer box 200 and discharge the gas in the wafer box 200 when the wafer box 200 is placed on the carrying surface of the wafer box carrying component 100 of the temporary storage device. The wafer box 200 has an openable wafer box cover, and when the wafer box cover is closed, the inside of the wafer box is in a sealed state.

[0041] In some embodiments, the above-mentioned film box bearing component 100 includes, for example, a multi-layer support bracket 101 spaced apart in the vertical direction, and a fixing bracket 102 for supporting and fixing the multi-layer support bracket 101. In order to more clearly illustrate the structure of the support bracket 101, Figure 1 The second support bracket 101 from bottom to top does not place the film box 200. Each support bracket 101 includes a support plate 101a for placing at least one film box 200, specifically, as shown in FIG. Figure 1 As shown, for example, two film boxes 200 can be placed on the support plate 101a of each layer of the support bracket 101. Optionally, a positioning structure 101b such as a positioning pin is also provided on the support plate 101a, and / or a position sensor 101c for detecting whether there is a film box 200 on the support plate 101a. In addition, the number of the film box gas conveying devices 300 is the same as the total number of the film boxes 200 that can be placed on the film box bearing component 100, and each film box gas conveying device 300 is arranged in a one-to-one correspondence with the bearing surface of the film box bearing component 100 on which each film box 200 is placed.

[0042] Specifically, each of the film box gas delivery devices 300 includes a gas delivery component 300a for delivering gas to the film box 200, and an exhaust component 300b for exhausting the gas in the film box 200, and the positions of the two on the film box bearing component 100 can be interchanged. Figure 2 and Figure 3 As shown, the bottom of the film box 200 is provided with an air supply port 201 and an air exhaust port 202 communicating with the inside of the film box 200, both of which are through holes penetrating the bottom wall of the film box 200, Figure 3Only the exhaust port 202 is shown, and the structure of the air supply port 201 can be the same or similar thereto. When the wafer box 200 is placed on the bearing surface of the wafer box bearing component 100, air is supplied to the wafer box 200 via the air supply port 201 by means of the air supply component 300a, and the gas in the wafer box 200 is discharged via the exhaust port 202 by means of the exhaust component 300b, so that the pressure in the wafer box 200 can be kept at a positive pressure (the pressure in the wafer box 200 is, for example, greater than or equal to 300Pa), thereby preventing external particles from entering the wafer box 200. At the same time, in the process of introducing gas (for example, clean nitrogen) into the wafer box 200 and discharging the gas in the wafer box 200, the pressure, humidity and oxygen content in the wafer box 200 can be controlled by controlling parameters such as the air intake flow rate and the air supply time, thereby improving the microenvironment quality in the wafer box 200 and protecting the wafers in the wafer box 200.

[0043] Please also read Figure 4 and Figure 5 , the gas supply component 300a and the exhaust component 300b that realize the above functions can, for example, adopt the same structure capable of transmitting gas, but have different functions, that is, the gas supply component 300a is used to supply gas to the film box 200, and the exhaust component 300b is used to exhaust the gas in the film box 200. For example, the gas supply component 300a and the exhaust component 300b both include a fixed seat 1 and a flexible connector 2, wherein the fixed seat 1 is used to be installed on the film box bearing component 100, the flexible connector 2 is fixedly connected to the fixed seat 1, and a first connecting channel 11 is provided in the fixed seat 1, and a second connecting channel 23 is provided in the flexible connector 2, one end of the first connecting channel 11 is used to be connected to a gas source or a factory exhaust end, and the other end of the first connecting channel 11 is connected to one end of the second connecting channel 23. When the film box 200 is placed on the bearing surface of the film box bearing component 100, the air supply port 201 of the film box 200 corresponds to an air supply component 300a, and the exhaust port 202 of the film box 200 corresponds to an exhaust component 300b. Specifically, the second connecting channel 23 in the air supply component 300a is used to communicate with the air supply port 201 at the bottom of the film box 200, and the second connecting channel 23 in the exhaust component 300b is used to communicate with the exhaust port 202 at the bottom of the film box 200. Moreover, the flexible connecting member 2 in the air supply component 300a is in contact with the bottom surface of the film box 200 and is in a compressed state, so as to seal the connection between the second connecting channel 23 in the air supply component 300a and the air supply port 201; the flexible connecting member 2 in the exhaust component 300b is in contact with the bottom surface of the film box 200 and is in a compressed state, so as to seal the connection between the second connecting channel 23 in the exhaust component 300b and the exhaust port 202.

[0044] In some embodiments, Figure 5As shown, one end of the first connecting channel 11 for connecting to the gas source or the factory exhaust end is provided with an internal threaded hole 12, and the internal threaded hole 12 is used to install an air pipe joint so as to be compatible with the air pipe of the gas source or the factory exhaust end to achieve a sealed connection.

[0045] When the film box 200 is placed on the bearing surface of the film box bearing component 100, the first connecting channel 11 in the fixing seat 1 and the second connecting channel 23 in the flexible connecting member 2 can respectively connect the interior of the film box 200 with the gas source for supplying gas and the factory exhaust end for recovering the gas in the film box 200. Specifically, the gas provided by the gas source enters the film box 200 through the first connecting channel 11 and the second connecting channel 23 in the gas supply component 300a and the gas supply port 201, and the gas in the film box 200 is discharged into the factory exhaust end through the exhaust port 202 and the first connecting channel 11 and the second connecting channel 23 in the exhaust component 300b. On this basis, the flexible connector 2 in the air supply component 300a is in contact with the bottom surface of the film box 200 and is in a compressed state, so as to seal the connection between the second connecting channel 23 in the air supply component 300a and the air supply port 201; the flexible connector 2 in the exhaust component 300b is in contact with the bottom surface of the film box 200 and is in a compressed state, so as to seal the connection between the second connecting channel 23 in the exhaust component 300b and the exhaust port 202, thereby ensuring that the gas will not leak.

[0046] In some embodiments, the flexible connector 2 for realizing the above functions includes, for example, a flexible bellows 21, one end of which is fixedly connected to the fixing seat 1, and when the film box 200 is placed on the bearing surface of the film box bearing component 100, the other end of the flexible bellows 21 is closely attached to the bottom surface of the film box 200 to achieve a sealing effect; the interior of the flexible bellows 21 constitutes the above second connecting channel 23. The above flexible bellows 21 can produce compression deformation when the film box 200 is placed on the bearing surface of the film box bearing component 100, so as to ensure that the end surface of the flexible bellows 21 can be closely attached to the bottom surface of the film box 200 when the film box 200 is placed horizontally, and avoid the gap between the flexible bellows 21 and the bottom surface of the film box 200 due to the processing error of the film box 200 (for example, ±0.5mm), so as to ensure that the flexible bellows 21 and the bottom surface of the film box 200 are well sealed and avoid air leakage. In some embodiments, the material of the flexible bellows 21 is rubber, for example.

[0047] There are many ways to fix one end of the flexible bellows 21 to the fixing seat 1. For example, the flexible bellows 21 includes a bellows body and a connecting portion 22 disposed at one end of the bellows body. The end surface of the connecting portion 22 away from the bellows body fits the outer surface of the fixing seat 1 and is provided with a threaded column 221. The outer surface of the fixing seat 1 is provided with a first threaded hole, and the threaded column 221 is disposed in the first threaded hole and cooperates with the first threaded hole, thereby achieving a fixed connection between the bellows body and the fixing seat 1. In some embodiments, as Figure 4 As shown, a hexagonal screw head structure is provided on the periphery of the connecting portion 22. When the threaded column 221 is screwed into the first threaded hole, the bottom surface of the hexagonal screw head structure is pre-tightened to the outer surface of the fixing seat 1 (i.e., the end surface of the first threaded hole), thereby realizing a fixed connection between the flexible bellows 21 and the fixing seat 1.

[0048] In some embodiments, the material of the bellows body includes, for example, rubber, and the material of the connecting portion 22 includes, for example, metal. The bellows body and the connecting portion 22 are fixed together by, for example, bonding, clamping, etc. The connecting portion 22 and the threaded column 221 are also provided with corresponding sub-channels 222 that are connected to the interior 211 of the bellows body and the first connecting channel 11, respectively. The sub-channels 222 and the interior 211 of the bellows body together constitute the second connecting channel 23. Therefore, for the air supply component 300a, the gas in the first connecting channel 11 can flow into the interior 211 of the bellows body via the threaded column 221 and the sub-channels 222 in the connecting portion 22 in sequence, and then flow into the interior of the film box 200. The airflow direction in the exhaust component 300b is opposite to the airflow direction of the above-mentioned air supply component 300a.

[0049] In some embodiments, Figure 6 As shown, the fixing seat 1 is used to be installed at the bottom of the film box bearing component 100, for example, installed at the bottom of the bottom plate 101a, and the flexible connecting member 2 passes through the film box bearing component 100 (for example, the bottom plate 101a), as shown in FIG. Figure 7 and Figure 8 As shown, the flexible connector 2, when in a non-compressed state, protrudes relative to the bearing surface of the film box bearing component 100 (eg, the bearing surface A of the bottom plate 101a), and the protruding height is Figure 8 Thus, when the film box 200 is placed on the bearing surface of the film box bearing member 100, as shown in FIG. Fig. 9 and Fig.10As shown, under the action of gravity, the portion of the flexible connector 2 (i.e., the flexible bellows 21) protruding from the above-mentioned bearing surface A of the film box 200 is pressed downward, so that the film box 200 can be placed horizontally on the bearing surface A, that is, the bottom surface B of the film box 200 is in contact with the bearing surface A, while ensuring that the end surface of the flexible bellows 21 can be in close contact with the bottom surface of the film box 200, avoiding the generation of a gap between the flexible bellows 21 and the bottom surface of the film box 200 due to the processing error of the film box 200, thereby ensuring that the flexible bellows 21 and the bottom surface of the film box 200 are well sealed to avoid air leakage.

[0050] In some embodiments, Figure 8 As shown, the height H1 of the portion of the flexible connecting member 2 (ie, the flexible bellows 21 ) protruding from the above-mentioned bearing surface is, for example, 3 mm or 3.5 mm.

[0051] In some embodiments, Figure 8 As shown, in order to position the flexible connector 2 (i.e., the flexible bellows 21), the bottom surface B of the film box 200 is provided with a plurality of grooves, and the air supply port 201 and the exhaust port 202 are respectively located on the bottom surfaces of the plurality of grooves. For example, there are two grooves, and the air supply port 201 and the exhaust port 202 are respectively located on the bottom surfaces of the two grooves. Fig.10 As shown, when the film box 200 is placed on the bearing surface (such as the bearing surface A of the bottom plate 101a) of the film box bearing component 100, the flexible connector 2 is in contact with the bottom surface C of the corresponding groove and is in a compressed state. Further optionally, the depth H2 of the above-mentioned groove is, for example, 1.5 mm, so that the height of the flexible connector 2 protruding from the bearing surface A when in a compressed state is 1.5 mm. By arranging the groove on the bottom surface B of the film box 200, the flexible connector 2 is located in the corresponding groove, which can not only play a positioning role for the flexible connector 2, but also reserve a certain space (that is, the depth H2 of the groove) for the flexible connector 2 in the vertical direction, increasing the installation space of the flexible bellows 21 and the connecting portion 22 in the vertical direction, thereby reducing the dimensional tolerance of the flexible bellows 21 and the connecting portion 22 and the installation tolerance requirements with the fixing seat 1 to a certain extent.

[0052] In some embodiments, Figure 6As shown, a second threaded hole is provided on the bottom surface of the film box bearing component 100 (for example, the bottom surface of the bottom plate 101a away from the bearing surface A); and the air supply component 300a and the exhaust component 300b both include a fastening screw 3 and at least one adjusting washer 5, wherein the bottom surface of the fixing seat 1 is provided with a mounting groove 13, and a through hole vertically penetrating the fixing seat 1 is provided on the bottom surface of the mounting groove 13, and the fastening screw 3 passes through the through hole from bottom to top and is threadedly connected with the second threaded hole, thereby realizing the fixed connection between the fixing seat 1 and the film box bearing component 100 (for example, the bottom plate 101a). At least one adjusting washer 5 is sleeved on the fastening screw 3 and is located between the bottom surface of the mounting groove 13 and the screw head of the fastening screw 3, and is used to adjust the length of the fastening screw 3 extending into the second threaded hole to prevent it from being screwed in too deep, or even penetrating and protruding from the film box bearing component 100.

[0053] In some embodiments, the fixing seat 1 is further provided with a plurality of third threaded holes vertically passing through the fixing seat 1; the air supply component 300a and the exhaust component 300b also include a plurality of adjusting screws 4, and the plurality of adjusting screws 4 are arranged one by one in the plurality of third threaded holes; and the top end of the adjusting screw 4 is abutted against the bottom surface of the film box bearing component 100 (for example, the bottom surface of the groove 101a1 formed on the bottom surface of the bottom plate 101a facing away from the bearing surface A), so as to adjust the horizontality of the fixing seat 1 by rotation, thereby avoiding the flexible connection 2 from tilting relative to the vertical direction, resulting in sealing failure.

[0054] In some embodiments, Fig.11As shown, the film box gas delivery device 300 also includes a gas supply gas path mechanism, which includes a gas supply pipeline 61 and a pressure reducing valve 62, a flow controller 63, a first on-off valve 64 and a filter 65 which are sequentially arranged on the gas supply pipeline 61 along the gas supply direction of the gas supply pipeline 61. The two ends of the gas supply pipeline 61 are respectively connected to the first connecting channel 11 and the gas source (for example, the gas source N2 for providing nitrogen) in the gas supply component 300a, and the gas provided by the gas source is sequentially delivered to the film box 200 via the gas supply pipeline 61 and the gas supply component 300a. The pressure reducing valve 62 is used to reduce the pressure of the gas flowing through, so as to reduce the pressure of the gas output from the pressure reducing valve 62 to a certain required pressure value (for example, 0.4Mpa), while ensuring the pressure stability; the flow controller 63 is used to adjust the gas flow of the gas supply pipeline 61; the first on-off valve 64 is used to connect or disconnect the gas supply pipeline 61; and the filter 65 is used to filter impurities in the gas flowing through. The pressure reducing valve 62, the flow controller 63 and the first on-off valve 64 can be, for example, manual valves or automatic control valves that can be controlled by a controller such as a host computer. Specifically, the first on-off valve 64 is, for example, a diaphragm valve, which is connected or disconnected under the control of the control gas circuit 66. Specifically, the two ends of the control gas circuit 66 are respectively connected to the diaphragm valve and the compressed air source (i.e., the air source CDA), and a three-way valve 67 and a pressure reducing valve 68 are arranged on the control gas circuit 66. When the three-way valve 67 is opened, the compressed air provided by the compressed air source is passed into the diaphragm valve via the control gas circuit 66 to connect the diaphragm valve. At this time, the gas provided by the air source is delivered to the chip box 200 via the air supply pipeline 61 and the air supply component 300a. The pressure reducing valve 68 is used to reduce the gas pressure output from the pressure reducing valve 68 to a certain required pressure value (e.g., 0.3Mpa to 0.4Mpa), while ensuring pressure stability.

[0055] In some embodiments, the cassette gas delivery device 300 further includes an exhaust gas circuit mechanism, which includes an exhaust pipeline 71 and a second on-off valve 72 and a flow control valve 73 disposed on the exhaust pipeline 71. The second on-off valve 72 is used to connect or disconnect the exhaust pipeline, and the second on-off valve 72 is controlled to connect or disconnect by, for example, a pilot two-way solenoid valve. The flow control valve 73 is, for example, a ball valve.

[0056] In some embodiments, when the film box 200 is placed on the bearing surface of the film box bearing component 100, or the in-position sensor 101c for detecting whether there is a film box 200 on the support plate 101a is triggered, and a trigger signal indicating that there is a film box 200 is fed back to the upper computer, at this time, the upper computer controls the above-mentioned gas supply gas path mechanism to start delivering the gas provided by the gas source to the first connecting channel 11, and finally passes into the inside of the film box 200, and controls the above-mentioned exhaust gas path mechanism to discharge the gas in the film box 200 into the factory exhaust end. When the film box 200 placed on the bearing surface of the film box bearing component 100 is taken out by the robot, the above-mentioned in-position sensor 101c is triggered, and a trigger signal indicating that there is no film box 200 is fed back to the upper computer, at this time, the upper computer controls the above-mentioned gas supply gas path mechanism to stop delivering the gas provided by the gas source to the first connecting channel 11. Of course, the embodiment of the utility model is not limited to this. In actual applications, the opening, stopping, gas supply duration and flow rate of gas supply can be controlled according to different process requirements.

[0057] Table 1 shows the oxygen content at different intake flow rates at the connection points between the air supply port 201 and the exhaust port 202 and the air supply component 300a and the exhaust component 300b respectively when four chip boxes (chip box 1 to chip box 4) are placed on the carrying surface of the chip box carrying component 100.

[0058] Table 1

[0059]

[0060] As can be seen from Table 1, the oxygen content at the connection of the four cassettes at different air inlet flow rates is 21% or a value greater than 20% and less than 21%. Among them, the oxygen content of 21% means that the oxygen content at the connection is consistent with the oxygen content of the external environment, and there is no gas leakage at this time. The oxygen content is greater than 20% and less than 21% indicates that the gas in the cassette has a slight leakage at the connection, but according to the process requirements, the leakage degree does not affect the function of the cassette gas delivery device.

[0061] By introducing an inert gas such as clean nitrogen into the film box 200 and controlling the air intake flow rate, the pressure in the film box 200 can be controlled to maintain a positive pressure, thereby preventing external particles from entering the film box. Specifically, Table 2 shows the pressure values ​​of the film box at different air intake flow rates.

[0062] Table 2

[0063]

[0064] It can be seen from Table 2 that when the air intake flow rate is greater than or equal to 4 L / min, the pressure in the chip box can be maintained in a range greater than or equal to 300 Pa, thereby preventing external particles from entering the chip box 200 while allowing gas (such as clean nitrogen) to enter the chip box 200.

[0065] The oxygen content of the chip box can be controlled by introducing an inert gas such as clean nitrogen into the chip box 200 and controlling the gas flow rate and / or gas supply time. Specifically, Table 3 shows the change in oxygen content of the chip box during the gas supply process.

[0066] Table 3

[0067]

[0068] It can be seen from Table 3 that when the air intake flow rate is 10L / min, during the process of the air delivery time from 0s to 460s, the oxygen content in the tablet box gradually decreases from 20.60% to 0.75%, so that the tablet box gas delivery device 300 provided by the embodiment of the utility model can effectively reduce the oxygen content in the tablet box.

[0069] The humidity of the film box can be controlled by introducing an inert gas such as clean nitrogen into the film box 200 and controlling the air flow rate, the film box pressure and / or the air supply time. Specifically, Table 4 shows the humidity change of the film box during the air supply process.

[0070] Table 4

[0071]

[0072]

[0073] It can be seen from Table 4 that when the air intake flow rate is 15L / min and the film box pressure is 680Pa, during the process of the air delivery time from 20s to 400s, the humidity in the film box gradually decreases from 58.9% to 3.98%, so that the film box gas delivery device 300 provided in the embodiment of the utility model can effectively reduce the humidity in the film box.

[0074] As another technical solution, an embodiment of the utility model further provides a semiconductor process equipment, including a temporary storage device for temporarily storing a wafer box 200, the temporary storage device including: a wafer box carrying component 100, for carrying at least one wafer box 200; and the above-mentioned wafer box gas delivery device 300 provided in an embodiment of the utility model. When the wafer box 200 is placed on the carrying surface of the wafer box carrying component 100, the wafer box gas delivery device 300 is used to supply gas to the wafer box 200 and discharge the gas in the wafer box 200.

[0075] The semiconductor process equipment provided by the present invention can reduce the oxygen content and humidity inside the wafer box 200 by adopting the above-mentioned wafer box gas delivery device 300 provided by the present invention, prevent external particles from entering the wafer box 200, thereby improving the microenvironment quality inside the wafer box 200 and protecting the wafers in the wafer box 200.

[0076] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer box gas delivery device, applied to semiconductor process equipment, characterized in that: It includes an air supply component for supplying air to the film box, and an exhaust component for exhausting the gas in the film box, and the air supply component and the exhaust component both include a fixing seat and a flexible connector, wherein: The fixing seat is used to be installed on the film box bearing component, the flexible connecting member is fixedly connected to the fixing seat, and a first connecting channel is provided in the fixing seat, and a second connecting channel is provided in the flexible connecting member, one end of the first connecting channel is used to be connected to an air source or a factory exhaust end, and the other end of the first connecting channel is connected to one end of the second connecting channel; When the film box is placed on the bearing surface of the film box bearing component, the other end of the second connecting channel is used to communicate with the air supply port or the exhaust port at the bottom of the film box, and the flexible connecting member is in contact with the bottom surface of the film box and is in a compressed state to seal the connection between the second connecting channel and the air supply port or the exhaust port.

2. The film box gas delivery device according to claim 1, characterized in that: The flexible connecting member includes a flexible bellows, one end of which is fixedly connected to the fixing seat, and when the film box is placed on the bearing surface of the film box bearing component, the other end of the flexible bellows is in contact with the bottom surface of the film box; the interior of the flexible bellows constitutes the second connecting channel.

3. The film box gas delivery device according to claim 2, characterized in that: The flexible bellows comprises a bellows body and a connecting portion arranged at one end of the bellows body, the end surface of the other end of the connecting portion away from the bellows body is in contact with the outer surface of the fixing seat and is provided with a threaded column; The outer surface of the fixing seat is provided with a first threaded hole, and the threaded column is arranged in the first threaded hole and matched with the first threaded hole; Sub-channels communicating with the interior of the bellows body and the first connecting channel are correspondingly provided in the connecting portion and the threaded column, and the sub-channels and the interior of the bellows body together constitute the second connecting channel.

4. The film box gas delivery device according to claim 1, characterized in that: The fixing seat is used to be installed on the bottom of the film box bearing component, and the flexible connecting member passes through the film box bearing component and protrudes relative to the bearing surface of the film box bearing component when it is in a non-compressed state.

5. The film box gas delivery device according to claim 4, characterized in that: A second threaded hole is provided on the bottom surface of the film box bearing component; The air supply assembly and the exhaust assembly each further include a fastening screw and at least one adjusting washer, wherein a mounting groove is provided on the bottom surface of the fixing seat, and a through hole vertically penetrating the fixing seat is provided on the bottom surface of the mounting groove, and the fastening screw passes through the through hole from bottom to top and is threadedly connected with the second threaded hole; At least one adjusting washer is sleeved on the fastening screw and is located between the bottom surface of the mounting groove and the screw head of the fastening screw.

6. The film box gas delivery device according to claim 1, characterized in that: The bottom surface of the film box is provided with a plurality of grooves, and the air supply port and the air exhaust port are respectively located on the bottom surfaces of the plurality of grooves; When the film box is placed on the bearing surface of the film box bearing component, the flexible connecting member is in contact with the bottom surface of the corresponding groove and is in a compressed state.

7. The film box gas delivery device according to claim 1, characterized in that: The fixing seat is also provided with a plurality of third threaded holes vertically penetrating the fixing seat; The air supply component and the exhaust component also include a plurality of adjustment screws, which are arranged in a one-to-one correspondence in the plurality of third threaded holes; and the top ends of the adjustment screws abut against the bottom surface of the film box supporting component, so as to adjust the horizontality of the fixing seat by rotation.

8. The film box gas delivery device according to any one of claims 1 to 7, characterized in that: The film box gas delivery device also includes an air supply gas path mechanism, which includes an air supply pipeline and a pressure reducing valve, a flow controller, a first on-off valve and a filter arranged on the air supply pipeline in sequence along the air supply direction of the air supply pipeline; the two ends of the air supply pipeline are respectively connected to the first connecting channel and the air source in the air supply component.

9. The film box gas delivery device according to any one of claims 1 to 7, characterized in that: The film box gas conveying device also includes an exhaust gas circuit mechanism, which includes an exhaust pipeline and a second on-off valve arranged on the exhaust pipeline; the two ends of the exhaust pipeline are respectively connected to the first connecting channel in the exhaust component and the factory exhaust end.

10. A semiconductor process equipment, comprising a temporary storage device for temporarily storing a film box, characterized in that: The temporary storage device comprises: A film box carrying component, used for carrying at least one film box; The tablet box gas delivery device as described in any one of claims 1 to 9 is used to deliver gas to the tablet box and exhaust gas in the tablet box when the tablet box is placed on the bearing surface of the tablet box bearing component.