Component heating device and electronic equipment

Abstract

The utility model provides a component heating device and electronic equipment, belongs to the technical field of electronic equipment, and particularly relates to the technical field of electronic equipment heating. The component heating device comprises a steam cavity VC metal seat and a heating piece, the VC metal base is hollow and filled with heat conduction fluid, the VC metal base is arranged on one side of the electronic equipment, the electronic equipment comprises components and a circuit board where the components are located, and the VC metal base and the electronic equipment form a closed cavity used for containing the components. The heating piece is located in the closed cavity and arranged on the inner surface of the VC metal base. According to the invention, the heating effect of the electronic equipment component in the low-temperature environment can be improved, the soaking property of the whole electronic component heated area is improved, the thermal stress of the component caused by non-soaking temperature is reduced, and the fault probability of the electronic component is further reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, specifically to the technical field of electronic equipment heating, and more particularly to a component heating device and electronic equipment. Background Art

[0002] With the rapid development of electronic equipment, the working environment in which electronic equipment is applicable is becoming more and more extensive. In order to ensure that electronic equipment can be used normally in harsh environments and has a certain degree of reliability, a heating device is required to heat electronic components such as chips in electronic equipment.

[0003] At present, in the prior art, when the ambient temperature is lower than the lower limit of the operating temperature of electronic equipment components, it is easy to cause the electronic equipment to fail to start or work properly. At this time, the electronic equipment needs to be heated. Generally, the low-temperature sensitive electronic components are heated before starting. The commonly used heating method is generally to add resistors on the circuit board on the electronic components to heat the electronic components through resistance heating.

[0004] However, the inventors have found that the prior art has at least the following technical problems: since resistors are used directly to heat the circuit board and the heat is conducted to the electronic components, the temperature of the electronic components will rise too quickly, the temperature distribution will be uneven, and thermal stress will be generated inside the components, which may easily lead to component failure and reduce the high-temperature reliability of the equipment. Utility Model Content

[0005] The present application provides a component heating device and an electronic device, which can improve the heating effect of electronic device components in a low-temperature environment, improve the thermal uniformity of the entire heated area of ​​the electronic component, reduce the thermal stress of the component caused by uneven temperature, and thus reduce the failure probability of the electronic component.

[0006] In a first aspect, the present application provides a component heating device, comprising: a steam chamber VC metal seat and a heating element;

[0007] The VC metal seat is hollow and filled with a heat-conducting fluid. The VC metal seat is arranged on one side of an electronic device. The electronic device includes components and a circuit board where the components are located. The VC metal seat and the electronic device form a closed cavity for accommodating the components.

[0008] The heating element is located in the closed cavity and is arranged on the inner surface of the VC metal seat.

[0009] In some possible implementations, a boss is provided on the inner side surface of the VC metal seat, and the boss is in contact with the component.

[0010] In some possible implementations, the boss and the VC metal seat are integrally formed, and the boss is hollow and filled with a heat-conducting fluid, and the hollow is connected to the hollow in the VC metal seat.

[0011] In some possible implementations, a heat conductor is disposed between the boss and the component, and two surfaces of the heat conductor are in contact with the boss and the component respectively.

[0012] In some possible implementations, the heating element is arranged at any position on the upper inner surface of the VC metal seat parallel to the component, and the surface area of ​​the heating element is smaller than the surface area of ​​the upper inner surface of the VC metal seat and larger than a preset lower limit of the bonding area.

[0013] In some possible implementations, the VC metal seat and at least a portion of the circuit board form the closed cavity.

[0014] In some possible implementations, the device further includes: a mounting base for fixing the VC metal base, wherein the mounting base is disposed on one side of the electronic device and connected to the VC metal base.

[0015] In some possible implementations, a plurality of through holes are formed on the VC metal seat, and the VC metal seat is connected to the mounting seat via a connector, and one end of the connector passes through the through holes and is connected to the mounting seat.

[0016] In some possible implementations, the electronic device has a plurality of components, and the VC metal seat is provided with a plurality of bosses, and the number of the bosses is equal to the number of components in the electronic device.

[0017] In a second aspect, an embodiment of the present application further provides an electronic device, comprising: a circuit board and components arranged on the circuit board and a component heating device as described in the first aspect.

[0018] The component heating device and electronic device provided by the present application use a VC metal seat to evenly and quickly transfer the heat generated by the heating element to a closed cavity, so that the components of the electronic device are evenly heated. While improving the heating quality and efficiency, it can also reduce the thermal stress of the components caused by uneven temperature, improve the durability of the equipment, and thus reduce the failure probability of the electronic device. In addition, when the electronic device is working in a high-temperature working environment, the component heating device can also quickly conduct the heat generated by the components through the VC metal seat to avoid high-temperature damage to the components and improve the high-temperature reliability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 Schematic diagram of the installation structure of the thin film heating plate and chip components in the prior art provided in the embodiment of the present application Figure 1 ;

[0021] Figure 2 Schematic diagram of the installation structure of the thin film heating plate and chip components in the prior art provided in the embodiment of the present application Figure 2 ;

[0022] Figure 3 Schematic diagram of the cross-sectional structure of the component heating device provided in the embodiment of the present application Figure 1 ;

[0023] Figure 4 A bottom view of a VC metal seat provided in an embodiment of the present application;

[0024] Figure 5 Schematic diagram of the cross-sectional structure of the component heating device provided in the embodiment of the present application Figure 2 ;

[0025] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0026] Reference numerals:

[0027] 101-film heating plate; 102-chip components; 103-PCB board;

[0028] 11-electronic equipment; 111-components; 112-circuit board; 113-power connector; 114-power cord;

[0029] 21-VC metal seat; 211-inner surface; 213-through hole; 212-boss;

[0030] 31- heating element;

[0031] 41- Closed cavity;

[0032] 51- heat conducting member;

[0033] 61-mounting seat;

[0034] 71-Connector. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] In this application, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "side" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operate in a specific position. Therefore, it should not be understood as a limitation to the present application.

[0038] Figure 1 Schematic diagram of the installation structure of the thin film heating plate and chip components in the prior art provided in the embodiment of the present application Figure 1 .

[0039] Figure 2 Schematic diagram of the installation structure of the thin film heating plate and chip components in the prior art provided in the embodiment of the present application Figure 2 .

[0040] like Figure 1 and Figure 2 As shown, the mounting structure includes a thin film heating plate 101 , chip components 102 and a PCB board 103 .

[0041] In the prior art, in addition to the heating method of adding resistors to the circuit board of electronic components, there are also methods such as Figure 1 The heating method of the thin film heating plate is shown.

[0042] like Figure 1As shown, the thin film heating plate 101 is directly pasted on the surface of the chip component 102. In a low temperature environment, when the thin film heating plate 101 is powered on, the heat will heat the chip component 102 through the upper surface of the chip component 102. This heating method easily leads to uneven temperature of the chip component 102, too fast temperature rise, and easy generation of thermal stress inside the chip component 102, and poor long-term reliability. In addition, when the chip component 102 works in a high temperature environment, the chip component 102 itself will generate heat. The chip component 102 with a large heat generation generally needs to dissipate heat through the upper surface. Since the thin film heating plate 101 is pasted on the upper surface of the chip component 102, this not only increases the surface thermal resistance of the chip component 102, but also causes the heat dissipation effect of the chip component 102 to deteriorate, thereby reducing the high temperature reliability of the chip component 102. Therefore, how to ensure that a component heating device can improve the heating efficiency of the chip component 102 in a low temperature environment while reducing the heat dissipation efficiency of the chip component 102 in a high temperature environment or when it works by itself has become a problem that needs to be solved urgently.

[0043] In addition, if Figure 2 As shown, the film heating plate 101 is also pasted on the back of the PCB board 103 corresponding to the components. In a low temperature environment, when the film heating plate 101 is powered on, the heat of the film heating plate 101 passes through the PCB board 103 to heat the components. However, the thermal conductivity of the PCB board 103 is poor, and the heat generated by the film heating plate 101 cannot be effectively applied to the components, resulting in a poor heating effect.

[0044] In this embodiment, high temperature or low temperature generally refers to possible extreme temperatures at which the electronic product can operate normally. For example, the high temperature may be 60° C. and the low temperature may be minus 40° C.

[0045] In order to solve the above technical problems, the embodiments of the present application provide the following technical concepts for solving the problems: placing the heating element on a metal seat made of a VC (Vapor Chamber) heat spreader or a metal seat with the same structure as the inside of the VC heat spreader (hereinafter referred to as the VC metal seat), and then utilizing the high thermal conductivity and heat distribution properties of the VC metal seat to achieve rapid and uniform heating of the components and improve the heating efficiency. At the same time, after the VC metal seat is placed on the circuit board, a closed cavity is formed, and the components are placed in the cavity for operation. Due to the heat distribution in the entire cavity area, thermal stress caused by uneven temperature of the components is avoided, thereby reducing the probability of failure of the components.

[0046] Figure 3 Schematic diagram of the cross-sectional structure of the component heating device provided in the embodiment of the present application Figure 1 .

[0047] Figure 4A bottom view of the VC metal seat provided in an embodiment of the present application.

[0048] Figure 5 Schematic diagram of the cross-sectional structure of the component heating device provided in the embodiment of the present application Figure 2 .

[0049] like Figure 3 and Figure 4 As shown, an embodiment of the present application provides a component heating device, which can be used to uniformly heat a component 111 in an electronic device 11. Specifically, the component heating device includes: a steam chamber VC metal seat 21 and a heating element 31.

[0050] The VC metal seat 21 is hollow and filled with a heat-conducting fluid. The VC metal seat 21 is disposed on one side of the electronic device 11. The electronic device 11 includes components 111 and a circuit board 112 where the components 111 are located. The VC metal seat 21 and the electronic device 11 form a closed cavity 41 for accommodating the components. The heating element 31 is located in the closed cavity 41 and is disposed on the inner surface 211 of the VC metal seat 21.

[0051] In this embodiment, there is no restriction on the type and shape of the components 111 and the circuit board 112. For example, the components 111 may be chip components. The circuit board 112 may be a PCB board, and the circuit board 112 may be mounted on the device structure base. The heating element 31 may be a thin film heating plate, a resistance heating plate, or other objects used to heat electronic components. In this embodiment, the heating element is a thin film heating plate.

[0052] In this embodiment, the VC metal seat 21 has a hollow structure, which is the same as the structure in the VC (Vapor Chamber) heat spreader. Generally, in order to make the VC heat spreader have better anti-deformation performance, in some cases, the VC heat spreader has a hollow structure inside, and support points are evenly distributed on the inner surface of the hollow structure to prevent the outer wall of the VC heat spreader from collapsing.

[0053] In an optional embodiment of the present application, the VC metal seat 21 can be made of copper, and has a hollow structure formed by fine structures such as capillary structure and wick structure. The heat transfer fluid filled in the hollow structure can be a liquid working fluid, for example: the heat transfer fluid can be pure water.

[0054] In this embodiment, the specific external structure of the VC metal seat 21 is not limited, and those skilled in the art can set it according to specific design requirements. As an optional embodiment of the present application, the VC metal seat can be set to an inverted "concave" shape, "J" shape or inverted "U" shape. The VC metal seat 21 of this type of structure is convenient for forming a closed cavity 41 with the electronic device 11. In addition, when the closed cavity 41 is formed between the VC metal seat 21 and the electronic device 11, the inner surface 211 of the VC metal seat 21 located in the closed cavity 41 includes the upper surface and the side surface connected to the upper surface. At this time, the heating element 31 can be set on the upper surface of the VC metal seat 21, or it can also be set on the side surface of the VC metal seat 21. The specific shape and setting position of the heating element 31 can be adjusted according to the actual situation of the component design.

[0055] In an optional embodiment of the present application, the heating element 31 can be attached to any position of the inner surface 211 of the VC metal seat 21 located in the closed cavity 41. There is no special requirement for the shape of the heating element 31, and it is only necessary to satisfy that the heating element 31 and the VC metal seat 21 have a sufficient bonding area. This reduces the design difficulty of the entire component heating device and improves the versatility of the heating element 31 for different devices. Of course, those skilled in the art can also achieve the connection between the heating element 31 and the VC metal seat 21 by using other connection methods other than bonding, for example: other connection methods can be threaded connection or welding.

[0056] In this embodiment, no matter where the heating element 31 is disposed on the inner surface 211 of the closed cavity 41 , the heating element 31 can uniformly heat the component 111 through the closed cavity 4 .

[0057] In this embodiment, the heating principle of the heating element 31 is the same as that in Figure 1 and Figure 2 The heating principle in the structure shown is similar, so this embodiment will not be repeated here.

[0058] In this embodiment, the heat transfer fluid is pure water as an example, and the specific implementation principle of the entire component heating device is described as follows: when the electronic device 11 works in a low temperature environment, the heating element 31 starts to work, and the heat generated by the heating element 31 enters the inside of the VC metal seat 21 through heat conduction from the external high temperature area (i.e., the area where the working heating element 31 is located), and the pure water close to the high temperature area absorbs the heat and quickly vaporizes, taking away a large amount of heat at the same time. Then, by using the latent heat of water vapor, when the water vapor in the VC metal seat 21 diffuses from the high pressure area to the low pressure area (i.e., the low temperature area), i.e., the area far away from the heating element 31 in the closed cavity 41, the water vapor will quickly condense into liquid and release heat energy when it contacts the inner wall of the VC metal seat 21 with a lower temperature, and the heat energy will uniformly heat the closed cavity 41, and then the water condensed into liquid in the VC metal seat 21 will return to the high temperature area through the capillary force of the microstructure, thereby completing a heat conduction cycle in the VC metal seat 21, and transferring the heat to the closed cavity 41, and the components 111 located in the closed cavity 41 will be uniformly heated. In this way, a two-way circulating heat conduction system with pure water and water vapor coexisting is formed, so that the heating effect of the entire component heating device is better. Similarly, when the component 111 works in a high temperature environment, the heating element 31 stops heating, and the heat will be circulated through the heat conduction of the VC metal seat 21 to quickly achieve the purpose of heat dissipation, so that the heat dissipation effect of the entire component heating device is better.

[0059] In summary, the component heating device provided in the embodiment of the present application utilizes the VC metal seat 21 to uniformly and quickly transfer the heat generated by the heating element 31 to the closed cavity 41, so that the components 111 of the electronic device 11 are uniformly heated. While improving the heating effect, it can also reduce the thermal stress of the components 111 caused by uneven temperature, improve the durability of the electronic device 11, and thus reduce the failure probability of the electronic device 11. In addition, when the electronic device 11 is working in a high-temperature working environment, the component heating device can also quickly conduct the heat generated by the components 111 through the VC metal seat 21, thereby avoiding high-temperature damage to the components 111 and improving the high-temperature reliability of the electronic device 11.

[0060] Since the heat conducting medium in the closed cavity 41 is air, in order to further improve the heat conduction performance between the VC metal seat 21 and the component 111. In an optional embodiment of the present application, a boss 212 is provided on the inner side of the VC metal seat 21, and the boss 212 is in contact with the component 111.

[0061] The difference from the above embodiment is that in this embodiment, heat can be directly transferred more quickly between the VC metal seat 21 and the component 111 through the boss 212. In this embodiment, the shape of the boss 212 and the specific value of the contact area between the boss and the component 111 are not limited, and those skilled in the art can set them according to the specific design requirements of the electronic device. For example, the boss 212 is set to be the same rectangle or circle as the component 111.

[0062] Based on the above embodiment, in an optional embodiment of the present application, the boss 212 is integrally formed with the VC metal seat 21 , that is, the boss 212 is also hollow inside and filled with heat-conducting fluid, and the hollow is connected with the hollow inside the VC metal seat 21 .

[0063] In this embodiment, when the electronic device 11 works in a low temperature environment, the boss 212 can conduct heat to the component 111 more quickly, and the heating effect is better. When the electronic device 11 works in a high temperature environment, the heat generated by the component 111 can also be quickly conducted outward, improving the heat dissipation effect.

[0064] Furthermore, when the heat dissipation operation is performed on the component 111, the component 11 contacts the metal seat 2 through the boss 212, and the heat generated on the component 111 can be dissipated through the boss 212 and the VC metal seat 21. At this time, in order to improve the thermal conductivity of the contact surface between the boss 212 and the component 111. In an optional embodiment of the present application, a heat conducting member 51 is provided between the boss 21 and the component 111, and the two surfaces of the heat conducting member 51 are in contact with the boss 212 and the component 111 respectively.

[0065] In this embodiment, the heat conducting member 51 may be a heat conducting sheet, a heat conducting pad, a heat conducting paste, a heat conducting silicone grease or the like made of a material having a higher heat conductivity than the VC metal seat 21, so that the heat of the component 101 is quickly transferred to the VC metal seat 21 through the heat conducting member 51 and the boss 212 for heat dissipation. At the same time, the VC metal seat 21 is in direct contact with the upper surface of the component 111 through the boss 212, thereby improving the heat dissipation performance. At the same time, the high temperature reliability of the electronic device 11 is also improved.

[0066] Based on the above embodiments, it can be known that the heating element 31 can be disposed on the upper surface of the VC metal seat 21, or can also be disposed on the side surface of the VC metal seat 21. However, in some embodiments, if the heating element 31 is disposed on the side surface of the upper inner surface 211 of the VC metal seat 21, in order to ensure the heating quality and efficiency of the heating element 31, the height dimension of the metal seat 2 needs to be increased, which is not conducive to the development of the electronic device 11 towards a lighter and thinner design.

[0067] Therefore, in order to avoid the above situation, in an optional embodiment of the present application, the heating element 31 is arranged at any position on the upper inner surface 211 of the VC metal seat 21 parallel to the components, and the surface area of ​​the heating element 31 is smaller than the surface area of ​​the upper inner surface of the VC metal seat and greater than the preset lower limit of the bonding area.

[0068] In this embodiment, any position on the upper inner surface 211 of the VC metal seat 21 parallel to the components means that the heating element 31 is installed on the upper surface of the upper inner surface 211 of the VC metal seat 21 .

[0069] On the basis of the above embodiment, as an optional embodiment of the present application, the VC metal seat 21 and at least a portion of the circuit board 112 form a closed cavity 41 .

[0070] The VC metal seat 21 can form the above-mentioned closed cavity 41 with the entire circuit board 112. In this case, the length and width dimensions of the VC metal seat 21 are the same as the length and width dimensions of the circuit board 112; or, the VC metal seat 21 can also form the above-mentioned closed cavity 41 with a part of the circuit board 112. In this case, the length and width dimensions of the VC metal seat 21 are smaller than the length dimension of the circuit board 112.

[0071] like Figure 4 and Figure 5 As shown, in order to improve the stability, reliability and sealing of the closed cavity 41, the component heating device provided in an optional embodiment of the present application further includes: a mounting seat 61 for fixing the VC metal seat 21, the mounting seat 61 is arranged on one side of the electronic device 11, and is connected to the VC metal seat 21. The connection between the mounting seat 61 and the VC metal seat 21 can be bonding.

[0072] However, in order to make the connection between the mounting seat 61 and the VC metal seat 21 more secure and adapt to more working scenarios of the electronic device 11. Based on the above embodiment, in an optional embodiment of the present application, a plurality of through holes 213 are provided on the VC metal seat 21, and the VC metal seat 21 is connected to the mounting seat 61 through a connector 71, and one end of the connector 71 passes through the through hole 213 and is connected to the mounting seat 61.

[0073] In this embodiment, the number of through holes 213 is 4, and the through holes 213 are respectively located near the edge of the VC metal seat 21 for the connection member 71 to pass through. The connection member 71 can be an object or material that can achieve a fixed connection, such as a screw, a bolt, a stud or an adhesive. It should be noted that in order to prevent the surface of the connection member 71 from abutting against the surface of the electronic device 11 or the circuit board 112, which affects the stability and reliability of the closed cavity 41, in this embodiment, the through hole 213 can be a countersunk hole, so that the connection member 71 can be flush with the surface of the VC metal seat 21 after installation, and fit with the circuit board 112.

[0074] like Figure 5 As shown, in order to enable the component heating device to be used for heating an electronic device 11 including a plurality of components 111, based on the above embodiment, in an optional embodiment of the present application, a component heating device is further provided. Figure 3 The difference of the component heating device in the embodiment shown is that the number of components 111 of the electronic device 11 is multiple, and accordingly, a plurality of bosses 212 are also provided on the VC metal seat 21, and the number of the bosses 212 is equal to the number of components of the electronic device. The specific number and position of the bosses 212 are not limited in this embodiment. The specific design can be adaptively performed by those skilled in the art according to the position and size of the components 111 in the electronic device 11. For example: Figure 5 As shown, the number of components 111 in the electronic device 11 is 2, and the number of bosses 212 is also designed to be 2.

[0075] like Figure 5 As shown, in order to achieve a better heating effect for the entire component heating device, in an optional embodiment of the present application, the heating element 31 can be arranged on the upper surface of the inner side surface of the VC metal seat 21 between the two bosses 212 .

[0076] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0077] like Figure 6 As shown, the electronic device 11 provided in this embodiment may include: components 111 and a circuit board 112, and the electronic device 11 may also include the component heating device in any one of the above embodiments.

[0078] It should be noted that the electronic device 11 may also include a power connector 113 , and the power connector 113 may be electrically connected to the component 111 via a power line 114 , so that the electronic device 11 may work normally.

[0079] In addition, the specific results and use effects of the component heating device included in the electronic device 11 in this embodiment have been described in detail in the above embodiments, so they will not be repeated in this embodiment.

[0080] The electronic device 11 provided in this embodiment is provided with a component heating device for heating and dissipating heat for the component 111. The specific implementation principle is as follows:

[0081] When the heating element 31 is powered on, it generates heat, which causes the heat-conducting medium in the high-temperature zone of the VC metal seat 21 to absorb heat and vaporize rapidly. The water vapor brings the heat to the low-temperature zone of the VC metal seat 21. In this process, the heat is continuously released, so that the temperature in the closed cavity 41 is stably and evenly increased. When the water vapor passes through the boss 212, the heat is quickly conducted to the component 111 through the heat-conducting element 51, so that the component 111 is quickly heated. After the heat-conducting medium condenses, it returns to the high-temperature zone through the capillary action in the VC metal seat to continue to be vaporized and flow to the low-temperature zone. In this cycle, the temperature in the closed cavity 41 gradually rises, so that each position of the component 111 is also evenly heated until the component 111 can work normally. This not only avoids the thermal stress of the component 111 caused by uneven heating, but also ensures the heating quality and heating efficiency of the component 111.

[0082] When the ambient temperature of the electronic device 11 is too high, after the heating element 31 is powered off, the heat generated by the component 111 can be quickly conducted to the boss 212 by the heat conducting element 51, and then conducted to the VC metal seat 21 by the boss 212, and finally quickly dissipated by the VC metal seat 21. The heat dissipation effect of the electronic device 11 is improved, thereby improving the high temperature reliability of the electronic device 11.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A component heating device, characterized in that: include: Steam chamber VC metal seat and heating element; The VC metal seat is hollow and filled with a heat-conducting fluid. The VC metal seat is arranged on one side of an electronic device. The electronic device includes components and a circuit board where the components are located. The VC metal seat and the electronic device form a closed cavity for accommodating the components. The heating element is located in the closed cavity and is arranged on the inner surface of the VC metal seat.

2. The component heating device according to claim 1, characterized in that: A boss is arranged on the inner side surface of the VC metal seat, and the boss is in contact with the component.

3. The component heating device according to claim 2, characterized in that: The boss is integrally formed with the VC metal seat, and the boss is hollow and filled with a heat-conducting fluid, and the hollow is communicated with the hollow in the VC metal seat.

4. The component heating device according to claim 2, characterized in that: A heat conducting member is arranged between the boss and the component, and two surfaces of the heat conducting member are in contact with the boss and the component respectively.

5. The component heating device according to claim 1, characterized in that: The heating element is arranged at any position on the upper inner surface of the VC metal seat parallel to the component, and the surface area of ​​the heating element is smaller than the surface area of ​​the upper inner surface of the VC metal seat and larger than the preset lower limit of the bonding area.

6. The component heating device according to claim 1, characterized in that: The VC metal seat and at least a portion of the circuit board form the closed cavity.

7. The component heating device according to any one of claims 1 to 6, characterized in that: Also includes: A mounting base for fixing the VC metal base, wherein the mounting base is arranged on one side of the electronic device and connected to the VC metal base.

8. The component heating device according to claim 7, characterized in that: The VC metal seat is provided with a plurality of through holes, and the VC metal seat is connected to the mounting seat via a connecting piece, and one end of the connecting piece passes through the through hole and is connected to the mounting seat.

9. The component heating device according to claim 1, characterized in that: There are multiple components in the electronic device, and multiple bosses are arranged on the VC metal seat, and the number of the bosses is equal to the number of components in the electronic device.

10. An electronic device, characterized in that: include: A circuit board and components arranged on the circuit board, and a component heating device as claimed in any one of claims 1 to 9.

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