Wafer auxiliary cleaning device

Abstract

The utility model provides an auxiliary wafer cleaning device, and relates to the technical field of quartz wafer cleaning. The arranged first driving assembly can drive the mounting roller and the wafer clamped on the mounting roller through the flexible clamping assembly to do overturning motion in the mounting frame, that is, the wafer and the mounting frame are kept in a horizontal state at the beginning, and then the wafer enters the cleaning tank at the driving frame of the first driving assembly to be cleaned; according to the structure, the situation that the wafer is directly attached to the driving roller, so that colloidal substances on the wafer are increased, and the subsequent glue removing effect on the wafer cannot be guaranteed can be avoided; the second driving assembly mounted at the bottom of the cleaning tank can drive the wafer to do circular motion in the cleaning tank after the wafer is placed in the cleaning tank, so that the wafer is in full contact with the cleaning liquid in the displacement cleaning tank, and the cleaning capacity of the equipment on the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of quartz wafer cleaning, in particular to a wafer auxiliary cleaning device. Background Art

[0002] The chip is one of the most important raw materials of LED, the light-emitting component of LED, and the core part of LED. The quality of the chip will directly determine the performance of LED. The chip is composed of III and V group composite semiconductor materials. During LED packaging, the incoming chips are neatly arranged on the chip film. During the preparation of the chip, in order to facilitate the processing of the chip and increase the processing speed of the chip, the chip generally needs to be bonded together by adhesive, or multiple chips are bonded to auxiliary tools, so as to batch process the corresponding production process of the chip; in the prior art, the auxiliary tools attached to the chip are usually directly put into the cleaning tank for manual water washing and degumming. When a large number of chips are degummed at the same time, some quartz chips are not in sufficient contact with the degumming agent, resulting in low chip degumming efficiency, which makes the degumming method not only time-consuming and labor-intensive, but also has the problem of residual glue debris that cannot be cleaned up. Utility Model Content

[0003] The utility model aims to provide a wafer auxiliary cleaning device, which can solve the problems raised by the above-mentioned background technology in view of the shortcomings of the prior art.

[0004] The technical solution of the utility model is achieved in this way:

[0005] The utility model provides a wafer auxiliary cleaning device, comprising a mounting frame installed on the top of a cleaning tank, a mounting roller rotatably arranged in the mounting frame, a plurality of mounting seats are arranged along the axial direction of the mounting roller, flexible clamping components for clamping wafers are arranged on the mounting seats, a first driving component for driving the mounting roller to rotate is arranged on the mounting frame, and a second driving component for driving a plurality of wafers to move is arranged on the bottom of the cleaning tank.

[0006] In some technical solutions of the utility model, the first driving assembly includes a first driving motor installed on a mounting frame, and a reducer drivingly connected to the first driving motor is provided on the mounting roller.

[0007] In some technical schemes of the utility model, the second driving component includes a driving roller rotatably arranged in the cleaning tank, a plurality of clamping plates are sleeved on the driving roller, an annular mounting groove is opened on the outer circumferential surface of the clamping plates, and a second driving motor transmission-connected to the driving roller is installed on the outer wall of the cleaning tank.

[0008] In some technical schemes of the utility model, the flexible clamping assembly includes a mounting sleeve installed on a mounting seat, a piston is slidably provided in the mounting sleeve, two clamping plates are hinged on the piston, and the clamping plates are provided with torsion springs connected to the piston. A negative pressure inflation device connected to the mounting sleeve is provided on the mounting frame.

[0009] In some technical solutions of the utility model, a plurality of partitions are provided in the cleaning tank to divide the cleaning tank into a plurality of cleaning areas, and a plurality of through holes are provided on the side walls of the partitions.

[0010] In some technical solutions of the utility model, airbag strips are provided on the opposite side walls of the two clamping plates.

[0011] In some technical schemes of the utility model, the end of the mounting sleeve is hinged with two limit plates respectively abutting against the clamping plates, a sliding sleeve is sleeved on the outer wall of the mounting sleeve, the sliding sleeve is provided with two push rods respectively hinged with the limit plates, and the outer wall of the mounting sleeve is provided with a pushing component for driving the sliding sleeve to move along the axial direction of the mounting sleeve.

[0012] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0013] The first driving component is arranged to drive the mounting roller and the wafer clamped on the mounting roller by the flexible clamping component to perform a 270-degree flipping movement in the mounting frame, that is, the wafer and the mounting frame are kept in a horizontal state at the initial stage, and then the driving frame of the first driving component enters the cleaning tank to clean the wafer; the above structure can avoid the wafer from being directly attached to the driving roller, resulting in an increase in the colloidal substance on the wafer, resulting in the subsequent degumming effect on the wafer cannot be guaranteed; the second driving component installed on the bottom of the cleaning tank can drive the wafer to perform a circular motion in the cleaning tank through the second driving component after the wafer is placed in the cleaning tank, so that the wafer is fully in contact with the cleaning liquid in the displacement cleaning tank, thereby improving the cleaning ability of the device for the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the top view structure of the utility model;

[0017] Figure 3It is a top view of a partial assembly schematic diagram of the utility model;

[0018] Figure 4 It is a schematic cross-sectional structural diagram of the clamping assembly in the utility model.

[0019] Icons: 1. Cleaning tank; 2. Partition; 3. Through hole; 4. Mounting frame; 5. Mounting seat; 6. Mounting sleeve; 7. Clamping plate; 8. Mounting roller; 9. First drive motor; 10. Reducer; 11. Negative pressure inflation device; 12. Frame; 13. Cleaning roller; 14. Push rod; 15. Sliding sleeve; 16. Pushing assembly; 17. Clamping plate; 18. Drive roller; 19. Second drive motor; 20. Airbag strip. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Example 1

[0023] Please refer to Figure 1-Figure 4 shown.

[0024] The utility model provides a wafer auxiliary cleaning device, such as Figure 1 , Figure 2As shown, it includes a mounting frame 4 installed on the top of the cleaning tank 1, a mounting roller 8 is rotatably provided in the mounting frame 4, a plurality of mounting seats 5 are provided along the axial direction of the mounting roller 8, and a flexible clamping assembly for clamping the wafer is installed on the mounting frame 4, a first driving assembly for driving the mounting roller 8 to rotate is provided, and a second driving assembly for driving the movement of the plurality of wafers is provided on the bottom of the cleaning tank 1. The auxiliary equipment for clamping the wafer is installed on the top of the cleaning tank 1 by the mounting frame 4, so that the adaptability of the device can be improved, and the mounting frame 4 can be disassembled on the top of the cleaning tank 1 by means of bolts, etc., the mounting roller 8 is rotatably provided in the U-shaped area of ​​the mounting frame 4 by means of a bearing bearing, and a plurality of internal thread holes are opened on the outer wall of the mounting roller 8 along the axial direction thereof, and screws adapted to the internal thread holes are penetrated on the mounting seat 5, so that the spacing between any two adjacent mounting seats 5 can be adjusted according to actual needs, or the relative spacing of the plurality of mounting seats 5 can be adjusted, so that more mounting seats 5 can be installed within the effective length of the mounting roller 8, so that a certain number of wafers can be clamped as much as possible, thereby improving the efficiency of the device in cleaning the wafers at one time. The effect and efficiency are improved; the first driving component can drive the mounting roller 8 and the wafer clamped on the mounting roller 8 by the flexible clamping component to perform a 270-degree flipping movement in the mounting frame 4, that is, the wafer and the mounting frame 4 are kept in a horizontal state at the beginning, and then the driving frame of the first driving component enters the cleaning tank 1 to clean the wafer; the above structure can avoid the wafer from being directly attached to the driving roller 18, resulting in an increase in the colloidal substance on the wafer, resulting in the subsequent wafer degumming effect cannot be guaranteed; the second driving component installed on the bottom of the cleaning tank 1 can drive the wafer to perform a circular motion in the cleaning tank 1 through the second driving component after the wafer is placed in the cleaning tank 1, so that the wafer is fully in contact with the cleaning liquid in the displacement cleaning tank 1, thereby improving the cleaning ability of the device for the wafer.

[0025] In some technical solutions of the utility model, the first driving assembly includes a first driving motor 9 installed on the mounting frame 4, and a reducer 10 is provided on the mounting roller 8 and is connected to the first driving motor 9. The first driving motor 9 is installed on the mounting frame 4 by bolts and other components, and the first driving motor 9 is connected to the mounting roller 8 by the reducer 10 to avoid high-speed rotation of the mounting roller 8, so that the rotation speed of the mounting roller 8 can be controlled, so that the mounting roller 8 and the wafer clamped on the mounting roller 8 by the clamping assembly can remain stable when performing a 270-degree flipping movement in the mounting frame 4 to avoid damage to the wafer, thereby protecting the wafer.

[0026] In some technical schemes of the utility model, the second driving assembly includes a driving roller 18 rotatably arranged in the cleaning tank 1, a plurality of clamping pieces 17 are sleeved on the driving roller 18, an annular mounting groove is provided on the outer circumferential surface of the clamping piece 17, and a second driving motor 19 connected to the driving roller 18 is installed on the outer wall of the cleaning tank 1. The material of the clamping piece 17 arranged on the driving roller 18 is hard rubber material, when the driving roller 18 is driven by the second driving motor 19 to make a circular motion, the clamping piece 17 in the rotating state will not be deformed due to the centrifugal force; the mounting groove opened on the outer circumferential surface of the clamping piece 17 is embedded with a protective layer, and the material of the protective layer is a flexible rubber sheet, so as to avoid the protective layer from scratching the wafer placed in the mounting groove, causing the problem of scrapping the wafer. And when the second driving motor 19 drives the driving roller 18 and the clamping piece 17 arranged on the driving roller 18 to rotate in the cleaning tank 1, the cleaning liquid in the cleaning tank 1 can be stirred to impact on the wafer, thereby improving the cleaning effect of the device on the wafer.

[0027] In some technical schemes of the utility model, the flexible clamping assembly includes a mounting sleeve 6 mounted on the mounting seat 5, a piston is slidably arranged in the mounting sleeve 6, two clamping plates 7 are hinged on the piston, and the clamping plates 7 are provided with torsion springs connected to the piston, and the mounting frame 4 is provided with a negative pressure inflation device 11 connected to the mounting sleeve 6. The cross section of the mounting sleeve 6 is annular, and one end of the mounting sleeve 6 is closed and the other end is open. The piston and the two clamping plates 7 are installed at the open end of the mounting sleeve 6, and the two clamping plates 7 extend out of the mounting sleeve 6. The closed end 1 of the mounting sleeve 6 is provided with an inlet and outlet valve connected to the negative pressure inflation device 11, and the inlet and outlet valve is a solenoid valve. When the negative pressure device inflates the gas in the mounting sleeve 6, the piston will move in the direction close to the mounting seat 5 under the action of the negative pressure. At this time, the two clamping plates 7 are squeezed by the mounting sleeve 6 and move closer to each other. The distance between the two clamping plates is gradually reduced, so that the wafer placed between the two clamping plates 7 is clamped, and the wafer is fixed by gluing, which reduces the glue content on the wafer.

[0028] Preferably, the negative pressure inflation device 11 is prior art and will not be described in detail here.

[0029] In some technical solutions of the present utility model, airbag strips 20 are provided on the opposite side walls of the two clamping plates 7. The airbag strips 20 can prevent the clamping plates 7 from being in hard contact with the wafer, thereby preventing the wafer from being damaged.

[0030] In some technical schemes of the utility model, the end of the installation sleeve 6 is hinged with two limit plates respectively abutting against the clamping plate 7, a sliding sleeve 15 is sleeved on the outer wall of the installation sleeve 6, and two push rods 14 are respectively hinged with the limit plates on the sliding sleeve 15, and a pushing assembly 16 is provided on the outer wall of the installation sleeve 6 to drive the sliding sleeve 15 to move along the axial direction of the installation sleeve 6. The limit plate arranged at the end of the installation sleeve 6 is hinged with the clamping plate 7 by rotating the pin, and the push rod 14 is arranged to be L-shaped, and the angle between the two ends is an acute angle; the push rod 14 is hinged with the limit plate through the pin, so that when the push assembly 16 pushes the sliding sleeve 15 to move in the direction close to the limit plate, the push rod 14 will force the two limit plates to approach each other, so that the limit spacing of the installation sleeve 6 to the two clamping plates 7 can be changed, so as to control the movement of the two limit plate seats approaching each other at a smaller spacing, so as to clamp the wafer placed between the two clamping plates 7, avoid fixing the wafer by gluing, and reduce the glue content on the wafer.

[0031] Preferably, the pushing component 16 is a micro electric push rod 14 component, and its specific model is a lifting motor and a lifter, which is the existing technology.

[0032] In some technical solutions of the utility model, a plurality of partitions 2 are provided in the cleaning tank 1 to divide the cleaning tank 1 into a plurality of cleaning areas, and a plurality of through holes 3 are provided on the side walls of the partitions 2, and the through holes 3 can allow the cleaning liquid to flow in the cleaning tank 1. In this way, a plurality of wafers can be separated into independent cleaning areas for cleaning, thereby ensuring the cleaning effect of a single wafer; and each clamping piece 17 is placed in a cleaning area.

[0033] Preferably, a frame 12 is installed between any two adjacent partitions 2, and at least two cleaning rollers 13 rotate on the frame 12. A flexible brush cover is provided on the outer wall of the cleaning roller 13, and a channel for the wafer to pass through is reserved between the two cleaning rollers 13. When the wafer is placed between the two cleaning rollers 13, the flexible brush cover contacts the wafer, and the two cleaning rollers 13 can also provide auxiliary support for the wafer.

[0034] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer auxiliary cleaning device, comprising a cleaning tank, characterized in that: It includes a mounting frame installed on the top of the cleaning tank, a mounting roller is rotatably provided in the mounting frame, a plurality of mounting seats are provided along the axial direction of the mounting roller, a flexible clamping assembly for clamping the wafer is installed on each of the mounting seats, a first driving assembly for driving the mounting roller to rotate is provided on the mounting frame, and a second driving assembly for driving the movement of multiple wafers is provided on the bottom of the cleaning tank.

2. A wafer auxiliary cleaning device according to claim 1, characterized in that: The first driving assembly includes a first driving motor installed on the mounting frame, and the mounting roller is provided with a reducer drivingly connected to the first driving motor.

3. The wafer auxiliary cleaning device according to claim 1, characterized in that: The second driving assembly includes a driving roller rotatably disposed in the cleaning tank, a plurality of clamping plates are sleeved on the driving roller, an annular mounting groove is opened on the outer circumferential surface of the clamping plate, and a second driving motor drivingly connected to the driving roller is installed on the outer wall of the cleaning tank.

4. The wafer auxiliary cleaning device according to claim 1, characterized in that: The flexible clamping assembly includes a mounting sleeve installed on the mounting seat, a piston is slidably provided in the mounting sleeve, two clamping plates are hinged on the piston, and the clamping plates are each provided with a torsion spring connected to the piston. The mounting frame is provided with a negative pressure inflation device connected to the mounting sleeve.

5. The wafer auxiliary cleaning device according to claim 1, characterized in that: A plurality of partitions are arranged in the cleaning tank to divide the cleaning tank into a plurality of cleaning areas, and a plurality of through holes are opened on the side walls of the partitions.

6. The wafer auxiliary cleaning device according to claim 4, characterized in that: Air bag strips are arranged on the opposite side walls of the two clamping plates.

7. The wafer auxiliary cleaning device according to claim 4, characterized in that: The end of the mounting sleeve is hinged with two limit plates respectively abutting against the clamping plates, a sliding sleeve is sleeved on the outer wall of the mounting sleeve, the sliding sleeve is provided with two push rods respectively hinged with the limit plates, and a pushing component for driving the sliding sleeve to move along the axial direction of the mounting sleeve is provided on the outer wall of the mounting sleeve.

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