Circuit board heat dissipation device

Abstract

The utility model discloses a circuit board heat dissipation device, and relates to the technical field of heat dissipation devices, the circuit board heat dissipation device comprises a circuit board assembly, the circuit board assembly comprises a fixed housing, the bottom of the fixed housing is fixedly connected with a bottom plate, the fixed housing is internally provided with a circuit board main body, and the bottom of the circuit board main body is provided with a heat dissipation mechanism. According to the utility model, heat on the surface of the circuit board main body is directly absorbed and transmitted through the second heat conducting plate, then heat generated by the circuit board main body is quickly dissipated through the connecting inner plate, the connecting outer plate, the first heat conducting plate and the heat dissipation plate, and then the surface of the heat dissipation plate is ventilated through the ventilator main body. And the heat in the circuit board main body and the fixed shell is quickly dissipated.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a circuit board heat dissipation equipment. Background Art

[0002] Circuit board cooling equipment can effectively reduce the temperature of circuit boards in electronic equipment and ensure the stability and reliability of circuit components. Common circuit board cooling equipment includes heat sinks, cooling fans, heat pipes, etc.

[0003] However, in the prior art, when a circuit board heat dissipation device is dissipating heat for a circuit board, the heat sink is generally in contact with the air inside the device, and the heat generated by the circuit board is transferred to the heat sink through the air as a conductive medium, and then the heat is dissipated outward through the heat sink to reduce the temperature of the circuit board. The method of transferring heat through air as a medium requires the circuit board to heat the air first, and then the air transfers the heat, which will reduce the heat dissipation efficiency of the circuit board and make it inconvenient for the circuit board to quickly dissipate heat. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that the method of transferring heat through air as a medium in the prior art requires the circuit board to heat the air first and then transfer the heat through the air, which will lead to reduced heat dissipation efficiency of the circuit board and inconvenience for the circuit board to quickly dissipate heat, and to propose a circuit board heat dissipation device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a circuit board heat dissipation device, including a circuit board assembly, the circuit board assembly including a fixed shell, the bottom of the fixed shell is fixedly connected with a base plate, and the circuit board body is installed inside the fixed shell, the bottom of the circuit board body is installed with a heat dissipation mechanism, the heat dissipation mechanism includes a No. 1 heat conducting plate and a connecting outer plate, the No. 1 heat conducting plate is fixedly connected to the upper part of the base plate, and the bottom of the No. 1 heat conducting plate is fixedly connected with a heat dissipation plate, the connecting outer plate is fixedly connected to the upper part of the No. 1 heat conducting plate, and a connecting inner plate is plugged into the connecting outer plate, the upper part of the connecting inner plate is fixedly connected with a No. 2 heat conducting plate, and the No. 2 heat conducting plate is fitted with the bottom of the circuit board body.

[0006] Preferably, a ventilation mechanism is fixedly connected to the side of the circuit board assembly, and the ventilation mechanism includes a fixing frame, the fixing frame is fixedly connected to the side of the fixed shell, and a ventilator body is fixedly connected to the bottom of the fixing frame.

[0007] Preferably, the connecting inner plate is tightly fitted to the inner wall of the connecting outer plate, and the heat dissipation plate penetrates the surface of the bottom plate.

[0008] Preferably, a plurality of heat dissipation holes are arranged on the surface of the heat dissipation plate, and the plurality of heat dissipation holes are evenly distributed on the surface of the heat dissipation plate.

[0009] Preferably, a connecting head is fixedly connected to the upper portion of the No. 1 heat conducting plate, a threaded sleeve is rotatably connected to the upper portion of the connecting head, and a threaded support rod is threadedly connected to the inner portion of the threaded sleeve.

[0010] Preferably, the upper portion of the threaded support rod is fixedly connected to a connecting plate, the upper portion of the connecting plate is fixedly connected to a telescopic rod, the telescopic rod is fixedly connected to the bottom of the second heat conducting plate, and a spring is provided on the surface of the telescopic rod, one end of the spring is fixedly connected to the upper portion of the connecting plate, and the other end of the spring is fixedly connected to the bottom of the second heat conducting plate.

[0011] Compared with the prior art, the advantages and positive effects of the utility model are:

[0012] 1. In the utility model, the heat on the surface of the circuit board body is directly absorbed and transferred through the second heat conducting plate, and then the heat generated by the circuit board body is quickly dissipated through the connecting inner plate, the connecting outer plate, the first heat conducting plate and the heat dissipation plate, and then the surface of the heat dissipation plate is ventilated through the ventilator body to quickly dissipate the heat inside the circuit board body and the fixed shell.

[0013] 2. In the utility model, the threaded support rod is pushed upward by rotating the threaded sleeve, so that the second heat conducting plate is closely fitted with the surface of the circuit board body, so that the second heat conducting plate can fully absorb and transfer the heat generated by the circuit board body, and the heat transferred by the air inside the fixed shell is absorbed and transferred again by the first heat conducting plate, so as to fully and quickly dissipate heat and cool the circuit board body.

[0014] 3. In the utility model, when the threaded support rod pushes the connecting plate and the second heat conducting plate to move upward, the spring and the telescopic rod are compressed, and the reaction force of the spring and the telescopic rod to restore the deformation makes the second heat conducting plate fit tightly with the bottom of the circuit board body, thereby avoiding excessive pushing force of the second heat conducting plate on the circuit board body, causing deformation and damage of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional structural schematic diagram of a circuit board heat dissipation device is proposed for the utility model;

[0016] Figure 2 The utility model provides a schematic diagram of the front view structure of a circuit board heat dissipation device;

[0017] Figure 3 The utility model provides a schematic diagram of the internal three-dimensional structure of a fixed shell in a circuit board heat dissipation device;

[0018] Figure 4 The utility model provides a side structural schematic diagram of a heat dissipation mechanism in a circuit board heat dissipation device.

[0019] Legend: 1. Circuit board assembly; 11. Fixed shell; 12. Circuit board body; 13. Bottom plate; 2. Ventilation mechanism; 21. Fixed frame; 22. Fan body; 3. Heat dissipation mechanism; 31. Heat dissipation plate; 32. Heat conducting plate No. 1; 33. Connecting outer plate; 34. Connecting inner plate; 35. Heat conducting plate No. 2; 36. Connecting head; 37. Threaded sleeve; 38. Threaded support rod; 39. Connecting plate; 310. Telescopic rod; 311. Spring. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] Embodiment 1: Figure 1 - Figure 4 As shown, the utility model provides a circuit board heat dissipation device, including a circuit board assembly 1, the circuit board assembly 1 includes a fixed shell 11, the bottom of the fixed shell 11 is fixedly connected to a bottom plate 13, and a circuit board body 12 is installed inside the fixed shell 11, and a heat dissipation mechanism 3 is installed at the bottom of the circuit board body 12, and the heat dissipation mechanism 3 includes a first heat conducting plate 32 and a connecting outer plate 33, the first heat conducting plate 32 is fixedly connected to the upper part of the bottom plate 13, and the bottom of the first heat conducting plate 32 is fixedly connected to a heat dissipation plate 31, the connecting outer plate 33 is fixedly connected to the upper part of the first heat conducting plate 32, and the connecting outer plate 33 is connected to the inner part of the connecting outer plate 33. A connecting inner plate 34 is plugged in the part, and a second heat conducting plate 35 is fixedly connected to the upper part of the connecting inner plate 34. The second heat conducting plate 35 is fitted with the bottom of the circuit board body 12. A ventilation mechanism 2 is fixedly connected to the side of the circuit board assembly 1. The ventilation mechanism 2 includes a fixing frame 21, and the fixing frame 21 is fixedly connected to the side of the fixed shell 11, and a fan body 22 is fixedly connected to the bottom of the fixing frame 21. The connecting inner plate 34 is tightly fitted with the inner wall of the connecting outer plate 33. The heat dissipation plate 31 passes through the surface of the bottom plate 13. A plurality of heat dissipation holes are arranged on the surface of the heat dissipation plate 31, and the plurality of heat dissipation holes are evenly distributed on the surface of the heat dissipation plate 31.

[0023] The specific settings and functions of this embodiment are described in detail below. After the circuit board body 12 generates a large amount of heat during operation, the heat on the surface of the circuit board body 12 is directly absorbed and transferred through the second heat conducting plate 35, and then the heat generated by the circuit board body 12 is quickly dissipated through the connecting inner plate 34, the connecting outer plate 33, the first heat conducting plate 32 and the heat dissipation plate 31. Then, the surface of the heat dissipation plate 31 is ventilated through the ventilator body 22, so that the heat inside the circuit board body 12 and the fixed shell 11 can be quickly dissipated.

[0024] Embodiment 2: Figure 1 and Figure 4 As shown, a connecting head 36 is fixedly connected to the upper part of the No. 1 heat conducting plate 32, a threaded sleeve 37 is rotatably connected to the upper part of the connecting head 36, a threaded support rod 38 is threadedly connected to the inner part of the threaded sleeve 37, a connecting plate 39 is fixedly connected to the upper part of the threaded support rod 38, a telescopic rod 310 is fixedly connected to the upper part of the connecting plate 39, the telescopic rod 310 is fixedly connected to the bottom of the No. 2 heat conducting plate 35, and a spring 311 is arranged on the surface of the telescopic rod 310, one end of the spring 311 is fixedly connected to the upper part of the connecting plate 39, and the other end of the spring 311 is fixedly connected to the bottom of the No. 2 heat conducting plate 35.

[0025] The effect achieved by the entire embodiment is that when the No. 2 heat conducting plate 35 is installed, the threaded support rod 38 is pushed upward by rotating the threaded sleeve 37, so that the No. 2 heat conducting plate 35 is tightly fitted with the surface of the circuit board body 12, so that the No. 2 heat conducting plate 35 can fully absorb and transfer the heat generated by the circuit board body 12, and the heat transferred by the air inside the fixed shell 11 through the No. 1 heat conducting plate 32 is absorbed and transferred again, so that the circuit board body 12 is fully and quickly dissipated and cooled. When the threaded support rod 38 pushes the connecting plate 39 and the No. 2 heat conducting plate 35 to move upward, the spring 311 and the telescopic rod 310 are compressed, and the reaction force of the spring 311 and the telescopic rod 310 to restore the deformation makes the No. 2 heat conducting plate 35 and the bottom of the circuit board body 12 fit tightly, avoiding the No. 2 heat conducting plate 35 from pushing the circuit board body 12 too much, causing the circuit board body 12 to be deformed and damaged.

[0026] The use method and working principle of the device: after the circuit board body 12 generates a large amount of heat during operation, the heat on the surface of the circuit board body 12 is directly absorbed and transferred through the second heat conducting plate 35, and then the heat generated by the circuit board body 12 is quickly dissipated through the connecting inner plate 34, the connecting outer plate 33, the first heat conducting plate 32 and the heat dissipation plate 31, and then the surface of the heat dissipation plate 31 is ventilated through the ventilator body 22;

[0027] When installing the second heat conducting plate 35, the threaded support rod 38 is pushed upward by rotating the threaded sleeve 37, so that the second heat conducting plate 35 is closely attached to the surface of the circuit board body 12, so that the second heat conducting plate 35 can fully absorb and transfer the heat generated by the circuit board body 12, and the heat transferred by the air inside the fixed housing 11 is absorbed and transferred again by the first heat conducting plate 32;

[0028] When the threaded support rod 38 pushes the connecting plate 39 and the second heat conducting plate 35 to move upward, the spring 311 and the telescopic rod 310 are compressed, and the reaction force of the spring 311 and the telescopic rod 310 to restore the deformation makes the second heat conducting plate 35 fit tightly with the bottom of the circuit board body 12.

[0029] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any technician familiar with the profession may use the technical contents disclosed above to change or modify them into equivalent embodiments with equivalent changes and apply them to other fields. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A circuit board heat dissipation device, comprising a circuit board assembly (1), the circuit board assembly (1) comprising a fixed housing (11), a bottom plate (13) being fixedly connected to the bottom of the fixed housing (11), and a circuit board body (12) being installed inside the fixed housing (11), characterized in that: A heat dissipation mechanism (3) is installed at the bottom of the circuit board body (12), and the heat dissipation mechanism (3) comprises a first heat conducting plate (32) and a connecting outer plate (33), the first heat conducting plate (32) is fixedly connected to the upper part of the bottom plate (13), and a heat dissipation plate (31) is fixedly connected to the bottom of the first heat conducting plate (32), the connecting outer plate (33) is fixedly connected to the upper part of the first heat conducting plate (32), and a connecting inner plate (34) is inserted into the connecting outer plate (33), and a second heat conducting plate (35) is fixedly connected to the upper part of the connecting inner plate (34), and the second heat conducting plate (35) is bonded to the bottom of the circuit board body (12).

2. A circuit board heat dissipation device according to claim 1, characterized in that: A ventilation mechanism (2) is fixedly connected to the side of the circuit board assembly (1), and the ventilation mechanism (2) comprises a fixing frame (21), the fixing frame (21) is fixedly connected to the side of the fixed housing (11), and a ventilator body (22) is fixedly connected to the bottom of the fixing frame (21).

3. A circuit board heat dissipation device according to claim 1, characterized in that: The connecting inner plate (34) is tightly fitted to the inner wall of the connecting outer plate (33), and the heat dissipation plate (31) penetrates the surface of the bottom plate (13).

4. A circuit board heat dissipation device according to claim 1, characterized in that: The surface of the heat dissipation plate (31) is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are evenly distributed on the surface of the heat dissipation plate (31).

5. The circuit board heat dissipation device according to claim 1, characterized in that: The upper portion of the first heat conducting plate (32) is fixedly connected to a connector (36), the upper portion of the connector (36) is rotatably connected to a threaded sleeve (37), and the inner portion of the threaded sleeve (37) is threadably connected to a threaded support rod (38).

6. A circuit board heat dissipation device according to claim 5, characterized in that: The threaded support rod (38) is fixedly connected to a connecting plate (39) at its upper portion, the connecting plate (39) is fixedly connected to a telescopic rod (310) at its upper portion, the telescopic rod (310) is fixedly connected to the bottom of the second heat conducting plate (35), and a spring (311) is provided on the surface of the telescopic rod (310), one end of the spring (311) is fixedly connected to the upper portion of the connecting plate (39), and the other end of the spring (311) is fixedly connected to the bottom of the second heat conducting plate (35).

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