High-surface-area flow guide heat dissipation substrate

Abstract

The utility model provides a high surface area diversion heat dissipation substrate, which comprises a diversion heat dissipation cavity and a plurality of diversion columns arranged in the diversion heat dissipation cavity at intervals, each diversion column is provided with a flow breaking end, a diversion end and two curved surface diversion walls, the flow breaking end and the diversion end are opposite to each other, and the two curved surface diversion walls are connected with the flow breaking end and the diversion end. The distance between the curved flow guide wall and a connecting line between the wave flow end and the flow guide end is increased firstly and then decreased in the direction from the flow breaking end to the flow guide end; the maximum distance between the two curved flow guide walls in the direction perpendicular to the connecting line of the flow breaking end and the flow guide end is smaller than the distance between the flow breaking end and the flow guide end, and the flow guide heat dissipation cavity is communicated with an injection port and an output port. The flow guide columns are arranged in the state that the direction from the flow breaking end to the flow guide end is the same as the direction from the injection port to the output port, so that the phase change media are guided in the direction from the injection port to the output port.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging heat dissipation, in particular to a high-surface-area flow-conducting heat dissipation substrate. Background Art

[0002] With the development of artificial intelligence, big data and other fields, there is a strong demand for computing power, which puts forward higher requirements on the power and density of various integrated circuits such as CPU, GPU, TPU, etc. In power semiconductors, as the size of a single chip decreases and the power increases, the unit heat flux generated increases rapidly, so the requirements for heat dissipation performance are also getting higher and higher. At present, chip thermal management methods are divided into active heat dissipation and passive heat dissipation. Passive heat dissipation uses heat conduction to perform passive heat dissipation. Active heat dissipation includes phase change heat dissipation, liquid metal heat dissipation, microchannel heat dissipation, thermoelectric heat dissipation, and forced air cooling. At present, the use of phase change fluid for heat conduction is one of the most effective means.

[0003] Among them, the improvement of the thermal conductivity and heat dissipation effect of the fluid is mainly optimized through two aspects, one is to increase the surface area in the cavity, and the other is to optimize the design of the flow channel of the fluid. In the prior art, upright heat dissipation fins are formed in the cavity through the shovel tooth technology, which can effectively increase the internal surface area of ​​the cavity. However, when the thickness of the fins is thicker, the spacing between the fins will increase accordingly, and the surface area will decrease. When the thickness of the fins is reduced, the spacing between the fins can be reduced, but in any case, the resistance to the fluid is large, which affects the flow rate of the fluid and causes the heat dissipation effect to be unclear. When the thickness of the fins is reduced, the contact area with the fluid will be reduced. Another technology to increase the surface area in the cavity is to use a method of welding copper pillars, such as Figure 1 As shown, an existing substrate structure using copper pillars to increase the surface area of ​​the cavity is schematically illustrated. It utilizes the structural characteristics of the curved surface of the copper pillar to effectively increase the surface area of ​​the cavity under equal volume, and can also have a certain disturbing effect on the fluid. However, in terms of process implementation, only when the diameter of the copper pillar is greater than a certain size can the quality and efficiency of production be guaranteed to meet the requirements of batch production consistency. Moreover, when the phase change fluid is injected into the cavity, although the copper pillar can form a diversion effect based on the curved surface structure on the frontal surface, that is, the fluid is broken to the two sides of the copper pillar, a fluid vortex will be formed on the back of the copper pillar. Therefore, the copper pillar disturbs the normal flow of the fluid as a whole, and the thermal conductivity in the heat conduction direction is low, resulting in a large thermal resistance between the heat source and the heat dissipation device. In general, the heat dissipation efficiency of the existing heat dissipation system is low, and it is difficult to meet the heat dissipation needs of the increasingly high-performance power devices at this stage. Utility Model Content

[0004] One object of the present invention is to provide a high surface area flow-conducting heat dissipation substrate, wherein the high surface area flow-conducting heat dissipation substrate can form a smaller flow resistance in the desired flow direction of the corresponding phase change medium, and can form a larger flow resistance perpendicular to the flow direction, so as to increase the flow velocity of the phase change medium in the desired direction, thereby improving the heat dissipation effect.

[0005] Another object of the present invention is to provide a high surface area flow-conducting heat dissipation substrate, wherein the high surface area flow-conducting heat dissipation substrate can increase the flow rate of the corresponding phase change medium in its central area, avoid the phase change medium from gathering in the central area of ​​the substrate, and thus improve the heat dissipation effect on the corresponding device.

[0006] Another object of the present utility model is to provide a high surface area flow-conducting heat dissipation substrate, wherein the high surface area flow-conducting heat dissipation substrate comprises a base plate, a metal layer, a plurality of flow-conducting columns, a frame and a metal cover plate, wherein the metal layer is carried on the base plate, wherein the flow-conducting columns are arranged at intervals above the metal layer, wherein the frame is arranged above the metal layer and is arranged around the periphery of the plurality of flow-conducting columns, wherein the metal cover plate is arranged above the frame and together with the frame and the metal layer constitutes a flow-conducting heat dissipation cavity, wherein the high surface area flow-conducting heat dissipation substrate has an injection port and an output port connected to the flow-conducting heat dissipation cavity, so that when the corresponding phase change medium is injected into the flow-conducting heat dissipation cavity, it can be guided along the injection port toward the output port.

[0007] Another object of the utility model is to provide a high surface area flow-guiding heat dissipation substrate, wherein the flow-guiding column is arranged at intervals above the metal layer, wherein the flow-guiding column has a flow-breaking end and a flow-guiding end opposite to each other, and two curved flow-guiding walls connecting the flow-breaking end and the flow-guiding end, wherein the distance between the curved flow-guiding wall and the line connecting the flow-breaking end and the flow-guiding end from the flow-breaking end to the flow-guiding end first increases and then decreases, and the maximum distance between the two curved flow-guiding walls in a direction perpendicular to the line connecting the flow-breaking end and the flow-guiding end is less than the distance between the flow-breaking end and the flow-guiding end, wherein the flow-guiding column is arranged in a state where the direction from the flow-breaking end to the flow-guiding end is in the same direction as the direction from the injection port to the output port, so that when the corresponding phase change medium is injected into the flow-guiding heat dissipation cavity from the injection port, it can be guided to flow in the direction of the output port, and blocked in the direction perpendicular to the injection port to the output port to avoid flow concentration, thereby improving the corresponding heat dissipation effect.

[0008] Another object of the utility model is to provide a high surface area flow-conducting heat dissipation substrate, wherein the substrate plate has two long sides and two wide sides connecting the two long sides, wherein the injection port approaches the angle between one of the long sides and one of the wide sides, and the output port approaches the angle between the other long side and the other wide side, and the line connecting the injection port and the output port approaches the diagonal line of the substrate plate, so that the direction of the line connecting the injection port and the output port passes through the central area of ​​the high surface area flow-conducting heat dissipation substrate, and based on the structural position relationship in which the flow-conducting column is arranged in a state in which the direction of the flow-breaking end toward the flow-conducting end is in the same direction as the direction of the injection port toward the output port, when the corresponding phase change medium is injected into the flow-conducting heat dissipation cavity from the injection port, it can be guided to flow quickly through the central area of ​​the high surface area flow-conducting heat dissipation substrate, and avoid gathering in the central area of ​​the high surface area flow-conducting heat dissipation substrate, thereby improving the heat dissipation capacity of the corresponding device.

[0009] Another object of the present utility model is to provide a high surface area flow-guiding heat dissipation substrate, wherein the two curved flow-guiding walls are symmetrical to each other with respect to the line connecting the flow-breaking end and the flow-guiding end, and have a morphological design in which the distance from one of the flow-guiding ends to the other flow-guiding end first gradually increases and then gradually decreases. When the corresponding phase change medium flows toward the flow-guiding end toward the flow-guiding column, it can be guided to flow along the curved flow-guiding wall and fully contact the curved flow-guiding wall, thereby increasing the heat dissipation surface area of ​​the high surface area flow-guiding heat dissipation substrate.

[0010] Another object of the utility model is to provide a high surface area flow-conducting heat dissipation substrate, wherein the two curved flow-conducting walls are symmetrical to each other with respect to the line connecting the two flow-conducting ends, and the distance between the curved flow-conducting wall and the line connecting the flow-breaking end and the flow-conducting end from the flow-breaking end to the flow-conducting end first increases and then decreases, and when the phase-change medium flows between the two flow-conducting columns, the flow velocity of the phase-change medium is increased, and the phase-change medium is in full contact with the curved flow-conducting wall, thereby improving the corresponding heat dissipation effect.

[0011] Another object of the utility model is to provide a high surface area flow-guiding heat dissipation substrate, wherein the distance between the two curved flow-guiding walls first increases and then decreases from the flow-breaking end to the flow-guiding end, so that a flow-guiding groove whose width first decreases and then increases is formed between any two adjacent flow-guiding columns along a direction perpendicular to the injection port to the output port. When the corresponding phase-change medium flows from the flow-guiding end to the flow-guiding column, it flows through the flow-guiding groove and is first pressurized and then released based on the width of the flow-guiding groove that first decreases and then increases. On the one hand, the flow rate of the phase-change medium is improved, and on the other hand, sufficient contact between the phase-change medium and the curved flow-guiding wall is ensured, thereby improving the corresponding heat dissipation effect.

[0012] Another object of the present utility model is to provide a high surface area flow-conducting and heat-dissipating substrate, wherein the flow-breaking end and the flow-conducting end have a distance of 0.7255 mm within an error range of 20%, thereby ensuring that the overall shape and size of the flow-conducting column can produce efficient flow conduction and contact with the corresponding phase change medium based on the reasonable distance setting of the two flow-conducting ends, thereby ensuring the corresponding heat dissipation effect.

[0013] Another object of the utility model is to provide a high surface area flow-guiding and heat-dissipating substrate, wherein the maximum distance between the two curved flow-guiding walls in a direction perpendicular to the line connecting the flow-breaking end and the flow-guiding end is equal to 0.3 mm within an error range of 20%, thereby ensuring that the overall shape and size of the flow-guiding column can produce efficient flow guidance and contact with the corresponding phase change medium based on a reasonable distance setting of the two flow-blocking ends, thereby ensuring the corresponding heat dissipation effect.

[0014] Another object of the present utility model is to provide a high surface area flow-conducting heat dissipation substrate, wherein any two adjacent flow-conducting columns arranged along the direction of the line connecting the flow-breaking end and the flow-conducting end have a minimum distance greater than or equal to 0.2745 mm within an error range of 20%, so as to ensure the overall flow-conducting effect of each flow-conducting column on the corresponding phase change medium based on the reasonable setting of the spacing between the flow-conducting columns in the direction from the injection port to the output port, and to help ensure the consistency of mass production of the high surface area flow-conducting heat dissipation substrate.

[0015] Another object of the present utility model is to provide a high surface area flow-conducting heat dissipation substrate, wherein any two adjacent flow-conducting columns arranged in a direction perpendicular to the line connecting the flow-breaking end and the flow-conducting end have a minimum distance greater than or equal to 0.9 mm within an error range of 20%, so as to form a reasonable size design for the flow-conducting groove based on a reasonable setting of the spacing between the flow-conducting columns, thereby ensuring the overall flow-conducting effect of each flow-conducting column on the corresponding phase change medium, and facilitating the batch production consistency of the high surface area flow-conducting heat dissipation substrate.

[0016] Another object of the present utility model is to provide a high surface area flow-conducting and heat-dissipating substrate, wherein any two adjacent flow-conducting columns arranged in a direction perpendicular to the line connecting the flow-breaking end and the flow-conducting end preferably have a minimum distance less than or equal to 1.5 mm within an error range of 20%, so as to form a reasonable size design for the flow-conducting groove based on a reasonable setting of the spacing between the flow-conducting columns, thereby ensuring the overall flow-conducting effect of each flow-conducting column on the corresponding phase change medium.

[0017] Another object of the present utility model is to provide a high surface area flow-conducting heat dissipation substrate, wherein when the flow rate of phase change medium is equal and the volume of the flow-conducting heat dissipation cavity is equal, the high surface area flow-conducting heat dissipation substrate has obvious flow-conducting effect in the direction from the injection port to the output port compared with the existing solution of using copper pillars for flow-conducting heat dissipation, and the phase change medium can flow along the flow-conducting pillar without being disturbed or forming vortices at the flow-conducting end, so that the flow velocity of the phase change medium in the central area of ​​the high surface area flow-conducting heat dissipation substrate is faster, and the area with slow flow velocity is biased towards the side area, thereby achieving better heat dissipation effect on the corresponding device.

[0018] Another object of the present invention is to provide a high surface area flow-conducting heat dissipation substrate, wherein the intervals between the flow-conducting columns located in the central region of the high surface area flow-conducting heat dissipation substrate are greater than the intervals between the flow-conducting columns located in the edge region of the high surface area flow-conducting heat dissipation substrate, so that the phase change medium can flow through the central region at a high speed under the condition of a large flow rate of the phase change medium, thereby improving the heat dissipation effect.

[0019] According to one aspect of the present invention, the present invention provides a high surface area heat dissipation substrate, wherein the high surface area heat dissipation substrate comprises:

[0020] a base plate;

[0021] a metal layer, wherein the metal layer is carried on the base plate;

[0022] A plurality of guide posts, wherein the guide posts are spaced apart and arranged above the metal layer, wherein the guide posts have a flow-breaking end and a flow-guiding end opposite to each other, and two curved guide walls connecting the flow-breaking end and the flow-guiding end, wherein the distance between the curved guide walls and the line connecting the flow-breaking end and the flow-guiding end increases first and then decreases from the flow-breaking end to the flow-guiding end, and the maximum distance between the two curved guide walls in the direction perpendicular to the line connecting the flow-breaking end and the flow-guiding end is less than the distance between the flow-breaking end and the flow-guiding end;

[0023] a frame, wherein the frame is disposed above the metal layer and around the periphery of the plurality of guide posts; and

[0024] A metal cover plate, wherein the metal cover plate is arranged above the frame and together with the frame and the metal layer forms a diversion heat dissipation cavity, wherein the high surface area diversion heat dissipation substrate has an injection port and an output port connected to the diversion heat dissipation cavity, wherein the diversion column is arranged in a state where the direction from the flow-breaking end to the diversion end is in the same direction as the direction from the injection port to the output port, so that when the corresponding phase change medium is injected into the diversion heat dissipation cavity through the injection port, it can be diverted along the direction from the injection port to the output port.

[0025] In one embodiment, the base plate has two long sides and two wide sides connecting the two long sides, wherein the injection port is close to the angle between one of the long sides and one of the wide sides, and the output port is close to the angle between the other long side and the other wide side.

[0026] In one embodiment, the distance between the two curved guide walls first increases and then decreases from the flow-breaking end toward the guide end.

[0027] In one embodiment, the two curved guide walls are symmetrical with respect to a line connecting the flow-breaking end and the flow-guiding end.

[0028] In one embodiment, the distance between the flow-breaking end and the flow-guiding end is 0.7255 mm within a 20% error range.

[0029] In one embodiment, the maximum distance between the two curved guide walls in a direction perpendicular to a line connecting the flow-breaking end and the guide end is equal to 0.3 mm within a 20% error range.

[0030] In one embodiment, any two adjacent flow-guiding columns arranged along the line connecting the flow-breaking end and the flow-guiding end have a minimum distance greater than or equal to 0.2745 mm within a 20% error range.

[0031] In one embodiment, any two adjacent flow-guiding columns arranged in a direction perpendicular to a line connecting the flow-breaking end and the flow-guiding end have a minimum distance greater than or equal to 0.9 mm within a 20% error range.

[0032] In one embodiment, any two adjacent flow-guiding columns arranged in a direction perpendicular to a line connecting the flow-breaking end and the flow-guiding end preferably have a minimum distance less than or equal to 1.5 mm within a 20% error range.

[0033] In one embodiment, the flow-breaking end of any one of the guide columns is used as a base point to connect the flow-breaking ends of other guide columns, and the connection direction of the two flow-breaking ends with the shortest connection length is used as the arrangement direction of each of the guide columns, wherein the arrangement direction is perpendicular to the connection direction of the flow-breaking end and the guide end.

[0034] In one embodiment, the flow-breaking end of any one of the guide columns is used as a base point to connect the flow-breaking ends of other guide columns, and the connection direction of the two flow-breaking ends with the shortest connection length is used as the arrangement direction of each of the guide columns, wherein the arrangement direction is parallel to the long side or the wide side.

[0035] In one embodiment, the interval between the guide columns located in the central region of the high surface area guide heat dissipation substrate is greater than the interval between the guide columns located in the edge region of the high surface area guide heat dissipation substrate.

[0036] Through understanding of the following description and drawings, further objects and advantages of the present utility model will be fully reflected. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of the structure of an existing substrate using copper pillars to increase the surface area of ​​the cavity.

[0038] Figure 2 The figure is a schematic structural diagram of a high surface area heat dissipation substrate according to an embodiment of the present invention.

[0039] Figure 3 Schematic diagram of the flow-conducting structure of the high-surface-area flow-conducting heat-dissipating substrate according to the above embodiment of the utility model.

[0040] Figure 4 for Figure 3 A partial enlarged view of .

[0041] Figure 5 1 is a schematic structural diagram of the high surface area flow-conducting and heat-dissipating substrate according to the above embodiment of the utility model, which mainly illustrates another arrangement method of the flow-conducting columns.

[0042] Figure 6 for Figure 5 A partial enlarged view of .

[0043] FIG. 7A to FIG. 7C It is a schematic diagram of the dimensions of the high surface area heat dissipation substrate according to the above embodiment of the present utility model.

[0044] Figure 8 It is a schematic diagram of the simulation structure of the high surface area heat dissipation substrate according to the above embodiment of the present utility model.

[0045] Fig.9A It is a simulation velocity cloud diagram of the high surface area heat dissipation substrate according to the above embodiment of the present utility model.

[0046] Fig. 9B This is a simulation speed cloud diagram of an existing substrate that uses copper pillars to increase the surface area of ​​the cavity.

[0047] Fig. 10A It is a simulated temperature cloud diagram of the high surface area heat dissipation substrate according to the above embodiment of the present utility model.

[0048] Fig. 10B This is a simulated temperature cloud diagram of an existing substrate that uses copper pillars to increase the surface area of ​​the cavity.

[0049] Fig.11A It is a simulated surface temperature cloud diagram of the high surface area heat dissipation substrate at an ambient temperature of 85° C. according to the above embodiment of the utility model.

[0050] Fig. 11B It is a simulated surface temperature cloud diagram of the high surface area heat dissipation substrate at an ambient temperature of 25° C. according to the above embodiment of the utility model.

[0051] Fig.12 The schematic structural diagram of the high surface area heat dissipation substrate according to the above embodiment of the present invention mainly illustrates another arrangement of the guide columns. DETAILED DESCRIPTION

[0052] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0053] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0054] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0055] Referring to the drawings of the specification of the utility model Figures 2 to 7CA high surface area flow-conducting heat dissipation substrate 100 of an embodiment of the utility model is schematically shown, wherein the high surface area flow-conducting heat dissipation substrate 100 comprises a base plate 10, a metal layer 20, a plurality of flow-conducting pillars 31, a frame 32 and a metal cover plate 40, wherein the metal layer 20 is carried on the base plate 10, wherein the flow-conducting pillars 31 are arranged above the metal layer 20 at intervals, wherein the frame 32 is arranged above the metal layer 20 and around the periphery of the plurality of flow-conducting pillars 31, wherein the metal cover plate 40 is arranged above the frame 32 and together with the frame 32 and the metal layer 20, forms a flow-conducting heat dissipation cavity, wherein the high surface area flow-conducting heat dissipation substrate 100 has an injection port 101 and an output port 102 connected to the flow-conducting heat dissipation cavity, and when the corresponding phase change medium is injected into the flow-conducting heat dissipation cavity, it can be guided along the injection port 101 toward the output port 102.

[0056] Specifically, the guide column 31 has a flow-breaking end 311 and a flow-guiding end 313 opposite to each other, and two curved guide walls 312 connecting the flow-breaking end 311 and the flow-guiding end 313, wherein the distance between the curved guide wall 312 and the line connecting the flow-breaking end 311 and the flow-guiding end 313 from the flow-breaking end 311 to the flow-guiding end 313 first increases and then decreases, and the maximum distance between the two curved guide walls 312 in a direction perpendicular to the line connecting the flow-breaking end 311 and the flow-guiding end 313 is less than the distance between the flow-breaking end 311 and the flow-guiding end 313, so that when the fluid flows toward the flow-breaking end 311 toward the guide column 31, the flow resistance of the guide column 31 is small, and when the fluid is perpendicular to the flow-breaking end 311 When the liquid flows in the direction of the line connecting the flow-breaking end 311 and the flow-guiding end 313 toward the flow-guiding column 31, the flow resistance of the flow-guiding column 31 is relatively large, wherein the flow-guiding column 31 is arranged in a state in which the direction of the flow-breaking end 311 toward the flow-guiding end 313 is in the same direction as the direction of the injection port 101 toward the output port 102, so that when the corresponding phase-change medium is injected into the flow-guiding heat-dissipating cavity from the injection port 101, it can be guided to flow in the direction of the output port 102, and blocked in the direction perpendicular to the injection port 101 toward the output port 102 to avoid flow convergence, so as to form a smaller flow resistance in the desired flow direction of the phase-change medium, and to form a larger flow resistance perpendicular to the flow direction, so as to increase the flow velocity of the phase-change medium in the desired direction, thereby improving the heat dissipation effect.

[0057] It can be understood that the phase change medium can be water or oil, and the present invention does not limit this.

[0058] In particular, the base plate 10 has two long sides and two wide sides connecting the two long sides, wherein the injection port 101 approaches the angle between one of the long sides and one of the wide sides, and the output port 102 approaches the angle between the other long side and the other wide side, and the line connecting the injection port 101 and the output port 102 approaches the diagonal line of the base plate 10, so that the direction of the line connecting the injection port 101 and the output port 102 passes through the central area of ​​the high surface area conductive heat dissipation substrate , and based on the structural position relationship that the guide column 31 is arranged in the same direction from the flow-breaking end 311 to the guide end 313 and from the injection port 101 to the output port 102, when the corresponding phase change medium is injected into the guide heat dissipation cavity from the injection port 101, it can be guided to flow quickly through the central area of ​​the high surface area guide heat dissipation substrate 100, and avoid gathering in the central area of ​​the high surface area guide heat dissipation substrate 100, thereby improving the heat dissipation capacity of the corresponding device.

[0059] It is worth mentioning that the two curved guide walls 312 are symmetrical to each other with respect to the line connecting the flow-breaking end 311 and the guide end 313, and have a morphological design in which the distance from the flow-breaking end 311 to the guide end 313 first gradually increases and then gradually decreases. When the corresponding phase change medium flows toward the flow-breaking end 311 toward the guide column 31, it can be guided to flow along the curved guide wall 312 and fully contact the curved guide wall 312, thereby increasing the heat dissipation surface area of ​​the high surface area guide heat dissipation substrate 100.

[0060] In particular, the two curved guide walls 312 are symmetrical with each other about the line connecting the flow-breaking end 311 and the guide end 313, and have a morphological design in which the distance from the flow-breaking end 311 to the guide end 313 first gradually increases and then gradually decreases, so that a guide groove whose width first decreases and then increases is formed between any two adjacent guide columns 31 along the direction perpendicular to the injection port 101 to the output port 102. When the corresponding phase change medium flows from the guide end 311 to the guide column 31, it flows through the guide groove and is pressurized and then released based on the width of the guide groove that first decreases and then increases. On the one hand, the flow rate of the phase change medium is improved, and on the other hand, sufficient contact between the phase change medium and the curved guide wall 312 is ensured, thereby improving the corresponding heat dissipation effect.

[0061] For details, refer to the accompanying drawings of the specification. Fig. 7A, wherein the distance between the flow-breaking end 311 and the flow-guiding end 313 of the guide column 31 is 0.7255 mm within an error range of 20%. Therefore, based on the reasonable distance setting between the flow-breaking end 311 and the flow-guiding end 313, it is ensured that the overall shape and size of the guide column 31 can produce efficient flow guidance and contact with the corresponding phase change medium, thereby ensuring the corresponding heat dissipation effect.

[0062] Furthermore, the maximum distance between the two curved guide walls 312 in a direction perpendicular to the line connecting the flow-breaking end 311 and the guide end 313 is equal to 0.3 mm within an error range of 20%. Therefore, based on the reasonable distance setting of the two curved guide walls 312, it is ensured that the overall shape and size of the guide column 31 can produce efficient guidance and contact with the corresponding phase change medium. In this way, based on the size design of the guide column 31, the guidance and high contact area with the corresponding phase change medium are guaranteed, while ensuring the realization of the process.

[0063] Furthermore, the utility model is also based on the reasonable setting of the spacing between the guide columns 31 to ensure the density of the guide columns 31 and the overall guiding effect on the phase change medium. For details, refer to the accompanying drawings of the specification. Figure 7B , wherein any two adjacent guide posts 31 arranged along the connecting direction of the flow-breaking end 311 and the guide end 313 have a minimum distance greater than or equal to 0.2745 mm within an error range of 20%, so as to ensure the guiding effect of each guide post 31 on the corresponding phase change medium as a whole based on the reasonable setting of the spacing between the guide posts 31 in the direction from the injection port 101 to the output port 102, and to help ensure the batch production consistency of the high surface area guide heat dissipation substrate 100.

[0064] Further, referring to the drawings of the specification Figure 7C , wherein any two adjacent guide posts 31 arranged in a direction perpendicular to the line connecting the flow-breaking end 311 and the guide end 313 have a minimum distance greater than or equal to 0.9 mm within a 20% error range, so as to form a reasonable size design for the guide groove based on a reasonable setting of the spacing between the guide posts 31, thereby ensuring the overall guiding effect of the guide posts 31 on the corresponding phase change medium, and facilitating the batch production consistency of the high surface area guide heat dissipation substrate 100.

[0065] Furthermore, any two adjacent guide columns 31 arranged in a direction perpendicular to the line connecting the flow-breaking end 311 and the guide end 313 preferably have a minimum distance less than or equal to 1.5 mm within an error range of 20%, so as to ensure the overall guiding effect of each guide column 31 on the corresponding phase change medium based on a reasonable setting of the spacing between the guide columns 31.

[0066] In particular, under the restriction that the direction of the flow-breaking end 311 toward the flow-guiding end 313 is in the same direction as the direction of the injection port 101 toward the output port 102, the arrangement of the flow-guiding columns 31 can be varied. Figure 3 and Figure 4 As shown, the flow-breaking end 311 of any guide column 31 is used as a base point to connect the flow-breaking ends 311 of other guide columns 31, and the direction of the connection between the two flow-breaking ends 311 with the shortest connection length is the arrangement direction of each guide column 31, wherein the arrangement direction is parallel to the wide side. Figure 3 In the arrangement shown, there are two mutually perpendicular arrangement directions, one of which is parallel to the wide side, and the other is parallel to the long side.

[0067] Further references Figure 5 and Figure 6 Similarly, the flow-breaking end 311 of any of the guide pillars 31 is used as a base point to connect the flow-breaking ends 311 of other guide pillars 31, and the direction of the connection between the two flow-breaking ends 311 with the shortest connection length is the arrangement direction of the guide pillars 31. Figure 5 and Figure 6 In the arrangement shown, the arrangement direction is perpendicular to the direction of the connection between the two guide ends 311 of the guide column 31 .

[0068] Further references Fig.12 As shown, the arrangement of the fluid channel is formed based on adjusting the density of the guide columns 31 in different areas of the high surface area guide heat dissipation substrate 100. Specifically, Fig.12 In the arrangement shown, the spacing between the guide columns 31 located in the central area of ​​the high surface area flow-conducting heat dissipation substrate 100 is greater than the spacing between the guide columns 31 located in the edge area of ​​the high surface area flow-conducting heat dissipation substrate 100, so that the phase change medium can flow through the central area at a high speed when the phase change medium has a large flow rate, thereby improving the heat dissipation effect.

[0069] Further, refer to Figure 8 , a simulation structure of the high surface area conductive heat dissipation substrate 100 is illustrated, wherein the high surface area conductive heat dissipation substrate 100 carries a simulated heat source 200, and the simulated heat source 200 simulates the heat generation of power devices such as chips in actual applications.

[0070] contrast Fig.9A and Fig. 9BUnder the same phase change medium flow rate, when the phase change medium is injected from the injection port 101, the high surface area flow-conducting heat dissipation substrate 100 has a more obvious flow-conducting effect in the direction from the injection port 101 to the output port 102 than the existing solution of using copper pillars for flow-conducting heat dissipation. The flow velocity of the phase change medium on the line connecting the injection port 101 and the output port 102 is faster, and the phase change medium can flow along the flow-conducting pillar 31 without being disturbed or forming a vortex at the flow-conducting end 313, so that the flow velocity of the phase change medium in the central area of ​​the high surface area flow-conducting heat dissipation substrate 100 is faster, and the area with slow flow velocity is biased towards the side area, so that the simulated heat source 200 carried in the central area of ​​the high surface area flow-conducting heat dissipation substrate 100 can have a better heat dissipation effect, and the simulated heat source 200 can be cooled more quickly, effectively reducing thermal resistance, so that power devices with higher power density can be packaged in a unit volume.

[0071] Specific comparison Fig. 10A and Fig. 10B The highest temperature of the simulated heat source 200 of the high surface area conductive heat dissipation substrate 100 is at the edge area of ​​the simulated heat source 200, while the highest temperature of the simulated heat source of the existing copper column conductive heat dissipation substrate appears in the area close to the center of the heat source. In other words, the high surface area conductive heat dissipation substrate 100 has an obvious heat dissipation effect on the heat source, which is beneficial to dissipate the heat at the center of the power device and reduce the maximum temperature, and can effectively avoid overheating of the center of the power device. At the same time, compared with the existing copper column conductive heat dissipation substrate, the average temperature of the simulated heat source 200 on the high surface area conductive heat dissipation substrate 100 is reduced by about 4°C, so the high surface area conductive heat dissipation substrate 100 can encapsulate power devices with higher power density.

[0072] Moreover, the maximum temperature difference of the simulated heat source 200 of the high surface area conductive heat dissipation substrate 100 is less than 3°C, while the maximum temperature difference of the simulated heat source of the existing copper column conductive heat dissipation substrate is greater than 3°C. That is to say, the high surface area conductive heat dissipation substrate 100 has a more uniform heat dissipation effect on the heat source.

[0073] Further references Fig.11A and Fig. 11B , a comparative diagram illustrates the heat dissipation effect of the high surface area conductive heat dissipation substrate 100 at different ambient temperatures, wherein at an ambient temperature of 25°C, the maximum temperature of the simulated heat source 200 is 36.41°C, and when the ambient temperature rises from 25°C to 75°C, the maximum temperature of the simulated heat source 200 is 36.43. In other words, based on the heat dissipation of the high surface area conductive heat dissipation substrate 100, when the ambient temperature rises, the temperature of the heat source does not change much and is less affected by the ambient temperature.

[0074] To further understand the present invention, the present invention also provides a method for manufacturing the high surface area conductive heat dissipation substrate 100, wherein the method for manufacturing the high surface area conductive heat dissipation substrate 100 comprises the following steps:

[0075] A. forming a metal layer 20 on a surface of a base plate 10;

[0076] B. forming a plurality of flow guide columns 31 spaced apart on the metal layer 20, wherein the flow guide columns 31 have a flow-breaking end 311 and a flow-guiding end 313 opposite to each other, and two curved flow guide walls 312 connecting the flow-breaking end 311 and the flow-guiding end 313, wherein the distance between the curved flow guide wall 312 and the line connecting the flow-breaking end 311 and the flow-guiding end 313 from the flow-breaking end 311 to the flow-guiding end 313 first increases and then decreases, and the maximum distance between the two curved flow guide walls 312 in a direction perpendicular to the line connecting the flow-breaking end 311 and the flow-guiding end 313 is less than the distance between the flow-breaking end 311 and the flow-guiding end 313;

[0077] C. forming a frame 32 on the outer periphery of the plurality of guide posts 31;

[0078] D. forming a metal cover plate 40 on the frame 32, so that the metal cover plate 40, the frame 32 and the metal layer 20 together form a heat dissipation cavity; and

[0079] E. An injection port 101 and an output port 102 are provided to connect the diversion and heat dissipation cavity, wherein the diversion column 31 is arranged in a state where the direction of the flow-breaking end 311 toward the diversion end 313 is in the same direction as the direction of the injection port 101 toward the output port 102, so that when the corresponding phase change medium is injected into the diversion and heat dissipation cavity through the injection port 101, it can be diverted along the direction of the injection port 101 toward the output port 102.

[0080] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0081] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A high surface area heat dissipation substrate, characterized in that: include: a base plate; a metal layer, wherein the metal layer is carried on the base plate; A plurality of guide posts, wherein the guide posts are spaced apart and arranged above the metal layer, wherein the guide posts have a flow-breaking end and a flow-guiding end opposite to each other, and two curved guide walls connecting the flow-breaking end and the flow-guiding end, wherein the distance between the curved guide walls and the line connecting the flow-breaking end and the flow-guiding end increases first and then decreases from the flow-breaking end to the flow-guiding end, and the maximum distance between the two curved guide walls in the direction perpendicular to the line connecting the flow-breaking end and the flow-guiding end is less than the distance between the flow-breaking end and the flow-guiding end; a frame, wherein the frame is disposed above the metal layer and around the periphery of the plurality of guide posts; and A metal cover plate, wherein the metal cover plate is arranged above the frame and together with the frame and the metal layer forms a diversion heat dissipation cavity, wherein the high surface area diversion heat dissipation substrate has an injection port and an output port connected to the diversion heat dissipation cavity, wherein the diversion column is arranged in a state where the direction from the flow-breaking end to the diversion end is in the same direction as the direction from the injection port to the output port, so that when the corresponding phase change medium is injected into the diversion heat dissipation cavity through the injection port, it can be diverted along the direction from the injection port to the output port.

2. The high surface area heat dissipation substrate according to claim 1, wherein the base plate has two long sides and two wide sides connecting the two long sides, wherein the injection port is close to the angle between one of the long sides and one of the wide sides, and the output port is close to the angle between the other long side and the other wide side. 3 . The high surface area flow-conducting heat dissipating substrate according to claim 2 , wherein the distance between the two curved flow-conducting walls first increases and then decreases from the flow-breaking end toward the flow-conducting end. 4 . The high surface area flow-conducting heat dissipating substrate according to claim 3 , wherein the two curved flow-conducting walls are symmetrical with respect to a line connecting the flow-breaking end and the flow-conducting end. 5 . The high surface area flow-conducting heat dissipating substrate according to claim 4 , wherein the flow-breaking end and the flow-conducting end have a distance of 0.7255 mm within a 20% error range.

6. The high surface area flow-conducting heat dissipating substrate according to claim 5, wherein the maximum distance between the two curved flow-conducting walls in a direction perpendicular to the line connecting the flow-breaking end and the flow-conducting end is equal to 0.3 mm within a 20% error range.

7. The high surface area flow-conducting heat dissipating substrate according to claim 6, wherein the minimum distance between any two adjacent flow-conducting columns arranged along the line connecting the flow-breaking end and the flow-conducting end is greater than or equal to 0.2745 mm within a 20% error range.

8. The high surface area flow-conducting heat dissipation substrate according to claim 7, wherein any two adjacent flow-conducting columns arranged in a direction perpendicular to a line connecting the flow-breaking end and the flow-conducting end have a minimum distance greater than or equal to 0.9 mm within a 20% error range.

9. The high surface area flow-conducting heat dissipation substrate according to claim 8, wherein any two adjacent flow-conducting columns arranged in a direction perpendicular to a line connecting the flow-breaking end and the flow-conducting end have a minimum distance less than or equal to 1.5 mm within a 20% error range.

10. The high surface area flow-conducting heat dissipation substrate according to claim 4, wherein the flow-breaking end of any one of the flow-conducting columns is used as a base point to connect the flow-breaking ends of other flow-conducting columns, and the connection direction of the two flow-breaking ends with the shortest connection length is the arrangement direction of each of the flow-conducting columns, wherein the arrangement direction is perpendicular to the connection direction of the flow-breaking end and the flow-conducting end.

11. The high surface area flow-conducting heat dissipation substrate according to claim 4, wherein the flow-breaking end of any one of the flow-conducting columns is used as a base point to connect the flow-breaking ends of other flow-conducting columns, and the connection direction of the two flow-breaking ends with the shortest connection length is the arrangement direction of each of the flow-conducting columns, wherein the arrangement direction is parallel to the long side or the wide side.

12. The high surface area flow-conducting heat dissipation substrate according to claim 4, wherein the intervals between the flow-conducting columns located in the central region of the high surface area flow-conducting heat dissipation substrate are greater than the intervals between the flow-conducting columns located in the edge region of the high surface area flow-conducting heat dissipation substrate.

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