Packaging structure of high-power-density plastic packaging type IPM module

Abstract

The utility model discloses a packaging structure of a high-power density plastic packaging type I PM module, which relates to the technical field of packaging structures, and comprises a copper-clad substrate, a graphene film covered on the copper-clad substrate, a first packaging piece sleeved on the periphery of the copper-clad substrate, a second packaging piece sleeved on the periphery of the graphene film, and a third packaging piece sleeved on the periphery of the graphene film. A third packaging piece is arranged on the side, away from the copper-clad substrate, of the graphene film. A first heat conduction piece is arranged between the first packaging piece and the second packaging piece. According to the utility model, the graphene film is grown on the upper surface of the direct copper-clad substrate in a graphical manner through a chemical vapor deposition method, and local hot spot heat of the high-power-density plastic package type I PM module is rapidly and transversely transmitted by using the excellent in-plane heat conduction performance of the graphene film; meanwhile, the heat-conducting glue I and the heat-conducting glue II can be transferred out, so that the heat dissipation effect of the whole structure is improved; the first heat-conducting glue, the second heat-conducting glue and the packaging resin are filled with graphene for reinforcement, so that the heat conduction performance of a traditional packaging material is improved, and the reliability of the module is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging structures, in particular to a packaging structure of a high-power density plastic-sealed IPM module. Background Art

[0002] IPM module, namely Intelligent Power Module, is a powerful integrated circuit module used to control and drive high-power electronic devices such as AC motor drives, frequency converters, inverters, etc. It combines multiple functional modules such as power switching devices (such as IGBT or MOSFET), drive circuits, protection circuits and control circuits into one, achieving efficient and reliable power conversion, and has intelligent control, fault protection and monitoring functions.

[0003] IPM modules are widely used in the field of power electronics. For example, in electric vehicles and hybrid vehicles, IPM modules are used to drive motors; in wind power generation and solar power generation systems, IPM modules are used to convert variable-frequency electric energy into stable grid electric energy. In addition, IPM modules can also be used in industrial automation, robotics, energy management and other fields, providing efficient and reliable control and drive solutions for various high-power electronic devices.

[0004] With the continuous development of power electronics technology, high power density plastic-encapsulated IPM modules have been widely used in various fields due to their excellent performance. However, the packaging structure of existing IPM modules has problems such as poor thermal conductivity and low reliability, which affects the working efficiency and stability of the module. Therefore, it is necessary to improve the packaging structure of the IPM module to improve its thermal conductivity and reliability. To this end, we provide a packaging structure of a high power density plastic-encapsulated IPM module. Utility Model Content

[0005] The technical problem solved by the utility model is that the packaging structure of the existing IPM module has the problems of poor heat conduction performance, low reliability, etc., which affects the working efficiency and stability of the module.

[0006] The utility model can be implemented through the following technical scheme: a packaging structure of a high-power density plastic-sealed IPM module, including a copper-clad substrate, the copper-clad substrate is covered with a graphene film, a first packaging component is sleeved around the copper-clad substrate, a second packaging component is sleeved around the graphene film, a third packaging component is provided on the side of the graphene film away from the copper-clad substrate, a heat-conducting component 1 is provided between the first packaging component and the second packaging component, and a plurality of heat-conducting components 2 are provided on the third packaging component; the graphene film uses its excellent in-plane thermal conductivity performance on the direct copper-clad substrate to quickly spread the local hot spot heat of the high-power density plastic-sealed IPM module laterally; at the same time, the thermal conductive adhesive 1 and the thermal conductive adhesive 2 can transfer the heat out to improve the heat dissipation effect of the entire structure.

[0007] A further technical improvement of the utility model is that the first packaging component includes a packaging resin 1, and the packaging resin 1 is arranged around the copper-clad substrate, and the packaging resin 1 is in contact with the graphene film.

[0008] A further technical improvement of the present invention is that the second packaging component includes a second packaging resin, and the second packaging resin is sleeved around the graphene film.

[0009] A further technical improvement of the utility model is that: the third packaging component includes packaging resin three, the packaging resin three is arranged on the graphene film, and the packaging resin three is located on the side of the graphene film away from the copper-clad substrate.

[0010] A further technical improvement of the utility model is that the heat-conducting component 1 includes heat-conducting glue 1, the heat-conducting glue 1 is arranged between the packaging resin 1 and the packaging resin 2, and the heat-conducting glue 1 is in contact with the graphene film.

[0011] A further technical improvement of the utility model is that: the second heat-conducting member comprises a plurality of second heat-conducting adhesives, the third packaging resin is provided with a plurality of heat-conducting holes, and the plurality of second heat-conducting adhesives are arranged in the plurality of heat-conducting holes.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The graphene film of the device is patterned on the surface of the direct copper-clad substrate by chemical vapor deposition, and its excellent in-plane thermal conductivity is used to quickly spread the heat of the local hot spot of the high-power density plastic-sealed IPM module laterally; at the same time, thermal conductive adhesive 1 and thermal conductive adhesive 2 can transfer the heat to improve the heat dissipation effect of the entire structure; and thermal conductive adhesive 1, thermal conductive adhesive 2 and the packaging resin are filled with graphene to improve the thermal conductivity of traditional packaging materials and further improve the reliability of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0015] Figure 1 It is a cross-sectional structural schematic diagram of the utility model;

[0016] Figure 2 For this utility model Figure 1 A local enlarged schematic diagram of point A;

[0017] Figure 3 For this utility model Figure 1 A partial enlarged schematic diagram of point B.

[0018] In the figure: 1. Copper-clad substrate; 2. Graphene film; 3. Packaging resin 1; 4. Packaging resin 2; 6. Packaging resin 3; 7. Thermal conductive glue 1; 8. Thermal conductive glue 2; 9. Thermal conductive hole. DETAILED DESCRIPTION

[0019] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0020] See also Figure 1-Figure 3 As shown, the utility model proposes a packaging structure of a high power density plastic-sealed IPM module; it includes a copper-clad substrate 1, a graphene film 2 is covered on the copper-clad substrate 1, a first packaging component is arranged around the copper-clad substrate 1, a second packaging component is arranged around the graphene film 2, a third packaging component is arranged on the side of the graphene film 2 away from the copper-clad substrate 1, a heat-conducting component 1 is arranged between the first packaging component and the second packaging component, and a plurality of heat-conducting components 2 are arranged on the third packaging component.

[0021] The first packaging component includes a packaging resin 3, which is sleeved around the copper-clad substrate 1 and is in contact with the graphene film 2; the packaging resin 3 can clamp and fix the bottom of the copper-clad substrate 1 and the graphene film 2 to improve the stability of the entire structure.

[0022] The second packaging component includes a second packaging resin 4, which is sleeved around the graphene film 2; the second packaging resin 4 can clamp and fix the four sides of the graphene film 2, thereby improving the stability of the entire structure.

[0023] The third packaging component includes packaging resin three 6, which is arranged on the graphene film 2, and the packaging resin three 6 is located on the side of the graphene film 2 away from the copper-clad substrate 1; the packaging resin three 6 can clamp and fix the side of the graphene film 2 away from the copper-clad substrate 1, thereby improving the stability of the entire structure.

[0024] The heat-conducting component 1 includes a heat-conducting adhesive 7, which is arranged between the packaging resin 1 3 and the packaging resin 2 4, and the heat-conducting adhesive 7 is in contact with the graphene film 2; the heat-conducting adhesive 7 can bond the packaging resin 1 3 and the packaging resin 2 4 to improve the stability of the structure, and the heat-conducting adhesive 7 can transfer the heat on the graphene film 2 to facilitate the heat dissipation of the entire structure.

[0025] The heat-conducting component 2 includes a plurality of heat-conducting adhesives 2 8, and a plurality of heat-conducting holes 9 are provided on the packaging resin 3 6, and the plurality of heat-conducting adhesives 2 8 are arranged in the plurality of heat-conducting holes 9; the heat-conducting adhesives 2 8 can bond and fix the packaging resin 3 6 to the graphene film 2 to improve the structural stability, and at the same time, the heat-conducting adhesives 2 8 can transfer the heat on the graphene film 2 to improve the heat dissipation effect of the entire structure.

[0026] When the utility model is in use, the graphene film 2 is graphically grown on the surface of the direct copper-clad substrate 1 by chemical vapor deposition, and the excellent in-plane thermal conductivity is utilized to rapidly spread the heat of the local hot spot of the high-power density plastic-sealed IPM module laterally; at the same time, the thermal conductive adhesive 1 7 and the thermal conductive adhesive 2 8 can transfer the heat to improve the heat dissipation effect of the entire structure; and the thermal conductive adhesive 1 7 and the thermal conductive adhesive 2 8 and the packaging resin are filled and enhanced with graphene to improve the thermal conductivity of traditional packaging materials and further improve the reliability of the module.

[0027] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A packaging structure of a high power density plastic-sealed IPM module, characterized in that: The invention comprises a copper-clad substrate (1), the copper-clad substrate (1) is covered with a graphene film (2), a first packaging component is arranged around the copper-clad substrate (1), a second packaging component is arranged around the graphene film (2), a third packaging component is arranged on a side of the graphene film (2) away from the copper-clad substrate (1), a heat-conducting component 1 is arranged between the first packaging component and the second packaging component, and a plurality of heat-conducting components 2 are arranged on the third packaging component.

2. The packaging structure of a high power density plastic-encapsulated IPM module according to claim 1, characterized in that: The first packaging component comprises a packaging resin (3), wherein the packaging resin (3) is sleeved around the copper-clad substrate (1), and the packaging resin (3) is in contact with the graphene film (2).

3. The packaging structure of a high power density plastic-encapsulated IPM module according to claim 1, characterized in that: The second packaging component comprises a second packaging resin (4), and the second packaging resin (4) is sleeved around the graphene film (2).

4. The packaging structure of a high power density plastic-encapsulated IPM module according to claim 1, characterized in that: The third packaging component comprises a packaging resin three (6), wherein the packaging resin three (6) is arranged on the graphene film (2), and the packaging resin three (6) is located on a side of the graphene film (2) away from the copper-clad substrate (1).

5. The packaging structure of a high power density plastic-encapsulated IPM module according to claim 3, characterized in that: The heat-conducting component 1 comprises a heat-conducting adhesive 1 (7), and the heat-conducting adhesive 1 (7) is arranged between the packaging resin 1 (3) and the packaging resin 2 (4), and the heat-conducting adhesive 1 (7) is in contact with the graphene film (2).

6. The packaging structure of a high power density plastic-encapsulated IPM module according to claim 4, characterized in that: The second heat-conducting component comprises a plurality of second heat-conducting adhesives (8), the third packaging resin (6) is provided with a plurality of heat-conducting holes (9), and the plurality of second heat-conducting adhesives (8) are arranged in the plurality of heat-conducting holes (9).

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