Double-lower-disc operation device of sapphire substrate grinding equipment

Abstract

The utility model discloses a double-lower-disc operation device of sapphire substrate slice grinding equipment, and relates to the field of sapphire wafer processing. The double-lower-disc working device of the sapphire substrate slice grinding equipment solves the problems that an existing double-lower-disc working device of the sapphire substrate slice grinding equipment is low in substrate slice grinding machining efficiency and poor in machining quality. A rotating motor is vertically arranged in the center of a lower platform of a rack, a follow-up rotating disc matched with an upper platform of the rack in a rotating mode is arranged below the upper platform of the rack, and the follow-up rotating disc and a lower grinding disc are connected with the rotating motor through an upper and lower disc linkage mechanism. An upper disc lifting mechanism with the power output end connected with the upper grinding disc is installed on the lower portion of the follow-up rotary disc, an upper disc center hole is machined in the middle of the upper surface of the upper grinding disc, a middle disc lifting mechanism is vertically inserted into the center of the upper disc center hole, the upper portion of the middle disc lifting mechanism is slidably connected with the follow-up rotary disc, and the power output end of the middle disc lifting mechanism is connected with the middle grinding disc. The grinding device is used for improving the product machining operation efficiency and the machining quality after grinding.

Description

Technical Field

[0001] The utility model relates to the field of sapphire wafer processing, in particular to a double lower plate operating device of sapphire substrate sheet grinding equipment. Background Art

[0002] In recent years, due to the emergence of display technologies such as OLED, QLED, Mini LED and Micro LED, integrated circuit chip packaging technology has developed towards smaller size, higher density, higher performance and more functions, and the corresponding wafer quality requirements have also increased. Therefore, the development of high-quality processing technology for sapphire wafers has become a necessary task for current development.

[0003] After the sapphire substrate is cut from the crystal rod into a sheet, the appearance of the cutting texture, surface roughness, various flatness values, and the overall thickness difference can no longer be changed by the cutting process. Therefore, in order to obtain a more uniform thickness, a certain surface roughness value, and a smaller flatness value test result, the substrate needs to go through a grinding process. The grinding equipment used in the existing grinding operation method relies on the cylinder to pull the cast iron grinding upper plate and land on the lower plate full of substrate sheets to be worked on. The substrate sheet is thinned and ground by rotating the upper and lower plates in opposite directions. The number of substrate sheets that can be worked together at the same time is small, and the efficiency is low. When the abrasive diameter is relatively small, the thinning operation time of the grinding sheet is extended and the processing efficiency is reduced. At the same time, the long grinding process is not conducive to the repair of the warped shape of the grinding sheet, affecting the processing quality of the grinding sheet.

[0004] In summary, the existing double bottom plate operation device of sapphire substrate sheet grinding equipment has the problems of low substrate sheet grinding efficiency and poor processing quality. Utility Model Content

[0005] The purpose of the utility model is to solve the problems of low substrate sheet grinding efficiency and poor processing quality in the existing double lower plate operating device of sapphire substrate sheet grinding equipment, and further provide a double lower plate operating device of sapphire substrate sheet grinding equipment.

[0006] The technical solution of the utility model is:

[0007] A double lower plate operation device for a sapphire substrate sheet grinding device comprises a grinding frame 1, a grinding upper plate 2, a grinding middle plate 3, a grinding lower plate 4, an upper and lower plate linkage mechanism 5, an upper plate lifting mechanism 6, a middle plate lifting mechanism 7, a rotary motor 8 and a follower turntable 9. The grinding upper plate 2, the grinding middle plate 3 and the grinding lower plate 4 are coaxially arranged from top to bottom between an upper frame platform 1-1 and a lower frame platform 1-2 of the grinding frame 1. A vertically arranged rotary motor 8 is arranged at the center of the lower frame platform 1-2. A follower turntable 9 is arranged below the upper frame platform 1-1. The follower turntable 9 is connected to the grinding frame 1 and the lower frame platform 1-2. The upper platform 1-1 of the frame rotates in coordination, the follow-up turntable 9 and the grinding lower plate 4 are connected to the rotating motor 8 through the upper and lower plate linkage mechanism 5, and the upper plate lifting mechanism 6 is installed at the lower part of the follow-up turntable 9, and the power output end of the upper plate lifting mechanism 6 is connected to the grinding upper plate 2, and an upper plate center hole is processed in the middle of the upper surface of the grinding upper plate 2, and a middle plate lifting mechanism 7 is vertically inserted into the center of the upper plate center hole, and the upper part of the middle plate lifting mechanism 7 is slidably connected to the follow-up turntable 9, and the power output end of the middle plate lifting mechanism 7 is connected to the grinding middle plate 3, and the center of the grinding lower plate 4 is connected to the sun gear of the equipment.

[0008] Furthermore, the upper and lower disk linkage mechanism 5 includes a power transmission rod 5-1, a large disk spindle 5-2 and a turntable spindle 5-3. The turntable spindle 5-3 and the large disk spindle 5-2 are both hollow shafts. The upper end of the power transmission rod 5-1 is fixedly inserted in the inner hole of the turntable spindle 5-3. The turntable spindle 5-3 is fixedly inserted in the inner hole of the follower turntable 9. The centers of the upper surfaces of the grinding middle disk 3 and the grinding lower disk 4 are respectively processed with the middle disk center hole and the lower disk center hole. The lower end of the power transmission rod 5-1 passes through the upper disk center hole, the middle disk center hole, the inner hole of the large disk spindle 5-2 and the lower disk center hole from top to bottom and is connected to the rotating shaft of the rotating motor 8. The side of the large disk spindle 5-2 is fixedly connected to the power transmission rod 5-1, and the top of the grinding lower disk 4 is fixedly connected to the bottom of the large disk spindle 5-2.

[0009] Furthermore, the upper plate lifting mechanism 6 includes an upper plate cylinder, the number of which is no less than 2, and the upper plate cylinders are vertically arranged in a circular array between the follower turntable 9 and the grinding upper plate 2, the cylinder body end of the upper plate cylinder is fixedly connected to the bottom of the follower turntable 9, and the piston rod end of the upper plate cylinder is fixedly connected to the top of the grinding upper plate 2.

[0010] Furthermore, the middle plate lifting mechanism 7 includes a middle plate cylinder, the number of which is not less than 2, and the middle plate cylinders are vertically arranged in a circular array between the follower turntable 9 and the grinding middle plate 3. The cylinder body end of the middle plate cylinder is slidably connected to the bottom of the follower turntable 9, and the piston rod end of the middle plate cylinder is fixedly connected to the top of the grinding middle plate 3.

[0011] Furthermore, all the middle plate cylinders pass through the upper plate center hole of the grinding upper plate 2.

[0012] Furthermore, it also includes a T-shaped connecting block. A circular ring groove with a T-shaped longitudinal section is processed at the bottom of the follower turntable 9. A T-shaped connecting block can be slidably installed in the circular ring groove. The number of T-shaped connecting blocks is consistent with the number of middle disk cylinders. The cylinder body end of the middle disk cylinder is connected to the lower end of the T-shaped connecting block.

[0013] Furthermore, the grinding upper plate 2, the grinding middle plate 3 and the grinding lower plate 4 are all circular cast iron plates, and the surfaces of the circular cast iron plates are processed into grids with the same length and width by grooves.

[0014] Furthermore, it also includes a stirring liquid supply system, which includes a liquid storage container, a Qinshui sand pump, a stirring paddle, a stirring motor and a conveying pipeline. The liquid storage container is installed inside the frame lower platform 1-2 of the grinding frame 1. A vertically arranged stirring paddle is provided inside the liquid storage container. The top of the stirring paddle passes through the liquid storage container cover and is connected to the rotating shaft of the stirring motor. A Qinshui sand pump is provided inside the liquid storage container. One end of the conveying pipeline passes through the side wall of the liquid storage container and is connected to the outlet of the Qinshui sand pump. The conveying pipeline is sealed to the side wall of the liquid storage container.

[0015] Compared with the prior art, the utility model has the following effects:

[0016] 1. The double bottom plate operation device of the sapphire substrate grinding equipment of the utility model realizes a significant increase in the number of operating products within the same operating time, reduces the production cycle of the product, and improves the processing efficiency of the substrate in the grinding process, laying a solid foundation for the implementation of increasing production and efficiency.

[0017] 2. The double lower plate operating device of the sapphire substrate sheet grinding equipment of the utility model sets the cylinders acting on two different plates (grinding upper plate 2 and grinding middle plate 3) to different forces to pull up the plate weights, so that each substrate sheet in the grinding and thinning process can be subjected to the same operating pressure, maintaining the same thickness removal speed of the grinding sheets produced thereby and a relatively small thickness difference of each sheet itself.

[0018] 3. The double lower plate operating device of the sapphire substrate sheet grinding equipment of the utility model can rely on the balanced and stable pressure on the products being operated to improve the quality of the produced grinding sheets, and can make the grinding sheets at the end of the operation have better performance in the test results of the flatness values.

[0019] 4. The double lower plate operation device of the sapphire substrate grinding equipment of the utility model can adjust different forces applied to the cutting disc to be processed by the action of the cylinder. Different pressures can be applied to the incoming cutting discs of different qualities: when the incoming cutting disc value is small, the pressure can be appropriately increased to reduce the force of pulling up the disc weight, and the thickness can be thinned faster; when the incoming cutting disc value is not good, the pressure can be appropriately reduced to increase the force of pulling up the disc weight, reduce the thinning speed, and repair the value of the cutting disc to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The utility model is a schematic diagram of the structure of a double lower plate working device of a sapphire substrate lapping device.

[0021] In the figure: 1. grinding frame; 2. grinding upper plate; 3. grinding middle plate; 4. grinding lower plate; 5. upper and lower plate linkage mechanism; 6. upper plate lifting mechanism; 7. middle plate lifting mechanism; 8. rotating motor; 9. follow-up turntable; 1-1. upper platform of frame; 1-2. lower platform of frame; 5-1. power transmission rod; 5-2. main shaft of large plate; 5-3. main shaft of turntable. DETAILED DESCRIPTION

[0022] Specific implementation method 1: Combination Figure 1 The present embodiment is described. The present embodiment is a double lower plate operation device of a sapphire substrate sheet grinding equipment, which includes a grinding frame 1, a grinding upper plate 2, a grinding middle plate 3, a grinding lower plate 4, an upper and lower plate linkage mechanism 5, an upper plate lifting mechanism 6, a middle plate lifting mechanism 7, a rotary motor 8 and a follower turntable 9. The grinding upper plate 2, the grinding middle plate 3 and the grinding lower plate 4 are coaxially arranged in sequence from top to bottom between the upper frame platform 1-1 and the lower frame platform 1-2 of the grinding frame 1. The center of the lower frame platform 1-2 is provided with a vertically arranged rotary motor 8. The lower frame platform 1-1 is provided with a rotary motor 8. There is a follower turntable 9, which is rotatably matched with the upper platform 1-1 of the frame. The follower turntable 9 and the grinding lower plate 4 are connected to the rotating motor 8 through the upper and lower plate linkage mechanism 5. The lower part of the follower turntable 9 is installed with an upper plate lifting mechanism 6, and the power output end of the upper plate lifting mechanism 6 is connected to the grinding upper plate 2. The middle part of the upper surface of the grinding upper plate 2 is processed with an upper plate center hole, and a middle plate lifting mechanism 7 is vertically inserted into the center of the upper plate center hole. The upper part of the middle plate lifting mechanism 7 is slidably connected to the follower turntable 9, and the power output end of the middle plate lifting mechanism 7 is connected to the grinding middle plate 3.

[0023] In order to improve the current situation of low operating efficiency of the existing substrate sheets in the grinding process, and at the same time improve the processing quality of the substrate sheets in the grinding process, and obtain better numerical results of the flatness of the substrate sheets. Through this operation method, on the basis of the basic process of processing grinding sheets in the original grinding equipment, a planetary wheel of appropriate thickness is placed on the grinding lower plate 4, and the cutting sheet to be operated is placed in the planetary wheel, and the placement of the cutting sheet is confirmed to avoid stringing and winches. Drop the grinding middle plate 3 in the improved device, repeat the balance wheel and balance sheet operations, and confirm the placement position again. Drop the grinding upper plate 2, and run the equipment to start operation. Through the implementation of the above method, the efficiency of product processing operations can be effectively improved. At the same time, the relatively more uniform force can also improve the processing quality of the product after grinding.

[0024] Specific implementation method 2: Combination Figure 1 Describing the present embodiment, the upper and lower disk linkage mechanism 5 of the present embodiment comprises a power transmission rod 5-1, a large disk spindle 5-2 and a turntable spindle 5-3. The turntable spindle 5-3 and the large disk spindle 5-2 are both hollow shafts. The upper end of the power transmission rod 5-1 is fixedly inserted in the inner hole of the turntable spindle 5-3. The turntable spindle 5-3 is fixedly inserted in the inner hole of the follower turntable 9. The centers of the upper surfaces of the grinding middle disk 3 and the grinding lower disk 4 are respectively processed with the middle disk center hole and the lower disk center hole. The lower end of the power transmission rod 5-1 passes through the upper disk center hole, the middle disk center hole, the inner hole of the large disk spindle 5-2 and the lower disk center hole from top to bottom in sequence and is connected to the rotating shaft of the rotating motor 8. The side of the large disk spindle 5-2 is fixedly connected to the power transmission rod 5-1, the top of the grinding lower disk 4 is fixedly connected to the bottom of the large disk spindle 5-2, and the center of the grinding lower disk 4 is connected to the sun gear of the equipment. In this arrangement, the center of the grinding lower plate 4 is connected to the sun gear of the equipment, and the rotational power is provided by the main shaft of the large plate inside the equipment, and then the upper and lower plates are made to rotate at the same speed through the upper and lower plate linkage mechanism 5. Under the action of the power transmission rod 5-1, the rotational power and rotational direction of the grinding lower plate 4 are transmitted to the grinding upper plate 2, so that the two can run synchronously. The other components and connection relationships are the same as those of the specific embodiment 1.

[0025] In this embodiment, the center hole of the middle plate is used to accommodate the main shaft 5-2 of the large plate, and the penetrating hole is used to ensure the normal operation of the main shaft 5-2 of the large plate.

[0026] Specific implementation method three: Combination Figure 1To explain this embodiment, the upper plate lifting mechanism 6 of this embodiment includes an upper plate cylinder, the number of which is not less than 2, and the upper plate cylinders are vertically arranged in a circular array between the follower turntable 9 and the grinding upper plate 2, the cylinder end of the upper plate cylinder is fixedly connected to the bottom of the follower turntable 9, and the piston rod end of the upper plate cylinder is fixedly connected to the top of the grinding upper plate 2. In this way, the upper plate cylinder is responsible for controlling the pressure of the grinding upper plate 2 on the operating product. Since the grinding upper plate 2 adopts a cast iron plate with a large dead weight, the upper plate cylinder controls the pressure on the substrate to be operated during the grinding operation through the action of force. Other components and connection relationships are the same as those of the first or second specific embodiments.

[0027] Specific implementation method four: Combination Figure 1 This embodiment is described. The middle plate lifting mechanism 7 of this embodiment includes a middle plate cylinder, the number of which is not less than 2. The middle plate cylinders are vertically arranged in a circular array between the follower turntable 9 and the grinding middle plate 3. The cylinder end of the middle plate cylinder is slidably connected to the bottom of the follower turntable 9, and the piston rod end of the middle plate cylinder is fixedly connected to the top of the grinding middle plate 3. In this way, the middle plate cylinder is similar to the upper plate cylinder and is responsible for the plate weight and lifting of the grinding middle plate 3. Other components and connection relationships are the same as those of the first, second or third specific embodiments.

[0028] Specific implementation method five: Combination Figure 1 To explain this embodiment, all the middle plate cylinders of this embodiment pass through the upper plate center hole of the grinding upper plate 2. In this way, the upper plate center hole in the middle of the grinding upper plate 2 is a hole for accommodating the penetration of the middle plate cylinder to ensure the normal operation of the middle plate cylinder. Other components and connection relationships are the same as those of the specific embodiments one, two, three or four.

[0029] Specific implementation method six: Combination Figure 1 This embodiment is described. This embodiment also includes a T-shaped connection block. The bottom of the follower turntable 9 is processed with a circular annular groove with a T-shaped longitudinal section. The circular annular groove can be slidably installed. The number of T-shaped connection blocks is consistent with the number of middle plate cylinders. The cylinder end of the middle plate cylinder is connected to the lower end of the T-shaped connection block. In this way, since the grinding middle plate 3 needs to rotate relative to the grinding upper plate 2 and the grinding lower plate 4 during the operation, it is necessary to ensure that there is a certain speed difference between the grinding middle plate 3 and the upper and lower plates or the grinding middle plate 3 remains stationary. By designing the top of the middle plate cylinder connected to the grinding middle plate 3 to connect the T-shaped connection block, the T-shaped connection block is slidably connected to the circular annular groove at the bottom of the follower turntable 9, so that the grinding middle plate 3 can rotate relative to the grinding upper plate 2 and the grinding lower plate 4. The grinding middle plate 3 is a cast iron plate with a certain thickness, which is not easily driven by the grinding upper plate 2 and the grinding lower plate 4. The other components and connection relationships are the same as those of the specific embodiments one, two, three, four or five.

[0030] Specific implementation method seven: Combination Figure 1 This embodiment is described. The grinding upper plate 2, the grinding middle plate 3 and the grinding lower plate 4 of this embodiment are all circular cast iron plates, and the surface of the circular cast iron plates is processed into grids with the same length and width by grooves. In this way, the grinding upper plate 2, the grinding middle plate 3 and the grinding lower plate 4 are all circular cast iron plates with a certain thickness, and the surface is processed into grids with the same length and width by grooves. The design of the grooves greatly improves the efficiency of removing the thickness of the grinding sheet. The other components and connection relationships are the same as those of the specific embodiments one, two, three, four, five or six.

[0031] Specific implementation method eight: Combination Figure 1 This embodiment is described. This embodiment also includes a stirring liquid supply system, which includes a liquid storage container, a Qinshui sand pump, a stirring paddle, a stirring motor and a delivery pipeline. The liquid storage container is installed inside the frame lower platform 1-2 of the grinding frame 1. A vertically arranged stirring paddle is provided inside the liquid storage container. The top of the stirring paddle passes through the liquid storage container cover and is connected to the rotating shaft of the stirring motor. A Qinshui sand pump is provided inside the liquid storage container. One end of the delivery pipeline passes through the side wall of the liquid storage container and is connected to the outlet of the Qinshui sand pump. The delivery pipeline is sealed to the side wall of the liquid storage container. With such a configuration, after a mixture of water and abrasive is added to the liquid storage container, the liquid storage container is transported through the delivery pipeline connected to the Qinshui sand pump, which is responsible for the supply of abrasive during the processing of the grinding sheet. Other components and connection relationships are the same as those of specific embodiments one, two, three, four, five, six or seven.

[0032] Embodiment 1

[0033] Combination Figure 1 To illustrate this embodiment, the specific process of grinding the sapphire substrate sheet in this embodiment is as follows:

[0034] Step 1: Mix abrasive and water in a certain proportion in the stirring liquid supply system container of the equipment, as well as other oil reagents for suspension. Run the stirring operation to fully stir the above mixture so that it can be suspended in the container.

[0035] Step 2: Raise the grinding upper plate 2 and the grinding middle plate 3, place the planetary wheels at the same intervals on the grinding lower plate 4, and drop the grinding middle plate 3. Run the stirring and liquid supply system and the equipment. Perform operations such as warming up the machine and checking the wheel to confirm the placement quality of the planetary wheels and verify whether there are problems such as uneven rotation that may affect the product processing quality.

[0036] Step 3: Use the upper plate cylinder to raise the upper grinding plate 2, and use the middle plate cylinder to raise the middle grinding plate 3. Place the cutting discs to be processed in the planetary wheel. After the planetary wheel of the lower grinding plate 4 is filled, confirm the placement of the cutting discs to avoid displacement of the working cutting discs, which may cause the risk of slipping from the planetary wheel. Confirm the initial thickness of the cutting disc to be processed, and calculate the estimated operation time according to the difference between it and the target grinding disc thickness.

[0037] Step 4: drop the grinding middle plate 3, repeat the above-mentioned operation of placing the cutting disc in the planetary wheel placed on the grinding middle plate 3, while ensuring the placement quality of the cutting disc, and drop the grinding upper plate 2.

[0038] Step 5: Run the stirring liquid supply system, so that the "grinding liquid" carries the filled abrasive and flows through the pipeline to the surface of the cutting piece to be worked between the discs, and the equipment is operated. At this time, the grinding upper disc 2 and the grinding lower disc 4 start to rotate in the same direction and at the same speed under the action of the upper and lower disc linkage mechanism 5, and form a relative motion with the grinding middle disc 3. The power of its rotation is provided by the sun gear connected to the center of the grinding lower disc 4 by the internal motor of the equipment.

[0039] Step 6: 3 minutes before starting the operation, the operator is required not to leave the equipment. If an emergency occurs, the equipment must be stopped immediately.

[0040] Step 7. When the automatic operation mode of the equipment ends, use the upper plate cylinder to raise the grinding upper plate 2. Take a piece of grinding sheet and measure the remaining thickness at this time. If it is close to or reaches the target value, you can take out the remaining grinding sheet for the next step. If it is still not close to the target thickness, you need to repeat the piece inspection operation and continue the operation for a certain period of time.

[0041] Step 8: When the grinding sheet reaches the expected thickness, take out the grinding sheet after the operation is completed. Repeat the above operation and continue to work on the next batch of cutting sheets.

[0042] Step 9: After the operation is completed, rinse the seams of each layer to remove the residual grinding fluid inside the equipment. Rinse the grinding sheet and send it to the next process. After inspection, continue processing.

[0043] How it works

[0044] Combination Figure 1 The working principle of the double bottom plate operation device of the sapphire substrate grinding equipment of the utility model is described as follows:

[0045] First, measure the thickness of the cutting disc to be ground, and calculate the operation time according to the estimated thickness removal per minute.

[0046] Before the equipment is put into operation, place the planetary wheel on the grinding lower plate 4, confirm the engagement position of the gear ring, drop the grinding middle plate 3, and then continue to place the planetary wheel on the grinding middle plate 3, and drop the grinding upper plate 2. Turn on the stirring and liquid supply system, turn on the stirring motor of the stirring and liquid supply system, so that the grinding liquid is fully stirred under the action of the high-speed rotating stirring paddle, and the grinding liquid is transported between the plates, so that the grinding liquid flows into the gap between the plates, and the equipment is tested.

[0047] After the trial run, raise the grinding upper plate 2 and the grinding middle plate 3 in turn, place the cutting disc to be operated in the planetary wheel of the grinding lower plate 4, drop the grinding middle plate 3, continue to place the cutting disc, confirm the placement of the cutting disc to avoid placing it in a wrong position, and drop the grinding upper plate 2. Start running the equipment. During the operation of the equipment, the grinding upper plate 2 and the grinding lower plate 4 keep rotating at the same speed and in the same direction. The grinding middle plate 3 is "reversed" relative to the grinding upper plate 2 and the grinding lower plate 4, and plays the role of grinding with the grinding upper plate 2 and the grinding lower plate 4 respectively.

[0048] As mentioned above, after the same operation time, more grinding sheets can be obtained, which improves the product processing efficiency and the processing quality. The number of product operations can be increased in the same time, and the time consumption of product production can be shortened.

[0049] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A double bottom plate operation device for a sapphire substrate lapping device, characterized in that: The invention comprises a grinding frame (1), a grinding upper plate (2), a grinding middle plate (3), a grinding lower plate (4), an upper and lower plate linkage mechanism (5), an upper plate lifting mechanism (6), a middle plate lifting mechanism (7), a rotary motor (8), and a follower turntable (9). The grinding upper plate (2), the grinding middle plate (3), and the grinding lower plate (4) are coaxially arranged in sequence from top to bottom between an upper frame platform (1-1) and a lower frame platform (1-2) of the grinding frame (1). A rotary motor (8) arranged vertically is arranged at the center of the lower frame platform (1-2). A follower turntable (9) is arranged below the upper frame platform (1-1). The follower turntable (9) is connected to the upper frame platform (1-1) and the lower frame platform (1-2). 1-1) rotational cooperation, the follow-up turntable (9) and the grinding lower plate (4) are connected to the rotating motor (8) through the upper and lower plate linkage mechanism (5), the lower part of the follow-up turntable (9) is installed with an upper plate lifting mechanism (6), the power output end of the upper plate lifting mechanism (6) is connected to the grinding upper plate (2), the middle part of the upper surface of the grinding upper plate (2) is processed with an upper plate center hole, the center of the upper plate center hole is vertically inserted with a middle plate lifting mechanism (7), the upper part of the middle plate lifting mechanism (7) is slidably connected to the follow-up turntable (9), the power output end of the middle plate lifting mechanism (7) is connected to the grinding middle plate (3), and the center of the grinding lower plate (4) is connected to the sun gear of the equipment.

2. The double bottom plate operation device of a sapphire substrate lapping equipment according to claim 1, characterized in that: The upper and lower disk linkage mechanism (5) comprises a power transmission rod (5-1), a large disk spindle (5-2) and a turntable spindle (5-3). The turntable spindle (5-3) and the large disk spindle (5-2) are both hollow shafts. The upper end of the power transmission rod (5-1) is fixedly inserted in the inner hole of the turntable spindle (5-3). The turntable spindle (5-3) is fixedly inserted in the inner hole of the follower turntable (9). The centers of the upper surfaces of the grinding middle disk (3) and the grinding lower disk (4) are respectively processed with a middle disk center hole and a lower disk center hole. The lower end of the power transmission rod (5-1) passes through the upper disk center hole, the middle disk center hole, the inner hole of the large disk spindle (5-2) and the lower disk center hole from top to bottom in sequence and is connected to the rotating shaft of the rotating motor (8). The side of the large disk spindle (5-2) is fixedly connected to the power transmission rod (5-1). The top of the grinding lower disk (4) is fixedly connected to the bottom of the large disk spindle (5-2).

3. A double bottom plate operation device for sapphire substrate lapping equipment according to claim 1 or 2, characterized in that: The upper plate lifting mechanism (6) comprises an upper plate cylinder, the number of which is not less than 2, and the upper plate cylinders are vertically arranged in a circular array between the follower turntable (9) and the grinding upper plate (2), the cylinder body end of the upper plate cylinder is fixedly connected to the bottom of the follower turntable (9), and the piston rod end of the upper plate cylinder is fixedly connected to the top of the grinding upper plate (2).

4. The double bottom plate operation device of a sapphire substrate lapping equipment according to claim 3, characterized in that: The middle plate lifting mechanism (7) comprises middle plate cylinders, the number of which is not less than 2, and the middle plate cylinders are vertically arranged in a circular array between the follower turntable (9) and the grinding middle plate (3), the cylinder body end of the middle plate cylinder is slidably connected to the bottom of the follower turntable (9), and the piston rod end of the middle plate cylinder is fixedly connected to the top of the grinding middle plate (3).

5. The double bottom plate operation device of a sapphire substrate lapping equipment according to claim 4, characterized in that: All the middle plate cylinders pass through the upper plate center hole of the grinding upper plate (2).

6. The double bottom plate operation device of a sapphire substrate lapping equipment according to claim 5, characterized in that: It also includes a T-shaped connecting block. The bottom of the follower turntable (9) is processed with a circular groove with a T-shaped longitudinal section. The T-shaped connecting block can be slidably installed in the circular groove. The number of the T-shaped connecting blocks is consistent with the number of the middle plate cylinders. The cylinder end of the middle plate cylinder is connected to the lower end of the T-shaped connecting block.

7. The double bottom plate operation device of a sapphire substrate lapping equipment according to claim 6, characterized in that: The upper grinding plate (2), the middle grinding plate (3) and the lower grinding plate (4) are all circular cast iron plates, and the surfaces of the circular cast iron plates are processed into grids with the same length and width by grooves.

8. A double bottom plate operation device for sapphire substrate lapping equipment according to claim 1 or 7, characterized in that: It also includes a stirring liquid supply system, which includes a liquid storage container, a Qinshui sand pump, a stirring paddle, a stirring motor and a conveying pipeline. The liquid storage container is installed inside the frame lower platform (1-2) of the grinding frame (1). A vertically arranged stirring paddle is provided inside the liquid storage container. The top end of the stirring paddle passes through the liquid storage container cover and is connected to the rotating shaft of the stirring motor. The liquid storage container is provided with a Qinshui sand pump. One end of the conveying pipeline passes through the side wall of the liquid storage container and is connected to the outlet of the Qinshui sand pump. The conveying pipeline is sealed to the side wall of the liquid storage container.

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