Temperature adjusting device of vehicle-mounted parking apron, vehicle-mounted parking apron and vehicle

Abstract

A temperature adjusting device of a vehicle-mounted parking apron comprises a first shell, a second shell and a temperature adjusting device, wherein the first shell is provided with an inner air duct used for communicating with a parking apron cabin; the second shell is provided with an outer air duct communicated with the external environment; an inner air duct radiating fin; the outer air duct radiating fins are fixedly connected with the inner air duct radiating fins; the semiconductor chilling plate is clamped between the inner air duct cooling fin and the outer air duct cooling fin; when forward current is introduced into the semiconductor chilling plate, heat is conducted from the inner air channel cooling fin to the outer air channel cooling fin through the semiconductor chilling plate, and when reverse current is introduced into the semiconductor chilling plate, heat is conducted from the outer air channel cooling fin to the inner air channel cooling fin through the semiconductor chilling plate. The utility model further provides a vehicle-mounted parking apron and a vehicle. According to the temperature adjusting device, heat can be transferred between the inner air channel cooling fin and the outer air channel cooling fin through the semiconductor chilling plate, so that the temperature in the parking apron cabin is adjusted, the temperature conforms to the working environment temperature of the unmanned aerial vehicle, and the effects of salt mist prevention and dust prevention are achieved.

Description

Technical Field

[0001] The utility model relates to the field of unmanned aerial vehicles, in particular to a temperature regulating device for a vehicle-mounted helipad, and a vehicle-mounted helipad and a vehicle. Background Art

[0002] At present, vehicles are becoming more and more networked and intelligent, and more and more vehicles are integrating drone landing pads, intending to deeply integrate vehicles and drones so that users can get a richer driving and entertainment experience.

[0003] The vehicle-mounted helipad is generally designed according to the manufacturing standards of the vehicle, and the reliability requirements of vehicle-grade devices are high, and its operating temperature range is -40℃~125℃. However, the operating environment temperature of common consumer-grade drones is only -10℃~40℃ (the charging environment temperature is 5℃~40℃). Therefore, the temperature inside the vehicle-mounted helipad may exceed or fall below the operating environment temperature of consumer-grade drones. For example, when a vehicle (and a vehicle-mounted helipad) is exposed to the summer sun, the temperature inside the vehicle-mounted helipad can easily reach above 60℃, exceeding the operating temperature and charging temperature of the consumer-grade drone it carries, causing the drone to be unable to work and charge, and even damaging the internal circuit. For another example, when a vehicle (and a vehicle-mounted helipad) is driven outdoors in winter or at high altitudes, the temperature inside the vehicle-mounted helipad can easily fall below the operating temperature and charging temperature of consumer-grade drones, which can also cause the drone to be unable to work and charge. Utility Model Content

[0004] In view of the problems existing in the background technology, the first aspect of the present utility model provides a temperature regulating device for a vehicle-mounted helipad, comprising:

[0005] A first housing having an inner air duct, wherein the inner air duct is used to communicate with the apron cabin;

[0006] A second housing having an external air duct, wherein the external air duct is used to communicate with the external environment;

[0007] An inner air duct heat sink fixedly disposed in the inner air duct;

[0008] An outer air duct heat sink fixedly arranged in the outer air duct, the outer air duct heat sink being fixedly connected to the inner air duct heat sink;

[0009] A semiconductor cooling sheet sandwiched between the inner duct heat sink and the outer duct heat sink, one side of the semiconductor cooling sheet is bonded to the inner duct heat sink, and the other side is bonded to the outer duct heat sink, and is configured as follows:

[0010] When a forward current is passed through the semiconductor cooling sheet, heat is transferred from the inner duct heat sink to the outer duct heat sink via the semiconductor cooling sheet. When a reverse current is passed through the semiconductor cooling sheet, heat is transferred from the outer duct heat sink to the inner duct heat sink via the semiconductor cooling sheet.

[0011] In some embodiments of the utility model, an external duct fan for accelerating the air flow is provided in the external air duct; a temperature sensor is provided on the external duct heat sink, and the external duct fan is turned on / off according to the temperature value of the external duct heat sink obtained by the temperature sensor; and / or the speed of the external duct fan is adjusted according to the temperature value of the external duct heat sink obtained by the temperature sensor.

[0012] In some embodiments of the utility model, the external air duct is formed on the second shell with an external air duct air inlet facing the direction of vehicle travel and an external air duct air outlet away from the direction of vehicle travel. When the vehicle travel speed exceeds a preset speed, the external air duct fan remains closed.

[0013] In some embodiments of the utility model, an inner air duct fan is provided in the inner air duct to accelerate the air flow in the apron cabin.

[0014] In some embodiments of the utility model, the inner air duct is formed on the first shell with an inner air duct air inlet located on the side of the vehicle's driving direction and an inner air duct air outlet located away from the vehicle's driving direction, and the inner air duct air inlet and the inner air duct air outlet are both connected to the apron cabin.

[0015] In some embodiments of the utility model, a heat insulation layer is filled between the inner air duct heat sink and the outer air duct heat sink, a first accommodating cavity is opened on the heat insulation layer, the semiconductor refrigeration sheet is arranged in the first accommodating cavity, and the contact surfaces between the semiconductor refrigeration sheet and the inner air duct heat sink and the outer air duct heat sink are coated with thermal conductive silicone grease.

[0016] In some embodiments of the present invention, a second accommodating cavity is formed on the thermal insulation layer, and the temperature sensor is disposed in the second accommodating cavity.

[0017] In some embodiments of the present invention, there are two second shells, which are symmetrically distributed on both sides of the first shell.

[0018] A second aspect of the utility model provides a vehicle-mounted helipad, comprising:

[0019] apron compartment; and

[0020] A temperature regulating device for any vehicle-mounted apron as described above, arranged on the apron cabin.

[0021] A third aspect of the utility model provides a vehicle, comprising the vehicle-mounted helipad as described above.

[0022] The temperature regulating device of the vehicle-mounted apron provided by the utility model can "transfer" heat between the inner air duct heat sink and the outer air duct heat sink through the semiconductor cooling sheet, adjust the temperature in the inner air duct, and thus adjust the temperature in the apron cabin connected to the inner air duct, so that the temperature in the apron cabin meets the working environment temperature of the drone (especially the charging environment temperature), and expands the application environment of the drone. In addition, by lowering the temperature in the apron cabin, the time waiting for cooling between two flights can be reduced, and the number of flights can be increased in the same time. In addition, although the outer air duct is connected to the external environment, the air in the external environment cannot directly enter the inner air duct (it can also be regarded as the air in the external environment cannot directly enter the apron cabin), but is blocked by the heat conduction system composed of the outer air duct heat sink, the semiconductor cooling sheet and the inner air duct heat sink, that is, the temperature regulating device of the vehicle-mounted apron also has the effect of preventing salt spray and dust. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the structure and working principle of the semiconductor refrigeration chip;

[0024] Figure 2 A schematic diagram of the structure of a temperature regulating device for a vehicle-mounted helipad provided in one embodiment of the utility model;

[0025] Figure 3 for Figure 2 An exploded view of the temperature regulation device of the vehicle-mounted apron is shown;

[0026] Figure 4 It is a schematic diagram of the connection relationship between the inner air duct heat sink, the outer air duct heat sink and the semiconductor cooling sheet;

[0027] Figure 5 It is a schematic diagram of the structure of the vehicle-mounted apron (with the air flow direction mark of the external air duct);

[0028] Figure 6 It is a schematic diagram of the structure of the vehicle-mounted apron (with the air flow direction mark in the internal air duct).

[0029] Description of reference numerals:

[0030] The temperature regulating device 100 of the vehicle-mounted apron;

[0031] Onboard parking apron 200;

[0032] First housing 10; inner air duct 11; inner air duct air inlet 11a; inner air duct air outlet 11b; inner air duct heat sink 12; inner air duct fan 13;

[0033] Second housing 20; external air duct 21; external air duct air inlet 21a; external air duct air outlet 21b; external air duct heat sink 22; external air duct fan 23; temperature sensor 24;

[0034] Semiconductor cooling sheet 30;

[0035] Heat insulation layer 40; first accommodating cavity 41; second accommodating cavity 42;

[0036] Apron compartment 50. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] like Figures 1 to 6 As shown, an embodiment of the utility model provides a temperature regulating device 100 for a vehicle-mounted apron 200, mainly comprising a first housing 10 having an inner air duct 11, the inner air duct 11 being used to communicate with the apron cabin 50. A second housing 20 having an outer air duct 21, the outer air duct 21 being used to communicate with the external environment. An inner air duct heat sink 12 fixedly disposed in the inner air duct 11. An outer air duct heat sink 22 fixedly disposed in the outer air duct 21, the outer air duct heat sink 22 being fixedly connected to the inner air duct heat sink 12. A semiconductor cooling sheet 30 (Thermoelectric Cooler, TEC for short) is sandwiched between the inner duct heat sink 12 and the outer duct heat sink 22. One side of the semiconductor cooling sheet 30 is in contact with the inner duct heat sink 12, and the other side is in contact with the outer duct heat sink 22. The semiconductor cooling sheet 30 is configured so that when a forward current is passed through the semiconductor cooling sheet 30, heat is transferred from the inner duct heat sink 12 to the outer duct heat sink 22 via the semiconductor cooling sheet 30. When a reverse current is passed through the semiconductor cooling sheet 30, heat is transferred from the outer duct heat sink 22 to the inner duct heat sink 12 via the semiconductor cooling sheet 30.

[0039] Special reference Figure 1, which shows the structure and working principle of the semiconductor cooling sheet 30. The smallest unit of the semiconductor cooling sheet 30 is a pair (group) of N-type and P-type semiconductors connected by electrodes (sintering points), and the connecting electrodes form a heat absorbing end (cold end) and a heat releasing end (hot end). Under the action of an external electric field, the current can conduct the heat generated in the semiconductor from the heat absorbing end (cold end) to the heat releasing end (hot end). As the direction of the current changes, the heat absorbing end (cold end) and the heat releasing end (hot end) will exchange with each other.

[0040] In this embodiment, the inner duct heat sink 12 is fastened to the inner duct 11 by screws, the outer duct heat sink 22 is fastened to the outer duct 21 by screws, and the outer duct heat sink 22 and the inner duct heat sink 12 are fixed to each other by screws. In other embodiments, the connection can also be fixed by welding, gluing, etc.

[0041] In this embodiment, a temperature sensor is provided in the apron cabin 50. The semiconductor refrigeration sheet 30 can be connected to the control system and the power supply system. Among them, the control system and the power supply system can be a control system and a power supply system separately provided for the vehicle-mounted apron itself (generally provided in the apron cabin 50), or a total control system and a total power supply system installed on the vehicle (generally provided in the cabin). When the value obtained by the temperature sensor in the apron cabin 50 is higher than the upper limit of the working environment temperature of the drone (for example, the upper limit of the working environment temperature of the consumer-grade drone is 45°C), the control system controls the power supply system to pass a forward current to the semiconductor refrigeration sheet 30, and the heat is transferred from the inner air duct heat sink 12 to the outer air duct heat sink 22 via the semiconductor refrigeration sheet 30, and the temperature in the apron cabin 50 is reduced. When the value obtained by the temperature sensor in the apron cabin 50 is lower than the lower limit of the operating environment temperature of the drone (for example, the lower limit of the operating environment temperature of a consumer-grade drone is 0°C), the control system controls the power supply system to pass a reverse current to the semiconductor refrigeration plate 30, and the heat is transferred from the outer duct heat sink 22 to the inner duct heat sink 12 via the semiconductor refrigeration plate 30, and the temperature in the apron cabin 50 increases.

[0042] In other embodiments, when the value obtained by the temperature sensor in the apron cabin 50 is higher than the upper limit of the working environment temperature of the drone, the control system controls the power supply system to pass a forward current to the semiconductor cooling chip 30, and the heat is transferred from the inner duct heat sink 12 to the outer duct heat sink 22 via the semiconductor cooling chip 30, until the temperature in the apron cabin 50 drops to a first preset temperature (such as 35°C or 30°C, etc.), and the semiconductor cooling chip 30 stops working. When the value obtained by the temperature sensor in the apron cabin 50 is lower than the lower limit of the working environment temperature of the drone, the control system controls the power supply system to pass a reverse current to the semiconductor cooling chip 30, and the heat is transferred from the outer duct heat sink 22 to the inner duct heat sink 12 via the semiconductor cooling chip 30, until the temperature in the apron cabin 50 rises to a second preset temperature (such as 10°C or 15°C, etc.), and the semiconductor cooling chip 30 stops working.

[0043] Those skilled in the art should be able to understand that the temperature regulating device 100 of the vehicle-mounted apron 200 can "transfer" heat between the inner air duct heat sink 12 and the outer air duct heat sink 22 through the semiconductor cooling sheet 30, adjust the temperature in the inner air duct 11, and thus adjust the temperature in the apron cabin 50 connected to the inner air duct 11, so that the temperature in the apron cabin 50 meets the working environment temperature of the drone (especially the charging environment temperature), and expands the application environment of the drone. In addition, by reducing the temperature in the apron cabin 50, the time for waiting for cooling between two flights can be reduced, and the number of flights can be increased in the same time. In addition, although the outer air duct 21 is connected to the external environment, the air in the external environment cannot directly enter the inner air duct 11 (it can also be regarded as the air in the external environment cannot directly enter the apron cabin 50), but is blocked by the heat conduction system composed of the outer air duct heat sink 22, the semiconductor cooling sheet 30 and the inner air duct heat sink 12, that is, the temperature regulating device 100 of the vehicle-mounted apron 200 also has the effect of preventing salt fog and dust.

[0044] Furthermore, an external duct fan 23 for accelerating the air flow is provided in the external duct 21, and a temperature sensor 24 is provided on the external duct heat sink 22. The external duct fan 23 is turned on / off according to the temperature value of the external duct heat sink 22 obtained by the temperature sensor 24; and / or the rotation speed of the external duct fan 23 is adjusted according to the temperature value of the external duct heat sink 22 obtained by the temperature sensor 24.

[0045] Furthermore, the outer air duct 21 is formed on the second shell 20 with an outer air duct air inlet 21a facing the vehicle's driving direction and an outer air duct air outlet 21b away from the vehicle's driving direction. When the vehicle's driving speed exceeds a preset speed, the outer air duct fan 23 remains closed.

[0046] In this embodiment, the frame of the external air duct fan 23 has a through hole, and the inner wall of the external air duct 21 may have a threaded hole, and the two may be fixed to each other by screws. The external air duct fan 23 is close to the side of the external air duct outlet 21b.

[0047] For example, the vehicle-mounted control system is electrically connected to the external duct fan 23 to control the opening / closing and speed adjustment of the external duct fan 23. When the vehicle speed exceeds 80 km / h, the external duct fan 23 remains closed, and the heat dissipation efficiency of the external duct heat sink 22 is improved by relying on the air flowing through the external duct 21. When the vehicle speed is lower than 80 km / h, and the value obtained by the temperature sensor in the apron cabin 50 reaches 45°C (exceeding the working environment temperature of consumer-grade drones), the vehicle-mounted control system controls the opening of the external duct fan 23 at a speed of 1000 rpm. When the value obtained by the temperature sensor in the apron cabin 50 is higher than 50°C, the speed of the external duct fan 23 is increased to 2000 rpm.

[0048] Those skilled in the art should be able to understand that the external duct fan 23 can speed up the air flow in the external duct 21 and improve the heat conduction efficiency of the external duct heat sink 22, but it does not have to be in the on state all the time, and can be controlled to be on / off according to the vehicle's driving speed, and the speed can also be adjusted according to the temperature in the apron cabin 50, thereby achieving energy saving and consumption reduction.

[0049] Furthermore, an inner air duct fan 13 is provided in the inner air duct 11 to accelerate the air flow in the apron cabin 50 .

[0050] Furthermore, the inner air duct 11 is formed on the first shell 10 with an inner air duct air inlet 11a located on the side of the vehicle's driving direction and an inner air duct air outlet 11b located away from the vehicle's driving direction, and both the inner air duct air inlet 11a and the inner air duct air outlet 11b are connected to the apron cabin 50.

[0051] In this embodiment, the frame of the inner duct fan 13 has a through hole, and the inner wall of the inner duct 11 may have a threaded hole, and the two can be fixed to each other by screws. The inner duct fan 13 is close to the inner duct air outlet 11b. The inner duct fan 13 accelerates the air flow in the apron cabin 50 (which can also be regarded as the air flow in the inner duct 11), which can improve the heat conduction efficiency of the inner duct heat sink 12. The heat absorbed by the inner duct heat sink 12 is conducted to the inner duct heat sink 12 via the semiconductor cooling sheet 30.

[0052] Furthermore, a heat insulating layer 40 is filled between the inner duct heat sink 12 and the outer duct heat sink 22, a first accommodating cavity 41 is opened on the heat insulating layer 40, the semiconductor refrigeration sheet 30 is arranged in the first accommodating cavity 41, and the contact surfaces between the semiconductor refrigeration sheet 30 and the inner duct heat sink 12 and the outer duct heat sink 22 are coated with thermal conductive silicone grease.

[0053] Furthermore, a second accommodating cavity 42 is formed on the heat insulation layer 40 , and the temperature sensor 24 is disposed in the second accommodating cavity 42 .

[0054] In this embodiment, the space occupied by the semiconductor cooling sheet 30 is much smaller than the area of ​​the inner duct heat sink 12 and the outer duct heat sink 22. In order to prevent heat from being directly conducted between the inner duct heat sink 12 and the outer duct heat sink 22, a heat insulation layer 40 can be filled between the two. The first accommodating cavity 41 and the second accommodating cavity 42 provided on the heat insulation layer 40 just provide space for the semiconductor cooling sheet 30 and the temperature sensor 24. Avoidance holes are provided at the four corners of the heat insulation layer 40 so that screws for fixing the inner duct heat sink 12 and the outer duct heat sink 22 can pass through. The heat insulation layer 40 can be made of a material with a small thermal coefficient, such as foam.

[0055] Those skilled in the art should be able to understand that the contact surfaces of the semiconductor refrigeration plate 30 and the inner duct heat sink 12 and the outer duct heat sink 22 are coated with thermal conductive silicone grease to improve the heat conduction efficiency in the area where the semiconductor refrigeration plate 30 is located, and the thermal insulation layer 40 blocks the heat from being directly conducted between the inner duct heat sink 12 and the outer duct heat sink 22, which makes the temperature control device 100 of the vehicle-mounted apron 200 more efficient and reliable.

[0056] Furthermore, there are two second shells 20 , which are symmetrically distributed on both sides of the first shell 10 .

[0057] In this embodiment, openings are respectively provided on the left and right sides of the first shell 10, and the inner duct heat sink 12 is embedded in the opening. A seal or a sealant can be provided between the inner duct heat sink 12 and the mounting surface of the first shell 10. Each second shell 20 also has an opening, and the outer duct heat sink 22 is embedded in the opening. A seal or a sealant can be provided between the outer duct heat sink 22 and the mounting surface of the second shell 20. A semiconductor cooling sheet 30 is sandwiched between each pair of inner duct heat sink 12 and outer duct heat sink 22. The temperature regulating device 100 of the vehicle-mounted helipad 200 can adjust the temperature in the inner duct 11 through a heat "transfer" system composed of two sets of inner duct heat sinks 12, semiconductor cooling sheets 30 and outer duct heat sinks 22, thereby adjusting the temperature in the helipad cabin 50 connected to the inner duct 11, so that the temperature in the helipad cabin 50 meets the working environment temperature of the drone.

[0058] An embodiment of the present invention further provides a vehicle-mounted apron 200 , comprising a apron cabin 50 ; and a temperature regulating device 100 of any vehicle-mounted apron 200 as described above, which is arranged on the apron cabin 50 .

[0059] In this embodiment, the temperature adjustment device 100 of the vehicle-mounted apron 200 is arranged at the bottom of the apron cabin 50, and the bottom of the apron cabin 50 may have openings corresponding to the inner air duct air inlet 11a and the inner air duct air outlet 11b, and the first shell 10 may be fixedly connected to the apron cabin 50 at the inner air duct air inlet 11a and the inner air duct air outlet 11b by screws, welding, bonding, etc., so that the inner air duct 11 is connected to the inside of the apron cabin 50. The interior of the apron cabin 50 may also be provided with components such as the control system and temperature sensor as described above.

[0060] Those skilled in the art should be able to understand that the vehicle-mounted apron 200 has the same beneficial effects as the temperature regulating device 100 of the vehicle-mounted apron 200. For example, the semiconductor cooling sheet 30 can "transfer" heat between the inner duct heat sink 12 and the outer duct heat sink 22 to adjust the temperature in the inner duct 11, thereby adjusting the temperature in the apron cabin 50 connected to the inner duct 11, so that the temperature in the apron cabin 50 meets the working environment temperature of the drone (especially the charging environment temperature), and expands the application environment of the drone. In addition, by lowering the temperature in the apron cabin 50, the waiting time for cooling between two flights can be reduced, thereby increasing the number of flights in the same time. In addition, although the outer air duct 21 is connected to the external environment, the air in the external environment cannot directly enter the inner air duct 11 (it can also be regarded as entering the apron cabin 50), but is blocked by the heat conduction system composed of the outer air duct heat sink 22, the semiconductor cooling plate 30 and the inner air duct heat sink 12, that is, the temperature control device 100 of the vehicle-mounted apron 200 also has the effect of preventing salt fog and dust.

[0061] In addition, an embodiment of the present invention further provides a vehicle, comprising the above-mentioned vehicle-mounted helipad 200 .

[0062] In this embodiment, the vehicle-mounted helipad 200 is fixedly arranged on the top of the vehicle, for example, by being fixedly connected to the luggage rack on the roof by screws or the like, thereby being indirectly fixed to the top of the vehicle. Alternatively, the vehicle-mounted helipad 200 is directly and partially embedded in the roof of the vehicle, so that the vehicle-mounted helipad 200 becomes a part of the roof of the vehicle. For another example, the vehicle-mounted helipad 200 is fixed on a position that does not affect the driver's line of sight, such as on the trunk.

[0063] Those skilled in the art should be able to understand that the vehicle has the same beneficial effects as the temperature adjustment device 100 of the vehicle-mounted helipad 200 .

[0064] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0065] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not restrictive. Although the utility model is described in detail with reference to the embodiments, it should be understood by those skilled in the art that any modification or equivalent replacement of the technical solution of the utility model does not deviate from the spirit and scope of the technical solution of the utility model, and should be included in the scope of the claims of the utility model.

Claims

1. The temperature regulating device of the vehicle-mounted helipad is characterized by: include: A first shell having an inner air duct, wherein the inner air duct is used to communicate with the apron cabin; A second housing having an external air duct, wherein the external air duct is used to communicate with the external environment; An inner air duct heat sink fixedly disposed in the inner air duct; An outer air duct heat sink fixedly arranged in the outer air duct, the outer air duct heat sink being fixedly connected to the inner air duct heat sink; A semiconductor cooling sheet sandwiched between the inner duct heat sink and the outer duct heat sink, one side of the semiconductor cooling sheet is bonded to the inner duct heat sink, and the other side is bonded to the outer duct heat sink, and is configured as follows: When a forward current is passed through the semiconductor cooling sheet, heat is transferred from the inner duct heat sink to the outer duct heat sink via the semiconductor cooling sheet. When a reverse current is passed through the semiconductor cooling sheet, heat is transferred from the outer duct heat sink to the inner duct heat sink via the semiconductor cooling sheet.

2. The temperature regulating device for the vehicle-mounted helipad according to claim 1, characterized in that: The external air duct is provided with an external air duct fan for accelerating air flow; A temperature sensor is provided on the outer air duct heat sink, and the outer air duct fan is turned on / off according to the temperature value of the outer air duct heat sink obtained by the temperature sensor; and / or, The rotation speed of the external air duct fan is adjusted according to the temperature value of the external air duct heat sink obtained by the temperature sensor.

3. The temperature regulating device for the vehicle-mounted helipad according to claim 2 is characterized in that: The external air duct is formed on the second shell with an external air duct air inlet facing the vehicle's driving direction and an external air duct air outlet away from the vehicle's driving direction. When the vehicle's driving speed exceeds a preset speed, the external air duct fan remains closed.

4. The temperature regulating device for the vehicle-mounted helipad according to claim 1, characterized in that: An inner duct fan is arranged in the inner duct to accelerate the air flow in the apron cabin.

5. The temperature regulating device for the vehicle-mounted helipad according to claim 1, characterized in that: The inner air duct is formed on the first shell with an inner air duct air inlet located on the side of the vehicle's driving direction and an inner air duct air outlet on the side away from the vehicle's driving direction, and the inner air duct air inlet and the inner air duct air outlet are both connected to the apron cabin.

6. The temperature regulating device for the vehicle-mounted helipad according to claim 2, characterized in that: A heat insulation layer is filled between the inner duct heat sink and the outer duct heat sink, a first accommodating cavity is opened on the heat insulation layer, the semiconductor refrigeration sheet is arranged in the first accommodating cavity, and the contact surfaces between the semiconductor refrigeration sheet and the inner duct heat sink and the outer duct heat sink are coated with thermal conductive silicone grease.

7. The temperature regulating device for the vehicle-mounted helipad according to claim 6, characterized in that: A second accommodating cavity is formed on the heat insulation layer, and the temperature sensor is arranged in the second accommodating cavity.

8. The temperature regulating device for the vehicle-mounted helipad according to any one of claims 1 to 7, characterized in that: The second shells are two and are symmetrically distributed on both sides of the first shell.

9. A vehicle-mounted helipad, characterized in that: include: apron compartment; as well as The temperature regulating device for the vehicle-mounted helipad according to any one of claims 1 to 8 is arranged on the helipad cabin.

10. A vehicle, characterized in that Comprising the vehicle-mounted helipad as claimed in claim 9.

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