Power module and motor control device
By directly welding and connecting the power tube and the thermally sensitive component to the carrier structure in the power module, the problem of low thermal conductivity caused by excessive medium between the power tube and the radiator in the prior art is solved, and effective cooling and stable support for the power tube are achieved.
Patent Information
- Application Number
- CN202421343497.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-06-12
AI Technical Summary
There is too much medium between the power tube and the radiator of the existing power module, resulting in low thermal conductivity and unable to effectively cool down the power tube.
A power module is designed, wherein a plurality of power tubes are arranged spaced in the first mounting area of the carrier structure and are welded and connected to the area; a thermally sensitive component is arranged in the second mounting area of the carrier structure and is welded and connected to the area to ensure the direct welding connection between the power tube and the thermally sensitive component and the carrier structure.
Through direct welding connection, the connection reliability between the power tube and the carrier structure and the connection reliability between the thermally sensitive components and the carrier structure are improved, ensuring effective cooling and stable support for the power tube.
Smart Images

Figure CN222838845U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of new energy, and in particular to a power module and a motor control device. Background Art
[0002] New energy vehicles do not burn gasoline or diesel to generate power, so they have many characteristics such as environmental protection and low pollution. With the vigorous promotion and application of new energy power generation such as hydropower, wind power, solar power and nuclear power, many new energy vehicles are gradually being promoted and applied, such as new energy electric cars, new energy electric buses, new energy electric trucks, new energy electric cleaning vehicles, new energy electric rail transportation vehicles, new energy electric flying transportation vehicles, new energy electric shipping transportation vehicles, etc.
[0003] New energy vehicles are generally equipped with batteries, motor control devices, motors and power generation devices. The power tube in the motor control device receives the DC power output by the battery, and converts the DC power into AC power for output to the motor. The motor then outputs a rotational driving force to drive the power generation devices such as wheels and paddles, which in turn drive the vehicle to move.
[0004] However, the mounting surface of each power tube of the existing power module needs to be processed separately, resulting in high processing costs for the power tube. In addition, the structural setting of the thermistor component of the power module is unreasonable, resulting in low thermal conductivity of the thermistor component. There is too much medium between the power tube and the heat sink of the existing power module, and the thermal conductivity is low, which makes it impossible to achieve the purpose of effectively cooling the power tube. Utility Model Content
[0005] The main purpose of the utility model is to provide a power module and a motor control device to solve the problem that there is too much medium between the power tube and the heat sink of the power module in the prior art, the heat conduction efficiency is low, and the purpose of effectively cooling the power tube cannot be achieved.
[0006] In order to achieve the above-mentioned purpose, the utility model provides a power module, including a carrier structure, a plurality of power tubes, and a thermistor component, wherein the carrier structure has a first mounting area and a second mounting area; the plurality of power tubes are arranged at intervals in the first mounting area, and each power tube is welded and connected to the first mounting area; the thermistor component is arranged in the second mounting area, and the thermistor component is welded and connected to the second mounting area.
[0007] Further, the first mounting area and the second mounting area are located on the same side of the carrier structure.
[0008] Furthermore, the first installation area is provided with a plurality of first support structures, the plurality of first support structures correspond one-to-one to the plurality of power tubes, and each power tube is arranged one-to-one on each first support structure, and a first weld bead structure is formed between the first support structure and the power tube.
[0009] Furthermore, the second installation area is provided with a second supporting structure, the thermosensitive component is arranged on the second supporting structure, and a second weld bead structure is formed between the thermosensitive component and the second supporting structure.
[0010] Further, the carrier structure includes a carrier body and an assembly lug, wherein a first side surface of the carrier body in the thickness direction has a first mounting area, a second side surface of the carrier body in the thickness direction has a plurality of heat dissipation pins, and each heat dissipation pin is protruding from the second side surface and extends in a direction away from the first side surface; the assembly lug is arranged on one side in the length direction of the carrier body, a third side surface of the assembly lug in the thickness direction has a second mounting area, and the third side surface is oriented in the same direction as the first side surface.
[0011] Furthermore, there are two assembly lugs, which are respectively arranged on both sides of the length direction of the carrier body, and the third side surfaces of the two assembly lugs have a second mounting area, and the thermal sensitive component is arranged on one of the two assembly lugs.
[0012] Further, the carrier body includes a first plate body structure and a second plate body structure, wherein the first side surface of the first plate body structure in the thickness direction has a first installation area, and the assembly lug is arranged on one side of the length direction of the first plate body structure; the first side surface of the second plate body structure in the thickness direction is connected to the second side surface of the first plate body structure in the thickness direction, and the second side surface of the second plate body structure in the thickness direction has a plurality of heat dissipation pins.
[0013] Furthermore, the cross-sectional area of the cross section of the first plate structure is greater than the cross-sectional area of the cross section of the second plate structure, so that a step structure is formed at the connection between the first plate structure and the second plate structure.
[0014] Furthermore, the thermistor component includes a ceramic plate, a thermistor, and a pin, wherein the surface of the ceramic plate away from the second mounting area has a third supporting structure; the thermistor is arranged on the third supporting structure, and a third weld bead structure is provided between the thermistor and the third supporting structure; the pin is arranged on the third supporting structure, and a fourth weld bead structure is provided between the pin and the third supporting structure.
[0015] According to another aspect of the present invention, a motor control device is provided, including a power module, and the power module is the above-mentioned power module.
[0016] By applying the technical solution of the utility model, multiple power tubes are arranged at intervals in the first installation area of the carrier structure, and each power tube is welded to the first installation area; in addition, the thermal component is arranged in the second installation area of the carrier structure, and the thermal component is welded to the second installation area. In this way, multiple power tubes and thermal components are directly connected to the carrier structure by welding, which ensures the connection reliability between the multiple power tubes and the carrier structure, and the connection reliability between the thermal component and the carrier structure, and can also ensure that the carrier structure can play a supporting role for the multiple power tubes, and ensure the supporting role of the carrier structure for the thermal component, and no additional tools are needed to fix the multiple power tubes and the carrier structure, and no additional tools are needed to fix the thermal component and the carrier structure.
[0017] Furthermore, the multiple power tubes in the present application are in direct contact with the carrier structure, and the thermistor components in the present application are in direct contact with the carrier structure, ensuring that the carrier structure can provide stable support for the multiple power tubes and thermistor components while also ensuring that the carrier structure can effectively cool the multiple power tubes and thermistor components. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:
[0019] Figure 1 A schematic structural diagram of a power module according to an optional embodiment of the utility model is shown;
[0020] Figure 2 Shows Figure 1 Schematic diagram of the exploded structure of the power module in FIG.
[0021] Figure 3 Shows Figure 2 A schematic structural diagram of a carrier structure of a power module in FIG.
[0022] Figure 4 Shows Figure 2 Schematic diagram of the structure of the thermal sensitive components of the power module.
[0023] The above drawings include the following reference numerals:
[0024] 10. Carrier structure; 11. First mounting area; 111. First supporting structure; 12. Second mounting area; 121. Second supporting structure; 13. Carrier body; 131. First plate structure; 132. Second plate structure; 14. Mounting lug;
[0025] 20. Power tube;
[0026] 30. Thermistor; 31. Ceramic plate; 311. Third support structure; 32. Thermistor; 33. Pin;
[0027] 40. Heat dissipation pin; 100. Step structure. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] In order to solve the problem in the prior art that there is too much medium between the power tube and the heat sink of the power module, the thermal conductivity is low, and the purpose of effectively cooling the power tube cannot be achieved, the utility model provides a power module and a motor control device, wherein the motor control device includes a power module, and the power module is the power module mentioned above and below.
[0030] like Figures 1 to 4 As shown, the power module includes a carrier structure 10, a plurality of power tubes 20 and a thermal component 30, wherein the carrier structure 10 has a first mounting area 11 and a second mounting area 12; the plurality of power tubes 20 are arranged at intervals in the first mounting area 11, and each power tube 20 is welded and connected to the first mounting area 11; the thermal component 30 is arranged in the second mounting area 12, and the thermal component 30 is welded and connected to the second mounting area 12.
[0031] By arranging a plurality of power tubes 20 at intervals in the first mounting area 11 of the carrier structure 10, and at the same time, each power tube 20 is welded and connected to the first mounting area 11; in addition, the thermal component 30 is arranged in the second mounting area 12 of the carrier structure 10, and at the same time, the thermal component 30 is welded and connected to the second mounting area 12. In this way, the plurality of power tubes 20 and the thermal component 30 are directly connected to the carrier structure 10 by welding, ensuring the connection reliability between the plurality of power tubes 20 and the carrier structure 10, and the connection reliability between the thermal component 30 and the carrier structure 10, while ensuring that the carrier structure 10 can play a supporting role for the plurality of power tubes 20, and ensuring that the carrier structure 10 supports the thermal component 30, no additional tools are needed to fix the plurality of power tubes 20 and the carrier structure 10, and no additional tools are needed to fix the thermal component 30 and the carrier structure 10.
[0032] Furthermore, the multiple power tubes 20 in the present application are in direct contact with the carrier structure 10, and the thermistor component 30 in the present application is in direct contact with the carrier structure 10, ensuring that the carrier structure 10 can provide stable support for the multiple power tubes 20 and thermistor component 30 while also ensuring that the carrier structure 10 can effectively cool the multiple power tubes 20 and thermistor component 30.
[0033] It should be noted that, in the present application, the first installation area 11 and the second installation area 12 are located on the same side of the carrier structure 10 .
[0034] like Figures 1 to 3 As shown, the first installation area 11 is provided with a plurality of first support structures 111, and the plurality of first support structures 111 correspond to the plurality of power tubes 20 one by one, and each power tube 20 is arranged on each first support structure 111 in a one-to-one correspondence, and a first weld bead structure is formed between the first support structure 111 and the power tube 20. In this way, while ensuring the support reliability of each first support structure 111 for each corresponding power tube 20 arranged thereon, the welding reliability of each power tube 20 and the first installation area 11 through each first support structure 111 can also be ensured.
[0035] It should be noted that, in the present application, the above-mentioned carrier structure 10 is a heat sink.
[0036] Preferably, the first support structure 111 is a metal structure to ensure the welding reliability between the first support structure 111 and the power tube 20. In addition, the first weld structure is solder, and each power tube 20 and the heat sink are connected by solder and the first support structure 111 made of metal to ensure that the thermal conductivity efficiency can be further improved.
[0037] like Figures 1 to 3 As shown, the second mounting area 12 is provided with a second supporting structure 121, the thermosensitive component 30 is provided on the second supporting structure 121, and a second weld bead structure is formed between the thermosensitive component 30 and the second supporting structure 121. In this way, while ensuring the support reliability of the thermosensitive component 30 provided thereon by the second supporting structure 121, the welding reliability of the thermosensitive component 30 and the second mounting area 12 through the second supporting structure 121 can also be ensured.
[0038] Preferably, the second support structure 121 is a metal structure to ensure the welding reliability between the second support structure 121 and the thermistor component 30. In addition, the second weld structure is solder, and the thermistor component 30 and the heat sink are connected by solder and the metal second support structure 121, ensuring that the thermal conductivity efficiency can be further improved.
[0039] like Figures 1 to 3As shown, the carrier structure 10 includes a carrier body 13 and an assembly lug 14, wherein the first side surface of the carrier body 13 in the thickness direction has a first mounting area 11, and the second side surface of the carrier body 13 in the thickness direction has a plurality of heat dissipation pins 40, and each heat dissipation pin 40 is protruding from the second side surface and extending in a direction away from the first side surface; the assembly lug 14 is arranged on one side of the length direction of the carrier body 13, and the third side surface of the assembly lug 14 in the thickness direction has a second mounting area 12, and the third side surface is in the same direction as the first side surface. In this way, by setting the carrier structure 10 to include the carrier body 13 and the assembly lug 14, the support function of the carrier body 13 for the plurality of power tubes 20 and the support function of the assembly lug 14 for the thermal component 30 are ensured. In addition, the arrangement of the plurality of heat dissipation pins 40 further increases the heat dissipation surface of the carrier structure 10, thereby facilitating the improvement of the heat dissipation reliability of the carrier structure 10 for the power tubes 20 and the thermal component 30.
[0040] like Figures 1 to 3 As shown, there are two assembly lugs 14, which are respectively arranged on both sides of the length direction of the carrier body 13, and the third side surfaces of the two assembly lugs 14 have a second mounting area 12, and the thermal component 30 is arranged on one of the two assembly lugs 14.
[0041] like Figure 1 and Figure 2 As shown, the carrier body 13 includes a first plate structure 131 and a second plate structure 132, wherein the first side surface in the thickness direction of the first plate structure 131 has a first mounting area 11, and the assembly lug 14 is arranged on one side in the length direction of the first plate structure 131; the first side surface in the thickness direction of the second plate structure 132 is connected to the second side surface in the thickness direction of the first plate structure 131, and the second side surface in the thickness direction of the second plate structure 132 has a plurality of heat dissipation pins 40. In this way, by setting the carrier body 13 to include the first plate structure 131 and the second plate structure 132, the support reliability of the first plate structure 131 for the plurality of power tubes 20 is ensured, and the installation reliability of the plurality of heat dissipation pins 40 on the second plate structure 132 is ensured.
[0042] like Figure 1 and Figure 2 As shown, the cross-sectional area of the first plate structure 131 is greater than the cross-sectional area of the second plate structure 132, so that a step structure 100 is formed at the connection between the first plate structure 131 and the second plate structure 132. In this way, the setting of the step structure 100 facilitates the installation of the sealing ring, which is sleeved on the outer peripheral side of the second plate structure 132 and abuts against the step surface of the step structure 100. When the power module is subsequently installed to the waiting position, the sealing ring can be fixed.
[0043] like Figure 4 As shown, the thermistor component 30 includes a ceramic plate 31, a thermistor 32, and a pin 33, wherein the surface of the ceramic plate 31 away from the second mounting area 12 has a third support structure 311; the thermistor 32 is arranged on the third support structure 311, and a third weld bead structure is provided between the thermistor 32 and the third support structure 311; the pin 33 is arranged on the third support structure 311, and a fourth weld bead structure is provided between the pin 33 and the third support structure 311.
[0044] Optionally, the third supporting structure 311 is a metal structure.
[0045] Preferably, the third supporting structure 311 is a copper structure, which effectively improves the thermal conductivity, thereby facilitating improving the detection efficiency of the thermistor 32 .
[0046] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0047] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0048] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.
[0049] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.
[0051] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A power module, characterized in that: include: A carrier structure (10), the carrier structure (10) having a first mounting area (11) and a second mounting area (12); a plurality of power tubes (20), wherein the plurality of power tubes (20) are arranged at intervals in the first installation area (11), and each of the power tubes (20) is welded to the first installation area (11); A thermally sensitive component (30), the thermally sensitive component (30) being arranged at the second installation area (12), and the thermally sensitive component (30) being connected to the second installation area (12) by welding.
2. The power module according to claim 1, characterized in that: The first mounting area (11) and the second mounting area (12) are located on the same side of the carrier structure (10).
3. The power module according to claim 1, characterized in that: The first installation area (11) is provided with a plurality of first support structures (111), the plurality of first support structures (111) correspond one-to-one to the plurality of power tubes (20), and each of the power tubes (20) is arranged one-to-one on each of the first support structures (111), and a first weld bead structure is formed between the first support structure (111) and the power tube (20).
4. The power module according to claim 1, characterized in that: The second installation area (12) is provided with a second supporting structure (121), the thermal component (30) is arranged on the second supporting structure (121), and a second weld bead structure is formed between the thermal component (30) and the second supporting structure (121).
5. The power module according to claim 1, characterized in that: The carrier structure (10) comprises: A carrier body (13), wherein a first side surface of the carrier body (13) in the thickness direction has the first mounting area (11), and a second side surface of the carrier body (13) in the thickness direction has a plurality of heat dissipation pins (40), and each of the heat dissipation pins (40) is arranged to protrude from the second side surface and extend in a direction away from the first side surface; An assembly lug (14), wherein the assembly lug (14) is arranged on one side of the length direction of the carrier body (13), a third side surface of the assembly lug (14) in the thickness direction has the second mounting area (12), and the third side surface is oriented in the same direction as the first side surface.
6. The power module according to claim 5, characterized in that: There are two assembly lugs (14), and the two assembly lugs (14) are respectively arranged on both sides of the length direction of the carrier body (13), and the third side surfaces of the two assembly lugs (14) have the second installation area (12), and the thermal sensitive component (30) is arranged on one of the two assembly lugs (14).
7. The power module according to claim 5, characterized in that: The carrier body (13) comprises: A first plate structure (131), wherein a first side surface in a thickness direction of the first plate structure (131) has the first mounting area (11), and the assembly lug (14) is arranged on one side in a length direction of the first plate structure (131); A second plate structure (132), wherein a first side surface of the second plate structure (132) in the thickness direction is connected to a second side surface of the first plate structure (131) in the thickness direction, and the second side surface of the second plate structure (132) in the thickness direction has a plurality of the heat dissipation needles (40).
8. The power module according to claim 7, characterized in that: The cross-sectional area of the first plate structure (131) is greater than the cross-sectional area of the second plate structure (132), so that a step structure (100) is formed at the connection between the first plate structure (131) and the second plate structure (132).
9. The power module according to any one of claims 1 to 8, characterized in that: The thermal sensitive component (30) comprises: A ceramic plate (31), wherein a surface of the ceramic plate (31) on a side away from the second mounting area (12) has a third supporting structure (311); a thermistor (32), wherein the thermistor (32) is arranged on the third supporting structure (311), and a third weld bead structure is provided between the thermistor (32) and the third supporting structure (311); An insertion pin (33), wherein the insertion pin (33) is arranged on the third supporting structure (311), and a fourth weld bead structure is provided between the insertion pin (33) and the third supporting structure (311).
10. A motor control device, characterized in that: It comprises a power module, and the power module is the power module according to any one of claims 1 to 9.