Battery pack management integrated circuit BMIC and battery management system BMS

Abstract

The utility model provides a battery pack management integrated circuit BMIC and a battery management system BMS. The battery pack management integrated circuit BMIC comprises a master BMIC device, N slave BMIC devices and N millimeter wave wireless communication modules. The master BMIC device is connected with one slave BMIC device through one millimeter wave wireless communication module, and every two slave BMIC devices are connected through one millimeter wave wireless communication module to form a daisy chain structure. According to the utility model, the BMIC devices communicate with each other through the millimeter wave wireless communication module, and high-speed, stable and reliable data communication between the BMIC devices can be realized based on the characteristics of high transmission rate, high stability and high reliability of the millimeter wave wireless communication module. And the acquired battery data can be timely, stably and reliably transmitted to the MCU module for processing, so that the battery management performance is remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of battery management, in particular to a battery pack management integrated circuit BMIC and a battery management system BMS. Background Art

[0002] Battery management systems (BMS) play a vital role in a variety of electrical systems and applications, including full electric vehicles (FE), hybrid electric vehicles (HE), backup energy storage systems, uninterruptible power supply (UPS) units, electric bicycles, electric scooters, and portable and semi-portable equipment. As electrical technology continues to advance, the demand for battery management integrated circuit (BMIC) devices is also increasing. BMIC devices are the core components of battery management systems, and they are responsible for managing the cells in the battery pack. Specifically, an important task of BMIC devices is to perform very accurate cell voltage measurements and transmit these measurements to the microcontroller MCU of the BMS as quickly as possible. Doing so can keep all cell voltages as close as possible, thereby improving the overall performance of the battery. However, as the number of battery packs used in electric vehicles continues to increase, it can become a challenge to transmit the measurements from all battery packs to the MCU in a timely manner. To solve this problem, it is necessary to develop BMIC devices that support high-speed data communication between the microcontroller MCU and the BMIC devices. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a battery pack management integrated circuit BMIC and a battery management system BMS, which can enable high-speed data communication performance between the MCU and the BMIC.

[0004] In order to solve the above technical problems, the first technical solution adopted by the utility model is:

[0005] A battery pack management integrated circuit BMIC, comprising a master BMIC device, N slave BMIC devices and N millimeter wave wireless communication modules; wherein N is an integer greater than or equal to 2;

[0006] The master BMIC device and one slave BMIC device are connected via a millimeter wave wireless communication module, and every two slave BMIC devices are connected via a millimeter wave wireless communication module to form a daisy chain structure.

[0007] Optionally, the SPI interface of the master BMIC device and the SPI interface of a slave BMIC device are connected via a millimeter wave wireless communication module.

[0008] Optionally, the SPI interfaces of every two slave BMIC devices are connected via a millimeter wave wireless communication module.

[0009] Optionally, the SPI interface is a dual-pin SPI communication interface with differential signals.

[0010] Optionally, each slave BMIC device is connected to a battery pack.

[0011] Optionally, the master BMIC device is also connected to an MCU module.

[0012] Optionally, the millimeter wave wireless communication module is a full-duplex millimeter wave wireless communication module.

[0013] Optionally, the millimeter wave wireless communication module is a millimeter wave isolation communication chip.

[0014] The second technical solution adopted by the utility model is:

[0015] A battery management system BMS, including an MCU module and the above-mentioned battery pack management integrated circuit BMIC;

[0016] The main BMIC device in the battery management integrated circuit BMIC is connected to the MCU module.

[0017] Optionally, the battery pack management integrated circuit BMIC is a battery pack management chip.

[0018] The beneficial effect of the utility model is that the battery pack management integrated circuit BMIC provided by the utility model communicates with each other through a millimeter wave wireless communication module, and based on the millimeter wave wireless communication module's maximum communication rate of 10Gbps, signal delay within 3nS, signal jitter control at the ps level and excellent isolation and voltage resistance, high-speed data communication can be achieved between BMIC devices, thereby effectively solving the problem of untimely cell voltage transmission caused by slow data transmission rate; thereby significantly improving the battery management performance of the battery pack management integrated circuit BMIC. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure and connection of a battery management system BMS provided in an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of a millimeter wave wireless communication module in a battery management system BMS provided in an embodiment of the utility model.

[0021] Description of labels:

[0022] 1. MCU module; 2. Master BMIC device; 3. Slave BMIC device; 4. Millimeter wave wireless communication module. DETAILED DESCRIPTION

[0023] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0024] Please refer to Figure 1 and Figure 2 , Embodiment 1 of the present utility model is:

[0025] The present embodiment provides a battery management integrated circuit BMIC, including a master BMIC device 2, N slave BMIC devices 3 and N millimeter wave wireless communication modules 4; wherein N is an integer greater than or equal to 2, such as 2, 3, 4... Here, the specific value of N can be flexibly configured according to the demand for the number of battery packs.

[0026] like Figure 1 As shown, the master BMIC device 2 and one of the slave BMIC devices 3 are connected via a millimeter wave wireless communication module 4; at the same time, every two slave BMIC devices 3 are connected via a millimeter wave wireless communication module 4, and all BMIC devices are connected in series in the above manner to form a daisy chain structure.

[0027] In this embodiment, the structures of the master BMIC device and the slave BMIC device may be completely the same or different, and may be configured specifically according to the requirements of the master BMIC device. In addition, the BMIC device mode may be adjusted by grounding a mode selection pin, connecting a power supply voltage VDD, or modifying the value of an internal register bit (such as an EEPROM bit).

[0028] In this embodiment, each slave BMIC device is connected to a battery pack to obtain the corresponding battery parameters including voltage, current, temperature, etc. in real time, and transmit the acquired data to the upper-level slave BMIC device through the millimeter wave isolation communication module in a timely manner. Here, a battery pack is composed of multiple battery cells, which can provide the required voltage and / or current by connecting in series or in parallel, and the number can range from a few to dozens according to actual needs. The connection between the battery pack and the slave BMIC device can be achieved by connecting the cells in the battery pack to the corresponding interfaces inside the slave BMIC device.

[0029] In this embodiment, if Figure 1 As shown, the master BMIC device 2 is also connected to the MCU module 1. After receiving the data sent from the BMIC device 3, the master BMIC device 2 sends it to the MCU module 1 for judgment and decision making when necessary.

[0030] In some specific implementations of this embodiment, Figure 1As shown, the master BMIC device 2 and one of the slave BMIC devices 3 are connected via a millimeter wave wireless communication module 4, specifically: the SPI interface of the master BMIC device 2 and the SPI interface of one of the slave BMIC devices 3 are connected via a millimeter wave wireless communication module 4. In other words, the isolated SPI interface of the master BMIC device is coupled to the isolated SPI interface of one of the slave BMIC devices via millimeter wave isolation.

[0031] Correspondingly, every two slave BMIC devices 3 are connected via a millimeter wave wireless communication module 4 , specifically: the isolated SPI interfaces of every two slave BMIC devices 3 are connected via a millimeter wave wireless communication module 4 .

[0032] Preferably, the SPI interface is a two-pin SPI communication interface of a differential signal including a positive signal and a complementary negative signal, wherein the bit frame of the positive signal includes a bit period followed by an idle period having the same duration as the bit period.

[0033] In this embodiment, the millimeter wave wireless communication module is a communication module that implements wireless communication transmission based on the millimeter wave communication protocol. Preferably, the millimeter wave wireless communication module is a full-duplex millimeter wave wireless communication module to support two-way interactive communication between BMIC devices. For example, the slave BMIC devices can upload the acquired data to the master BMIC device; at the same time, the master BMIC device can also send the control instructions of the MCU module to the slave BMIC devices to control the slave BMIC devices.

[0034] In some specific implementations of this embodiment, the structure of the millimeter wave wireless communication module 4 is as follows: Figure 2 As shown, on each of the two isolated sides, a transmitting / receiving antenna and its corresponding receiving / transmitting device are provided, and the antennas on both sides are millimeter wave antennas, and the two are based on millimeter wave wireless communication. Therefore, in this embodiment, high isolation, high rate and high stability transmission can be achieved between the two isolated sides based on millimeter wave technology; at the same time, it also has a two-way interactive function.

[0035] In some specific implementations of this embodiment, the millimeter wave wireless communication module is a millimeter wave isolation communication chip. The millimeter wave wireless communication module in the form of an integrated chip is not only convenient for connection, but also can reduce the volume occupied.

[0036] As a preferred specific implementation of this embodiment, Figure 1As shown, the number of slave BMIC devices is 6, namely the first slave BMIC device, the second slave BMIC device, the third slave BMIC device...the sixth slave BMIC device; the number of millimeter wave wireless communication modules is also 6, namely the first millimeter wave wireless communication module, the second millimeter wave wireless communication module, the third millimeter wave wireless communication module...the sixth millimeter wave wireless communication module; the number of battery packs is also 6, and each slave BMIC device is connected to a battery pack to obtain battery parameters including voltage, current, temperature, etc. in real time.

[0037] The SPI interface (IHM and IHP interface) of the master BMIC device and the SPI interface (ILP and ILM interface) of the first slave BMIC device are connected through the first millimeter wave wireless communication module; the SPI interface (IHP and IHM interface) of the first slave BMIC device and the SPI interface (ILP and ILM interface) of the second slave BMIC device are connected through the second millimeter wave wireless communication module; the SPI interface (IHP and IHM interface) of the second slave BMIC device and the SPI interface (ILP and ILM interface) of the third slave BMIC device are connected through the third millimeter wave wireless communication module; ... and so on, until the SPI interface (IHP and IHM interface) of the fifth slave BMIC device and the SPI interface (ILP and ILM interface) of the sixth slave BMIC device are connected through the sixth millimeter wave wireless communication module.

[0038] The working principle of the above preferred specific implementation is:

[0039] After each slave BMIC device obtains key parameters such as voltage, current, and temperature of the battery cell from the battery pack connected to it, it transmits the obtained data to the millimeter wave wireless communication module through the SPI interface, and transmits the data to the upper-level BMIC device connected to it (which may be the master BMIC device or the slave BMIC device) through the millimeter wave wireless communication module; if the upper-level BMIC device that receives the data is a slave BMIC device, it continues to transmit it to the upper-level BMIC device through its millimeter wave wireless communication module, and transmits it upward step by step until it reaches the master BMIC device; after the master BMIC device receives the data, it transmits the data to the controller, that is, the MCU module based on the SPI protocol to communicate; the MCU module uniformly analyzes and processes the data and feeds back corresponding instructions.

[0040] The battery pack management integrated circuit BMIC provided in this embodiment is connected between various BMIC devices through a millimeter wave wireless communication module. Based on the characteristics of the millimeter wave wireless communication module, such as a maximum communication rate of 10Gbps, a signal delay of less than 3nS, a signal jitter control at the ps level, and excellent isolation and withstand voltage performance, it can not only realize high-speed, stable and reliable data communication between BMIC devices, ensuring that the acquired battery data can be timely, stably and reliably transmitted to the MCU module for processing; it can also support full-duplex communication and is compatible with communication protocols such as SPI, I2C, and UART, and can better adapt to various application environments. In this way, the battery management integrated circuit BMIC provided in this embodiment will have significantly improved battery management performance compared to the battery pack management integrated circuit BMIC of the prior art.

[0041] Please refer to Figure 1 , Embodiment 2 of the present utility model is:

[0042] Based on the first embodiment, this embodiment provides a battery management system BMS, including an MCU module 1 and the battery pack management integrated circuit BMIC described in the first embodiment; and also includes a plurality of battery packs;

[0043] The main BMIC device 2 in the battery management integrated circuit BMIC is connected to the MCU module 1 .

[0044] In some specific implementations of this embodiment, the battery management integrated circuit BMIC is a battery management chip. By integrating the entire structure of the first embodiment into a chip form, it is not only more convenient to connect, but also can achieve a significant reduction in volume, which is better suitable for the current trend of miniaturization.

[0045] In this embodiment, each BMIC device of the battery management integrated circuit BMIC is independently mounted on a respective PCB and connected to a corresponding battery pack.

[0046] The battery management system BMS provided in this embodiment communicates with each other in the battery pack management integrated circuit BMIC through a millimeter wave wireless communication module, and can achieve high-speed data communication between BMIC devices, thereby having a significant data transmission rate advantage, thereby effectively solving the problem of untimely cell voltage transmission caused by slow data transmission rate; thereby significantly improving the battery management performance of the battery management system BMS.

[0047] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. Battery pack management integrated circuit BMIC, characterized in that: It includes a master BMIC device, N slave BMIC devices and N millimeter wave wireless communication modules; wherein N is an integer greater than or equal to 2; The master BMIC device and one slave BMIC device are connected via a millimeter wave wireless communication module, and every two slave BMIC devices are connected via a millimeter wave wireless communication module to form a daisy chain structure.

2. The battery management integrated circuit BMIC according to claim 1, characterized in that: The SPI interface of the master BMIC device and the SPI interface of the slave BMIC device are connected via a millimeter wave wireless communication module.

3. The battery management integrated circuit BMIC according to claim 1, characterized in that: Every two SPI interfaces of slave BMIC devices are connected via a millimeter wave wireless communication module.

4. The battery management integrated circuit BMIC according to claim 2 or 3, characterized in that: The SPI interface is a dual-pin SPI communication interface with differential signals.

5. The battery management integrated circuit BMIC as claimed in claim 1, characterized in that: Each slave BMIC device is connected to a battery pack.

6. The battery management integrated circuit BMIC as claimed in claim 1, characterized in that: The master BMIC device is also connected to the MCU module.

7. The battery management integrated circuit BMIC as claimed in claim 1, characterized in that: The millimeter wave wireless communication module is a full-duplex millimeter wave wireless communication module.

8. The battery management integrated circuit BMIC as claimed in claim 1, characterized in that: The millimeter wave wireless communication module is a millimeter wave isolation communication chip.

9. Battery management system BMS, characterized in that: It comprises an MCU module and a battery management integrated circuit BMIC as claimed in any one of claims 1 to 8; The main BMIC device in the battery management integrated circuit BMIC is connected to the MCU module.

10. The battery management system BMS according to claim 9, characterized in that: The battery management integrated circuit BMIC is a battery management chip.

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