Carrier tool and conveying device

Abstract

The utility model provides a carrier tool and a conveying device. The carrier tool is used for bearing a silicon wafer in the reaction chamber. The carrier tool comprises a bearing frame, a connecting frame and a roller assembly. The bearing frame is provided with a bearing side and a moving side. The bearing side and the moving side are arranged oppositely. The carrying side is configured to carry a silicon wafer. The bearing frame is rotationally connected to the connecting frame, and the rotating axis is perpendicular to the distribution direction of the bearing side and the moving side. The connecting frame is connected with the driving mechanism, so that the driving mechanism drives the bearing frame to enter and exit from the reaction chamber through the connecting frame. The roller assembly is arranged on the moving side. The roller assembly is configured to roll in the reaction chamber. According to the carrier tool and the conveying device, stress generated in the carrier tool can be digested, so that negative effects caused by the stress are relieved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic cell manufacturing, and in particular to a carrier tool and a conveying device. Background Art

[0002] In the process of preparing some solar cells, it is necessary to passivate the silicon wafers in the reaction chamber under high temperature conditions. The carrier is driven by the driving mechanism to carry the silicon wafers into the reaction chamber. In the related art, the carrier is provided with rollers to facilitate the movement of the carrier. However, due to the weight of the carrier itself, the weight of the silicon wafers carried, and the assembly accuracy, the carrier is prone to generate large stress inside in a high temperature environment, which affects the normal use of the carrier. Utility Model Content

[0003] In view of this, the present application provides a carrier tooling and a conveying device, which are helpful to absorb the stress generated inside the carrier tooling to alleviate the negative impact caused by the stress.

[0004] One embodiment of the present application provides a carrier tool for carrying silicon wafers in a reaction chamber. The carrier tool includes a carrier frame, a connecting frame and a roller assembly. The carrier frame is provided with a carrying side and a moving side. The carrying side and the moving side are arranged opposite to each other. The carrying side is configured to carry silicon wafers in reverse. The carrier frame is rotatably connected to the connecting frame, and the axis of rotation is perpendicular to the distribution direction of the carrying side and the moving side. The connecting frame is configured to be connected to a driving mechanism so that the driving mechanism drives the carrier frame in and out of the reaction chamber through the connecting frame. The roller assembly is arranged on the moving side. The roller assembly is configured to roll in the reaction chamber.

[0005] In some embodiments of the present application, the carrier tooling further includes a support assembly. The support assembly includes a support member. The support member is supported on the moving side. The support member is configured so that the moving side can move along the support member when the driving mechanism drives the connecting frame to move.

[0006] In some embodiments of the present application, the carrier tooling further includes a limiting structure, which is stopped between the carrier and the connecting frame so that the rotation angle range of the carrier relative to the connecting frame is within a set angle range.

[0007] In some embodiments of the present application, the support frame is provided with a first sleeve. The connecting frame is provided with a second sleeve. The first sleeve and the second sleeve are rotatably connected. The limiting structure includes a first limiting protrusion and / or a second limiting protrusion. The first limiting protrusion is connected to the first sleeve. The first limiting protrusion abuts the connecting frame to stop the support frame from rotating relative to the connecting frame. The second limiting protrusion is connected to the second sleeve. The second limiting protrusion abuts the support frame to stop the support frame from rotating relative to the connecting frame.

[0008] In some embodiments of the present application, the carrier tooling further includes a first rotating shaft and a limiting end cover. The first rotating shaft is simultaneously passed through the first sleeve and the second sleeve. The first rotating shaft is provided with limiting end covers at both ends along its own axial direction. The limiting end cover stops the first sleeve or the second sleeve along the axial direction of the first rotating shaft to prevent the first rotating shaft from being separated from the first sleeve and the second sleeve.

[0009] In some embodiments of the present application, the roller assembly includes a mounting seat and a rolling wheel. The mounting seat is connected to the mobile side. The rolling wheel is rotatably connected to the mounting seat. The mounting seat and the rolling wheel meet any of the following conditions a or b. a. The mounting seat is provided with a first axial hole, the rolling wheel is provided with a second rotating shaft, the second rotating shaft is passed through the first axial hole, and the diameter of the first axial hole is greater than the diameter of the second rotating shaft. b. The mounting seat is provided with a third rotating shaft, the rolling wheel is provided with a second axial hole, the third rotating shaft is passed through the second axial hole, and the diameter of the second axial hole is greater than the diameter of the third rotating shaft.

[0010] In some embodiments of the present application, when the mounting seat is provided with a first axial hole, the mounting seat is provided with an opening, and the opening passes through the first axial hole and the outside of the first axial hole in a direction from the load-bearing side to the moving side.

[0011] In some embodiments of the present application, the roller assembly further comprises a baffle. The baffle is connected to the mounting seat. Along the distribution direction of the bearing side and the moving side, the baffle is located between the rolling wheel and the moving side. Along the distribution direction perpendicular to the bearing side and the moving side, the projection of the baffle covers the projection of the roller and the projection of the gap between the roller and the mounting seat.

[0012] In some embodiments of the present application, the roller assembly further comprises an adjusting member. The adjusting member is disposed between the mounting seat and the support frame. The adjusting member is configured to be able to change position relative to the mounting seat or the support frame so that the mounting seat changes position relative to the moving side along the distribution direction of the bearing side and the moving side.

[0013] In some embodiments of the present application, a plurality of roller assemblies are provided, and the plurality of roller assemblies are spaced apart along a distribution direction perpendicular to the load-bearing side and the moving side.

[0014] In some embodiments of the present application, the support frame is provided with a hollow area, and the hollow area runs through the support side and the moving side.

[0015] In some embodiments of the present application, the carrier tooling further comprises a furnace door. The furnace door and the carrier frame are respectively arranged on two pairs of sides of the connecting frame. The furnace door is configured to shield the entrance and exit of the reaction chamber.

[0016] An embodiment of the present application provides a conveying device. The conveying device includes a driving mechanism and a carrier tool as described in any of the above embodiments. The connecting frame and the driving mechanism are in transmission connection so that the driving mechanism drives the carrier frame to enter and exit the reaction chamber.

[0017] In the present application, the driving mechanism can drive the connecting frame to move, so that the carrier frame carrying the silicon wafer can enter the reaction chamber for reaction. The rolling assembly is connected to the moving side opposite to the bearing side, so as to share the weight of the silicon wafer and other structures carried by the carrier frame, so that the carrier frame can smoothly enter and exit the reaction chamber. The connecting frame is connected to the driving mechanism and is relatively fixed. The reaction chamber is in a high temperature environment. The carrier frame is affected by its own weight, the weight of the silicon wafer and other structures, and the tightness of the assembly connection, which generates a large stress between the carrier frame and the connecting frame. However, the carrier frame absorbs the above stress by rotating relative to the connecting frame to reduce the possibility of greater pressure on the rolling assembly, thereby maintaining a good rolling posture of the rolling assembly in the reaction chamber, which is conducive to alleviating the negative effects of the carrier frame being blocked from entering and exiting the reaction chamber, the rolling assembly wearing the reaction chamber, and abnormal noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.

[0019] Figure 1 A schematic diagram of the structure of the conveying device provided in one embodiment of the present application in cooperation with the silicon wafer and the reaction chamber;

[0020] Figure 2 for Figure 1 A schematic diagram of the structure of the carrier tooling with some structures omitted;

[0021] Figure 3 for Figure 2 A magnified view of part A;

[0022] Figure 4 for Figure 2 A structural diagram of the mid-carrier tooling from another perspective;

[0023] Figure 5 for Figure 4 A magnified view of part B;

[0024] Figure 6 for Figure 2 A structural diagram of the mid-carrier tooling from another perspective;

[0025] Figure 7 for Figure 2 A schematic diagram of the structure of the middle roller assembly;

[0026] Figure 8 for Figure 7 A structural schematic diagram of the middle roller assembly from another perspective;

[0027] Fig. 9 for Figure 7 A schematic diagram of the structure of the middle roller assembly from another perspective.

[0028] Description of main component symbols:

[0029] 100. Carrier tooling;

[0030] 10. Carrying frame; 11. Carrying side; 12. Moving side; 13. First sleeve; 14. Second mating surface; 15. Waist-shaped hole; 16. Hollow area;

[0031] 20. Connecting frame; 21. Second shaft sleeve; 22. First mating surface;

[0032] 30. Roller assembly; 31. Mounting seat; 311. First shaft hole; 312. Opening; 32. Roller; 321. Second rotating shaft; 33. Baffle; 34. Adjustment member; 35. Fastener;

[0033] 40. Support assembly; 41. Support member; 42. Support driving member;

[0034] 50. Limiting structure; 51. First limiting protrusion; 52. Second limiting protrusion;

[0035] 60. first rotating shaft; 70. position limiting end cover; 80. furnace door;

[0036] 200, conveying device; 201, driving mechanism; 300, silicon wafer; 400, reaction chamber; 401, inlet and outlet. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0039] In the description of the present application, it should be noted that the terms "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0040] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0041] Furthermore, the terms “first,” “second,” “third,” etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

[0042] In the process of preparing some solar cells, it is necessary to passivate the silicon wafers entering the reaction chamber under high temperature conditions. The carrier, driven by the driving mechanism, carries the silicon wafers into the reaction chamber. In the related art, the carrier is provided with rollers to facilitate the movement of the carrier, but due to the weight of the carrier itself, the weight of the silicon wafers carried, and the assembly accuracy, the carrier is prone to produce large stress inside in a high temperature environment, thereby compressing the roller assembly, which may cause the carrier to be blocked from entering and exiting the reaction chamber, the roller assembly to wear the reaction chamber, and produce abnormal noise and other adverse consequences.

[0043] In the related art, when manufacturing solar modules such as half-cut modules and shingled modules, it is necessary to split a silicon wafer into two or more pieces. The surface recombination rate of the silicon wafer cross section (side section) formed after the silicon wafer is cut is large, which will have a negative impact on the electrical performance of the solar cell. After the silicon wafer is divided into two by laser scribing, its cross section is an unpassivated silicon wafer cross section. The conversion efficiency of the half-chip silicon wafer will be reduced by 0.2-0.3% due to the increased recombination at the edge of the cross section. The efficiency of heterojunction solar cells will be reduced more after laser cracking due to their higher open circuit voltage. The reduction in solar cell efficiency caused by the above-mentioned cutting directly leads to a reduction in the power of the module made of sliced ​​silicon wafers. Therefore, the cross section is usually passivated to form a passivation film on the cross section, thereby reducing minority carrier recombination, providing field passivation effect, and reducing reflectivity. However, the passivation reaction is a reaction in a high temperature environment, which is easy to cause stress in the carrier that carries the silicon wafer.

[0044] An embodiment of the present application provides a carrier tool for carrying silicon wafers in a reaction chamber. The carrier tool includes a carrier frame, a connecting frame and a roller assembly. The carrier frame is provided with a carrying side and a moving side. The carrying side and the moving side are arranged opposite to each other. The carrying side is configured to carry silicon wafers. The carrier frame is rotatably connected to the connecting frame, and the axis of rotation is perpendicular to the distribution direction of the carrying side and the moving side. The connecting frame is configured to be connected to a driving mechanism so that the driving mechanism drives the carrier frame in and out of the reaction chamber through the connecting frame. The roller assembly is arranged on the moving side. The roller assembly is configured to roll in the reaction chamber.

[0045] The driving mechanism can drive the connecting frame to move, so that the carrier frame carrying the silicon wafer can enter the reaction chamber for reaction. The rolling assembly is connected to the moving side opposite to the carrying side, so as to share the weight of the silicon wafer and other structures carried by the carrier frame, so that the carrier frame can smoothly enter and exit the reaction chamber. The connecting frame is connected to the driving mechanism and is relatively fixed. The reaction chamber is in a high temperature environment. The carrier frame is affected by its own weight, the weight of the silicon wafer and other structures, and the tightness of the assembly connection, which causes a large stress between the carrier frame and the connecting frame. However, the carrier frame absorbs the above stress by rotating relative to the connecting frame to reduce the possibility of bringing greater pressure to the rolling assembly, thereby maintaining a good rolling posture of the rolling assembly in the reaction chamber, which is conducive to alleviating the negative effects of the carrier frame being blocked from entering and exiting the reaction chamber, the rolling assembly wearing the reaction chamber, and abnormal noise.

[0046] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0047] See also Figure 1 One embodiment of the present application provides a conveying device 200 . The conveying device 200 is used to convey a silicon wafer 300 to a reaction chamber 400 .

[0048] See also Figure 1 and Figure 2 In some embodiments, the conveying device 200 includes a carrier jig 100. The carrier jig 100 is used to carry the silicon wafer 300. The carrier jig 100 carries the silicon wafer 300 in the reaction chamber 400 so that the silicon wafer 300 undergoes a process reaction.

[0049] See also Figure 1 In some embodiments, the conveying device 200 further includes a driving mechanism 201. The driving mechanism 201 drives the carrier tool 100 to move, and the carrier tool 100 moves and carries the silicon wafer 300 to enter and exit the reaction chamber 400 through the inlet and outlet 401 of the reaction chamber 400.

[0050] See also Figure 2 , Figure 4 and Figure 6 In some embodiments, the carrier tooling 100 includes a carrier frame 10, a connecting frame 20 ( Figure 2Only a partial structure of the connecting frame 20 is shown in the figure) and the roller assembly 30. The carrier 10 is provided with a carrying side 11 and a moving side 12. The carrying side 11 and the moving side 12 are arranged opposite to each other. The carrying side 11 is configured to carry a silicon wafer 300. The carrier 10 is rotatably connected to the connecting frame 20, and the axis of rotation is perpendicular to the distribution direction of the carrying side 11 and the moving side 12. The connecting frame 20 is configured to be connected to the driving mechanism 201 so that the driving mechanism 201 drives the carrier 10 in and out of the reaction chamber 400 through the connecting frame 20. The roller assembly 30 is arranged on the moving side 12. The roller assembly 30 is configured to roll in the reaction chamber 400. It can be understood that when the carrier 10 is located in the reaction chamber 400 in the carrier tooling 100 in the use state, the direction from the carrying side 11 to the moving side 12 can be approximately the direction of gravity.

[0051] The driving mechanism 201 drives the connecting frame 20 to move, so that the carrier 10 carrying the silicon wafer 300 can enter the reaction chamber 400 for reaction. The rolling assembly is connected to the moving side 12 opposite to the carrying side 11, so as to share the weight of the silicon wafer 300 and other structures carried by the carrier 10, so that the carrier 10 can smoothly enter and exit the reaction chamber 400. The connecting frame 20 is connected to the driving mechanism 201 and is relatively fixed. The reaction chamber 400 is in a high temperature environment. The carrier 10 is affected by its own weight, the weight of the silicon wafer 300 and other structures, and the tightness of the assembly connection, so that a large stress is generated between the carrier 10 and the connecting frame 20. However, the carrier 10 digests the above stress by rotating relative to the connecting frame 20 to reduce the possibility of bringing a large pressure to the rolling assembly, thereby maintaining a good rolling posture of the rolling assembly in the reaction chamber 400, which is conducive to alleviating the negative effects such as the obstruction of the carrier 10 entering and exiting the reaction chamber 400, the wear of the reaction chamber 400 by the rolling assembly, and abnormal noise.

[0052] See also Figure 1 In some embodiments, the silicon wafer 300 may be placed in a structure such as a flower basket, a graphite boat, a quartz boat, or a graphite frame, and then supported on the supporting side 11 of the supporting frame 10 .

[0053] See also Figure 1 In some embodiments, the carrier tooling 100 further includes a support assembly 40. The support assembly 40 includes a support member 41. The support member 41 is supported on the moving side 12. The support member 41 is configured such that the moving side 12 can move along the support member 41 when the driving mechanism 201 drives the connecting frame 20 to move.

[0054] The support member 41 is provided to support the carrier 10, so as to limit the rotation position of the carrier 10 relative to the connecting frame 20, which is conducive to aligning the carrier 10 with the entrance and exit of the reaction chamber 400, so that the carrier 10 can smoothly enter the reaction chamber 400. The support member 41 supports the carrier 10, so that the carrying side 11 is maintained in a suitable position, so as to stably carry the silicon wafer 300.

[0055] See also Figure 1 In some embodiments, the support assembly 40 further includes a support driving member 42. The support member 41 is disposed on the support driving member 42, and the support driving member 42 drives the support member 41 to move, so that the support member 41 supports the carrier 10 at different rotation positions relative to the connecting frame 20. This facilitates adapting to the actual shape of the carrier 10 and aligning the carrier 10 with the inlet and outlet 401 of the reaction chamber 400.

[0056] See also Figure 1 In some embodiments, a roller is provided on the side of the support member 41 facing the moving side 12, so that the carrier 10 can move relative to the support member 41 and enter and exit the reaction chamber 400. In other embodiments, the surface of the side of the support member 41 facing the moving side 12 is smooth, or a guide rail or other structure is provided, so that the carrier 10 can move relative to the support member 41 and enter and exit the reaction chamber 400.

[0057] See also Figure 1 and Figure 5 In some embodiments, the carrier tooling 100 further includes a limiting structure 50. The limiting structure 50 is stopped between the carrier frame 10 and the connecting frame 20, so that the rotation angle range of the carrier frame 10 relative to the connecting frame 20 is within a set angle range.

[0058] The limiting structure 50 is provided to limit the rotational position of the carrier 10 relative to the connecting frame 20 , which helps the carrier 10 to align with the entrance and exit of the reaction chamber 400 , so that the carrier 10 can smoothly enter the reaction chamber 400 .

[0059] Optionally, when the support member 41 fails to support the carrier 10, the limiting structure 50 can maintain the carrier 10 at a fixed angle relative to the connecting frame 20 to assist in supporting the carrier 10, which helps prevent structures such as the silicon wafer 300 from falling from the carrier side 11.

[0060] It is understood that in some embodiments, the defined angle range is between -15° and +15° based on the horizontal plane. As an exemplary example, the lower limit of the defined angle may be -15°, -10°, -7°, -5°, -3°, etc., and the upper limit of the defined angle may be 3°, 5°, 7°, 10°, 15°, etc.

[0061] See also Figures 3 to 5In some embodiments, the support frame 10 is provided with a first sleeve 13. The connecting frame 20 is provided with a second sleeve 21. The first sleeve 13 and the second sleeve 21 are rotatably connected. The limiting structure 50 includes a first limiting protrusion 51 and / or a second limiting protrusion 52. The first limiting protrusion 51 is connected to the first sleeve 13. The first limiting protrusion 51 abuts against the connecting frame 20 to stop the support frame 10 from rotating relative to the connecting frame 20. The second limiting protrusion 52 is connected to the second sleeve 21. The second limiting protrusion 52 abuts against the support frame 10 to stop the support frame 10 from rotating relative to the connecting frame 20.

[0062] The first sleeve 13 rotates relative to the second sleeve 21, so that the support frame 10 rotates relative to the connecting frame 20. During the rotation of the support frame 10 relative to the connecting frame 20, at least one of the first limiting protrusion 51 stops the connecting frame 20 and the second limiting protrusion 52 stops the support frame 10, so that the first sleeve 13 cannot continue to rotate relative to the second sleeve 21, so that the support frame 10 stops rotating relative to the connecting frame 20, thereby realizing the limitation and restriction of the rotation position of the support frame 10 relative to the connecting frame 20.

[0063] It is understandable that in some embodiments, the first limiting protrusion 51 and the first shaft sleeve 13 are integrally formed. The second limiting protrusion 52 and the second shaft sleeve 21 are integrally formed.

[0064] It can be understood that in some embodiments, the first limiting protrusion 51 abuts against the connecting frame 20 and / or the second limiting protrusion 52 abuts against the supporting frame 10, at least stopping the supporting frame 10 from rotating from the supporting side 11 to the moving side 12. Optionally, when the first limiting protrusion 51 abuts against the connecting frame 20 and / or the second limiting protrusion 52 abuts against the supporting frame 10, the supporting frame 10 can be stopped in both the positive and negative directions of rotation.

[0065] See also Figure 1 In some embodiments, the connecting frame 20 is provided with a first mating surface 22 on the side facing the first sleeve 13. The first limiting protrusion 51 abuts against the first mating surface 22 to stop the bearing frame 10 from rotating. The bearing frame 10 is provided with a second mating surface 14 on the side facing the second sleeve 21. The second limiting protrusion 52 abuts against the second mating surface 14 to stop the bearing frame 10 from rotating.

[0066] See also Figure 3 and Figure 5In some embodiments, the first limiting protrusion 51 is a planar boss disposed on the side of the first sleeve 13 facing the connecting frame 20 (that is, the first sleeve 13 and the first limiting protrusion 51 form an outer square inner circle structure), or a curved boss (not shown), or a plurality of protrusions (not shown) are arranged at intervals around the rotation axis. The second limiting protrusion 52 is a planar boss disposed on the side of the second sleeve 21 facing the supporting frame 10 (that is, the second sleeve 21 and the second limiting protrusion 52 form an outer square inner circle structure), or a curved boss (not shown), or a plurality of protrusions (not shown) are arranged at intervals around the rotation axis.

[0067] In other embodiments, the limiting structure 50 is disposed between the first sleeve 13 and the second sleeve 21 along the axial direction of rotation of the supporting frame 10 , thereby limiting the rotation range.

[0068] See also Figures 3 to 5 In some embodiments, the carrier tooling 100 further includes a first rotating shaft 60 and a limiting end cover 70. The first rotating shaft 60 is simultaneously passed through the first sleeve 13 and the second sleeve 21. The first rotating shaft 60 is provided with limiting end covers 70 at both ends along its axial direction. The limiting end cover 70 stops the first sleeve 13 or the second sleeve 21 along the axial direction of the first rotating shaft 60 to prevent the first rotating shaft 60 from being separated from the first sleeve 13 and the second sleeve 21.

[0069] The first sleeve 13 and the second sleeve 21 are simultaneously sleeved on the first rotating shaft 60, so that the first sleeve 13 and the second sleeve 21 are rotatably connected, and the support frame 10 is indirectly rotatably connected to the connecting frame 20 through the first rotating shaft 60, which is conducive to providing more clearance between the support frame 10 and the connecting frame 20. In a high temperature environment, when the support frame 10 is subjected to heavy pressure, the clearance between the support frame 10 and the connecting frame 20 can absorb the stress between the two, thereby relieving the pressure on the roller assembly 30. And by setting a limiting end cover 70, it is limitedly matched with the first sleeve 13 or the second sleeve 21 along the axial direction of the first rotating shaft 60, so that the first sleeve 13 and the second sleeve 21 are stably rotatably connected through the first rotating shaft 60.

[0070] See also Figure 4 In some embodiments, the first rotating shaft 60, the first sleeve 13, and the second sleeve 21 are separate structures for mutual assembly. In other embodiments, the first rotating shaft 60 can be an integral structure with the first sleeve 13, and the first rotating shaft 60 can also be an integral structure with the second sleeve 21.

[0071] See also Figure 4 and Figure 5In some embodiments, if the first rotating shaft 60 is a complete component, at least one end of the first rotating shaft 60 is detachably connected to the limiting end cover 70. If the first rotating shaft 60 is a multi-section structure, both ends of the first rotating shaft 60 can be fixedly connected to the limiting end cover 70, and the multiple sections of the first rotating shaft 60 are threaded or clamped to assemble the first rotating shaft 60 with the first sleeve 13 and the second sleeve 21.

[0072] See also Figure 1 , Figure 7 and Fig. 9 In some embodiments, the roller assembly 30 includes a mounting seat 31 and a rolling wheel 32. The mounting seat 31 is connected to the mobile side 12. The rolling wheel 32 is rotatably connected to the mounting seat 31. The mounting seat 31 and the rolling wheel 32 satisfy any one of the following conditions a or b (condition b is not shown). a. The mounting seat 31 is provided with a first axial hole 311, and the rolling wheel 32 is provided with a second rotating shaft 321, the second rotating shaft 321 is passed through the first axial hole 311, and the diameter of the first axial hole 311 is greater than the diameter of the second rotating shaft 321. b. The mounting seat 31 is provided with a third rotating shaft, and the rolling wheel 32 is provided with a second axial hole, the third rotating shaft is passed through the second axial hole, and the diameter of the second axial hole is greater than the diameter of the third rotating shaft.

[0073] Through the cooperation of the second rotating shaft 321 and the first shaft hole 311, the rolling wheel 32 rotates relative to the mounting seat 31. And the first shaft hole 311 is thicker than the second rotating shaft 321. In a high temperature environment, even if the gap between the rolling wheel 32 and the mounting seat 31 is reduced due to thermal expansion, the rolling wheel 32 can also rotate relative to the mounting seat 31, which is conducive to the smooth entry and exit of the carrier 10 in the reaction chamber 400, and is conducive to reducing wear and abnormal noise. Through the cooperation of the third rotating shaft and the second shaft hole, the rolling wheel 32 can also rotate relative to the mounting seat 31, and the second shaft hole is thicker than the third rotating shaft. In a high temperature environment, even if the gap between the rolling wheel 32 and the mounting seat 31 is reduced due to thermal expansion, the rolling wheel 32 can also rotate relative to the mounting seat 31, which is conducive to the smooth entry and exit of the carrier 10 in the reaction chamber 400, and is conducive to reducing wear and abnormal noise.

[0074] See also Figure 2 and Figure 7 In some embodiments, when the mounting seat 31 is provided with a first axial hole 311 , the mounting seat 31 is provided with an opening 312 , and the opening 312 penetrates the first axial hole 311 and the outside of the first axial hole 311 along the direction from the load-bearing side 11 to the moving side 12 .

[0075] By providing the opening 312 , impurities accumulated in the first shaft hole 311 (such as solidified materials generated by the reaction in the reaction chamber 400 ) can be discharged from the first shaft hole 311 through the opening 312 , which is beneficial to improving the smoothness of the rotational cooperation between the first shaft hole 311 and the second rotating shaft 321 .

[0076] See also Figure 1 , Figure 7 and Figure 8 In some embodiments, the roller assembly 30 further includes a baffle 33. The baffle 33 is connected to the mounting seat 31. Along the distribution direction of the bearing side 11 and the moving side 12, the baffle 33 is located between the rolling wheel 32 and the moving side 12. The baffle 33 is spaced apart from the rolling wheel 32 and the moving side 12. Along the distribution direction perpendicular to the bearing side 11 and the moving side 12, the projection of the baffle 33 covers the projection of the rolling wheel and the projection of the gap between the rolling wheel and the mounting seat 31.

[0077] The baffle 33 is provided to prevent impurities in the reaction chamber 400 (such as solidified materials produced by the reaction in the reaction chamber 400) from entering between the rolling wheel 32 and the mounting seat 31, thereby reducing the friction and abnormal noise of the rolling wheel 32 and improving the smoothness of the rolling of the rolling wheel 32.

[0078] See also Figure 1 , Figure 7 and Fig. 9 In some embodiments, the roller assembly 30 further includes an adjusting member 34. The adjusting member 34 is disposed between the mounting seat 31 and the carrier 10. The adjusting member 34 is configured to be able to change position relative to the mounting seat 31 or the carrier 10, so that the mounting seat 31 changes position relative to the moving side 12 along the distribution direction of the carrying side 11 and the moving side 12.

[0079] The position of the mounting seat 31 is adjusted by the adjusting member 34, so as to adjust the height of the rolling assembly supporting the carrier 10 in the reaction chamber 400, so that the silicon wafer 300 is in a suitable position in the reaction chamber 400. In addition, the carrier 10 may be deformed after being subjected to high temperatures for many times in the reaction chamber 400, and the adjusting member 34 can make the roller assembly 30 adapt to the deformation of the carrier 10.

[0080] See also Figure 6 and Figure 7 In some embodiments, the carrier 10 is provided with a waist-shaped hole 15. The roller assembly 30 further includes a fastener 35. The fastener 35 connects the mounting seat 31 and the waist-shaped hole 15. The adjusting member 34 abuts against the carrier 10 and is movably connected to the mounting seat 31. By adjusting the position of the adjusting member 34 relative to the mounting seat 31, the position of the fastener 35 fixed relative to the waist-shaped hole 15 is changed, thereby adjusting the position of the mounting seat 31 relative to the carrier 10. As an illustrative example, the fastener 35 and the adjusting member 34 can be bolts.

[0081] See also Figure 1 , Figure 4 and Figure 6In some embodiments, a plurality of roller assemblies 30 are provided. Along a distribution direction perpendicular to the carrying side 11 and the moving side 12, the plurality of roller assemblies 30 are distributed at intervals.

[0082] The carrier 10 moves in the reaction chamber 400 through multiple sets of rolling assemblies. The multiple sets of rolling assemblies can share the weight of the carrier 10 and the silicon wafer 300 and other structures it carries, so as to reduce the pressure on a single rolling assembly, thereby helping to improve the service life and working condition of each rolling assembly.

[0083] See also Figure 1 , Figure 2 and Figure 4 In some embodiments, the carrier frame 10 is provided with a hollow area 16. The hollow area 16 passes through the carrier side 11 and the moving side 12.

[0084] The hollow area 16 is provided to reduce the heat absorption of the carrier 10 , thereby increasing the heat absorption of the silicon wafer 300 toward the carrier side 11 , so that the silicon wafer 300 is heated evenly, thereby improving the process reaction yield of the silicon wafer 300 .

[0085] See also Figure 1 In some embodiments, the carrier tool 100 further includes a furnace door 80. The furnace door 80 and the carrier frame 10 are respectively disposed on two pairs of sides of the connecting frame 20. The furnace door 80 is configured to shield the entrance and exit of the reaction chamber 400.

[0086] The furnace door 80 is connected to the side of the connecting frame 20 away from the supporting frame 10, so that the furnace door 80 can move together with the connecting frame 20 and the supporting frame 10. When the supporting frame 10 moves into place in the reaction chamber 400, the furnace door 80 can shield the reaction chamber 400, which is conducive to improving operating efficiency.

[0087] It is understandable that in some embodiments, the driving structure is connected to the furnace door 80. By driving the furnace door 80 to move, the connecting frame 20 and the supporting frame 10 are driven to move.

[0088] In the present application, the relatively fixed arrangement of the two does not mean that they cannot be disassembled, but is intended to indicate that when the carrier tooling 100 is in use, the relatively fixed two can move together; the relative verticality of the two does not mean an absolute 90° relationship, but a certain deviation is allowed as long as it does not constitute an obstacle to the rotation of the carrier frame 10 relative to the connecting frame 20 and the movement of the carrier frame 10 in and out of the reaction chamber 400.

[0089] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A carrier tool for carrying a silicon wafer in a reaction chamber, characterized in that: include: A carrier frame, comprising a carrier side and a movable side, the carrier side and the movable side are arranged opposite to each other, and the carrier side is configured to carry the silicon wafer; A connecting frame, the carrier frame is rotatably connected to the connecting frame, and the axis of rotation is perpendicular to the distribution direction of the carrier side and the movable side, and the connecting frame is configured to be connected to a driving mechanism so that the driving mechanism drives the carrier frame to enter and exit the reaction chamber through the connecting frame; A roller assembly is disposed on the moving side, and the roller assembly is configured to roll in the reaction chamber.

2. The carrier tooling according to claim 1, characterized in that: The carrier tooling also includes a support assembly, and the support assembly includes a support member, and the support member is supported on the moving side. When the driving mechanism drives the connecting frame to move, the moving side can move along the support member.

3. The carrier tooling according to claim 1 or 2, characterized in that: The carrier tooling also includes a limiting structure, and the limiting structure is stopped between the carrier and the connecting frame so that the rotation angle range of the carrier relative to the connecting frame is within a set angle range.

4. The carrier tooling according to claim 3, characterized in that: The bearing frame is provided with a first sleeve, the connecting frame is provided with a second sleeve, the first sleeve and the second sleeve are rotatably connected, and the limiting structure includes a first limiting protrusion and / or a second limiting protrusion. The first limiting protrusion is connected to the first shaft sleeve, and the first limiting protrusion abuts against the connecting frame to stop the bearing frame from rotating relative to the connecting frame; The second limiting protrusion is connected to the second shaft sleeve, and the second limiting protrusion abuts against the supporting frame to stop the supporting frame from rotating relative to the connecting frame.

5. The carrier tooling according to claim 4, characterized in that: The carrier tooling also includes a first rotating shaft and a limiting end cover. The first rotating shaft is simultaneously passed through the first sleeve and the second sleeve. The limiting end covers are provided at both ends of the first rotating shaft along its own axial direction. The limiting end covers stop the first sleeve or the second sleeve along the axial direction of the first rotating shaft to prevent the first rotating shaft from separating from the first sleeve and the second sleeve.

6. The carrier tooling according to claim 1, characterized in that: The roller assembly includes a mounting seat and a rolling wheel, wherein the mounting seat is connected to the moving side, and the rolling wheel is rotatably connected to the mounting seat, and the mounting seat and the rolling wheel meet any one of the following conditions a or b: a. The mounting seat is provided with a first shaft hole, the rolling wheel is provided with a second rotating shaft, the second rotating shaft is passed through the first shaft hole, and the diameter of the first shaft hole is larger than the diameter of the second rotating shaft; b. The mounting seat is provided with a third rotating shaft, the rolling wheel is provided with a second shaft hole, the third rotating shaft is passed through the second shaft hole, and the diameter of the second shaft hole is larger than the diameter of the third rotating shaft.

7. The carrier tooling according to claim 6, characterized in that: When the mounting seat is provided with the first axial hole, the mounting seat is provided with an opening, and the opening penetrates the first axial hole and the outside of the first axial hole along a direction from the bearing side to the moving side.

8. The carrier tooling according to claim 6, characterized in that: The roller assembly also includes a baffle, which is connected to the mounting seat. Along the distribution direction of the load-bearing side and the moving side, the baffle is located between the rolling wheel and the moving side. Along the distribution direction perpendicular to the load-bearing side and the moving side, the projection of the baffle covers the projection of the roller and the projection of the gap between the roller and the mounting seat.

9. The carrier tooling according to claim 6, characterized in that: The roller assembly also includes an adjusting member, which is arranged between the mounting seat and the supporting frame, and the adjusting member is configured to be able to change its position relative to the mounting seat or the supporting frame so that the mounting seat can change its position relative to the moving side along the distribution direction of the supporting side and the moving side.

10. The carrier tooling according to any one of claims 6 to 9, characterized in that: The roller assemblies are provided in a plurality of groups, and the plurality of groups of roller assemblies are distributed at intervals along a distribution direction perpendicular to the bearing side and the moving side.

11. The carrier tooling according to claim 1, characterized in that: The support frame is provided with a hollow area, and the hollow area passes through the support side and the moving side.

12. The carrier tooling according to claim 1, characterized in that: The carrier tooling further includes a furnace door, wherein the furnace door and the carrier frame are respectively arranged on two pairs of sides of the connecting frame, and the furnace door is configured to shield the entrance and exit of the reaction chamber.

13. A conveying device, characterized in that: It comprises a driving mechanism and a carrier tooling as described in any one of claims 1 to 12, wherein the connecting frame and the driving mechanism are in transmission connection so that the driving mechanism drives the carrier frame to enter and exit the reaction chamber.

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