Lead frame of light emitting diode
By designing a light emitting diode wire frame including a wire substrate, a positive electrode lead, a negative electrode lead, a pin line, a heat dissipation plate and a heat conduction block, the problem of poor heat dissipation in the prior art is solved, and more efficient heat dissipation and the effect of extending the service life of the LED chip is achieved.
Patent Information
- Application Number
- CN202421717136.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-19
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-19
AI Technical Summary
The existing light emitting diode wire frames have poor heat dissipation effect, resulting in a low service life of LED chips.
A wire frame including a wire substrate, a positive electrode lead, a negative electrode lead, a pin line, a heat dissipation plate and a heat conduction block is designed. Through the joint action of the heat dissipation groove and the heat dissipation plate, effective heat dissipation is achieved in combination with the gaps in the T-shaped notch groove.
It improves heat dissipation efficiency, extends the service life of LED chips, and achieves effective heat transfer and heat dissipation through the combination of thermal grease and thermal blocks.
Smart Images
Figure CN222840040U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of light emitting diodes, in particular to a lead frame of a light emitting diode. Background Art
[0002] LED lead frames are electronic components used to support and connect LED chips, with a variety of design features and manufacturing methods. These lead frames are not only highly practical in structure, but also use advanced technology in the manufacturing process to ensure the performance and reliability of LED devices.
[0003] In the prior art, the lead frame of the light emitting diode has a simple structure and poor heat dissipation effect, which easily leads to a short service life of the LED chip. Utility Model Content
[0004] The utility model aims to provide a lead frame of a light emitting diode to overcome the above problems or at least partially solve the above problems.
[0005] In order to achieve the above-mentioned purpose, the technical solution of the utility model is specifically implemented as follows:
[0006] The utility model provides a lead frame of a light emitting diode, comprising a lead substrate, wherein a packaging notch for packaging an LED chip is provided on the upper side of the lead substrate, and a positive electrode conductor and a negative electrode conductor connected to the positive and negative electrodes of the LED chip are respectively fixed in the packaging notch, a pin wire is also fixedly connected to the lead substrate, and the pin wire is respectively connected to the positive electrode conductor and the negative electrode conductor, a T-shaped notch groove is provided on the lower side of the lead substrate, and a heat sink is fixedly connected in the upper part of the T-shaped notch groove, a heat sink is provided in the lower part of the lead substrate, and a plurality of heat conduction blocks are arranged between the heat conduction groove and the T-shaped notch groove, and the heat conduction blocks are embedded and fixed in the lead substrate and contact the upper side of the heat sink.
[0007] As a further solution of the utility model, the upper side surfaces of the positive electrode conductor and the negative electrode conductor are both provided with arc-shaped spherical surfaces.
[0008] As a further solution of the utility model, the heat dissipation grooves are provided in multiple groups, and the multiple heat dissipation grooves are stacked up and down, and the heat dissipation grooves are also filled with thermal conductive silicone grease.
[0009] As a further solution of the utility model, two circular grooves are provided inside the conductor substrate, and the positive electrode conductor and the negative electrode conductor are fixedly connected in the circular grooves.
[0010] The utility model provides a lead frame for a light emitting diode, which has the beneficial effects of improving the heat dissipation efficiency through the combined effect of the heat dissipation groove and the heat dissipation plate, and ensuring effective ventilation and heat dissipation of the heat conduction frame through the gap at the bottom of the T-shaped notch groove, further improving the heat dissipation efficiency, and having a simple structure, ensuring the service life of the LED chip, and having a good use effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0012] Figure 1 It is a structural schematic diagram of the utility model.
[0013] Figure 2 It is a structural schematic diagram of the conductor substrate in the utility model.
[0014] Figure 3 It is the positive electrode conductor in the utility model.
[0015] Figure 4 It is the negative electrode conductor in the utility model.
[0016] Figure 5 It is a structural schematic diagram of the heat conducting block in the utility model.
[0017] In the figure: 1. Wire substrate; 2. Positive conductor; 3. Negative conductor; 4. Pin line; 5. Heat conduction block; 6. Heat sink; 11. Package notch; 12. Heat sink; 13. T-notch groove; 14. Round groove. DETAILED DESCRIPTION
[0018] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0019] See also Figure 1-5A lead frame of a light-emitting diode provided by an embodiment of the utility model comprises a lead substrate 1, a packaging notch 11 for packaging an LED chip is provided on the upper side of the lead substrate 1, and a positive conductor 2 and a negative conductor 3 connected to the positive and negative electrodes of the LED chip are fixed in the packaging notch 11 respectively, a pin line 4 is also fixedly connected to the lead substrate 1, and the pin line 4 is respectively connected to the positive conductor 2 and the negative conductor 3, a T-shaped notch groove 13 is provided on the lower side of the lead substrate 1, and a heat sink 6 is fixedly connected in the upper part of the T-shaped notch groove 13, a heat sink 12 is provided on the lower part of the lead substrate 1, and a plurality of heat-conducting blocks 5 are arranged between the heat-conducting groove 12 and the T-shaped notch groove 13, and the heat-conducting blocks 5 are embedded and fixed in the inside of the lead substrate 1, and contact the upper side of the heat sink 6.
[0020] The upper side surfaces of the positive electrode conductor 2 and the negative electrode conductor 3 are both provided with arc-shaped spherical surfaces, so as to facilitate the positive electrode conductor 2 and the negative electrode conductor 3 to make stable contact with the LED chip.
[0021] There are multiple groups of heat dissipation slots 12, and multiple heat dissipation slots 12 are stacked up and down, and the heat dissipation slots 12 are also filled with thermal conductive silicone grease, so as to achieve the purpose of rapid heat conduction and heat dissipation.
[0022] Two circular grooves 14 are provided inside the conductor substrate 1 , and the positive electrode conductor 2 and the negative electrode conductor 3 are fixedly connected in the circular grooves 14 , so as to facilitate the stable placement of the positive electrode conductor 2 and the negative electrode conductor 3 .
[0023] During use of the utility model, the LED chip is aligned and placed in the packaging notch 11, and the positive and negative electrodes of the LED chip are aligned and contacted with the positive conductor 2 and the negative conductor 3 respectively, and then encapsulated with an insulating colloid. When in use, the heat sink 6 is in contact with the heat conductive block 5, and the heat dissipation groove 12 is filled with thermal grease, so that the heat dissipation groove 12 and the heat sink 6 are used for joint heat dissipation, and the lower gap of the T-notch groove 13 can further improve the heat dissipation efficiency of the LED chip, and the guide rail silicone grease and the heat conductive block 5 can realize effective transfer and heat dissipation of heat.
[0024] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.
Claims
1. A lead frame for a light emitting diode, comprising a lead substrate (1), characterized in that: The upper side of the conductor substrate (1) is provided with a packaging notch (11) for packaging the LED chip, and a positive electrode conductor (2) and a negative electrode conductor (3) connected to the positive and negative electrodes of the LED chip are fixed in the packaging notch (11), and a pin line (4) is also fixedly connected to the conductor substrate (1), and the pin line (4) is connected to the positive electrode conductor (2) and the negative electrode conductor (3), respectively. The lower side of the conductor substrate (1) is provided with a T-shaped notch groove (13), and a heat sink (6) is fixedly connected in the upper part of the T-shaped notch groove (13). The lower part of the conductor substrate (1) is provided with a heat sink (12), and a plurality of heat conduction blocks (5) are arranged between the heat sink (12) and the T-shaped notch groove (13), and the heat conduction blocks (5) are embedded and fixed in the conductor substrate (1) and are in contact with the upper side of the heat sink (6).
2. A lead frame for a light emitting diode according to claim 1, characterized in that: The upper side surfaces of the positive electrode conductor (2) and the negative electrode conductor (3) are both provided with arc-shaped spherical surfaces.
3. The lead frame of a light emitting diode according to claim 1, characterized in that: The heat dissipation grooves (12) are arranged in multiple groups, and the multiple heat dissipation grooves (12) are stacked up and down, and the heat dissipation grooves (12) are also filled with thermal conductive silicone grease.
4. The lead frame of a light emitting diode according to claim 1, characterized in that: Two circular grooves (14) are provided inside the conductor substrate (1), and the positive electrode conductor (2) and the negative electrode conductor (3) are fixedly connected in the circular grooves (14).