Cover opening device of semiconductor device and semiconductor device

Abstract

The embodiment of the utility model provides an uncovering device of semiconductor equipment and the semiconductor equipment, and relates to the field of semiconductor production and manufacturing, the uncovering device comprises a lifting shaft and a plurality of carrying parts which are sequentially arranged from top to bottom, and each carrying part is provided with a shaft hole and rotatably sleeves the periphery of the lifting shaft through the respective shaft hole; each loading part is connected with the lifting shaft in a synchronous lifting manner, at least one loading part is provided with a coupling part and is connected with the lifting shaft in a decoupling manner through the coupling part, the coupling part comprises a movable part, and the movable part can act to a coupling state or a decoupling state relative to the corresponding loading part; therefore, the synchronous lifting connection between the corresponding loading part and the lifting shaft can be realized or released. The cover opening device can open and close the cover plates of the semiconductor equipment, manual carrying is not needed in the cover opening and closing process, only one set of cover opening device is configured for the multiple cover plates sequentially arranged from top to bottom of the semiconductor equipment, and it can be guaranteed that the arrangement space occupied by the whole semiconductor equipment is small.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a cover opening device for semiconductor equipment and a semiconductor equipment comprising the cover opening device. Background Art

[0002] Semiconductor equipment has a vacuum cover plate for constructing a vacuum chamber, and an upper assembly is arranged on the vacuum cover plate, and the upper assembly includes an upper assembly cover plate. During use, the vacuum cover plate and the upper assembly cover plate need to be opened regularly to clean and repair the parts. Currently, the cover is opened and closed manually, and the operation is very cumbersome. For example, to open the vacuum cover plate, the upper assembly on the vacuum cover plate needs to be moved away first, and then the vacuum cover plate needs to be moved away. After cleaning and repairing the parts in the vacuum chamber, the vacuum cover plate needs to be moved back, and then the upper assembly needs to be moved back again.

[0003] The above manual handling process is inefficient and easily causes parts to be damaged and loosened. If a cover opening device is set up for automatic cover opening, this problem can be solved, but it also faces the problem that multiple cover plates need to be equipped with multiple sets of cover opening devices. For example, the upper component cover plate and the vacuum cover plate need to be equipped with a set of cover opening devices respectively, resulting in a large space occupied by the semiconductor equipment.

[0004] In view of this, how to realize automatic cover opening while ensuring that the semiconductor device occupies less space is a technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0005] In order to solve the above technical problems, the present application provides a cover opening device for semiconductor equipment, wherein the cover opening device includes a lifting shaft and a plurality of carrier parts arranged in sequence from top to bottom, each of the carrier parts is provided with an axial hole and can be rotatably sleeved on the outer periphery of the lifting shaft through its own axial hole, and each of the carrier parts is connected to the lifting shaft so as to be synchronously lifted and lowered, wherein at least one of the carrier parts is provided with a coupling part, and is decoupledly connected to the lifting shaft through the coupling part, and the coupling part includes a movable part, and the movable part can move to a coupled state or a decoupled state relative to the corresponding carrier part to realize or release the synchronously liftable connection between the corresponding carrier part and the lifting shaft.

[0006] In one embodiment of a cover opening device for semiconductor equipment, a plurality of step surfaces are sequentially arranged from top to bottom on the outer circumference of the lifting shaft, each of the step surfaces supports one of the carrier parts respectively, and a support bearing is arranged between each of the step surfaces and the carrier part it supports.

[0007] In one embodiment of a cover opening device for semiconductor equipment, a bushing is installed in the axial hole of the carrier part equipped with the coupling part, and the bushing is supported on the corresponding step surface of the lifting shaft through the corresponding support bearing. In the coupled state, the movable part is clamped on the outer periphery of the bushing.

[0008] In one embodiment of the cover opening device of semiconductor equipment, the movable component is configured to achieve switching between the coupled state and the decoupled state by horizontally moving or rotating relative to the corresponding carrier part.

[0009] An embodiment of a cover opening device for semiconductor equipment, the movable component includes an insert plate, the insert plate can be horizontally movably inserted into the corresponding slot of the carrier part, the insert plate is provided with a card slot, and in a coupled state, the insert plate is clamped on the outer periphery of the bushing through the card slot.

[0010] An embodiment of a cover opening device for semiconductor equipment, wherein the movable component includes two claws, and the two claws are horizontally rotatably connected in the claw grooves of the corresponding carrier part. In a coupled state, the two claws are clamped on the outer periphery of the bushing and cooperate to clamp the bushing.

[0011] In one embodiment of the cover opening device of semiconductor equipment, the coupling part further includes a mounting plate, the mounting plate is located above the corresponding clamping claw, and the mounting plate is fixedly connected to the corresponding carrier part.

[0012] In one embodiment of the cover opening device of the semiconductor equipment, the coupling part also includes a threaded locking assembly, which is simultaneously connected to one end of the two claws away from their respective rotation axes, so that the rotation angle of the two claws can be adjusted by loosening or tightening the threaded locking assembly.

[0013] In one embodiment of the cover opening device of the semiconductor device, the coupling part further includes two groups of tension springs, and the two groups of tension springs are respectively connected to the two claws to provide elastic force for the two claws to rotate and switch to a decoupled state.

[0014] In one embodiment of the cover opening device of the semiconductor equipment, a wear-resistant sleeve is fixedly installed in the axial hole of each of the carrier parts, and the wear-resistant sleeve can be rotatably sleeved on the outer periphery of the lifting shaft; or, an anti-wear bearing is installed in the axial hole of each of the carrier parts, the outer ring of the anti-wear bearing is interference fit with the axial hole of the corresponding carrier part, and the inner ring of the anti-wear bearing is interference fit with the outer periphery of the lifting shaft.

[0015] In one implementation of the cover opening device for semiconductor equipment, the lower end of the axial hole of each of the carrier parts is sealed and connected to a sealing cover.

[0016] In one embodiment of the cover opening device of the semiconductor equipment, a sealing ring is provided between the sealing cover and the lower end surface of the corresponding anti-wear sleeve and between the sealing cover and the outer periphery of the lifting shaft.

[0017] In one embodiment of the cover opening device for semiconductor equipment, the cover opening device further includes a limit block, the limit block is integrally formed with or fixedly connected to the lifting shaft, and the carrier part abuts against the limit block when rotating to the limit position.

[0018] The present application also provides a semiconductor device, wherein the semiconductor device comprises a plurality of build plate , also includes the cover opening device described in any of the above items, each of the carrier parts of the cover opening device is respectively connected to one of the cover plates.

[0019] In one embodiment of a semiconductor device, the multiple cover plates include a vacuum cover plate for constructing a vacuum chamber and an upper component located above the vacuum cover plate, the upper component includes an upper component cover plate, and the cover opening device includes a first carrier part and a second carrier part located below the first carrier part, the first carrier part is connected to the vacuum cover plate, and the second carrier part is connected to the upper component cover plate.

[0020] The cover opening device provided by the present application can open and close the cover plate of the semiconductor device, so that the opening and closing process of the semiconductor device does not require manual handling, which is more efficient than manual handling and is not easy to cause parts to be damaged or loosened. Moreover, the multiple cover plates arranged in sequence from top to bottom of the semiconductor device only need to be equipped with one set of cover opening devices, which reduces the number of sets of cover opening devices. Therefore, it can ensure that the overall volume of the semiconductor device is small and the layout space occupied is small. The state switching operation of the coupling part of the cover opening device is simple. The carrier part of the cover opening device has a small resistance to rotation around the lifting shaft, and the rotation operation is labor-saving. The shaft hole of the carrier part of the cover opening device has good sealing performance. The bearing in the shaft hole of the carrier part of the cover opening device is blocked by the bushing and is not easily corroded by impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A front view of a partial structure of an embodiment of the cover opening device provided by the present application;

[0022] Figure 2 for Figure 1 Partial cross-sectional view in coupled state;

[0023] Figure 3 for Figure 1 The main view of the middle lifting axis;

[0024] Figure 4 for Figure 1 A front view of the second carrier part and the coupling part in a coupled state;

[0025] Figure 5 for Figure 1 A top view of the second carrier part and the coupling part in a coupled state;

[0026] Figure 6 for Figure 1 A top view of the second carrier part and the coupling part in a decoupled state;

[0027] Figure 7 A front view of a second carrier part and a coupling part of another embodiment of the cover opening device provided by the present application;

[0028] Figure 8 for Figure 7 A top view of

[0029] Fig. 9 for Figure 7 Top sectional view in coupled state;

[0030] Fig.10 for Figure 7 Top sectional view in decoupled state;

[0031] Fig.11 A schematic diagram of an embodiment of a semiconductor device provided in the present application.

[0032] The following are the descriptions of the reference numerals:

[0033] 1. Opening device;

[0034] 101 lifting shaft, 101a first step surface, 101b second step surface, 102 first carrying part, 103 second carrying part, 103a slot, 103b claw slot, 104 coupling part, 104a plug plate, 104b claw, 104c thread locking assembly, 104d mounting plate, 104e tension spring, 104f pillar, 106 bushing, 107 first bearing, 108 second bearing, 109 first anti-wear sleeve, 110 second anti-wear sleeve, 111 first sealing cover, 112 second sealing cover, 113 limit block, 114 lifting shaft mounting seat, 115 power component.

[0035] 2Semiconductor equipment;

[0036] 201 vacuum chamber, 201a vacuum cover plate, 202 upper component, 202a upper component cover plate, 203 radio frequency coil, 204 dielectric window, 205 air inlet pipeline, 206 air inlet nozzle, 207 upper module. DETAILED DESCRIPTION

[0037] The present application provides a cover opening device for semiconductor equipment and a semiconductor equipment. In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] like Figure 1 As shown, the cover opening device 1 at least includes a lifting shaft 101 and a plurality of carrier parts arranged in sequence from top to bottom, wherein the plurality refers to two or more. In the illustrated embodiment, two carrier parts are provided, namely a first carrier part 102 and a second carrier part 103 located below the first carrier part 102. In other embodiments, more than two carrier parts may also be provided.

[0039] Each carrier part is synchronously liftable and connected to the lifting shaft 101, and at least one of the carrier parts is provided with a coupling part, which is decoupledly connected to the lifting shaft 101 through the corresponding coupling part. The coupling part includes a movable part connected to the corresponding carrier part, and the movable part can move to a coupled state or a decoupled state relative to the corresponding carrier part. In the coupled state, the carrier part is synchronously liftable and connected to the lifting shaft 101, and in the decoupled state, the synchronous liftable connection relationship between the carrier part and the lifting shaft 101 is released. In the illustrated embodiment, the first carrier part 102 is not provided with a coupling part 104, and the second carrier part 103 is provided with a coupling part 104. The second carrier part 103 is decoupledly connected to the lifting shaft 101 through the coupling part 104. In the coupled state, the second carrier part 103 is synchronously lifted and lowered with the lifting shaft 101, and in the decoupled state, the second carrier part 103 is not lifted and lowered with the lifting shaft 101. In other embodiments, each carrier part may be provided with a coupling part, or only one or several carrier parts may be provided with a coupling part.

[0040] like Figure 1 As shown, in the illustrated embodiment, it further includes a lifting shaft mounting seat 114 and a power component 115. The lifting shaft 101 is inserted into the inner hole of the lifting shaft mounting seat 114. When in use, the lifting shaft mounting seat 114 is fixedly arranged relative to the side wall of the cavity to be opened. The power component 115 is connected to the lifting shaft 101 to drive the lifting shaft 101 to automatically rise and fall. The power component 115 can be a cylinder, a hydraulic cylinder, a motor, etc.

[0041] like Figure 2 As shown, each carrier part is provided with an axial hole, and each carrier part is sleeved on the outer periphery of the lifting shaft 101 through its own axial hole and can rotate around the lifting shaft 101.

[0042] When in use, each carrier part of the cover opening device 1 is respectively connected to one of the multiple cover plates arranged in sequence from top to bottom of the semiconductor device 2. For example, when the semiconductor device 2 includes a vacuum cover plate 201a and an upper component cover plate 202a located above the vacuum cover plate 201a, the second carrier part 103 can be connected to the vacuum cover plate 201a, and the first carrier part 102 can be connected to the upper component cover plate 202a.

[0043] The following takes the example of the second carrier 103 being connected to the vacuum cover plate 201a and the first carrier 102 being connected to the upper component cover plate 202a as an example to illustrate the working process of the cover opening device:

[0044] When it is necessary to open the upper component cover 202a, the coupling part 104 is adjusted to the decoupling state, the lifting shaft 101 is driven to rise, and the first carrier part 102 rises with the lifting shaft 101, driving the upper component cover 202a and the parts thereon to rise together. After rising to a certain height, the first carrier block is made to rotate around the lifting shaft 101, driving the upper component cover 202a and the parts thereon to rotate to the side of the vacuum cover 201a, so that the upper component cover 202a is opened. At this time, the vacuum cover 201a still remains closed.

[0045] When the upper component cover 202a needs to be closed, the first carrier block is reversed around the lifting shaft 101 to drive the upper component cover 202a to rotate above the vacuum cover 201a, and then the lifting shaft 101 is driven to descend. The first carrier 102 descends with the lifting shaft 101, driving the upper component cover 202a and the parts thereon to fall to the target position.

[0046] When the vacuum cover 201a needs to be opened, the coupling part 104 is adjusted to the coupling state, the lifting shaft 101 is driven to rise, and the second carrier part 103 rises with the lifting shaft 101, driving the vacuum cover 201a and the parts thereon to rise together. After rising to a certain height, the second carrier part 103 is rotated around the lifting shaft 101, driving the vacuum cover 201a and the parts thereon to rotate to the side of the vacuum chamber 201, so that the vacuum cover 201a is opened.

[0047] When the vacuum cover 201a needs to be closed, the second carrier block is reversed around the lifting shaft 101, driving the vacuum cover 201a and the parts thereon to rotate to the top of the vacuum chamber 201, and then the lifting shaft 101 is driven to descend, and the second carrier 103 descends with the lifting shaft 101, driving the vacuum cover 201a and the parts thereon to fall to the target position.

[0048] It can be seen from the above process that the cover opening device provided by the present application can open and close the cover plate of the semiconductor device 2, so that the cover opening and closing process of the semiconductor device 2 does not require manual handling. Compared with manual handling, it is more efficient and less likely to cause parts to be damaged or loosened due to collisions. Moreover, the multiple cover plates arranged from top to bottom of the semiconductor device 2 only need to be configured with one set of cover opening devices, which reduces the number of sets of cover opening devices configured. Therefore, it can ensure that the overall volume of the semiconductor device 2 is small and the layout space occupied is small.

[0049] In some embodiments, the outer circumference of the lifting shaft 101 is provided with a plurality of step surfaces from top to bottom, and each step surface supports a corresponding carrier part. For example, in the embodiment shown in the figure, Figure 3 As shown, the outer periphery of the lifting shaft 101 is provided with a first step surface 101a and a second step surface 101b located below the first step surface 101a. Figure 2 As shown, the first carrier 102 is supported on the first step surface 101a. When the lifting shaft 101 is lifted or lowered, the first carrier 102 is lifted or lowered together with the first step surface 101a of the lifting shaft 101. In the coupled state, the second carrier 103 is indirectly supported on the second step surface 101b through the coupling part 104 and the bushing 106. When the lifting shaft 101 is lifted or lowered, the second carrier 103 is lifted or lowered together with the second step surface 101b of the lifting shaft 101. In the decoupled state, the second carrier 103 is no longer supported on the second step surface 101b. At this time, the lifting shaft 101 will not drive the second carrier 103 to rise or fall when it is lifted or lowered.

[0050] In some embodiments, a support bearing is provided between each step surface and the supporting carrier, so that the carrier can smoothly rotate around the lifting shaft 101 when supported on the step surface of the lifting shaft 101. Figure 2 In the illustrated embodiment, a first support bearing 107 is provided between the first step surface 101a and the first carrier 102 , and a second support bearing 108 is provided between the second step surface 101b and the second carrier 103 (specifically, between the bushing 106 in the axial hole of the second carrier 103 ).

[0051] In some embodiments, a bushing is installed in the shaft hole of the carrier part equipped with the coupling part. The bushing can be rotatably sleeved on the outer periphery of the lifting shaft 101 and supported on the corresponding step surface of the lifting shaft 101 through the corresponding support bearing, for example Figure 2In the illustrated embodiment, a bushing 106 is installed in the shaft hole of the second carrier 103, and the bushing 106 is rotatably sleeved on the outer circumference of the lifting shaft 101 and supported on the second step surface 101b of the lifting shaft 101 through the second support bearing 108. In the coupled state, the movable part of the coupling part 104 is clamped on the outer circumference of the bushing 106, so that the carrier is indirectly supported on the corresponding step surface of the lifting shaft 101 through the coupling part 104 and the bushing 106, thereby realizing a synchronous lifting connection with the lifting shaft 101, and the carrier and the bushing 106 can rotate around the lifting shaft 101 together. In the decoupled state, the movable part of the coupling part 104 is separated from the bushing 106, so that the carrier is no longer supported on the corresponding step surface of the lifting shaft 101, thereby releasing the synchronous lifting connection relationship with the lifting shaft 101. The bushing 106 is provided to facilitate the decoupling and coupling between the carrier and the lifting shaft 101, and can also be used to shield the support bearing to prevent the support bearing from being exposed and corroded by external impurities in the decoupled state, affecting the smoothness and life of the support bearing.

[0052] In some embodiments, a wear-resistant sleeve is fixedly installed in the shaft hole of each carrier part, and the wear-resistant sleeve is rotatably sleeved on the outside of the lifting shaft 101, which can reduce the wear of the carrier part when it rotates around the lifting shaft 101. For example, in the illustrated embodiment, a first wear-resistant sleeve 109 is fixedly installed in the shaft hole of the first carrier part 102, and the first wear-resistant sleeve 109 is rotatably sleeved on the outside of the lifting shaft 101, and a second wear-resistant sleeve 110 is fixedly installed in the shaft hole of the second carrier part 103, and the second wear-resistant sleeve 110 is rotatably sleeved on the outside of the lifting shaft 101. The wear-resistant sleeve can also be replaced by an anti-wear bearing, the outer ring of the anti-wear bearing is interference fit with the shaft hole of the carrier part, and the inner ring of the anti-wear bearing is interference fit with the outer periphery of the lifting shaft 101.

[0053] In some embodiments, the lower end of the shaft hole of each carrier part is sealed with a sealing cover to prevent the lubricating oil in the shaft hole from leaking out. For example, in the illustrated embodiment, the lower end of the shaft hole of the first carrier part 102 is sealed with a first sealing cover 111, and the lower end of the shaft hole of the second carrier part 103 is sealed with a second sealing cover 112.

[0054] In some embodiments, a sealing ring is provided between the sealing cover and the lower end surface of the corresponding anti-wear sleeve and between the sealing cover and the outer periphery of the lifting shaft 101. Figure 2 In the illustrated embodiment, sealing rings are provided between the first sealing cover 111 and the lower end surface of the first anti-wear sleeve 109 (at A in the figure) and between the first sealing cover 111 and the outer periphery of the lifting shaft 101 (at B in the figure), and sealing rings are provided between the second sealing cover 112 and the lower end surface of the second anti-wear sleeve 110 (at C in the figure) and between the first sealing cover 111 and the outer periphery of the lifting shaft 101 (at D in the figure).

[0055] In some embodiments, such as Figure 2As shown, the cover opening device also includes a limit block 113, which is integrally formed with or fixedly connected to the lifting shaft 101. When the carrier part rotates to the limit position, it contacts the limit block 113, thereby limiting the rotation limit of the carrier part and preventing the carrier part from rotating beyond the limit and affecting the cover opening and closing efficiency.

[0056] In some embodiments, the movable part of the coupling part realizes the switching between the coupling state and the decoupling state by horizontally moving or rotating relative to the corresponding carrier part, which is easy to realize and facilitates the state switching operation of the coupling part. Figure 4-Figure 6 In the embodiment shown, the movable component realizes switching between the coupling state and the decoupling state by horizontally moving relative to the second carrier 103. Figure 7-Figure 10 In the embodiment shown, the movable component switches between the coupling state and the decoupling state by horizontally rotating relative to the second carrier 103. It should be noted that the horizontal refers to the lifting shaft 101, and the direction perpendicular to the central axis of the lifting shaft 101 is horizontal.

[0057] Specifically, Figure 4-Figure 6 In the embodiment shown, the movable component includes a plug plate 104a, which can be horizontally moved and inserted into the slot 103a of the second carrier 103. The plug plate 104a is provided with a card slot, and a bushing 106 is fixedly installed in the shaft hole of the second carrier 103. Figure 5 As shown, when the plug plate 104a moves horizontally to the coupling state, the plug plate 104a is clamped on the outer periphery of the bushing 106 through the clamping groove, as shown in FIG. Figure 6 As shown, when the inserting plate 104 a moves horizontally to the decoupling state, the slot of the inserting plate 104 a is separated from the bushing 106 .

[0058] Specifically, Figure 7-Figure 10 In the embodiment shown, the movable component includes two claws 104b, and the two claws 104b are horizontally rotatably connected to the second carrier 103. A bushing 106 is fixedly installed in the shaft hole of the second carrier 103. Fig. 9 As shown, when the claws 104b are rotated horizontally to the coupling state, the two claws 104b are clamped on the outer periphery of the bushing 106 and cooperate to clamp the bushing 106, as shown in FIG. Fig.10 As shown, when the claws 104 b are horizontally rotated to the decoupled state, the two claws 104 b release the bushing 106 .

[0059] More specifically, Fig. 9As shown, in this embodiment, the coupling part 104 also includes a thread locking assembly 104c, and the thread locking assembly 104c is connected to one end of the two claws 104b away from their respective rotation axes at the same time, so as to adjust the rotation angle of the two claws 104b by loosening or tightening the thread locking assembly 104c. In the figure, the thread locking assembly 104c includes a bolt, and one end of the two claws 104b away from their respective rotation axes is provided with a through hole and the other end is provided with a threaded hole, and the bolt passes through the through hole and is screwed in the threaded hole, and the rotation angle of the two claws 104b can be adjusted by rotating the bolt to achieve the switching between the coupling state and the decoupling state. In other embodiments, the thread locking assembly 104c can also include a bolt and a nut, and the ends of the two claws 104b away from their respective rotation axes are both provided with a through hole, and the bolt passes through the two through holes and is threadedly connected with the nut, and the rotation angle of the two claws 104b can be adjusted by rotating the nut or the bolt to achieve the switching between the coupling state and the decoupling state.

[0060] More specifically, Figure 7 and Figure 8 As shown, in this embodiment, the second carrier 103 is provided with a claw groove 103b, and the claw 104b is rotatably connected in the claw groove 103b of the second carrier 103, and the side wall of the claw groove 103b can limit the rotation limit of the claw 104b. The coupling part 104 also includes a mounting plate 104d, which is fixedly connected to the second carrier 103 and located above the claw 104b. In the coupled state, the two claws 104b clamp the bushing 106. When the lifting shaft 101 is lifted or lowered, the bushing 106 is lifted or lowered accordingly, driving the two claws 104b to be lifted or lowered accordingly, and the mounting plate 104d is lifted or lowered accordingly, and the second carrier 103 is lifted or lowered accordingly.

[0061] More specifically, Fig.10 As shown, in this embodiment, the coupling part 104 also includes two groups of tension springs 104e, one end of the two groups of tension springs 104e is connected to the second carrier part 103, and the other ends of the two groups of tension springs 104e are respectively connected to the two claws 104b to provide elastic force for the two claws 104b to rotate and switch to a decoupled state. Fig.10 In the figure, each of the two sets of tension springs 104e corresponds to a support 104f, and is connected to the corresponding claw 104b through the support 104f.

[0062] like Fig.11As shown, the semiconductor device 2 provided by the present application includes a plurality of cover plates arranged sequentially from top to bottom. For example, in the illustrated embodiment, a vacuum cover plate 201a for constructing a vacuum chamber 201 and an upper component 202 located above the vacuum cover plate 201a are provided, and the upper component 202 includes an upper component cover plate 202a. In addition, the upper component 202 also includes a radio frequency coil 203, a dielectric window 204, an air intake line 205, an air intake nozzle 206, etc. An upper module 207 is provided above the upper component cover plate 202a, and the upper module 207 includes an electrical module, a radio frequency module, etc.

[0063] like Fig.11 As shown, the semiconductor device 2 also includes a cover opening device provided by the present application. Each carrier part of the cover opening device is connected to one of the cover plates. For example, in the illustrated embodiment, the first carrier part 102 of the cover opening device is connected to the upper component cover plate 202a, and the second carrier part 103 of the cover opening device is connected to the vacuum cover plate 201a.

[0064] In summary, the cover opening device and semiconductor device 2 provided by the present application include the following technical effects: the cover opening device can open and close the cover plate of the semiconductor device 2, so that the cover opening and closing process of the semiconductor device 2 does not require manual handling, which is more efficient than manual handling and is not easy to cause parts to be damaged or loosened. Moreover, the multiple cover plates arranged from top to bottom of the semiconductor device 2 only need to be equipped with one set of cover opening devices, which reduces the number of sets of cover opening devices. Therefore, it can ensure that the overall volume of the semiconductor device 2 is small and the layout space occupied is small. The state switching operation of the coupling part 104 of the cover opening device is simple. The carrier part of the cover opening device has a small rotation resistance around the lifting shaft 101, and the rotation operation is labor-saving. The shaft hole of the carrier part of the cover opening device has good sealing. The bearing in the shaft hole of the carrier part of the cover opening device is blocked by the bushing 106 and is not easily corroded by impurities.

[0065] The above specific examples are used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A cover opening device for semiconductor equipment, characterized in that: The cover opening device (1) comprises a lifting shaft (101) and a plurality of carrier parts arranged in sequence from top to bottom, each of the carrier parts being provided with an axial hole and being rotatably sleeved on the outer circumference of the lifting shaft (101) through its own axial hole, and each of the carrier parts being connected to the lifting shaft (101) in a synchronously liftable manner, wherein at least one of the carrier parts is provided with a coupling part (104) and is connected to the lifting shaft (101) in a decoupling manner through the coupling part (104), and the coupling part (104) comprises a movable part, and the movable part can move to a coupled state or a decoupling state relative to the corresponding carrier part, so as to realize or release the synchronously liftable connection between the corresponding carrier part and the lifting shaft (101).

2. The cover opening device for semiconductor equipment according to claim 1, characterized in that: The outer circumference of the lifting shaft (101) is provided with a plurality of step surfaces in sequence from top to bottom, each of the step surfaces correspondingly supports one of the carrier parts, and a support bearing is provided between each of the step surfaces and the carrier part it supports.

3. The cover opening device for semiconductor equipment according to claim 2, characterized in that: A bushing (106) is installed in the shaft hole of the carrier part equipped with the coupling part (104); the bushing (106) is supported on the corresponding step surface of the lifting shaft (101) through the corresponding support bearing; in the coupled state, the movable part is clamped on the outer periphery of the bushing (106).

4. The cover opening device for semiconductor equipment according to claim 3, characterized in that: The movable component is configured to achieve switching between a coupled state and a decoupled state by horizontally moving or rotating relative to the corresponding carrier part.

5. The cover opening device for semiconductor equipment according to claim 4, characterized in that: The movable component comprises an insert plate (104a), the insert plate (104a) being horizontally movable and inserted into a corresponding slot (103a) of the carrier part, the insert plate (104a) being provided with a clamping slot, and in a coupled state, the insert plate (104a) is clamped onto the outer periphery of the bushing (106) through the clamping slot.

6. The cover opening device for semiconductor equipment according to claim 4, characterized in that: The movable component comprises two claws (104b), and the two claws (104b) are horizontally rotatably connected in the corresponding claw grooves (103b) of the carrier part. In a coupled state, the two claws (104b) are clamped on the outer periphery of the bushing (106) and cooperate to clamp the bushing (106).

7. The cover opening device for semiconductor equipment according to claim 6, characterized in that: The coupling portion (104) further comprises a mounting plate (104d), wherein the mounting plate (104d) is located above the corresponding clamping claw (104b), and the mounting plate (104d) is fixedly connected to the corresponding carrier portion.

8. The cover opening device for semiconductor equipment according to claim 6, characterized in that: The coupling portion (104) further comprises a thread locking assembly (104c), wherein the thread locking assembly (104c) is simultaneously connected to one end of the two clamping claws (104b) away from the respective rotation axes, so as to adjust the rotation angle of the two clamping claws (104b) by loosening or tightening the thread locking assembly (104c).

9. The cover opening device for semiconductor equipment according to claim 6, characterized in that: The coupling portion (104) further comprises two groups of tension springs (104e), and the two groups of tension springs (104e) are respectively connected to the two clamping claws (104b) to provide the two clamping claws (104b) with elastic force for rotationally switching to a decoupled state.

10. The cover opening device for semiconductor equipment according to any one of claims 1 to 9, characterized in that: An anti-wear sleeve is fixedly installed in the shaft hole of each of the carrier parts, and the anti-wear sleeve can be rotatably sleeved on the outer periphery of the lifting shaft (101); or, an anti-wear bearing is installed in the shaft hole of each of the carrier parts, the outer ring of the anti-wear bearing is interference fit with the corresponding shaft hole of the carrier part, and the inner ring of the anti-wear bearing is interference fit with the outer periphery of the lifting shaft (101).

11. The cover opening device for semiconductor equipment according to claim 10, characterized in that: The lower end of the shaft hole of each of the carrier parts is sealed and connected to a sealing cover.

12. The cover opening device for semiconductor equipment according to claim 11, characterized in that: A sealing ring is provided between the sealing cover and the lower end surface of the corresponding anti-wear shaft sleeve, and between the sealing cover and the outer periphery of the lifting shaft (101).

13. The cover opening device for semiconductor equipment according to any one of claims 1 to 9, characterized in that: The cover opening device further comprises a limit block (113), wherein the limit block (113) is integrally formed with or fixedly connected to the lifting shaft (101), and when the carrier part rotates to the limit position, it contacts the limit block (113).

14. A semiconductor device, characterized in that: The semiconductor device (2) comprises a plurality of Cover , further comprising the cover opening device according to any one of claims 1 to 13, wherein each of the carrier parts of the cover opening device is respectively connected to one of the cover plates.

15. The semiconductor device according to claim 14, characterized in that The multiple cover plates include a vacuum cover plate (201a) for constructing a vacuum chamber (201) and an upper component (202) located above the vacuum cover plate (201a); the upper component (202) includes an upper component cover plate (202a); the cover opening device includes a first carrier part (102) and a second carrier part (103) located below the first carrier part (102); the first carrier part (102) is connected to the vacuum cover plate (201a); and the second carrier part (103) is connected to the upper component cover plate (202a).

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