Bridge sheet heat dissipation structure and terminal equipment
By designing a bridge sheet heat dissipation structure including the first and second thermal conductivity portions, the problem of poor heat dissipation of bridge sheets in Mini PCs is solved, short circuits and plate burning are avoided, and reliable heat dissipation of bridge sheets is achieved.
Patent Information
- Application Number
- CN202420843177.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-04-23
AI Technical Summary
Due to poor heat dissipation of bridges in Mini PCs, the temperature increases, affecting performance and life, and the adhesive structure has the risk of falling off and short-circuiting the plate.
A bridge plate heat dissipation structure is designed, and a radiator is arranged on the end surface of the bridge plate away from the main board, including a first thermal conductor contact with the bridge plate to conduct heat, and a gap between the second thermal conductor and the bridge plate to avoid short circuit, and is fixed to the main board by a fastener.
It effectively reduces the temperature of the bridge plate, avoids short circuit and plate burning problems, ensures the heat dissipation reliability of the bridge plate, and enhances the installation stability of the radiator.
Smart Images

Figure CN222850917U_ABST
Abstract
Citation Information
Cited By
Double-sided heat dissipation optical module and assembling method thereof
CN120802441A