Circuit board cooling module for reflow soldering

Abstract

The utility model relates to the field of circuit board production, and discloses a circuit board cooling module for reflow soldering, which comprises a reflow soldering device body, two electric sprayers are fixedly mounted on the inner wall of the top of the reflow soldering device body in a penetrating manner, the two electric sprayers are arranged at equal intervals, and liquid pipes are communicated with the two electric sprayers. The inner wall of the top of the reflow soldering device body is fixedly connected with an air blow gun in a penetrating manner, the air blow gun is communicated with an air pipe, one side of the reflow soldering device body is fixedly connected with a mounting plate, and a motor is fixedly embedded in one side of the mounting plate. Cooling liquid can be introduced into the cooling plate through the connecting pipe to take away heat generated during welding of the circuit board, after the sealing shell is installed, gas can be prevented from leaking out, welding flux can be prevented from splashing out, and an air blowing gun and an electric spray head can blow air and spray cooling gas to accelerate the cooling speed of the circuit board correspondingly. After the motor is started, the scraper can be driven to push the remaining solder to be cleaned.

Description

Technical Field

[0001] The utility model relates to the field of circuit board production, in particular to a circuit board cooling module for reflow soldering. Background Art

[0002] The names of circuit boards include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum base board, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances.

[0003] The utility model with authorization announcement number: CN216829050U discloses an intelligent control cooling device for integrated circuit board reflow soldering, including a cooling chamber main body, a conveying mechanism, a counting device, a control system and a refrigeration device with adjustable temperature rate; the conveying mechanism is used to convey the integrated circuit board and penetrates the side walls on opposite sides of the cooling chamber main body; the counting device is installed in the inner cavity of the cooling chamber main body and is used to count the integrated circuit boards entering the cooling chamber main body; the control system is arranged on the outside of the cooling chamber main body, and the control system is electrically connected to the counting device and the refrigeration device respectively; the integrated circuit boards entering the cooling chamber are counted by the counting device, and the temperature and wind speed of the air-conditioning unit are adjusted according to the number of integrated circuit boards, so as to grasp the optimal cooling rate, improve the quality of reflow soldering, and not easily cause waste of electric energy.

[0004] The above utility model patent cannot clean the residual solder in the device, because a small amount of solder will be left in the device during reflow soldering, so these solders are easy to adhere to the circuit board and affect the quality of the circuit board. Therefore, the technicians in this field provide a circuit board cooling module for reflow soldering to solve the problems raised in the above background technology. Utility Model Content

[0005] The utility model aims to provide a circuit board cooling module for reflow soldering to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board cooling module for reflow soldering, comprising a reflow soldering device body, the top inner wall of the reflow soldering device body is penetrated and fixedly installed with two electric nozzles, and the two electric nozzles are arranged at equal intervals, and the two electric nozzles are connected with liquid pipes, the top inner wall of the reflow soldering device body is penetrated and fixedly connected with an air blowing gun, and the air blowing gun is connected with an air pipe, a mounting plate is fixedly connected to one side of the reflow soldering device body, a motor is fixedly embedded on one side of the mounting plate, a driving screw is fixedly sleeved on the output shaft of the motor, a moving plate is threadedly sleeved on the outer wall of the driving screw, a scraper is fixedly connected to one side of the moving plate close to the reflow soldering device body, the scraper penetrates one side of the reflow soldering device body and extends into the reflow soldering device body, a cooling plate is fixedly connected to the top of the reflow soldering device body, a plurality of connecting pipes are arranged and connected in a transverse manner on one side of the cooling plate, and the top of the cooling plate and the bottom of the scraper are in contact with each other.

[0007] As a further solution of the utility model: two rectangular blocks are symmetrically fixedly connected to the inner wall of one side of the reflow soldering device body, and the same sealing shell is clamped on the two rectangular blocks. Two slots are opened on the side of the sealing shell close to the rectangular block, and the slots and the rectangular blocks are clamped.

[0008] As a further solution of the utility model: a transparent window is fixedly embedded on the side of the sealing shell away from the rectangular block, the top and bottom of the sealing shell are sealed and fit with the top inner wall and bottom inner wall of the reflow soldering device body, and the multiple connecting tubes pass through the sealing shell and extend to the outside of the sealing shell.

[0009] As a further solution of the utility model: a clamping block is fixedly connected to a side of the reflow soldering device body away from the connecting pipe, and a material receiving box is clamped on the clamping block.

[0010] As a further solution of the utility model: a rectangular hole is opened on the inner wall of one side of the reflow soldering device body, and the scraper passes through the rectangular hole.

[0011] As a further solution of the utility model: the air blowing gun is located between two electric nozzles, and the electric nozzles and the air blowing gun are both located directly above the cooling plate.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The top of the cooling plate can be used to place the circuit board for welding. Multiple connecting pipes on one side of the cooling plate can be used to pass coolant into the cooling plate to take away the heat generated by the circuit board welding. During welding, the sealing shell can be installed on the rectangular block through two card slots to prevent gas leakage or block solder splashing. Cooling gas can be passed into the two electric nozzles through the liquid pipe, and the liquid pipe can spray cooling gas to cool the circuit board after welding on the cooling plate. Air can be passed into the air pipe into the air blow gun, and the air blow gun can be blown to the welding completion. The completed circuit board is cooled by blowing air, and the welding condition on the cooling plate can be observed through the transparent window on the sealing shell. After the sealing shell is unplugged and the circuit board is taken out, the motor can be started, and the motor can drive the driving screw to rotate, and the driving screw rotation will drive the moving plate to translate, and the moving plate will drive the scraper to translate when it translates. Because the scraper is in contact with the top of the cooling plate, the scraper can push the solder on the top of the cooling plate to move when it translates, so that the solder can be pushed into the receiving box for collection, and the receiving box can be removed from the card block to dump the solder.

[0014] The utility model is easy to use. The cooling plate can be fed with coolant through a connecting pipe to take away the heat generated during the welding of the circuit board. After the sealing shell is installed, gas leakage can be prevented and solder splashing can be blocked. The air blowing gun and the electric nozzle can respectively blow and spray cooling gas to accelerate the cooling speed of the circuit board. After the motor is started, the scraper can be driven to push the remaining solder for cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0016] Figure 2 It is a first explosion three-dimensional schematic diagram of the utility model;

[0017] Figure 3 It is a second explosion three-dimensional schematic diagram of the utility model;

[0018] Figure 4 This is a third explosion three-dimensional schematic diagram of the utility model.

[0019] In the figure: 1. Reflow soldering device body; 2. Liquid pipe; 3. Air pipe; 4. Sealing shell; 5. Transparent window; 6. Cooling plate; 7. Mounting plate; 8. Motor; 9. Block; 10. Receiving box; 11. Connecting pipe; 12. Electric nozzle; 13. Driving screw; 14. Scraper; 15. Air blow gun; 16. Rectangular hole; 17. Moving plate; 18. Rectangular block; 19. Slot. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] See also Figures 1 to 4 In the embodiment of the utility model, a circuit board cooling module for reflow soldering includes a reflow soldering device body 1, two electric nozzles 12 are fixedly installed on the top inner wall of the reflow soldering device body 1, and the two electric nozzles 12 are arranged at equal intervals, and the two electric nozzles 12 are connected with a liquid pipe 2, and a blow gun 15 is fixedly connected to the top inner wall of the reflow soldering device body 1, and the blow gun 15 is connected with an air pipe 3, and one side of the reflow soldering device body 1 is fixedly connected to a mounting plate 7, and one side of the mounting plate 7 is fixedly embedded A motor 8 is installed, a driving screw 13 is fixedly sleeved on the output shaft of the motor 8, a moving plate 17 is threadedly sleeved on the outer wall of the driving screw 13, a scraper 14 is fixedly connected to the side of the moving plate 17 close to the reflow soldering device body 1, the scraper 14 penetrates one side of the reflow soldering device body 1 and extends into the reflow soldering device body 1, a cooling plate 6 is fixedly connected to the top of the reflow soldering device body 1, a plurality of connecting pipes 11 are horizontally arranged and connected to one side of the cooling plate 6, and the top of the cooling plate 6 and the bottom of the scraper 14 are in contact with each other.

[0022] In this embodiment, two rectangular blocks 18 are symmetrically fixedly connected to the inner wall of one side of the reflow soldering device body 1, and the same sealing shell 4 is clamped on the two rectangular blocks 18. Two slots 19 are provided on one side of the sealing shell 4 close to the rectangular block 18, and the slots 19 and the rectangular block 18 are clamped.

[0023] In this embodiment, a transparent window 5 is fixedly embedded on one side of the sealing shell 4 away from the rectangular block 18, the top and bottom of the sealing shell 4 are sealed and fitted with the top inner wall and the bottom inner wall of the reflow soldering device body 1, and a plurality of connecting tubes 11 penetrate the sealing shell 4 and extend to the outside of the sealing shell 4.

[0024] In this embodiment, a clamping block 9 is fixedly connected to a side of the reflow soldering device body 1 away from the connecting tube 11 , and a material receiving box 10 is clamped on the clamping block 9 .

[0025] In this embodiment, a rectangular hole 16 is formed on an inner wall of one side of the reflow soldering device body 1 , and the scraper 14 passes through the rectangular hole 16 .

[0026] In this embodiment, the air blow gun 15 is located between the two electric nozzles 12. The electric nozzles 12 and the air blow gun 15 are both located directly above the cooling plate 6. The top of the cooling plate 6 can be used to place the circuit board for welding. The multiple connecting pipes 11 on one side of the cooling plate 6 can pass the coolant into the cooling plate 6 to take away the heat generated during the welding of the circuit board. When welding, the sealing shell 4 can be installed on the rectangular block 18 through two card slots 19 to prevent gas leakage or solder splashing. Cooling gas can be passed into the two electric nozzles 12 through the liquid pipe 2, and the liquid pipe 2 can spray cooling gas to cool the circuit board after welding on the cooling plate 6. Air can be passed into the air pipe 3 and into the air blow gun 15. At this time, the air blow gun 15 can blow air to the circuit board after welding to accelerate cooling.

[0027] The working principle of the utility model is as follows: the top of the cooling plate 6 can be used to place the circuit board for welding, and the multiple connecting pipes 11 on one side of the cooling plate 6 can pass the cooling liquid into the cooling plate 6 to take away the heat generated during the welding of the circuit board. When welding, the sealing shell 4 can be clamped on the rectangular block 18 through the two card slots 19 for installation, so as to prevent gas leakage or block the solder from splashing. The two electric nozzles 12 can pass the cooling gas through the liquid pipe 2, and the liquid pipe 2 can spray the cooling gas to cool the circuit board after welding on the cooling plate 6. The air pipe 3 can pass the air into the air blowing gun 15, and the air blowing gun 15 can blow the welding The completed circuit board is cooled by blowing air to accelerate the cooling. The welding condition on the cooling plate 6 can be observed through the transparent window 5 on the sealing shell 4. After the sealing shell 4 is unplugged and the circuit board is taken out, the motor 8 can be started at this time. The motor 8 can drive the driving screw 13 to rotate. The driving screw 13 rotates to drive the moving plate 17 to translate. The moving plate 17 translates and drives the scraper 14 to translate. Because the scraper 14 is in contact with the top of the cooling plate 6, the scraper 14 can push the solder on the top of the cooling plate 6 to move when it translates, so that the solder can be pushed into the material receiving box 10 for collection. The material receiving box 10 can be removed from the block 9 to dump the solder.

[0028] However, as is well known to those skilled in the art, the working principles and wiring methods of the motor 8, electric nozzle 12, and air blow gun 15 are commonplace, and are conventional means or common knowledge, and will not be elaborated here. Those skilled in the art may make any selections according to their needs or convenience.

[0029] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A circuit board cooling module for reflow soldering, comprising a reflow soldering device body (1), characterized in that: The top inner wall of the reflow soldering device body (1) is penetrated and fixedly mounted with two electric nozzles (12), and the two electric nozzles (12) are arranged at equal intervals, and the two electric nozzles (12) are both connected with a liquid pipe (2), the top inner wall of the reflow soldering device body (1) is penetrated and fixedly connected with an air blowing gun (15), and the air blowing gun (15) is connected with an air pipe (3), one side of the reflow soldering device body (1) is fixedly connected with a mounting plate (7), one side of the mounting plate (7) is fixedly embedded with a motor (8), and the output shaft of the motor (8) is fixedly sleeved with a A driving screw (13) is provided, and a movable plate (17) is threadedly sleeved on the outer wall of the driving screw (13); a scraper (14) is fixedly connected to the side of the movable plate (17) close to the reflow soldering device body (1); the scraper (14) passes through one side of the reflow soldering device body (1) and extends into the reflow soldering device body (1); a cooling plate (6) is fixedly connected to the top of the reflow soldering device body (1); a plurality of connecting pipes (11) are transversely arranged and connected to one side of the cooling plate (6); the top of the cooling plate (6) and the bottom of the scraper (14) are in contact with each other.

2. A circuit board cooling module for reflow soldering according to claim 1, characterized in that: Two rectangular blocks (18) are symmetrically and fixedly connected to the inner wall of one side of the reflow soldering device body (1); the two rectangular blocks (18) are clamped with a same sealing shell (4); two clamping grooves (19) are provided on a side of the sealing shell (4) close to the rectangular block (18); and the clamping grooves (19) and the rectangular block (18) are clamped with each other.

3. A circuit board cooling module for reflow soldering according to claim 2, characterized in that: A transparent window (5) is fixedly embedded on one side of the sealing shell (4) away from the rectangular block (18); the top and bottom of the sealing shell (4) are sealed and fitted with the top inner wall and bottom inner wall of the reflow soldering device body (1); and the plurality of connecting tubes (11) penetrate the sealing shell (4) and extend to the outside of the sealing shell (4).

4. The circuit board cooling module for reflow soldering according to claim 1, characterized in that: A clamping block (9) is fixedly connected to the side of the reflow soldering device body (1) away from the connecting pipe (11), and a material receiving box (10) is clamped on the clamping block (9).

5. The circuit board cooling module for reflow soldering according to claim 1, characterized in that: A rectangular hole (16) is provided on the inner wall of one side of the reflow soldering device body (1), and the scraper (14) passes through the rectangular hole (16).

6. The circuit board cooling module for reflow soldering according to claim 1, characterized in that: The air blowing gun (15) is located between the two electric nozzles (12), and the electric nozzles (12) and the air blowing gun (15) are both located directly above the cooling plate (6).

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