Display module and display device

Abstract

The embodiment of the utility model provides a display module and a display device, relates to the technical field of display, and is used for improving the heat dissipation performance of the display module. The display module comprises a display panel, a circuit board and a heat dissipation structure, wherein the display panel comprises a main body part, a bending part and a binding part which are connected in sequence; the main body part is provided with a light-emitting side and a non-light-emitting side which are arranged back to back; one end, connected with the binding part, of the bending part is bent to a non-light-emitting side; the binding part is located on the non-light-emitting side. The circuit board is located on the non-light-emitting side and connected with the binding part. The heat dissipation structure is located on the side, facing the circuit board, of the main body part and comprises a first composite film layer, the first composite film layer comprises a metal layer, and the metal layer is configured to be electrically connected with the circuit board. The heat dissipation structure further comprises a second heat dissipation layer, the second heat dissipation layer is located on the side, away from the main body part, of the first composite film layer and makes contact with the metal layer, and the second heat dissipation layer comprises a heat conduction layer. The display module is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the development of display technology, display devices (such as mobile phones, laptops or tablets) are increasingly used in people's lives. The application forms of flexible OLED products are becoming more and more diverse, and they are generally moving towards being lighter and thinner, and their power consumption is significantly better than traditional display products. Utility Model Content

[0003] The purpose of the embodiments of the present disclosure is to provide a display module and a display device, so as to improve the heat dissipation performance of the display module.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display module is provided, which includes: a display panel, a circuit board and a heat dissipation structure, wherein the display panel includes a main body, a bending part and a binding part connected in sequence; the main body has a light-emitting side and a non-light-emitting side arranged opposite to each other; one end of the bending part connected to the binding part is bent to the non-light-emitting side; and the binding part is located on the non-light-emitting side. The circuit board is located on the non-light-emitting side and is connected to the binding part. The heat dissipation structure is located on a side of the main body facing the circuit board, and the heat dissipation structure includes a first composite film layer, and the first composite film layer includes a metal layer, and the metal layer is configured to be electrically connected to the circuit board. Among them, the heat dissipation structure also includes a second heat dissipation layer, which is located on a side of the first composite film layer away from the main body and in contact with the metal layer, and the second heat dissipation layer includes a thermal conductive layer.

[0006] In the above display module, the second heat dissipation layer contacts the metal layer, so the heat on the metal layer can be dissipated to the second heat dissipation layer. The thermal conductive layer has good thermal conductivity and can quickly dissipate the heat, thereby reducing the temperature of the display module during operation.

[0007] In some embodiments, the material of the metal layer includes aluminum, and the material of the thermal conductive layer includes at least one of graphite, graphene, and a carbon / carbon composite material.

[0008] In some embodiments, the second heat dissipation layer includes a first sub-portion and a second sub-portion; in an orthographic projection onto the main portion, the first sub-portion at least partially overlaps with the circuit board; the second sub-portion is located on a side of the first sub-portion away from the binding portion, and the second sub-portion is spaced apart from the first sub-portion.

[0009] In some embodiments, the first sub-portion is provided with at least one first connection hole, and the first connection hole passes through the first sub-portion; a conductive filling layer is provided in the first connection hole, and the conductive filling layer is configured to electrically connect the circuit board and the metal layer.

[0010] In some embodiments, the material of the conductive filling layer includes at least one of copper and conductive glue.

[0011] In some embodiments, a surface of the circuit board facing the first sub-portion includes: a conductive area and a non-conductive area, and in an orthographic projection onto the main body, the conductive area covers the first connecting hole.

[0012] In some embodiments, the second heat dissipation layer further includes: a first filling glue layer, the first filling glue layer is located in the first connecting hole, the first filling glue layer is filled between the conductive filling layer and the first sub-portion, and the material of the first filling glue layer is an insulating material.

[0013] In some embodiments, there is a spacing area between the first sub-section and the second sub-section, and the spacing area exposes the first composite film layer; the first composite film layer located in the spacing area includes an overlapping area; the display module also includes: an electromagnetic shielding layer, the electromagnetic shielding layer is located on a side of the circuit board away from the main body, and the electromagnetic shielding layer is connected to the overlapping area.

[0014] In some embodiments, the display module further includes: a conductive adhesive layer located on a side of the first sub-portion of the circuit board facing the second heat dissipation layer; and in an orthographic projection onto the main body, the conductive adhesive layer at least covers the first connection hole of the first sub-portion.

[0015] In some embodiments, the display module further includes: a double-sided adhesive layer located on a side of the circuit board facing the first sub-section; and in an orthographic projection onto the main body, the double-sided adhesive layer has no overlap with the conductive adhesive layer.

[0016] In some embodiments, the second heat dissipation layer further includes: a first glue layer, a second glue layer and a third glue layer, the first glue layer is located on a side of the thermal conductive layer close to the main body and in contact with the thermal conductive layer, the second glue layer is located on a side of the thermal conductive layer away from the main body and in contact with the thermal conductive layer, the third glue layer is located on a side of the thermal conductive layer and in contact with the thermal conductive layer, and the material of the first glue layer, the material of the second glue layer and the material of the third glue layer are insulating materials.

[0017] In some embodiments, the second heat dissipation layer is provided with a plurality of second connection holes, and the second connection holes penetrate the thermal conductive layer; the second heat dissipation layer further includes: a second filling glue layer, the second filling glue layer fills the second connection holes and the material of the second filling glue layer is an insulating material.

[0018] In some embodiments, the material of the first adhesive layer is different from the material properties of the second adhesive layer; the material of the third adhesive layer is the same as at least one of the material of the first adhesive layer and the material of the second adhesive layer; and / or the material of the second filling adhesive layer is the same as at least one of the material of the first adhesive layer and the material of the second adhesive layer.

[0019] In some embodiments, in an orthographic projection onto the first adhesive layer, a shape of the second connection hole includes at least one of a pentagon, a rectangle, a circle, and an ellipse.

[0020] In some embodiments, the first composite film layer further includes: at least two buffer layers, the buffer layers are located on a side of the metal layer close to the main body; and a fourth adhesive layer is disposed on a side of each buffer layer away from the metal layer.

[0021] In some embodiments, the at least two buffer layers include: a first buffer layer and a second buffer layer, wherein the compressive deformation of the first buffer layer is greater than the compressive deformation of the second buffer layer.

[0022] In some embodiments, the compressive deformation of the first buffer layer ranges from about 0.57 MPa to 1 MPa; the compressive deformation of the second buffer layer ranges from about 0 MPa to 0.16 MPa.

[0023] In some embodiments, the first composite film layer further includes: a reinforcement layer, which is arranged in the same layer as the metal layer, and in the orthographic projection to the main body, the reinforcement layer surrounds the metal layer; wherein the hardness of the material of the reinforcement layer is greater than the hardness of the material of the metal layer.

[0024] In some embodiments, along the second direction, the edge of the reinforcement layer toward the metal layer is arranged in a curve, and the edge of the reinforcement layer toward the metal layer is arranged parallel to the edge of the metal layer toward the reinforcement layer; wherein the second direction is parallel to the extension direction of the reinforcement layer.

[0025] In some embodiments, there is a gap between the reinforcement layer and the metal layer.

[0026] In some embodiments, a plurality of protrusions are provided on a side of the reinforcement layer facing the metal layer, and a plurality of grooves are provided on a side of the metal layer facing the reinforcement layer. The plurality of grooves are provided in one-to-one correspondence with the plurality of protrusions, the protrusions are filled into the grooves, and the protrusions are in contact with the groove walls of the grooves.

[0027] In some embodiments, in an orthographic projection onto the main body, the protrusion is at least one of a triangle, a trapezoid, and a square.

[0028] In some embodiments, the material of the reinforcement layer includes at least one of polyethylene terephthalate plastic, copper and stainless steel.

[0029] In another aspect, a display device is provided, comprising: a display module as described in any of the above embodiments, and a driving chip, wherein the driving chip is connected to a circuit board of the display module to drive a display panel of the display module to display.

[0030] The above-mentioned display device has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, etc.

[0032] Figure 1 A structural diagram of a display device provided according to some embodiments of the present disclosure;

[0033] Figure 2 Based on Figure 1 A cross-sectional view of the provided display device along section line CC;

[0034] Figure 3 Another structural diagram of a display device provided according to some embodiments of the present disclosure;

[0035] Figure 4 Based on Figure 3 An enlarged view of position D of the provided display device;

[0036] Figure 5 is another structural diagram of a display device provided according to some embodiments of the present disclosure;

[0037] Figure 6Based on Figure 5 A cross-sectional view of the provided display device along section line GG;

[0038] Figure 7 Based on Figure 6 An enlarged view of the display device at H is provided;

[0039] Figure 8 Based on Figure 6 Another enlarged view of the H of the provided display device;

[0040] Fig. 9 A structural diagram of a second heat dissipation layer provided according to some embodiments of the present disclosure;

[0041] Fig.10 A structural diagram of a printed circuit board provided according to some embodiments of the present disclosure;

[0042] Fig.11 Based on Figure 5 Another cross-sectional view of the provided display device along section line GG;

[0043] Fig. 12A Based on Fig.11 An enlarged view of a display device at position I is provided;

[0044] Fig. 12B Based on Fig.11 Another enlarged view of the provided display device at position I;

[0045] Fig.13 Another structural diagram of a printed circuit board provided according to some embodiments of the present disclosure;

[0046] Fig.14 is another structural diagram of a display device provided according to some embodiments of the present disclosure;

[0047] Fig.15 Another structural diagram of a second heat dissipation layer provided according to some embodiments of the present disclosure;

[0048] Fig.16 Based on Fig.15 A cross-sectional view of the provided second heat dissipation layer along section line JJ;

[0049] Fig.17 is a structural diagram of a first composite film layer provided according to some embodiments;

[0050] Fig.18 Based on Fig.17 A cross-sectional view of the first composite film layer along the section line KK is provided;

[0051] Fig.19A structural diagram of a first composite film layer provided according to some embodiments of the present disclosure;

[0052] Fig. 20 Based on Fig.19 A cross-sectional view of the first composite film layer along section line LL is provided;

[0053] Fig.21 A flow chart of a method for preparing a first composite film layer according to some embodiments of the present disclosure;

[0054] Fig. 22 A structural diagram corresponding to each step of a method for preparing a first composite film layer provided according to some embodiments of the present disclosure;

[0055] Fig.23 Another structural diagram of the first composite film layer provided according to some embodiments of the present disclosure;

[0056] Fig.24 is another structural diagram of the first composite film layer provided according to some embodiments of the present disclosure;

[0057] Fig.25 is another structural diagram of the first composite film layer provided according to some embodiments of the present disclosure;

[0058] Fig.26 is another structural diagram of the first composite film layer provided according to some embodiments of the present disclosure;

[0059] Fig. 27 is another structural diagram of the first composite film layer provided according to some embodiments of the present disclosure;

[0060] Fig.28 is another structural diagram of the first composite film layer provided according to some embodiments of the present disclosure;

[0061] Fig.29 Another flow chart of a method for preparing a first composite film layer according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0062] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0063] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0064] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0065] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0066] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0067] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0068] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0069] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0070] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0071] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0072] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0073] like Figure 1As shown, some embodiments of the present disclosure provide a display device 1000, which can be any device that displays whether it is moving (e.g., video) or fixed (e.g., still image) and whether it is text or image. More specifically, it is expected that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones (e.g., cell phones), wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc. Figure 1 In the figure, the display device 1000 is taken as a mobile phone as an example for illustration.

[0074] Exemplarily, the display device 1000 may be an electroluminescent display device or a photoluminescent display device. In the case where the display device 1000 is an electroluminescent display device, the electroluminescent display device may be an organic light-emitting diode (OLED) or a quantum dot electroluminescent display device (QLED). In the case where the display device 1000 is a photoluminescent display device, the photoluminescent display device may be a quantum dot photoluminescent display device. The following takes the display device 1000 as an OLED display device as an example to schematically illustrate some embodiments of the present disclosure, but the embodiments of the present disclosure include but are not limited to these, and any other display device may also be considered as long as the same technical concept is applied.

[0075] like Figure 2 As shown, Figure 2 for Figure 1 The display device 1000 is a cross-sectional view along the cross-sectional line CC. The display device 1000 includes a display module 100 and a driving chip 200.

[0076] The display module 100 includes a display panel 10 , and the display panel 10 includes a main body portion 10 a , a bending portion 10 b and a binding portion 10 c which are connected in sequence.

[0077] Exemplarily, the main body 10a may include a plurality of pixel circuits and a plurality of light-emitting devices. The plurality of pixel circuits and the plurality of light-emitting devices may be electrically connected in a one-to-one correspondence, for example. Each pixel circuit may control a corresponding light-emitting device to emit light, and the plurality of light-emitting devices cooperate with each other to enable the main body 10a to display an image.

[0078] Exemplarily, the main body 10a has a light-emitting side E and a non-light-emitting side F disposed opposite to each other. The side of the main body 10a displaying an image is the light-emitting side E of the main body 10a, and the side facing away from the light-emitting side E of the main body 10a is the non-light-emitting side F of the main body 10a.

[0079] Exemplarily, one end of the bent portion 10 b connected to the binding portion 10 c is bent to the non-light emitting side F, and the binding portion 10 c is located on the non-light emitting side F.

[0080] It is understandable that if Figure 1 and Figure 2 As shown, by using a bending process, the bending portion 10b can be bent, and the end of the bending portion 10b connected to the binding portion 10c is bent to the non-light-emitting side F of the main body 10a. In this way, the space occupied by the display module 100 in the first direction X can be reduced, the frame size of the display module 100 can be reduced, and a narrow frame design can be realized. The first direction X is parallel to the direction in which the main body 10a and the bending portion 10b are arranged.

[0081] Exemplarily, after the bending portion 10b is bent by a bending process, the binding portion 10c is bent to the non-light-emitting side F of the main body 10a.

[0082] In some examples, the display module 100 further includes: a circuit board 20 , which is located on the non-light emitting side F and connected to the binding portion 10 c .

[0083] Exemplarily, the circuit board 20 may be a rigid printed circuit board (Printed Circuit Board, PCB for short), a flexible printed circuit board (Flexible Printed Circuit board, FPC for short) or a rigid-flexible board. The circuit board 20 is coupled to the display module 100 and is configured to transmit electrical signals to the display module 100. For example, the circuit board 20 includes a printed circuit board 21 and a flexible circuit board 22, the printed circuit board 21 and the flexible circuit board 22 are connected, and the flexible circuit board 22 is connected to the binding portion 10c.

[0084] For example, when the main body 10a has only a display function, the driver chip 200 is used to provide the display signal required by the main body 10a, and the circuit board 20 can be used to transmit the display signal. When the main body 10a has both a display function and a touch function, the driver chip 200 is used to provide the display signal or the touch signal required by the main body 10a, and the circuit board 20 can be used to transmit the display signal or the touch signal.

[0085] It can be understood that the above display signal or touch signal is transmitted to the main body 10a through the binding portion 10c and the bending portion 10b in sequence, so that the main body 10a can work normally.

[0086] Exemplarily, the display module 100 further includes: a protective layer 31, the protective layer 31 at least partially covers the bent portion 10b. In some embodiments, the protective layer 31 completely and partially covers the bent portion 10b. In other embodiments, the protective layer 31 covers an end of the main body 10a close to the bent portion 10b, the bent portion 10b, and an end of the binding portion 10c close to the bent portion 10b. The protective layer 31 can provide protection for an end of the main body 10a close to the bent portion 10b, the bent portion 10b, and an end of the binding portion 10c close to the bent portion 10b, to prevent the display panel 10 from being corroded by water vapor and oxygen.

[0087] In some examples, such as Figure 2 and Figure 3 As shown, the display module 100 further includes: a cover plate 32 , a connection layer 33 , a polarizer 34 , a back film 35 , a heat dissipation structure 50 , a bending gasket 36 and an electronic device 37 .

[0088] Exemplarily, the cover plate 32 is disposed on the display side E of the display panel 10 to protect the display panel 10. The cover plate 32 covers the display panel 10, that is, the cover plate 32 covers the display side E of the display panel 10. Exemplarily, the boundary of the cover plate 32 is farther away from the main body 10a than the boundary of the bent portion 10b that is farthest from the main body 10a, that is, the cover plate 32 expands outward relative to the bent portion 10b of the display panel 10 to completely cover the bent portion 10b. The material of the cover plate 32 can be a transparent material such as acrylic or glass, which is not limited in the embodiments of the present disclosure.

[0089] Exemplarily, the connection layer 33 is disposed between the display panel 10 and the cover plate 32, and is used to connect the display panel 10 and the cover plate 32. The material of the connection layer 33 may include optically clear adhesive (full name: Optically Clear

[0090] Adhesive, referred to as OCA), Liquid Optical Clear Adhesive (English full name Liquid Optical Clear

[0091] The connection layer 33 may be at least one of a thermally transparent adhesive (LOCA) or a UV curing adhesive, but is not limited thereto, and may also be other adhesive materials capable of achieving connection. For example, the connection layer 33 is an optically transparent hot melt adhesive film (full name in English is Thermal-melt Optical Clear Adhesive, TOCA for short).

[0092] Exemplarily, the polarizer 34 is disposed between the connection layer 33 and the display side E of the display panel 10 and has polarization performance. The polarizer 34 is configured to convert the non-polarized light emitted by the display panel 10 and passing through the polarizer 34 into polarized light, thereby improving the uniformity of the light emitted from the display panel 10, thereby weakening the rainbow pattern appearing in the display image of the display panel 10, so as to improve the display effect of the display module 100. The polarizer 34 can be a transmissive polarizer, a reflective polarizer, a semi-transmissive reflective polarizer, a compensatory polarizer, and other types of polarizers, which are not limited in the embodiments of the present disclosure.

[0093] Exemplarily, the back film 35 is disposed on the non-display side F of the display panel 10. For example, the back film 35 includes: a first back film 351 and a second back film 352, the first back film 351 is disposed on the side of the main body 10a close to the binding part 10c, and the second back film 352 is disposed on the side of the binding part 10c close to the main body 10a. When the display panel 10 is bent via the bending part 10b so that the binding part 10c is disposed on the non-display side F of the main body 10a, the first back film 351 provides support force to the main body 10a of the display panel 10, and the second back film 352 provides support force to the binding part 10c to achieve a better bending effect. The material of the back film 35 can be at least one of polyethylene terephthalate (PET), polyimide (PI) or cyclo olefin polymer (COP).

[0094] Exemplarily, the heat dissipation structure 50 is disposed on the non-display side F of the display panel 10, which can buffer the stress acting on the display panel 10, and can dissipate the heat generated when the display panel 10 is working, and has a certain protective effect on the display panel 10. Exemplarily, the heat dissipation structure 50 is disposed on the side of the first back film 351 facing the binding portion 10c. The heat dissipation structure 50 can be a composite film composed of grid glue, foam and copper foil, such as a super clean foam (SCF) composite film, and the copper foil in the heat dissipation structure 50 is grounded.

[0095] The heat dissipation structure 50 assists the display module 100 in heat dissipation and grounding the display module 100. For example, the side of the printed circuit board 21 facing the main body 10a is electrically connected to the copper foil of the heat dissipation structure 50 to ground the printed circuit board 21.

[0096] Exemplarily, the bending gasket 36 is disposed between the main body 10a and the binding part 10c to prevent the bent display panel 10 from rebounding. For example, one side of the bending gasket 36 is connected to the heat dissipation structure 50, and the other side is connected to the second back film 352 of the binding part 10c close to the main body 10a.

[0097] Exemplarily, the electronic device 37 is disposed on a side of the circuit board 20 away from the main body 10a. For example, the electronic device 37 may be one or more of a capacitor and a resistor.

[0098] In some examples, such as Figure 2 As shown, the display module 100 also includes an electromagnetic shielding layer 38, which is arranged on the side of the electronic device 37 away from the main body 10a. The electromagnetic shielding layer 38 is made of a strong magnetic material with high magnetic permeability (such as steel), and can electromagnetically shield the area covered by it. One end of the electromagnetic shielding layer 38 is connected to the copper foil in the heat dissipation structure 50 to achieve the purpose of grounding.

[0099] Figure 4 for Figure 3 An enlarged view of the display device 1000 at D is shown. In some embodiments, the heat dissipation structure 50 includes copper foil. In other embodiments, in order to further reduce the weight of the display module 100 and achieve lightweight display module 100, the copper foil in the heat dissipation structure 50 is replaced with aluminum foil. For example, the heat dissipation structure 50 includes a first composite film layer 51, and the first composite film layer 51 includes a metal layer 511, a first foam layer 50b, a first mesh adhesive layer 50c, a second foam layer 50d, and a second mesh adhesive layer 50e arranged in sequence. The metal layer 511, the first foam layer 50b, the first mesh adhesive layer 50c, the second foam layer 50d, and the second mesh adhesive layer 50e are arranged in sequence in a direction away from the printed circuit board 21.

[0100] During the operation of the display device 1000, the driver chip 200 is an important component for transmitting and processing signals, and its excessive temperature will affect the stability of the working performance. The driver chip 200 itself generates a large amount of heat, and an important channel for the heat generated by the driver chip 200 to be dissipated is through the display module 100. Therefore, the heat dissipation performance of the display module 100 is poor, which causes the heat of the driver chip 200 to be difficult to dissipate, which will reduce the reliability of the driver chip 200 and even cause the driver chip 200 to be damaged due to overheating.

[0101] The heat dissipation of the display module 100 can be reflected by testing the surface temperature of the display device 1000. Generally, the surface temperature of the display device 1000 is required not to exceed 45°.

[0102] As shown in Table 1, Table 1 is a comparison table of the initial surface temperature of the display device 1000 and the surface temperature after running for 2 hours under the condition that the luminous brightness of the display device 1000 is 600 nit. The heat dissipation structure 50 in the display device 1000 in Table 1 includes a metal layer 511, a first foam layer 50b, a first mesh adhesive layer 50c, a second foam layer 50d and a second mesh adhesive layer 50e arranged in sequence, and the metal layer 511 includes, for example, aluminum foil.

[0103]

[0104] Table 1 shows the comparison between the initial surface temperature of the device and the surface temperature after 2 hours of operation

[0105] It can be seen from Table 1 that the temperature of the display device 1000 exceeds 45° after running for 2 hours, which will cause the temperature of the driving chip 200 to be too high and affect the stability of its working performance.

[0106] Based on this, Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 The display device 1000 is shown in a cross-sectional view along the section line GG. An embodiment of the present disclosure provides a display module 100, which includes: a display panel 10, a circuit board 20 and a heat dissipation structure 50. The display panel 10 includes a main body 10a, a bending portion 10b and a binding portion 10c connected in sequence. The main body 10a has a light-emitting side E and a non-light-emitting side F that are arranged opposite to each other. One end of the bending portion 10b connected to the binding portion 10c is bent to the non-light-emitting side F, and the binding portion 10c is located on the non-light-emitting side F of the main body 10a. The circuit board 20 is located on the non-light-emitting side F and is connected to the binding portion 10c. The heat dissipation structure 50 is located on the side of the main body 10a facing the circuit board 20.

[0107] like Figure 6 and Figure 7 As shown, Figure 7 for Figure 6 The enlarged view of the H of the display module 100 is shown. The heat dissipation structure 50 includes a first composite film layer 51, and the first composite film layer 51 includes a metal layer 511, and the metal layer 511 is configured to be electrically connected to the circuit board 20. The heat dissipation structure 50 also includes a second heat dissipation layer 52, which is located on a side of the first composite film layer 51 away from the main body 10a, and the second heat dissipation layer 52 is in contact with the metal layer 511, and the second heat dissipation layer 52 includes a heat conductive layer 52a.

[0108] It is understandable that since the copper foil in the heat dissipation structure 50 is replaced by the metal layer 511 , the metal layer 511 has the function of grounding the copper foil, and the metal layer 511 is electrically connected to the circuit board 20 to achieve grounding of the circuit board 20 , that is, grounding of the display module 100 .

[0109] In some examples, such as Figure 8 As shown, the first composite film layer 51 further includes: a buffer layer 512 and a fourth adhesive layer 513 . The buffer layer 512 is located on a side of the metal layer 511 close to the main body 10 a , and the fourth adhesive layer 513 is located on a side of the buffer layer 512 close to the main body 10 a .

[0110] In other examples, such as Figure 7 As shown, the first composite film layer 51 includes at least two buffer layers 512 , which are located on a side of the metal layer 511 close to the main body 10 a , and a fourth adhesive layer 513 is disposed on a side of each buffer layer 512 away from the metal layer 511 .

[0111] Exemplarily, the first composite film layer 51 includes two buffer layers 512, and the two buffer layers 512 are respectively a first buffer layer 512a and a second buffer layer 512b. For example, the first composite film layer 51 includes a metal layer 511, a first buffer layer 512a, a fourth adhesive layer 513a, a second buffer layer 512b, and a fourth adhesive layer 513b arranged in sequence.

[0112] The material of the buffer layer 512 may be foam, and the buffer layer 512 may reduce the high temperature risk caused by the heat of the metal film layer (e.g., the metal layer 511) to the main body 10a. The buffer layer 512 may be used to buffer the stress acting on the display panel 10 to protect the display panel 10 and may also be used for shading to ensure a better display effect of the display panel 10. The fourth adhesive layer 513 has the function of connecting the film layers on both sides thereof, and the fourth adhesive layer 513 may be a grid adhesive.

[0113] For example, the thickness of the buffer layer 512 may be about 0.08 mm, and the thickness of the fourth adhesive layer 513 may be about 0.03 mm.

[0114] In some examples, such as Figure 7 and Figure 8 As shown, the second heat dissipation layer 52 is in contact with the metal layer 511, so the heat on the metal layer 511 can be dissipated to the second heat dissipation layer 52. The thermal conductive layer 52a has good thermal conductivity and can quickly dissipate the heat, thereby reducing the temperature of the display module 100 during operation.

[0115] Exemplarily, the thickness of the heat conductive layer 52a ranges from about 0.03 mm to 0.06 mm. For example, the thickness of the heat conductive layer 52a is about 0.03 mm, 0.04 mm, 0.05 mm or 0.06 mm, etc., which is not limited here.

[0116] Exemplarily, the thickness of the metal layer 511 may be about 0.05 mm. The metal layer 511 having a thickness of about 0.05 mm may meet the requirements of electrical conduction and heat dissipation.

[0117] In some examples, the material of the metal layer 511 includes aluminum, and the material of the thermal conductive layer 52 a includes at least one of graphite, graphene, and a carbon / carbon composite material.

[0118] It should be noted that graphite is a crystalline carbon. Graphene is a two-dimensional crystal composed of one or more layers of carbon atoms. Carbon / carbon composite materials (cc composite or carbon-carbon composite material) are carbon matrix composite materials reinforced with carbon fibers and their fabrics.

[0119] In some embodiments, Figure 5 to Figure 7 As shown, the second heat dissipation layer 52 includes: a first sub-portion 521 and a second sub-portion 522; in the orthographic projection to the main body 10a, the first sub-portion 521 at least partially overlaps with the circuit board 20. The second sub-portion 522 is located on a side of the first sub-portion 521 away from the binding portion 10c, and the second sub-portion 522 is spaced apart from the first sub-portion 521.

[0120] Exemplarily, in the orthographic projection to the main body 10a, the first sub-portion 521 covers the printed circuit board 21. Usually, the area where the driver chip 200 and the circuit board 20 are located is the area with the most serious heat generation. The driver chip 200 is connected to the circuit board 20, and the printed circuit board 21 is connected to the first sub-portion 521 on the side facing the main body 10a. The first sub-portion 521 covers the printed circuit board 21, and the heat on the driver chip 200 and the circuit board 20 can be dissipated to the first sub-portion 521, and quickly dissipated through the heat dissipation structure 50 including the second sub-portion 522, so as to reduce the temperature of the display module 100 and ensure the stability of the working performance of the driver chip 200.

[0121] In some examples, such as Figure 5 and Fig. 9 As shown, the second sub-portion 522 is closer to the geometric center Q of the display panel 10. For example, the second sub-portion 522 may cover the geometric center Q of the display panel 10 and its surrounding area.

[0122] The second sub-portion 522 is spaced apart from the first sub-portion 521 , that is, there is a space between the first sub-portion 521 and the second sub-portion 522 , and the spaced region 53 exposes the first composite film layer 51 . It can be understood that the spaced region 53 exposes the metal layer 511 .

[0123] The spacing area 53 is provided to connect the electromagnetic shielding layer 38 to the metal layer 511 , thereby achieving grounding of the electromagnetic shielding layer 38 . Please refer to the subsequent content for details, which will not be described in detail here.

[0124] The heat of the first sub-portion 521 can be transferred to the metal layer 511 . The second sub-portion 522 is provided so that the heat of the metal layer 511 transferred by the first sub-portion 521 is transferred to the second sub-portion 522 . The second sub-portion 522 quickly dissipates the heat to reduce the temperature of the display module 100 .

[0125] In some implementations, such as Figure 7 and Fig. 9 As shown, the first sub-portion 521 is provided with at least one first connection hole 54 , which passes through the first sub-portion 521 , and a conductive filling layer 55 is provided in the first connection hole 54 , which is configured to electrically connect the circuit board 20 and the metal layer 511 .

[0126] For example, Fig. 9 As shown, the first sub-section 521 is provided with a plurality of first connection holes 54 , and a conductive filling layer 55 fills each first connection hole 54 .

[0127] Exemplarily, the conductive filling layer 55 is in direct contact with the hole wall of the first connection hole 54 , or there is a gap between the conductive filling layer 55 and the hole wall of the first connection hole 54 .

[0128] By providing the first connection hole 54 and the conductive filling layer 55 , the circuit board 20 and the metal layer 511 are connected, for example, the printed circuit board 21 and the metal layer 511 are connected, so as to realize grounding of the display module 100 .

[0129] For example, Figure 6 and Fig.10 As shown, the surface S10 of the printed circuit board 21 facing the first sub-portion 521 includes a conductive area S1 and a non-conductive area S2 , wherein in the orthographic projection onto the main body 10 a , the conductive area S1 covers the first connection hole 54 .

[0130] The surface S10 of the printed circuit board 21 facing the first sub-section 521 has an exposed copper area where no electronic devices are set and a non-exposed copper area where electronic devices are set. The exposed copper area has conductive properties, and this area is called the conductive area S1. The non-exposed copper area of ​​the surface S10 of the printed circuit board 21 facing the first sub-section 521 does not have conductive properties, and this area is called the non-conductive area S2. The exposed copper in the conductive area S1 is connected to the metal layer 511 through the conductive filling layer 55 of the first connection hole 54 to achieve grounding of the display module 100.

[0131] Therefore, it can be understood that the multiple first connection holes 54 of the first sub-section 521 are arranged based on the exposed copper area of ​​the surface S10 of the printed circuit board 21 facing the first sub-section 521, so that the exposed copper area of ​​the printed circuit board 21 covers the first connection hole 54 in the orthographic projection to the main body 10a, thereby realizing the connection between the exposed copper area of ​​the printed circuit board 21 and the conductive filling layer 55, and the surface of the conductive filling layer 55 facing away from the printed circuit board 21 is connected to the metal layer 511, thereby realizing the connection between the printed circuit board 21 and the metal layer 511 to realize the grounding of the display module 100.

[0132] In some embodiments, Figure 7 and Fig.10 As shown, the material of the conductive filling layer 55 includes: conductive glue.

[0133] For example, Figure 7 and Fig.10 As shown, a conductive adhesive layer 40 is disposed on the conductive area S1 of the surface S10 of the printed circuit board 21 facing the first sub-section 521 , and a double-sided adhesive layer 41 is disposed on the non-conductive area S2 . Moreover, a thickness d1 of the conductive adhesive layer 40 is greater than a thickness d2 of the double-sided adhesive layer 41 .

[0134] For example, the thickness d1 of the conductive adhesive layer 40 is approximately 0.1 mm, and the thickness d2 of the double-sided adhesive layer 41 is approximately 0.05 mm.

[0135] By setting the thickness d1 of the conductive adhesive layer 40 to be greater than the thickness d2 of the double-sided adhesive layer 41, when the printed circuit board 21 is attached to the heat dissipation structure 50, the portion of the conductive adhesive layer 40 away from the printed circuit board 21 is filled into the first connection hole 54, and the conductive adhesive layer 40 filled into the first connection hole 54 is the conductive filling layer 55. The surface of the double-sided adhesive layer 41 away from the printed circuit board 21 is adhered to the surface of the first sub-portion 521 away from the metal layer 511.

[0136] Exemplarily, after the first sub-section 521 is formed and before the first sub-section 521 is attached to the display module 100, the first connection hole 54 may be filled with polyethylene terephthalate (PET), and the first connection hole 54 is filled with PET so that the surface of the first sub-section 521 away from the main body 10a is a flat surface. Since the film layer of the display module 100 is a flexible film layer, when the surface of the film layer to be attached is uneven, a mold print will appear on the display side E of the display panel 10, that is, it will cause the surface of the display panel 10 to be uneven, and the presence of the mold print will affect the display quality of the display device 1000. After the first connection hole 54 is filled with PET, when the first sub-section 521 is attached to the display module 100, when the first sub-section 521 is pressed by an attachment jig, the mold print caused by the uneven surface of the first sub-section 521 can be effectively avoided, thereby improving the display quality of the display device 1000.

[0137] It should be noted that a protective film is provided on the surface of the first sub-section 521 away from the main body 10a. During the attachment process of the first sub-section 521, the protective film can protect the first sub-section 521. After the attachment of the first sub-section 521 is completed, the protective film needs to be peeled off. When the protective film is peeled off, the PET filled in the first connection hole 54 can be peeled off together with the protective film.

[0138] Afterwards, the printed circuit board 21 is attached to the first sub-section 521 , and at the same time, the portion of the conductive adhesive layer 40 away from the printed circuit board 21 is filled into the first connecting hole 54 . The conductive adhesive layer 40 filled into the first connecting hole 54 is the conductive filling layer 55 , so as to realize the connection between the printed circuit board 21 and the metal layer 511 .

[0139] Exemplarily, the conductive adhesive layer 40 and the double-sided adhesive layer 41 have a spacing, for example, the spacing is about 0.5 mm. By setting the spacing between the conductive adhesive layer 40 and the double-sided adhesive layer 41, the problem of overlapping of the conductive adhesive layer 40 and the double-sided adhesive layer 41 caused by the attachment deviation of the conductive adhesive layer 40 and / or the double-sided adhesive layer 41 can be effectively prevented. If the conductive adhesive layer 40 and the double-sided adhesive layer 41 overlap, the surface of the printed circuit board 21 attached to the first sub-section 521 will be uneven, thereby generating a mold mark, affecting the display quality of the display device 1000.

[0140] In some embodiments, Figure 8 As shown, the second heat dissipation layer 52 also includes: a first filling glue layer 52f, the first filling glue layer 52f is located in the first connection hole 54, the first filling glue layer 52f is filled between the conductive filling layer 55 and the first sub-portion 521, and the material of the first filling glue layer 52f is an insulating material.

[0141] Illustratively, in the first connection hole 54 , the first filling glue layer 52 f contacts the hole wall of the first connection hole 54 , and the conductive filling layer 55 is located on a side of the first filling glue layer 52 f away from the hole wall of the first connection hole 54 .

[0142] Exemplarily, the material of the first filling adhesive layer 52f is single-sided adhesive.

[0143] The material of the heat-conducting layer 52a is, for example, graphite. Since graphite has a low density, low mechanical strength, and is fragile, the structure of the heat-conducting layer 52a is unstable. The first filling glue layer 52f has a fixing effect on the graphite around the first connecting hole 54, and can effectively prevent the graphite around the first connecting hole 54 from peeling off.

[0144] In some embodiments, Fig.11 and Fig. 12A As shown, the material of the conductive filling layer 55 includes copper.

[0145] At this time, the printed circuit board 21 is electrically connected to the metal layer 511 through the conductive adhesive layer 40 and the conductive filling layer 55 to achieve grounding of the printed circuit board 21 .

[0146] For example, Fig.13 As shown, a conductive adhesive layer 40 is disposed on a surface S10 of the printed circuit board 21 facing the first sub-portion 521. For example, a thickness d1 of the conductive adhesive layer 40 is about 0.05 mm. When the printed circuit board 21 is attached to the heat dissipation structure 50, the surface of the conductive adhesive layer 40 away from the printed circuit board 21 is attached to the surface of the first sub-portion 521 away from the main body 10a and the surface of the conductive filling layer 55 away from the main body 10a.

[0147] By coating the conductive adhesive layer 40 as a whole layer, the process step of attaching the double-sided adhesive layer 41 can be saved.

[0148] In some embodiments, Fig. 12B As shown, there is a gap 52 g between the conductive filling layer 55 and the first sub-portion 521 .

[0149] That is, there is a gap 52g between the conductive filling layer 55 and the hole wall of the first connection hole 54. Since there is a deviation when the conductive filling layer 55 is filled in the first connection hole 54, in order to effectively avoid the problem of the conductive filling layer 55 covering the first sub-portion 521, a deviation gap is reserved when the conductive filling layer 55 is filled in the first connection hole 54. Therefore, there is a gap 52g between the conductive filling layer 55 and the first sub-portion 521.

[0150] In some embodiments, Fig.11 , Fig. 12A and Fig.14As shown, there is a spacing region 53 between the first sub-portion 521 and the second sub-portion 522, and the spacing region 53 exposes the first composite film layer 51. The first composite film layer 51 located in the spacing region 53 includes an overlapping region S4.

[0151] It can be understood that the spacing region 53 exposes the metal layer 511 .

[0152] The display module 100 further includes an electromagnetic shielding layer 38 . The electromagnetic shielding layer 38 is located on a side of the circuit board 20 away from the main body 10 a , and the electromagnetic shielding layer 38 is connected to the overlapping area S4 .

[0153] It can be understood that the electromagnetic shielding layer 38 is connected to the overlapping area S4, that is, the electromagnetic shielding layer 38 is connected to the metal layer 511 of the first composite film layer 51 to achieve grounding of the electromagnetic shielding layer 38 so that the electromagnetic shielding layer 38 releases static electricity.

[0154] In the first direction X, the ratio of the size d4 of the overlapping area S4 to the size d3 of the spacing area 53 is in the range of about 0.86 to 0.88, that is, d4 / d3≈0.86 to 0.88. The first direction X is parallel to the direction in which the first sub-section 521 and the second sub-section 522 are arranged. It can be understood that the direction in which the first sub-section 521 and the second sub-section 522 are arranged is parallel to the direction in which the main body 10a and the bending portion 10b are arranged.

[0155] Exemplarily, the ratio of the size d4 of the overlapping area S4 to the size d3 of the spacing area 53 is approximately 0.86, 0.87 or 0.88, etc., which is not limited here.

[0156] By setting the ratio of the size d4 of the overlapping area S4 to the size d3 of the spacing area 53 in the first direction X to be approximately 0.86 to 0.88, the spacing area 53 can be fully used for grounding the electromagnetic shielding layer 38. Moreover, the electromagnetic shielding layer 38 can be effectively prevented from overlapping the first sub-section 521 and the second sub-section 522 on both sides of the spacing area 53 along the first direction X, thereby ensuring the effectiveness of the grounding of the electromagnetic shielding layer 38.

[0157] In some examples, such as Fig. 12A As shown, the distance between the first sub-portion 521 and the second sub-portion 522 ranges from about 7 mm to 7.15 mm.

[0158] That is, the dimension d3 of the spacing area 53 in the first direction X is in the range of about 7 mm to 7.15 mm.

[0159] Exemplarily, the spacing between the first sub-portion 521 and the second sub-portion 522 is approximately 7 mm, 7.03 mm, 7.05 mm, 7.1 mm, 7.2 mm, or 7.15 mm, etc., which is not limited here.

[0160] For example, in order to meet the requirement of grounding the electromagnetic shielding layer 38 , the dimension d3 of the overlapping area S4 in the first direction X is about 6.15 mm.

[0161] By setting the spacing range between the first sub-section 521 and the second sub-section 522 to be approximately 7 mm to 7.15 mm, it can be ensured that the dimension d3 of the overlapping area S4 in the first direction X meets the overlapping requirement, and further, the overlapping area S4 in the spacing area 53 has a sufficient area to meet the grounding requirement of the electromagnetic shielding layer 38. Moreover, if the spacing between the first sub-section 521 and the second sub-section 522 is too large, the speed of heat transfer from the first sub-section 521 to the second sub-section 522 will be reduced. The spacing range between the first sub-section 521 and the second sub-section 522 is approximately 7 mm to 7.15 mm, which can achieve rapid heat transfer from the first sub-section 521 to the second sub-section 522, thereby achieving heat dissipation of the display module 100.

[0162] In some examples, such as Fig. 12A As shown, in the first direction X, there is a gap between the portion of the electromagnetic shielding layer 38 connected to the metal layer 511 and the second heat dissipation layer 52 .

[0163] Exemplarily, there is a distance between the first end D1 where the electromagnetic shielding layer 38 and the metal layer 511 are connected and the first sub-portion 521 , and there is a distance between the second end D2 where the electromagnetic shielding layer 38 and the metal layer 511 are connected and the second sub-portion 522 .

[0164] In the first direction X, there is a spacing between the two ends of the part of the electromagnetic shielding layer 38 connected to the metal layer 511 and the second heat dissipation layer 52, which can effectively avoid the electromagnetic shielding layer 38 covering the second heat dissipation layer 52 due to deviation when overlapping with the metal layer 511, resulting in overlap between the electromagnetic shielding layer 38 and the second heat dissipation layer 52, thereby ensuring that the overlapping area between the electromagnetic shielding layer 38 and the metal layer 511 meets the requirements and effectively ensuring the grounding area of ​​the electromagnetic shielding layer 38.

[0165] In some embodiments, Fig.11 , Fig.15 and Fig.16 As shown, the second heat dissipation layer 52 also includes: a first adhesive layer 52b, a second adhesive layer 52c and a third adhesive layer 52d, the first adhesive layer 52b is located on a side of the heat-conducting layer 52a close to the main body 10a and contacts the heat-conducting layer 52a, the second adhesive layer 52c is located on a side of the heat-conducting layer 52a away from the main body 10a and contacts the heat-conducting layer 52a, the third adhesive layer 52d is located on a side of the heat-conducting layer 52a and contacts the heat-conducting layer 52a, and the material of the first adhesive layer 52b, the material of the second adhesive layer 52c and the material of the third adhesive layer 52d are insulating materials.

[0166] It can be understood that the first adhesive layer 52b, the second adhesive layer 52c and the third adhesive layer 52d surround the heat-conducting layer 52a and perform an edge-wrapping process, which can prevent the material of the heat-conducting layer 52a from peeling off.

[0167] It should be noted that if Fig.11 As shown, the heat-conducting layer 52a includes multiple stacked graphite molecular layers, and adjacent graphite molecular layers are connected to each other by chemical bonds. If the chemical bonds between adjacent graphite molecular layers are broken, the heat dissipation capacity of the heat-conducting layer 52a will be reduced exponentially.

[0168] As can be seen from the above, after the second heat dissipation layer 52 is attached to the display module 100, it is necessary to peel off the protective film on the second heat dissipation layer 52. Since the intermolecular force between the protective film and the second adhesive layer 52c, and the intermolecular force between the second adhesive layer 52c and the thermal conductive layer 52a may be greater than the chemical bond force between adjacent graphite molecular layers, when peeling off the protective film on the second heat dissipation layer 52, it may cause delamination between adjacent graphite molecular layers, thereby destroying the heat dissipation performance of the thermal conductive layer 52a.

[0169] Therefore, if Fig.15 and Fig.16 As shown, the second heat dissipation layer 52 is provided with a plurality of second connection holes 56, and the second connection holes 56 penetrate the heat conductive layer 52a. The second heat dissipation layer 52 also includes: a second filling glue layer 52e, which fills the second connection holes 56 and is made of insulating material.

[0170] For example, Fig.15 and Fig.16 As shown, a plurality of second connection holes 56 can be arranged in an array on the heat-conducting layer 52a. The second filling glue layer 52e can increase the adhesion of graphite around the second connection holes 56, which is beneficial to improving the interaction between graphite molecular layers, so as to effectively prevent the delamination between graphite molecular layers when the protective film is peeled off, thereby making the heat-conducting layer 52a have better heat dissipation performance.

[0171] In some examples, such as Fig.15 and Fig.16 As shown, the material of the first adhesive layer 52b and the material properties of the second adhesive layer 52c are different.

[0172] Exemplarily, the material of the first adhesive layer 52b is double-sided adhesive, and the material of the second adhesive layer 52c is single-sided adhesive. The adhesive side of the second adhesive layer 52c is attached to the heat conductive layer 52a, and the non-adhesive side of the second adhesive layer 52c is used to set a protective film.

[0173] The material of the third glue layer 52 d is the same as at least one of the material of the first glue layer 52 b and the material of the second glue layer 52 c .

[0174] Exemplarily, when the first adhesive layer 52b is attached to the thermal conductive layer 52a, the first adhesive layer 52b covers the side of the thermal conductive layer 52a. In this case, the material of the third adhesive layer 52d is the same as that of the first adhesive layer 52b; or, when the second adhesive layer 52c is attached to the thermal conductive layer 52a, the second adhesive layer 52c covers the side of the thermal conductive layer 52a. In this case, the material of the third adhesive layer 52d is the same as that of the second adhesive layer 52c; or, when the first adhesive layer 52b and the second adhesive layer 52c are attached to the thermal conductive layer 52a, the first adhesive layer 52b and the second adhesive layer 52c jointly cover the side of the thermal conductive layer 52a. In this case, the material of the third adhesive layer 52d is the same as that of the first adhesive layer 52b and the second adhesive layer 52c.

[0175] The material of the second filling adhesive layer 52 e is the same as at least one of the material of the first adhesive layer 52 b and the material of the second adhesive layer 52 c .

[0176] Exemplarily, when the first glue layer 52b is attached to the thermal conductive layer 52a, the first glue layer 52b is filled in the second connecting hole 56 to form a second filling glue layer 52e. At this time, the material of the second filling glue layer 52e is the same as that of the first glue layer 52b; or, when the second glue layer 52c is attached to the thermal conductive layer 52a, the second glue layer 52c is filled in the second connecting hole 56 to form a second filling glue layer 52e. At this time, the material of the second filling glue layer 52e is the same as that of the second glue layer 52c; or, when the first glue layer 52b and the second glue layer 52c are attached to the thermal conductive layer 52a, the first glue layer 52b and the second glue layer 52c are jointly filled in the second connecting hole 56 to form a second filling glue layer 52e. At this time, the material of the second filling glue layer 52e is the same as that of the first glue layer 52b and the second glue layer 52c.

[0177] The material of the first adhesive layer 52b is double-sided adhesive, which can cover and reinforce the thermal conductive layer 52a and achieve the bonding between the first sub-section 521 and the metal layer 511. The material of the second adhesive layer 52c, the material of the third adhesive layer 52d and the second filling adhesive layer 52e are used to cover and reinforce the thermal conductive layer 52a.

[0178] In some examples, such as Fig.15 and Fig.16 As shown, in the orthographic projection onto the first adhesive layer 52 b , the size d5 of the second connection hole 56 is in the range of about 0.01 mm to 0.5 mm.

[0179] Illustratively, in the orthographic projection onto the first adhesive layer 52 b , a size d5 of the second connection hole 56 is approximately 0.01 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm or 0.5 mm, etc., which is not limited here.

[0180] For example, in the orthographic projection onto the first adhesive layer 52b, the shape of the second connection hole 56 includes: pentagon, square, circle or ellipse, etc., which is not limited here. When the shape of the second connection hole 56 is a pentagon, the size d5 of the second connection hole 56 refers to the length of the diagonal of the pentagon; when the shape of the second connection hole 56 is a square, the size d5 of the second connection hole 56 refers to the length or width of the square; when the shape of the second connection hole 56 is a circle, the size d5 of the second connection hole 56 refers to the diameter of the circle; when the shape of the second connection hole 56 is an ellipse, the size d5 of the second connection hole 56 refers to the major axis diameter or minor axis diameter of the ellipse.

[0181] By setting the size d5 of the second connecting hole 56 to a range of approximately 0.01 mm to 0.5 mm, the second connecting hole 56 can meet the requirements of reinforcing the thermal conductive layer 52a after setting the second filling glue layer 52e, and can effectively prevent the stratification between the graphite molecular layers when the protective film is peeled off, thereby protecting the thermal conductive layer 52a to have better heat dissipation performance.

[0182] In some examples, such as Table 2 and Fig. 12A As shown in Table 2, the Vickers hardness values ​​of different materials. Among them, Vickers hardness refers to using a diamond regular pyramid indenter with an angle of 136 degrees between the relative faces to press into the surface of the test sample under the action of a specified load F, maintaining the load for a certain period of time and then unloading it, measuring the diagonal length of the indentation, and then calculating the surface area of ​​the indentation. Finally, the average pressure on the indentation surface area is calculated, which is the Vickers hardness value of the metal. The larger the Vickers hardness value, the greater the hardness of the material. As can be seen from Table 2, the hardness of aluminum is less than that of copper and less than that of stainless steel. Therefore, the impact resistance of aluminum is poor.

[0183]

[0184] Table 2 Vickers hardness values ​​of different materials

[0185] In some examples, such as Figure 8 and Fig. 12A As shown, since the heat dissipation structure 50 of the display module 100 uses a metal layer 511, the material of the metal layer 511 is, for example, aluminum. Since aluminum has poor hardness, it is easy to produce mold marks on the display module 100, affecting the display quality of the display device 1000. Therefore, the impact resistance of the display module 100 needs to be further improved.

[0186] Based on this, Fig. 12A As shown, the first composite film layer 51 includes at least two buffer layers 512, and the at least two buffer layers 512 include: a first buffer layer 512a and a second buffer layer 512b, wherein the compression deformation of the first buffer layer 512a is greater than the compression deformation of the second buffer layer 512b.

[0187] It should be noted that compression force deformation (CFD) refers to the compressive load when the material is compressed to 25% of the deformation. The higher the compression deformation, the better the material's point impact resistance, and the lower the compression deformation, the better the material's surface impact resistance. The better the material's surface impact resistance can further prove that the material has a better anti-mold effect and can effectively prevent the occurrence of mold marks.

[0188] When testing the impact resistance of the display module 100, a falling ball test method can be used. When the falling ball hits the surface of the metal layer 511 of the first composite film layer 51, the first buffer layer 512a with a larger compression deformation has a better ability to resist point impact, so that the point impact transmitted to the screen is basically 0. When a large area of ​​force, that is, a surface impact force is transmitted to the first composite film layer 51, the second buffer layer 512b with a smaller compression deformation will block and absorb most of the impact force, further making the impact force transmitted to the screen basically 0.

[0189] For example, Fig. 12A As shown, the first composite film layer 51 includes a metal layer 511, a first buffer layer 512a, a fourth adhesive layer 513a, a second buffer layer 512b and a fourth adhesive layer 513b arranged in sequence, that is, the first buffer layer 512a with a larger compression deformation is closer to the metal layer 511 than the second buffer layer 512b with a smaller compression deformation.

[0190] Exemplarily, the first composite film layer 51 includes a metal layer 511, a second buffer layer 512b, a fourth adhesive layer 513a, a first buffer layer 512a and a fourth adhesive layer 513b arranged in sequence, that is, the first buffer layer 512a with a larger compression deformation is farther away from the metal layer 511 than the second buffer layer 512b with a smaller compression deformation.

[0191] Therefore, when the first composite film layer 51 includes a first buffer layer 512a with a larger compression deformation and a second buffer layer 512b with a smaller compression deformation, the first composite film layer 51 can have better point impact resistance and surface impact resistance at the same time to improve the impact resistance of the display module 100.

[0192] In some embodiments, Fig. 12A As shown, the compression deformation of the first buffer layer 512a ranges from about 0.57 MPa to 1 MPa, and the compression deformation of the second buffer layer 512b ranges from about 0 MPa to 0.16 MPa.

[0193] Exemplarily, the materials of the first buffer layer 512a and the second buffer layer 512b are both foam. The value of the compression deformation of the first buffer layer 512a is about 0.57MPa, 0.6MPa, 0.65MPa, 0.7MPa, 0.75MPa, 0.8MPa, 0.85MPa, 0.9MPa, 0.95MPa or 1MPa, etc., which is not limited here. The value of the compression deformation of the second buffer layer 512b is about 0MPa, 0.02MPa, 0.05MPa, 0.08MPa, 0.1MPa, 0.12MPa, 0.14MPa or 0.16MPa, etc., which is not limited here.

[0194] The first buffer layer 512a with a compression deformation value range of approximately 0.57MPa to 1MPa has good point impact resistance, and the second buffer layer 512b with a compression deformation value range of approximately 0MPa to 0.16MPa has good surface impact resistance. The display module 100 having the first buffer layer 512a and the second buffer layer 512b has good impact resistance.

[0195] In some examples, such as Fig.11 , Fig.17 and Fig.18 As shown, Fig.18 for Fig.17 The cross-sectional view of the first composite film layer 51 along the cross-sectional line KK is shown. Due to the low hardness of aluminum, when the initial first composite film layer is cut to form the first composite film layer 51, the cutting of the cutter wheel will cause a collapse in the edge area S5 of the metal layer 511, which can be called a cutter wheel mark, and the cutter wheel mark will cause the edge area S5 of the metal layer 511 to be uneven.

[0196] It should be noted that the size of the initial first composite film layer is larger than the size of the first composite film layer 51. After the initial first composite film layer is cut, the first composite film layer 51 of the required size of the display module 100 is formed. For example, the first composite film layer 51 includes a metal layer 511, a buffer layer 512 and a fourth adhesive layer 513 stacked in sequence. Then, the initial first composite film layer includes an initial metal layer 511a (such as Fig. 22 After the initial first composite film layer is cut, the initial metal layer 511a forms a metal layer 511, the initial buffer layer forms a buffer layer 512, and the initial fourth adhesive layer forms a fourth adhesive layer 513.

[0197] Moreover, when the roller 60 is used to extrude the first composite film layer 51 for attachment, the extrusion of the roller 60 may cause the knife wheel mark to become more serious, further causing the edge region S5 of the metal layer 511 to be uneven.

[0198] When the first composite film layer 51 is attached, since the edge region S5 of the metal layer 511 is uneven, a mold mark may appear on the display side E of the display panel 10 , affecting the display quality of the display device 1000 .

[0199] Based on this, Fig.11 , Fig.19 and Fig. 20 As shown, Fig. 20 for Fig.19 The first composite film layer 51 is a cross-sectional view along the cross-sectional line LL. The first composite film layer 51 further includes: a reinforcing layer 514, which is disposed on the same layer as the metal layer 511, and in the orthographic projection to the main body 10a, the reinforcing layer 514 surrounds the metal layer 511; wherein the hardness of the material of the reinforcing layer 514 is greater than the hardness of the material of the metal layer 511.

[0200] It should be noted that the reinforcing layer 514 and the metal layer 511 are arranged on the same layer, which means that the distance between the surface of the reinforcing layer 514 away from the main body 10a and the main body 10a is roughly equal to the distance between the surface of the metal layer 511 away from the main body 10a and the main body 10a.

[0201] Exemplarily, the thickness of the reinforcing layer 514 is substantially equal to the thickness of the metal layer 511, the reinforcing layer 514 and the metal layer 511 are located on the side of the buffer layer 512 away from the main body 10a, and the reinforcing layer 514 is arranged in a ring shape around the metal layer 511. For example, the metal layer 511 is arranged in a square shape, and the reinforcing layer 514 is a square ring structure.

[0202] In some embodiments, the reinforcement layer 514 at least partially surrounds the metal layer 511 , and may be, for example, only one segment, or a ring structure having multiple segments.

[0203] Exemplarily, the material hardness of the reinforcement layer 514 is greater than the hardness of aluminum, and the material may include: at least one of polyethylene terephthalate plastic, copper and stainless steel. As shown in Table 2 above, the hardness of polyethylene terephthalate plastic, copper and stainless steel are all greater than the hardness of aluminum.

[0204] By using a material with a relatively high hardness as the reinforcing layer 514, and the reinforcing layer 514 is arranged in a ring shape around the metal layer 511, when a cutter wheel is used to cut the initial first composite film layer to form a first composite film layer 51 of a desired size, the cutting position of the cutter wheel is located on the material with a relatively high hardness, so no cutter wheel mark is generated on the reinforcing layer 514. When the first composite film layer 51 is pressed by a roller 60 to attach the first composite film layer 51, since the surface of the first composite film layer 51 away from the main body 10a is relatively flat, no mold mark is generated due to the attachment of the first composite film layer 51, thereby improving the display quality of the display device 1000.

[0205] A method for preparing the first composite film layer 51 is exemplified below.

[0206] In some examples, such as Fig.21 and Fig. 22 As shown, the method for preparing the first composite film layer 51 includes the following steps:

[0207] R1~R3.

[0208] R1. Cutting the initial metal layer 511a to form a metal layer 511.

[0209] When the initial first composite film layer is cut by a cutter wheel, since the initial first composite film layer is a multi-layer stacked structure, for example, the initial first composite film layer includes an initial metal layer, an initial buffer layer, and an initial fourth adhesive layer stacked in sequence, the initial first composite film layer with multiple layers requires a larger cutting force, so a cutter wheel mark is generated at the edge of the metal layer 511, resulting in an uneven surface at the edge of the metal layer 511.

[0210] Step R1 uses a method of cutting the initial metal layer 511a separately to form the metal layer 511, which requires a smaller cutting force. Therefore, no cutter wheel marks are generated on the edge of the metal layer 511, making the surface of the metal layer 511 relatively flat.

[0211] R2. Form a stacked buffer layer 512 and a fourth adhesive layer 513 , and attach the metal layer 511 to a side of the buffer layer 512 away from the fourth adhesive layer 513 .

[0212] Exemplarily, the initial buffer layer and the initial fourth adhesive layer are stacked, and then the stacked initial buffer layer and the initial fourth adhesive layer are cut to form the stacked buffer layer 512 and the fourth adhesive layer 513 .

[0213] R3. Form a reinforcement layer 514 , which is located on a side of the buffer layer 512 away from the fourth adhesive layer 513 , and surrounds the metal layer 511 , thereby obtaining a first composite film layer 51 .

[0214] A first composite film layer 51 having a reinforcement layer 514 surrounding the metal layer 511 is formed through the above steps R1 to R3. When the first composite film layer 51 is attached to the display module 100, since the surface of the first composite film layer 51 away from the main body 10a is relatively flat, the attachment of the first composite film layer 51 will not cause a mold imprint to appear on the display side E of the display module 100, thereby improving the display quality of the display device 1000.

[0215] In some embodiments, Fig. 22 As shown, there is a distance d6 between the reinforcement layer 514 and the metal layer 511 .

[0216] Exemplarily, the distance between the reinforcement layer 514 and the metal layer 511 is about 0.5 mm.

[0217] By setting the distance d6 between the reinforcement layer 514 and the metal layer 511, space for attachment deviation can be provided for the reinforcement layer 514 to prevent the reinforcement layer 514 from being attached to the surface of the metal layer 511 and causing the surface of the first composite film layer 51 away from the main body 10a to be uneven, thereby effectively avoiding the first composite film layer 51 from being attached to the display module 100 to produce a mold imprint.

[0218] In some embodiments, Figure 23 to Figure 25 As shown, along the second direction Y, the edge L1 of the reinforcement layer 514 toward the metal layer 511 is arranged in a curve, and the edge L1 of the reinforcement layer 514 toward the metal layer 511 is arranged parallel to the edge L2 of the metal layer 511 toward the reinforcement layer 514, wherein the second direction Y is parallel to the extension direction of the reinforcement layer 514.

[0219] For example, Fig.23 and Figure 6 As shown, the plane where the second direction Y and the first direction X are located is parallel to the plane where the surface of the metal layer 511 away from the main body 10 a is located, and the second direction Y intersects with or is parallel to the first direction X.

[0220] For example, Fig.23 As shown, along the second direction Y, the edge L1 of the reinforcing layer 514 facing the metal layer 511 is arranged in a wavy line shape. Then, in the orthographic projection to the main body 10a, the side of the reinforcing layer 514 facing the metal layer 511 forms an arc-shaped convexity and concave toward the metal layer 511. Opposite to the arc-shaped convexity of the reinforcing layer 514 facing the metal layer 511, the side of the metal layer 511 facing the reinforcing layer 514 forms an arc-shaped concave toward the reinforcing layer 514; opposite to the arc-shaped concave of the reinforcing layer 514 facing the metal layer 511, the side of the metal layer 511 facing the reinforcing layer 514 forms an arc-shaped convexity toward the reinforcing layer 514.

[0221] For example, Fig.24 and Fig.25 As shown, along the second direction Y, the edge L1 of the reinforcement layer 514 facing the metal layer 511 is arranged in a zigzag shape. Then, in the orthographic projection to the main body 10a, the side of the reinforcement layer 514 facing the metal layer 511 can form a triangular protrusion and depression facing the metal layer 511. Alternatively, the side of the reinforcement layer 514 facing the metal layer 511 can form a square protrusion and depression facing the metal layer 511.

[0222] Along the second direction Y, the edge L1 of the reinforcement layer 514 facing the metal layer 511 is arranged in a curve or in a straight line, which can effectively avoid the generation of the knife wheel mark, thereby effectively solving the problem of the mold mark on the display side E of the display panel 10.

[0223] In some embodiments, Figure 22 to Figure 25 As shown, the dimension d7 of the reinforcement layer 514 in the third direction Z ranges from about 1 mm to 4 mm; the third direction Z intersects the second direction Y, and the plane where the third direction Z and the second direction Y are located is parallel to the plane where the surface of the metal layer 511 away from the main body 10a is located.

[0224] Exemplarily, the dimension d7 of the reinforcing layer 514 in the third direction Z can be understood as the width of the reinforcing layer 514. For example, the dimension d7 of the reinforcing layer 514 in the third direction Z is about 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 4 mm, etc., which is not limited here.

[0225] For example, Figure 23 to Figure 25 As shown, when the reinforcing layer 514 is arranged in a curve toward the edge L1 of the metal layer 511 along the second direction Y, the dimension d7 of the reinforcing layer 514 in the third direction Z is not uniform. That is, the dimension d7 includes two types: dimension d71 and dimension d72, wherein the dimension d7 of the reinforcing layer 514 at the narrowest part in the third direction Z is dimension d71, and the dimension d7 of the reinforcing layer 514 at the widest part in the third direction Z is dimension d72. Moreover, the range of the dimension d71 and the range of the dimension d72 are both within the range of about 1 mm to 4 mm.

[0226] By setting the size d7 of the reinforcement layer 514 in the third direction Z to be approximately 1 mm to 4 mm, the reinforcement layer 514 can effectively avoid the generation of a cutter wheel mark, thereby effectively solving the problem of mold marks on the display side E of the display panel 10 .

[0227] Furthermore, when the maximum dimension d72 of the reinforcement layer 514 in the third direction Z when the edge L1 of the reinforcement layer 514 toward the metal layer 511 is arranged in a curved shape is equal to the dimension d7 of the reinforcement layer 514 in the third direction Z when the edge L1 of the reinforcement layer 514 toward the metal layer 511 is arranged in a straight line, compared with the arrangement in which the edge L1 of the reinforcement layer 514 toward the metal layer 511 is arranged in a straight line, the arrangement in which the edge L1 of the reinforcement layer 514 toward the metal layer 511 is arranged in a curved shape can use less material of the reinforcement layer 514, thereby reducing the influence of the arrangement of the reinforcement layer 514 on the weight of the display module 100.

[0228] In some embodiments, Figure 26 to Figure 28 As shown, a plurality of protrusions 5141 are provided on the side of the reinforcement layer 514 facing the metal layer 511, and a plurality of grooves 5111 are provided on the side of the metal layer 511 facing the reinforcement layer 514. The plurality of grooves 5111 are provided in one-to-one correspondence with the plurality of protrusions 5141. The protrusions 5141 fill the grooves 5111, and the protrusions 5141 are in contact with the groove walls of the grooves 5111.

[0229] Exemplarily, multiple protrusions 5141 are evenly arranged along the side of the reinforcement layer 514 facing the metal layer 511, and multiple grooves 5111 are evenly arranged along the side of the metal layer 511 facing the reinforcement layer 514. A protrusion 5141 is inserted into a groove 5111 to achieve connection between the reinforcement layer 514 and the metal layer 511.

[0230] For example, Fig.26 As shown, in the orthographic projection to the main body 10a, the protrusion 5141 is triangular in shape. Correspondingly, the groove 5111 is also triangular in shape.

[0231] For example, Fig. 27 As shown, in the orthographic projection onto the main body 10a, the protrusion 5141 is square, and correspondingly, the groove 5111 is also square.

[0232] For example, Fig.28 As shown, in the orthographic projection onto the main body 10a, the protrusion 5141 is trapezoidal, and correspondingly, the groove 5111 is also trapezoidal.

[0233] The protrusions 5141 are arranged in a triangular, trapezoidal or square shape in the orthographic projection onto the main body 10 a , so as to achieve connection between the reinforcement layer 514 and the metal layer 511 .

[0234] Another method for preparing the first composite film layer 51 is exemplified below.

[0235] In some examples, such as Fig.29 As shown, the method for preparing the first composite film layer 51 includes steps: T1 to T3.

[0236] T1. Form a first laminated film layer, wherein the first laminated film layer includes a metal layer 511 and an initial reinforcement layer, wherein the initial reinforcement layer is connected to the metal layer 511 and the initial reinforcement layer surrounds the metal layer 511 .

[0237] For example, Figure 26 to Figure 28 As shown, a plurality of protrusions 5141 may be provided on a side of the initial reinforcement layer facing the metal layer 511 , and a plurality of grooves 5111 may be provided on a side of the metal layer 511 facing the initial reinforcement layer to achieve connection between the initial reinforcement layer and the metal layer 511 .

[0238] T2, forming a stacked initial buffer layer and an initial fourth adhesive layer, attaching the first laminated film layer to a side of the initial buffer layer away from the initial fourth adhesive layer, to obtain an initial first composite film layer.

[0239] T3, cutting the initial first composite film layer, wherein the initial reinforcement layer forms the reinforcement layer 514, the initial buffer layer forms the buffer layer 512, and the initial fourth adhesive layer forms the fourth adhesive layer 513, to obtain the first composite film layer 51.

[0240] A first composite film layer 51 having a reinforcement layer 514 surrounding the metal layer 511 is formed through the above steps T1 to T3. When the first composite film layer 51 is attached to the display module 100, since the surface of the first composite film layer 51 away from the main body 10a is relatively flat, the attachment of the first composite film layer 51 will not cause a mold imprint to appear on the display side E of the display module 100, thereby improving the display quality of the display device 1000.

[0241] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The display panel comprises a main body, a bending part and a binding part connected in sequence; the main body has a light-emitting side and a non-light-emitting side arranged opposite to each other; one end of the bending part connected to the binding part is bent to the non-light-emitting side; the binding part is located on the non-light-emitting side; A circuit board, located on the non-light-emitting side and connected to the binding portion; a heat dissipation structure, located on a side of the main body facing the circuit board; the heat dissipation structure comprises a first composite film layer, the first composite film layer comprises a metal layer, and the metal layer is configured to be electrically connected to the circuit board; Wherein, the heat dissipation structure further includes a second heat dissipation layer, which is located on a side of the first composite film layer away from the main body and in contact with the metal layer, and the second heat dissipation layer includes a heat conductive layer.

2. The display module according to claim 1, characterized in that: The material of the metal layer includes aluminum, and the material of the heat-conducting layer includes at least one of graphite, graphene and a carbon / carbon composite material.

3. The display module according to claim 1 or 2, characterized in that: The second heat dissipation layer includes a first sub-portion and a second sub-portion; In an orthographic projection onto the main body, the first sub-portion at least partially overlaps with the circuit board; The second sub-portion is located at a side of the first sub-portion away from the binding portion, and the second sub-portion is spaced apart from the first sub-portion.

4. The display module according to claim 3, characterized in that: The first sub-section is provided with at least one first connection hole, and the first connection hole passes through the first sub-section; a conductive filling layer is provided in the first connection hole, and the conductive filling layer is configured to electrically connect the circuit board and the metal layer.

5. The display module according to claim 4, characterized in that: The material of the conductive filling layer includes at least one of copper and conductive glue.

6. The display module according to claim 4 or 5, characterized in that: The surface of the circuit board facing the first sub-portion includes a conductive area and a non-conductive area. In an orthographic projection onto the main body, the conductive area covers the first connecting hole.

7. The display module according to claim 4 or 5, characterized in that: The second heat dissipation layer further includes: a first filling glue layer, the first filling glue layer is located in the first connection hole, the first filling glue layer is filled between the conductive filling layer and the first sub-portion, and the material of the first filling glue layer is an insulating material.

8. The display module according to claim 7, characterized in that: There is a spacing area between the first sub-section and the second sub-section, and the spacing area exposes the first composite film layer; the first composite film layer located in the spacing area includes an overlapping area; The display module further includes an electromagnetic shielding layer, which is located at a side of the circuit board away from the main body, and the electromagnetic shielding layer is connected to the overlapping area.

9. The display module according to claim 1, characterized in that: Also includes: The conductive adhesive layer is located on a side of the first sub-portion of the circuit board facing the second heat dissipation layer; and in an orthographic projection onto the main body, the conductive adhesive layer at least covers the first connection hole of the first sub-portion.

10. The display module according to claim 9, characterized in that: Also includes: The double-sided adhesive layer is located on a side of the circuit board facing the first sub-section; and in an orthographic projection onto the main body, the double-sided adhesive layer does not overlap with the conductive adhesive layer.

11. The display module according to claim 1, characterized in that: The second heat dissipation layer also includes: a first glue layer, a second glue layer and a third glue layer, the first glue layer is located on a side of the heat-conducting layer close to the main body and in contact with the heat-conducting layer, the second glue layer is located on a side of the heat-conducting layer away from the main body and in contact with the heat-conducting layer, the third glue layer is located on a side of the heat-conducting layer and in contact with the heat-conducting layer, and the material of the first glue layer, the material of the second glue layer and the material of the third glue layer are insulating materials.

12. The display module according to claim 11, characterized in that: The second heat dissipation layer is provided with a plurality of second connection holes, and the second connection holes penetrate the thermal conductive layer; the second heat dissipation layer also includes: a second filling glue layer, the second filling glue layer fills the second connection holes and the material of the second filling glue layer is an insulating material.

13. The display module according to claim 12, characterized in that: The material of the first adhesive layer has different properties from the material of the second adhesive layer; The material of the third adhesive layer is the same as at least one of the material of the first adhesive layer and the material of the second adhesive layer; And / or, a material of the second filling adhesive layer is the same as at least one of a material of the first adhesive layer and a material of the second adhesive layer.

14. The display module according to claim 12 or 13, characterized in that: In the orthographic projection onto the first adhesive layer, the shape of the second connection hole includes at least one of a pentagon, a rectangle, a circle and an ellipse.

15. The display module according to claim 1, characterized in that: The first composite film layer further includes: at least two buffer layers, the buffer layers are located on a side of the metal layer close to the main body; and a fourth adhesive layer is disposed on a side of each buffer layer away from the metal layer.

16. The display module according to claim 15, characterized in that: The at least two buffer layers include: a first buffer layer and a second buffer layer, wherein the compressive deformation of the first buffer layer is greater than the compressive deformation of the second buffer layer.

17. The display module according to claim 16, characterized in that: The compressive deformation of the first buffer layer ranges from about 0.57 MPa to 1 MPa; The compressive deformation of the second buffer layer ranges from about 0 MPa to about 0.16 MPa.

18. The display module according to claim 1, characterized in that: The first composite film layer further includes: a reinforcement layer, the reinforcement layer is arranged in the same layer as the metal layer, and in an orthographic projection onto the main body, the reinforcement layer surrounds the metal layer; Wherein, the hardness of the material of the reinforcement layer is greater than the hardness of the material of the metal layer.

19. The display module according to claim 18, characterized in that: Along the second direction, the edge of the reinforcement layer toward the metal layer is arranged in a curve, and the edge of the reinforcement layer toward the metal layer is arranged parallel to the edge of the metal layer toward the reinforcement layer; wherein the second direction is parallel to the extension direction of the reinforcement layer.

20. The display module according to claim 18 or 19, characterized in that: There is a gap between the reinforcement layer and the metal layer.

21. The display module according to claim 18, characterized in that: A plurality of protrusions are arranged on the side of the reinforcement layer facing the metal layer, and a plurality of grooves are arranged on the side of the metal layer facing the reinforcement layer. The plurality of grooves are arranged in one-to-one correspondence with the plurality of protrusions, the protrusions are filled into the grooves, and the protrusions are in contact with the groove walls of the grooves.

22. The display module according to claim 21, characterized in that: In an orthographic projection onto the main body, the protrusion is at least one of a triangle, a trapezoid and a square.

23. The display module according to claim 18, characterized in that: The material of the reinforcement layer includes at least one of polyethylene terephthalate plastic, copper and stainless steel.

24. A display device, characterized in that: include: The display module according to any one of claims 1 to 23; The driving chip is connected to the circuit board of the display module to drive the display panel of the display module to display.

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