Integrated core arrangement vapor chamber and radiator

Abstract

The utility model discloses an integrated core arrangement uniform temperature plate and radiator, the uniform temperature plate comprises a uniform temperature plate body and a support column body, the uniform temperature plate body comprises an upper cover plate, a lower cover plate and a first capillary structure, the support column body comprises a first connecting plate and a plurality of support columns, the upper portions of the multiple supporting columns are fixedly connected to the first connecting plate, the first connecting plate is fixedly connected to the lower portion of the upper cover plate, and the lower portions of the supporting columns are fixedly connected to the upper portion of the lower cover plate. And meanwhile, more liquid working media are adsorbed through the first connecting plate and the second connecting plate, the liquid working media in the cavity of the uniform temperature plate can be rapidly supplemented when the uniform temperature plate operates, and then the heat dissipation performance of the uniform temperature plate is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and in particular to an integrated core arrangement temperature averaging plate and a radiator. Background Art

[0002] Vapor chamber (VC) is a common fast heat conduction and heat dissipation mechanism. Its working principle is that in a closed plate-shaped cavity, the working medium circulates under evaporation and condensation conditions to achieve rapid heat conduction and heat diffusion, thereby achieving the characteristics of rapid temperature uniformity.

[0003] With the development of science and technology, the overall requirements for radiators are getting higher and higher, and correspondingly, improving VC performance is becoming more and more important. The core layout structure design of VC is directly related to the performance of VC. Most of the existing VC core areas are arranged in a dispersed manner according to a certain size. During the manufacturing process of the temperature equalizer, the edges of the upper cover and the lower cover need to be welded and fixed into a cavity, and the support columns in the cavity also need to be placed between the upper cover and the lower cover for welding. This makes the manufacturing process of the temperature equalizer complicated and requires high precision. In addition, the existing support column structure is dispersed, which limits the capillary water storage capacity of the core area. Utility Model Content

[0004] In view of the above-mentioned problems, the purpose of the utility model is to provide an integrated core arrangement temperature equalizing plate and radiator. By treating the support column body as an integrated overall structure, the production efficiency and the qualified rate of finished products of the temperature equalizing plate are greatly improved. At the same time, more liquid working medium is adsorbed by the first connecting plate and the second connecting plate. When the temperature equalizing plate is in operation, the liquid working medium in the cavity of the temperature equalizing plate can be quickly replenished, thereby effectively improving the heat dissipation performance of the temperature equalizing plate.

[0005] To achieve the above-mentioned purpose, the utility model provides an integrated core arrangement temperature averaging plate, comprising a temperature averaging plate body and a support column body.

[0006] The temperature homogenizing plate body comprises an upper cover plate, a lower cover plate and a first capillary structure, wherein the first capillary structure comprises an upper first capillary structure and a lower first capillary structure, wherein the upper first capillary structure is located on the inner surface of the upper cover plate, the lower first capillary structure is located on the inner surface of the lower cover plate, and the upper first capillary structure is communicated with the lower first capillary structure, the upper cover plate and the lower cover plate form a closed cavity, and a working medium is arranged in the cavity;

[0007] The support column body includes a first connecting plate and a plurality of support columns, the upper parts of the plurality of support columns are fixedly connected to the first connecting plate, the first connecting plate is fixedly connected to the lower part of the upper cover plate, the lower parts of the support columns are fixedly connected to the upper part of the lower cover plate, and a second capillary structure is also provided on the outer surface of the support column, and the second capillary structure is communicated with the first capillary structure.

[0008] Preferably, the support column body includes a second connecting plate, and the second connecting plate is fixedly connected between the lower cover plate and the support column.

[0009] Preferably, the first connecting plate and the second connecting plate are both provided with a third capillary structure, and the third capillary structure is communicated with the second capillary structure.

[0010] Preferably, the first connecting plate and the second connecting plate are formed by sintering metal powder and graphite.

[0011] Preferably, the support column comprises a first support column and a second support column, the outer diameter of the first support column is greater than the outer diameter of the second support column, and the first support column and the second support column are evenly spaced.

[0012] Preferably, the support column has a circular, annular or frustum-shaped cross-section structure.

[0013] Preferably, the pressure in the cavity is less than 0.1 atmosphere, and the working medium is one of water, brine, ethylene glycol or acetone.

[0014] The utility model provides an integrated core arrangement radiator, comprising a temperature equalizing plate.

[0015] The beneficial effects of the utility model are as follows: the integrated core arrangement temperature equalizing plate and radiator provided by the utility model greatly improves the production efficiency and finished product qualification rate of the temperature equalizing plate by treating the support column body as an integrated whole structure. At the same time, more liquid working medium is adsorbed by the first connecting plate and the second connecting plate. When the temperature equalizing plate is in operation, the liquid working medium in the cavity of the temperature equalizing plate can be quickly replenished, thereby effectively improving the heat dissipation performance of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings illustrate exemplary embodiments of the present invention and are used to explain the principles of the present invention together with the description. These drawings are included to provide a further understanding of the present invention, and the drawings are included in and constitute a part of this specification.

[0017] Figure 1 This is a schematic diagram of the internal structure of the integrated core arrangement temperature averaging plate in Example 1;

[0018] Figure 2 This is a schematic diagram of the structure of the support column body in Example 1;

[0019] Figure 3 This is a schematic diagram of the internal structure of the integrated core arrangement temperature averaging plate in Example 2;

[0020] Figure 4 This is a schematic diagram of the structure of the support column body in Example 2. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant contents, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings.

[0022] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] Example 1: Please refer to Figure 1 to Figure 2 ,

[0024] An integrated core arrangement temperature averaging plate comprises a temperature averaging plate body and a support column body.

[0025] The temperature equalizing plate body includes an upper cover plate 1, a lower cover plate 2 and a first capillary structure, the first capillary structure includes an upper first capillary structure 31 and a lower first capillary structure 32, the upper first capillary structure 31 is located on the inner surface of the upper cover plate 1, the lower first capillary structure 32 is located on the inner surface of the lower cover plate 2, and the upper first capillary structure 31 is communicated with the lower first capillary structure 32, the upper cover plate 1 and the lower cover plate 2 form a closed cavity 11, and a working medium is provided in the cavity 11;

[0026] The support column body includes a first connecting plate 41 and multiple support columns 5. The upper parts of the multiple support columns 5 are fixedly connected to the first connecting plate 41. The first connecting plate 41 is fixedly connected to the lower part of the upper cover plate 1. The lower part of the support column 5 is fixedly connected to the upper part of the lower cover plate 2. A second capillary structure 33 is also provided on the outer surface of the support column 5, and the second capillary structure 33 is communicated with the first capillary structure.

[0027] The support column body is an integral structure with an integrated structural design, that is, the first connecting plate 41 and multiple support columns 5 are designed as an integrated structure. During the manufacturing process, the multiple support columns 5 are first fixed and welded on the first connecting plate 41 as a whole of the support column body, and then the support column body is welded between the upper cover plate 1 and the lower cover plate 2, and then the edges of the upper cover plate 1 and the lower cover plate 2 are welded. The support column body is used as an integral structure, which greatly reduces the time of directly placing the support columns individually and as required on the upper cover plate 1 and the lower cover plate 2 at this stage, and greatly improves the production efficiency and the qualified rate of finished products.

[0028] Specifically in the present embodiment 1, the support column body is an integrated structure as a whole, fixedly connected in the cavity 11 between the upper cover plate 1 and the lower cover plate 2, and the first connecting plate 41 is fixedly connected to the upper cover plate 1, and the lower surface of the lower cover plate 2 is in contact with the chip (heat source). Since the cavity 11 is set to a vacuum state (close to a vacuum state), the heat transferred from the chip is transferred to the lower cover plate 2, and the liquid working medium in the lower first capillary structure 32 in contact with the lower cover plate 2 is phase-changed into a gaseous working medium and absorbs heat at the same time, that is, the lower cover plate 2 absorbs heat during the phase change process, and the gaseous working medium continuously evaporates upward, and the pressure in the cavity 11 increases. Under the action of the pressure, the high-temperature gaseous working medium The medium (carrying the heat of the chip) continuously flows in the cavity 11 toward the upper cover plate 1, and the upper cover plate 1 transfers the heat out. When the gaseous working medium with a higher temperature encounters the upper cover plate 1 with a lower temperature, it condenses into a liquid working medium and releases a large amount of heat at the same time, that is, heat is released during the phase change process of the upper cover plate 1. The heat is dissipated through the heat sink connected to the temperature equalizer. Subsequently, under the action of capillary action and gravity, the liquid working medium will return to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, and finally return to the bottom of the lower cover plate 2. The liquid working medium encounters the hot chip again, changes phase again, and absorbs and releases heat in a reciprocating cycle, thereby achieving the heat dissipation and cooling effect on the chip.

[0029] Specifically in this embodiment 1, the support column body is an integrated structure as a whole, fixedly connected in the cavity 11 between the upper cover plate 1 and the lower cover plate 2, and the first connecting plate 41 is fixedly connected to the upper cover plate 1. The first connecting plate 41 is sintered by copper powder or other metal powder and graphite according to graphite shape, and has certain water absorption performance. When the gaseous working medium with higher temperature encounters the upper cover plate 1 with lower temperature and condenses into liquid working medium, the first connecting plate 41 with a certain thickness can absorb a certain amount of liquid working medium, so that when the temperature equalizing plate is in operation, the liquid working medium in the evaporation zone in the cavity 11 of the temperature equalizing plate can be quickly replenished, thereby effectively improving the heat dissipation performance of the temperature equalizing plate.

[0030] The first connecting plate 41 is provided with a third capillary structure 34, which is communicated with the second capillary structure 33. When the gaseous working medium with a higher temperature meets the upper cover plate 1 with a lower temperature and condenses into a liquid working medium, the first connecting plate 41 with a certain thickness can absorb a certain amount of liquid working medium. Under the dual effects of gravity and capillary force, the liquid working medium will return to the lower first capillary structure 32 along the upper first capillary structure 31, the second capillary structure 33, and the third capillary structure 34, and finally return to the bottom of the lower cover plate 2. The liquid working medium encounters the hot chip again, undergoes phase change again, and absorbs and releases heat in a reciprocating cycle to achieve heat dissipation and cooling of the chip. The third capillary structure 34 is communicated with the second capillary structure 33, and the second capillary structure 33 is communicated with the first capillary structure. Then, the third capillary structure 34, the second capillary structure 33, and the first capillary structure are communicated to form a plurality of intricate loops, which are conducive to accelerating the reflux speed of the liquid working medium and improving the heat dissipation power of the temperature balancing plate.

[0031] In this embodiment 1, multiple support columns 5 have the same height and are evenly distributed. The even distribution allows for uniform heat dissipation in the cavity 11, which is beneficial to the uniform temperature performance of the heat dissipation plate. The support columns 5 are provided with a circular, annular or frustum cross-sectional structure. Specifically in this embodiment 1, the support columns 5 are arranged to be cylindrical, and the conventional shape is beneficial to the production and manufacturing of the support columns 5.

[0032] If the pressure in the cavity 11 is less than 0.1 atmosphere, it is considered that the cavity 11 is in a vacuum state, which meets the working requirements of the temperature equalization plate, and the working medium is one of water, salt water, ethylene glycol or acetone.

[0033] Example 2, an integrated core arrangement temperature averaging plate, such as Figure 3 , 4 As shown, the differences from Example 1 include: (1) the support column body also includes a second connecting plate 42, and the second connecting plate 42 is fixedly connected between the lower cover plate 2 and the support column 5, that is, the second connecting plate 42 is fixedly connected to the lower cover plate 2,

[0034] The working principle is the same as that of the first embodiment, except that the second connecting plate 42 is sintered by copper powder or other metal powder and graphite according to the graphite shape, has a certain water absorption performance, and can absorb more liquid working medium. The lower surface of the lower cover plate 2 is in contact with the chip (heat source). Since the cavity 11 is set to a vacuum state (close to a vacuum state), the heat transferred from the chip is transferred to the lower cover plate 2, and the liquid working medium in the lower first capillary structure 32 in contact with the lower cover plate 2 is transformed into a gaseous working medium and absorbs heat at the same time. Since the second connecting plate 42 absorbs more liquid working medium, the heat dissipation performance of the temperature equalizing plate is effectively improved, and when the gaseous working medium with a higher temperature meets the gaseous working medium with a lower temperature When the liquid working medium is condensed into the upper cover plate 1, the first connecting plate 41 of a certain thickness can absorb a certain amount of the liquid working medium. Under the action of capillary action and gravity, the liquid working medium will return to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, and finally return to the bottom of the lower cover plate 2. Since the second connecting plate 42 is fixedly connected between the lower cover plate 2 and the support column 5, that is, the second connecting plate 42 is fixedly connected to the lower cover plate 2, the second connecting plate 42 can absorb more liquid working medium, so that when the temperature equalizing plate is in operation, the liquid working medium in the evaporation zone in the temperature equalizing plate cavity 11 can be quickly replenished, thereby effectively improving the heat dissipation performance of the temperature equalizing plate.

[0035] The differences from Example 1 include: (2) A third capillary structure 34 is also provided on the second connecting plate 42, and the third capillary structure 34 is connected to the second capillary structure 33. Its function and working principle are the same as those of Example 1. The third capillary structure 34, the second capillary structure 33, and the first capillary structure are connected to form a plurality of intricate loops, which are beneficial to accelerate the reflux speed of the liquid working medium and improve the heat dissipation power of the temperature equalizing plate.

[0036] The differences from Example 1 include: (3) The support column 5 includes a first support column 51 and a second support column 52. The outer diameter of the first support column 51 is larger than the outer diameter of the second support column 52. The first support column 51 and the second support column 52 are evenly spaced. After the liquid working medium is transformed into a gaseous working medium at the lower cover plate 2, the gaseous working medium will flow upward in the cavity 11. As the gas flows, the pressure in the cavity 11 increases, and the pressure on the inner wall of the cavity 11 increases. Therefore, the temperature equalizing plate may have cracks on the upper cover plate 1 and the lower cover plate 2, causing the temperature equalizing plate to be scrapped. Therefore, a support column 5 is set in the cavity 11, and the support column 5 includes a first support column 51 and a second support column 52. According to the actual pressure demand in the cavity 11, the influence of the pressure on the upper cover plate 1 and the lower cover plate 2 can be reduced by changing the diameter of the first support column 51 and the second support column 52, thereby protecting and extending the service life of the temperature equalizing plate.

[0037] Embodiment 3, an integrated core arrangement heat sink, includes a temperature averaging plate, the temperature averaging plate is the temperature averaging plate in embodiment 1 or embodiment 2, the heat dissipation principle of the temperature averaging plate is the same as that in embodiment 1 or 2, and will not be repeated here.

[0038] The utility model provides an integrated core arrangement temperature-averaging plate. The support column body is used as an integrated whole structure. During the manufacturing process, a plurality of support columns are first fixedly welded on the first connecting plate as a whole of the support column body. The support column body is welded between the upper cover plate and the lower cover plate, and then the edges of the upper cover plate and the lower cover plate are welded. The support column body is used as a whole structure, which greatly reduces the time of directly placing the support columns separately and as required on the upper cover plate and the lower cover plate at the current stage, and greatly improves the production efficiency and the qualified rate of finished products of the temperature-averaging plate. At the same time, the support column body is used as a whole of an integrated structure. The first connecting plate is sintered by copper powder or other metal powder and graphite according to graphite modeling, and has a certain water absorption performance. When the gaseous working medium with a higher temperature encounters the upper cover plate with a lower temperature and condenses into a liquid working medium, the first connecting plate with a certain thickness can absorb a certain amount of liquid working medium, and the second connecting plate with a certain thickness can also absorb a certain amount of liquid working medium, so that when the temperature-averaging plate is in operation, the liquid working medium in the evaporation zone in the cavity of the temperature-averaging plate can be quickly replenished, thereby effectively improving the heat dissipation performance of the temperature-averaging plate.

[0039] To summarize, the integrated core arrangement temperature equalizing plate and radiator provided by the utility model greatly improves the production efficiency and finished product qualification rate of the temperature equalizing plate by treating the support column body as an integrated whole structure. At the same time, more liquid working medium is adsorbed by the first connecting plate and the second connecting plate. When the temperature equalizing plate is in operation, the liquid working medium in the cavity of the temperature equalizing plate can be quickly replenished, thereby effectively improving the heat dissipation performance of the temperature equalizing plate.

[0040] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present invention, and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications may be made based on the above utility model, and these changes or modifications are still within the scope of the present utility model.

Claims

1. An integrated core arrangement temperature equalizing plate, characterized in that: Including the main body of the temperature plate and the main body of the support column, The temperature homogenizing plate body comprises an upper cover plate, a lower cover plate and a first capillary structure, wherein the first capillary structure comprises an upper first capillary structure and a lower first capillary structure, wherein the upper first capillary structure is located on the inner surface of the upper cover plate, the lower first capillary structure is located on the inner surface of the lower cover plate, and the upper first capillary structure is communicated with the lower first capillary structure, the upper cover plate and the lower cover plate form a closed cavity, and a working medium is arranged in the cavity; The support column body includes a first connecting plate and a plurality of support columns, the upper parts of the plurality of support columns are fixedly connected to the first connecting plate, the first connecting plate is fixedly connected to the lower part of the upper cover plate, the lower parts of the support columns are fixedly connected to the upper part of the lower cover plate, and a second capillary structure is also provided on the outer surface of the support column, and the second capillary structure is communicated with the first capillary structure.

2. The integrated core arrangement temperature equalizing plate according to claim 1, characterized in that: The support column body includes a second connecting plate, and the second connecting plate is fixedly connected between the lower cover plate and the support column.

3. The integrated core arrangement temperature equalizing plate according to claim 2, characterized in that: The first connecting plate and the second connecting plate are both provided with a third capillary structure, and the third capillary structure is communicated with the second capillary structure.

4. The integrated core arrangement temperature equalizing plate according to claim 2, characterized in that: The first connecting plate and the second connecting plate are formed by sintering metal powder and graphite.

5. The integrated core arrangement temperature equalizing plate according to claim 1, characterized in that: The support column comprises a first support column and a second support column, the outer diameter of the first support column is greater than the outer diameter of the second support column, and the first support column and the second support column are evenly spaced.

6. The integrated core arrangement temperature equalizing plate according to claim 1, characterized in that: The support column has a circular, annular or frustum cross-section structure.

7. The integrated core arrangement temperature equalizing plate according to claim 1, characterized in that: The pressure in the cavity is less than 0.1 atmosphere, and the working medium is one of water, salt water, ethylene glycol or acetone.

8. An integrated core arrangement heat sink, characterized in that: It includes a temperature averaging plate, and the temperature averaging plate is the integrated core arrangement temperature averaging plate as described in any one of claims 1-7.

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