Special-shaped backflow vapor chamber and radiator

Abstract

The temperature-uniforming plate comprises a temperature-uniforming plate body and a supporting column, the temperature-uniforming plate body comprises an upper body, a lower body and a first capillary structure, the two ends of the supporting column are fixedly connected to the upper body and the lower body respectively, the supporting column is provided with at least one groove, and the first capillary structure is arranged in the groove. According to the special-shaped backflow temperature-uniforming plate and the radiator, the at least one groove is formed in the supporting column, the at least one vacant space is formed between the groove and the temperature-uniforming plate body, in the backflow process of a liquid working medium, the liquid working medium is not prone to falling off, and the temperature-uniforming plate is not prone to falling off. The vacant space can store more liquid working media, the requirement for rapid backflow of the liquid working media can be met, the weight of the vapor chamber is reduced, the backflow speed of the liquid working media in the vapor chamber can be increased, the storage space of the liquid working media is increased, and the heat dissipation performance of the vapor chamber is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a special-shaped reflow temperature averaging plate and a radiator. Background Art

[0002] Vapor chamber (VC) is a common fast heat conduction and heat dissipation mechanism. Its working principle is that in a closed plate-shaped cavity, the working medium circulates under evaporation and condensation conditions to achieve rapid heat conduction and heat diffusion, thereby achieving the characteristics of rapid temperature uniformity.

[0003] The existing support columns inside the temperature equalizing plate are mostly composed of solid or hollow capillary pillars or powder columns, and the reflux rate has not been able to break through. It is well known that with the in-depth research on microscopic capillaries internationally, the use of capillaries to transmit and reflux working media has been widely used. Its application in the evaporation chamber can quickly help accelerate the operation of the working medium. However, with the increasing computing speed and volume integration, the traditional form can no longer meet the demand for fast reflux. In addition, traditional capillary rings or supporting capillary columns cannot store excess working fluid. If you want to store more reflux working media, you can only increase the volume at this stage. In this way, the volume of the evaporation chamber will inevitably decrease due to the increase in the internal capillary columns. As the volume increases, the weight also increases, which does not meet the needs of weight reduction, cost reduction, and environmental protection. Utility Model Content

[0004] In view of the above-mentioned problems, the purpose of the present utility model is to provide a special-shaped reflux temperature equalizing plate and radiator. By arranging at least one groove on the support column, at least one vacant space is formed between the groove and the temperature equalizing plate body. During the reflux process of the liquid working medium, the vacant space can store more liquid working medium and meet the demand for rapid reflux of the liquid working medium.

[0005] To achieve the above-mentioned purpose, the utility model provides a special-shaped reflow temperature evaporating plate, comprising a temperature evaporating plate body and a support column.

[0006] The temperature homogenizing plate body comprises an upper body, a lower body and a first capillary structure, wherein the first capillary structure comprises an upper first capillary structure and a lower first capillary structure, wherein the upper first capillary structure is located on the inner surface of the upper body, the lower first capillary structure is located on the inner surface of the lower body, and the upper first capillary structure is communicated with the lower first capillary structure, the upper body and the lower body form a closed cavity, and a working medium is arranged in the cavity;

[0007] The two ends of the support column are respectively fixedly connected to the upper body and the lower body, and a second capillary structure is also provided on the outer surface of the support column, and the second capillary structure is connected to the first capillary structure;

[0008] The support column is provided with at least one groove, and at least one empty space is formed between the groove and the temperature homogenizing plate body.

[0009] Preferably, there are two grooves, each of which has a circular cross-sectional structure, and each of which is located on the upper surface and the lower surface of the support column, respectively.

[0010] Preferably, the groove is located on the side, upper surface or lower surface of the support column, and a vacant space is formed between the groove and at least the lower body.

[0011] Preferably, the support column is configured to be solid or hollow.

[0012] Preferably, the support column is provided with a circular, annular or frustoconical cross-sectional structure, and the groove is provided with a semicircular, circular, square, trapezoidal or elliptical cross-sectional structure.

[0013] Preferably, the pressure in the cavity is less than 0.1 atmosphere, and the working medium is one of water, brine, ethylene glycol or acetone.

[0014] The utility model provides a special-shaped reflux radiator, which comprises a temperature equalizing plate.

[0015] The beneficial effect of the utility model is as follows: the special-shaped reflux temperature equalizing plate and radiator provided by the utility model, by arranging at least one groove on the support column, at least one vacant space is formed between the groove and the temperature equalizing plate body, during the reflux process of the liquid working medium, that is, in the process of returning along the upper first capillary structure and the second capillary structure to the lower first capillary structure, the vacant space can store more liquid working medium, and can meet the demand for rapid reflux of the liquid working medium, while reducing the weight of the temperature equalizing plate, it can also increase the reflux speed of the liquid working medium in the temperature equalizing plate, increase the storage space of the liquid working medium, and improve the heat dissipation performance of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings illustrate exemplary embodiments of the present invention and are used to explain the principles of the present invention together with the description. These drawings are included to provide a further understanding of the present invention, and the drawings are included in and constitute a part of this specification.

[0017] Figure 1 This is a schematic diagram of the internal structure of the special-shaped reflow temperature evaporating plate in Example 1;

[0018] Figure 2 It is a schematic diagram of the structure of the support column in Example 1;

[0019] Figure 3 It is a schematic diagram of the structure of the support column in Example 2;

[0020] Figure 4 This is a schematic diagram of the structure of the support column in Example 3. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant contents, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings.

[0022] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] Example 1: Please refer to Figure 1 to Figure 2 ,

[0024] A special-shaped reflow temperature balancing board, comprising a temperature balancing board body and a support column 4,

[0025] The temperature equalizing plate body includes an upper body 1, a lower body 2 and a first capillary structure, the first capillary structure includes an upper first capillary structure 31 and a lower first capillary structure 32, the upper first capillary structure 31 is located on the inner surface of the upper body 1, the lower first capillary structure 32 is located on the inner surface of the lower body 2, and the upper first capillary structure 31 is communicated with the lower first capillary structure 32, the upper body 1 and the lower body 2 form a closed cavity 11, and a working medium is provided in the cavity 11.

[0026] The support column 4 is provided with at least one groove, and the two ends of the support column 4 are fixedly connected to the upper body 1 and the lower body 2 respectively. A second capillary structure 33 is also provided on the outer surface of the support column 4. The second capillary structure 33 is connected to the first capillary structure, and multiple interconnected reflux loops are formed between the second capillary structure 33 and the upper first capillary structure 31 and the lower first capillary structure 32.

[0027] The support column 4 is provided with at least one groove, and at least one vacant space is formed between the groove and the main body of the temperature equalizing plate, that is, the groove forms a vacant space for accommodating the liquid working medium between the support column 4 and the upper main body 1, or / and the lower main body 2. In other words, when the groove is located at the bottom of the support column 4, at least one vacant space is formed between the support column 4 and the lower main body 2. When the groove is located at the top of the support column 4, at least one vacant space is formed between the support column 4 and the upper main body 1. In the process of the liquid working medium returning to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, the existing capillary structure or supporting capillary column cannot store excess liquid working medium, and the vacant space formed by the groove can store more liquid working medium and meet the demand for rapid reflux of the liquid working medium. While reducing the weight of the temperature equalizing plate, it can also increase the reflux speed of the liquid working medium in the temperature equalizing plate, increase the storage space of the liquid working medium, and improve the heat dissipation performance of the temperature equalizing plate.

[0028] Specifically in this embodiment, the support column 4 is provided with a first groove 51, and the first groove 51 is located at the center of the lower surface of the support column 4, and the first groove 51 is set to be cylindrical, the lower surface of the first groove 51 is flush with the lower surface of the support column 4, and its upper surface is located inside the support column 4, so that the first groove 51 constitutes a blind hole structure, and the interior of the blind hole is the empty space formed between the first groove 51 and the lower body 2, and the second capillary structure 33 is provided on the entire outer surface of the support column 4, and the second capillary structure 33 is connected with the first capillary structure, and the lower surface of the lower body 2 is in contact with the chip (heat source). Since the cavity 11 is set to a vacuum state (close to a vacuum state), the heat transferred from the chip is transferred to the lower body 2, and the liquid working medium in the lower first capillary structure 32 in contact with the lower body 2 is transformed into a gaseous working medium, and at the same time, the heat is absorbed. Heat absorption, that is, the lower body 2 absorbs heat during the phase change process, the gaseous working medium continuously evaporates upward, the pressure of the cavity 11 increases, and under the action of pressure, the high-temperature gaseous working medium (carrying the heat of the chip) continuously flows through the cavity 11 to the upper body 1, and the upper body 1 transfers the heat out. After the gaseous working medium flows to the upper body 1, it will condense into a liquid working medium and release a large amount of heat at the same time, that is, heat is released during the phase change process of the upper body 1. The heat is dissipated through the heat sink connected to the temperature equalizing plate. Subsequently, under the action of capillary action and gravity, the liquid working medium will return to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, and finally return to the bottom of the lower body 2. The liquid working medium encounters the hot chip again, changes phase again, and absorbs and releases heat in a reciprocating cycle to achieve the heat dissipation and cooling effect on the chip.

[0029] Specifically in this embodiment 1, since a first groove 51 is provided inside the lower end of the support column 4, that is, a vacant space is formed at the first groove 51, in the process of the liquid working medium returning to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, the existing capillary structure or supporting capillary column cannot store excess liquid working fluid, while the vacant space formed by the first groove 51 in this embodiment 1 can store more liquid working medium while meeting the demand for rapid reflux of the liquid working medium.

[0030] In this embodiment 1, the support column 4 is set to be solid, and the support column 4 is set to be a circular cross-sectional structure. Of course, the support column 4 can also be set to a semicircular, annular or frustum cross-sectional structure, and the groove is provided with a semicircular, circular, square, trapezoidal or elliptical cross-sectional structure. The pressure in the cavity 11 is less than 0.1 atmospheres, then the cavity 11 is considered to be in a vacuum state, which meets the working requirements of the temperature equalizing plate, and the working medium is one of water, brine, ethylene glycol or acetone.

[0031] Embodiment 2, a special-shaped reflow temperature absorbing plate, such as Figure 3 As shown, the support column 4 is a solid, circular cross-section structure, and the second groove 52 is located on the side, upper surface or lower surface of the support column 4. The difference from Example 1 is that the support column 4 is provided with two second grooves 52, and the second grooves 52 are respectively located on the upper and lower surfaces of the support column 4, forming two vacant spaces in the upper and lower parts of the support column 4. In this way, in the process of the liquid working medium returning to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, the two vacant spaces formed by the two second grooves 52 can store more liquid working medium, and at the same time, meet the demand for rapid reflux of the liquid working medium.

[0032] Embodiment 3, a special-shaped reflux heat sink, such as Figure 4 As shown, it includes a temperature equalizing plate. The difference between the temperature equalizing plate and embodiment 1 is that the support column 4 is hollow, there are two third grooves 53, the third grooves 53 are located on the side of the support column 4, and the third grooves 53 are provided with a square cross-sectional structure. Similarly, the third grooves 53 form a vacant space between the support column 4 and the lower body 2 for accommodating the liquid working medium. In the process of the liquid working medium returning to the lower first capillary structure 32 along the upper first capillary structure 31 and the second capillary structure 33, the two vacant spaces formed by the two second grooves 52 can store more liquid working medium. At the same time, the demand for rapid reflux of the liquid working medium is met, the weight of the temperature equalizing plate is reduced, and the reflux speed of the liquid working medium in the temperature equalizing plate can be increased while increasing the storage space of the liquid working medium, thereby improving the heat dissipation performance of the temperature equalizing plate.

[0033] The utility model provides a special-shaped reflux temperature equalizing plate, by arranging at least one groove on the support column, forming at least one vacant space between the groove and the temperature equalizing plate body, the groove forms a vacant space for accommodating liquid working medium between the support column and the upper body or / and the lower body, in other words, when the groove is located at the bottom of the support column, a vacant space is formed between the support column and the lower body, and when the groove is located at the top of the support column, a vacant space is formed between the support column and the upper body, in the process of the liquid working medium returning to the lower first capillary structure along the upper first capillary structure and the second capillary structure, the existing capillary structure or the supporting capillary column cannot store excess liquid working medium, and the vacant space formed by the groove can store more liquid working medium and meet the demand for rapid reflux of the liquid working medium, while reducing the weight of the temperature equalizing plate, it can also increase the reflux speed of the liquid working medium in the temperature equalizing plate, increase the storage space of the liquid working medium, and improve the heat dissipation performance of the temperature equalizing plate.

[0034] To summarize, the special-shaped reflow temperature equalizing plate and radiator provided by the utility model, by setting at least one groove on the support column, at least one vacant space is formed between the groove and the temperature equalizing plate body. During the reflux process of the liquid working medium, that is, in the process of returning to the lower first capillary structure along the upper first capillary structure and the second capillary structure, the vacant space can store more liquid working medium, and can meet the demand for rapid reflux of the liquid working medium, while reducing the weight of the temperature equalizing plate, it can also increase the reflux speed of the liquid working medium in the temperature equalizing plate, increase the storage space of the liquid working medium, and improve the heat dissipation performance of the temperature equalizing plate.

[0035] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present invention, and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications may be made based on the above utility model, and these changes or modifications are still within the scope of the present utility model.

Claims

1. A special-shaped reflow temperature plate, characterized in that: Including the temperature plate body and support column, The temperature homogenizing plate body comprises an upper body, a lower body and a first capillary structure, wherein the first capillary structure comprises an upper first capillary structure and a lower first capillary structure, wherein the upper first capillary structure is located on the inner surface of the upper body, the lower first capillary structure is located on the inner surface of the lower body, and the upper first capillary structure is communicated with the lower first capillary structure, the upper body and the lower body form a closed cavity, and a working medium is arranged in the cavity; The two ends of the support column are respectively fixedly connected to the upper body and the lower body, and a second capillary structure is also provided on the outer surface of the support column, and the second capillary structure is connected to the first capillary structure; The support column is provided with at least one groove, and at least one empty space is formed between the groove and the temperature homogenizing plate body.

2. The special-shaped reflow temperature evaporating plate according to claim 1, characterized in that: There are two grooves, each of which has a circular cross-sectional structure, and the grooves are respectively located on the upper surface and the lower surface of the support column.

3. The special-shaped reflow temperature equalizing plate according to claim 1, characterized in that: The groove is located on the side surface, the upper surface or the lower surface of the support column, and a vacant space is formed between the groove and at least the lower body.

4. The special-shaped reflow temperature evaporating plate according to claim 1, characterized in that: The support column is configured to be solid or hollow.

5. The special-shaped reflow temperature equalizing plate according to claim 1, characterized in that: The support column has a circular, annular or frustum-shaped cross-sectional structure, and the groove has a semicircular, circular, square, trapezoidal or elliptical cross-sectional structure.

6. The special-shaped reflow temperature evaporating plate according to claim 1, characterized in that: The pressure in the cavity is less than 0.1 atmosphere, and the working medium is one of water, salt water, ethylene glycol or acetone.

7. A special-shaped reflux radiator, characterized in that: It comprises a temperature equalizing plate, and the temperature equalizing plate is the special-shaped reflow temperature equalizing plate as described in any one of claims 1-6.

Images