Snakelike HPD uniform-temperature heat dissipation bottom plate

Abstract

The utility model relates to a snakelike HPD uniform-temperature heat dissipation bottom plate, which comprises a heat dissipation bottom plate, a heat dissipation water channel arranged on one side of the heat dissipation bottom plate, and a plurality of chips arranged on the heat dissipation bottom plate. The side, facing the heat dissipation water channel, of the heat dissipation bottom plate is provided with at least six heat dissipation areas at intervals, and each heat dissipation area comprises a heat dissipation frame and at least two partition blocks arranged in the heat dissipation frame at intervals. According to the snakelike HPD uniform-temperature heat dissipation bottom plate, resistance borne by cooling liquid in the flowing process is reduced through the snakelike water channels, the overall pressure drop of the cooling liquid is improved, and therefore the heat dissipation capacity of a module is improved. The six first openings and the six second openings can guarantee that the temperatures of cooling liquid just entering the six containing cavities are basically the same, so that the temperature uniformity among the chips is improved, inlets and outlets of the cooling liquid are located on the same side, the influence caused by heat exchange of the cooling liquid is avoided, and the heat exchange efficiency of the cooling liquid is improved. Therefore, the temperature uniformity of the whole module is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of power modules, in particular to a serpentine HPD uniform temperature heat dissipation bottom plate. Background Art

[0002] The power module is a power electronic device that is combined with certain functions and then encapsulated into a module. With the rapid development of modern science and technology, the market demand for power modules is increasing rapidly, and the heat dissipation effect of the power module will affect the use of the module, so the heat dissipation problem of the power module has become a top priority. For example, Chinese patent CN201721513164.X discloses an IGBT power module and a power module comprising it, which includes a plurality of IGBT power module submodules and two cooling substrates, and the plurality of IGBT power module submodules are arranged along the length direction of the cooling substrate at a predetermined interval and encapsulated between the two cooling substrates through a package body, and the cooling substrate includes a first cooling substrate and a second cooling substrate, and the first cooling substrate and the second cooling substrate are formed with a cooling portion consisting of a plurality of protrusions on the surface that does not contact the IGBT power module submodule, and the first cooling substrate and the second cooling substrate are respectively provided with openings at both ends that are interconnected to form a first water guide port and a second water guide port respectively. The module reduces the risk of overheating failure and improves the output electrical performance of the power module through uniform contact between the coolant and the wing pins. However, due to the large distance between the coolant inlet and outlet, the temperature of the coolant rises near the outlet after heat exchange, which causes the heat dissipation effect there to decrease. This results in a large temperature difference between the chips, and the temperature uniformity cannot be guaranteed. In addition, the processing and installation of traditional heat dissipation fins are more troublesome, and the processing cost can be further reduced. Utility Model Content

[0003] In view of this, the utility model provides a serpentine HPD uniform temperature heat dissipation base plate to solve the above problems.

[0004] A serpentine HPD uniform temperature heat dissipation base plate, which includes a heat dissipation base plate, a heat dissipation water channel arranged on one side of the heat dissipation base plate, and a plurality of chips arranged on the heat dissipation base plate. At least six heat dissipation areas are spaced apart on the side of the heat dissipation base plate facing the heat dissipation water channel, and the heat dissipation area includes a heat dissipation frame, and at least two spacers spaced apart in the heat dissipation frame. A plurality of first convex strips are spaced apart and protruded on the two opposite inner side walls of the heat dissipation frame, and the plurality of first convex strips on both sides are staggered. A plurality of second convex strips are spaced apart and protruded on the two opposite outer side walls of the spacer, and the second convex strips on the two spacers close to the first convex strips are located between the adjacent first convex strips, and the second convex strips on the opposite sides of the two spacers are staggered with each other. The connecting ends of the first and second convex strips are bent, and at least three curved serpentine flow channels are formed in the heat dissipation area.

[0005] Furthermore, the heat dissipation water channel includes a main body, an inlet water channel opened inside the main body, two outlet water channels opened on both sides of the inlet water channel, and six accommodating chambers opened on one side of the main body facing the heat dissipation base plate.

[0006] Furthermore, the four outer side walls of the heat dissipation frame are in contact with the four inner side walls of the accommodating chamber in an interval manner, and the six heat dissipation areas are respectively accommodated in the six accommodating chambers.

[0007] Furthermore, the inlet water channel is located in the middle of the main body, and at least six first openings are opened on one side of the inlet water channel facing the accommodating chambers, and the six first openings are respectively connected to the six accommodating chambers.

[0008] Furthermore, the two outlet water channels are arranged in parallel with the inlet water channel and spaced apart from each other, and a water outlet is provided at one end of the outlet water channel close to the coolant inlet position.

[0009] Furthermore, the distance between the outlet water channel and the inlet water channel is the width of one of the accommodating chambers, and at least three second openings are respectively opened on one side of the two outlet water channels facing the accommodating chamber, and the six second openings are respectively connected to the six accommodating chambers.

[0010] Compared with the prior art, the serpentine HPD temperature-averaging heat dissipation base provided by the utility model reduces the resistance encountered by the coolant flow through the serpentine water channel, increases the overall pressure drop of the coolant, and thus improves the heat dissipation capacity of the module. Moreover, the serpentine water channel is easier to process than densely distributed wing pins, which reduces the processing cost. The six first openings and the six second openings can ensure that the temperature of the coolant just entering the six accommodating chambers is basically the same, thereby improving the temperature uniformity between each of the chips, and the inlet and outlet of the coolant are on the same side, avoiding the influence of the coolant after heat exchange, thereby further improving the temperature uniformity of the entire module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the structure of the serpentine HPD uniform temperature heat dissipation base plate provided by the utility model.

[0012] Figure 2 for Figure 1 Schematic diagram of the structure of the heat dissipation base plate of the serpentine HPD uniform temperature heat dissipation base plate.

[0013] Figure 3 for Figure 1 Schematic diagram of the structure of the heat dissipation area of ​​the serpentine HPD uniform temperature heat dissipation base plate.

[0014] Figure 4 for Figure 1 A schematic cross-sectional diagram of the heat dissipation channels of the serpentine HPD uniform temperature heat dissipation base plate. DETAILED DESCRIPTION

[0015] The following is a further detailed description of the specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0016] like Figure 1 As shown, it is a schematic diagram of the structure of the serpentine HPD temperature-average heat dissipation base provided by the utility model. The serpentine HPD temperature-average heat dissipation base includes a heat dissipation base 10, a heat dissipation water channel 20 arranged on one side of the heat dissipation base 10, and a plurality of chips 30 arranged on the heat dissipation base 10. It can be imagined that the serpentine HPD temperature-average heat dissipation base also includes some other functional modules, such as a power module, a welding module, etc., which are technologies already known to those skilled in the art and will not be described one by one here.

[0017] Please also read Figures 2 to 3 At least six heat dissipation areas 11 are provided at intervals on one side of the heat dissipation base plate 10 facing the heat dissipation channel 20, and the heat dissipation areas 11 match with part of the heat dissipation channel 20, thereby achieving the function of dissipating heat for the chip 30. The specific matching will be described below.

[0018] The heat dissipation area 11 includes a heat dissipation frame 12 and at least two spacers 13 spaced apart in the heat dissipation frame 12 .

[0019] On the two opposite inner side walls of the heat dissipation frame 12, a plurality of first ridges 14 are respectively arranged at intervals and protruded, and the plurality of first ridges 14 on both sides are respectively arranged in an interlaced manner. On the two opposite outer side walls of the spacer block 13, a plurality of second ridges 15 are respectively arranged at intervals and protruded, and the second ridges 15 on the side of the two spacer blocks 13 close to the first ridges 14 are located between the adjacent first ridges 14, and the second ridges 15 on the opposite sides of the two spacer blocks 13 are arranged in an interlaced manner. In this way, the first ridges 14 on the two inner side walls of the heat dissipation frame 12 are respectively interlaced with the second ridges 15 on the two outer side walls of the two spacer blocks 13, and the second ridges 15 between the two adjacent spacer blocks 13 are interlaced, so that at least three curved serpentine flow channels 16 are formed in the heat dissipation area 11.

[0020] The connecting ends of the first and second convex strips 14 and 15 are bent, so that when the coolant passes through the serpentine flow channel 16, the resistance encountered by the coolant can be reduced, the overall pressure drop of the coolant can be increased, and the heat dissipation capacity of the module can be improved.

[0021] The heat dissipation water channel 20 includes a body 21 , an inlet water channel 22 opened inside the body 21 , two outlet water channels 23 opened on both sides of the inlet water channel 22 , and six accommodating chambers 24 opened on one side of the body 21 facing the heat dissipation base plate 10 .

[0022] The main body 21 has one side of the accommodating chamber 24 that abuts against and is fixedly connected to the heat dissipation base plate 10, and the six accommodating chambers 24 correspond to the six heat dissipation areas 11 respectively, and the four outer walls of the heat dissipation frame 12 are in contact with the four inner walls of the accommodating chamber 24 at intervals, so that the six heat dissipation areas 11 are respectively accommodated in the six accommodating chambers 24.

[0023] One end of the inlet water channel 22 is in communication with the outside of the body 21, so as to guide the coolant into the inside of the body 21. The inlet water channel 22 is located in the middle of the body 21, and at least six first openings 25 are opened on the side of the inlet water channel 22 facing the accommodating chamber 24, and the six first openings 25 are respectively in communication with the six accommodating chambers 24. In this way, the external coolant flows into the inlet water channel 22, flows through the six first openings 25 to the six accommodating chambers 24, and flows into the serpentine water channel 16 in the heat dissipation area 11, thereby achieving the purpose of heat dissipation.

[0024] The cross-sectional area of ​​the first opening 25 is smaller than the cross-sectional area of ​​the inlet water channel 22 , so when the coolant flows from the inlet water channel 22 through the first opening 25 into the accommodating chamber 24 , the flow rate of the coolant will become faster, thereby improving the heat dissipation effect of the module.

[0025] The two outlet water channels 23 are arranged in parallel with the inlet water channel 22, and one end of the outlet water channel 23 close to the coolant inlet position is provided with a water outlet 26, and the water outlet 26 is communicated with the outside of the body 21, so that the coolant is discharged from the body 21 through the water outlet 26. The distance between the outlet water channel 23 and the inlet water channel 22 is the width of one accommodating chamber 24, and the two outlet water channels 23 are respectively provided with at least three second openings 27 on one side facing the accommodating chamber 24, and the six second openings 27 are respectively communicated with the six accommodating chambers 24. In this way, the coolant after heat exchange in the accommodating chamber 24 can flow to the two outlet water channels 23 through the six second openings 27, and flow to the outside of the body 21 through the water outlet 26.

[0026] The coolant flows into the accommodating chamber 24 through the first opening 25 in the inlet water channel 22, and then converges in the outlet water channel 23 through the second opening 27, so that the temperature of the coolant just entering the six accommodating chambers 24 is basically the same, so that the heat dissipation is the same, and there is no need to perform heat exchange before performing heat dissipation operations in the next area, thereby ensuring the uniformity of the temperature of each chip 30. In addition, the inlet and outlet of the coolant are on the same side, avoiding the influence of the coolant after heat exchange, and further improving the uniformity of the temperature of the entire module.

[0027] The plurality of chips 30 are in a triangle shape, and are soldered on a DBC substrate by a primary reflow process, and then the DBC substrate is soldered on the heat dissipation base plate 10 by a secondary reflow process. The chip 30 itself is a prior art, and will not be described in detail here.

[0028] Compared with the prior art, the serpentine HPD temperature-averaging heat dissipation base provided by the utility model reduces the resistance encountered by the coolant flow through the serpentine water channel 16, increases the overall pressure drop of the coolant, and thus improves the heat dissipation capacity of the module. Moreover, the serpentine water channel 16 is easier to process than densely distributed wing pins, which reduces the processing cost. The six first openings 25 and the six second openings 27 can ensure that the temperature of the coolant just entering the six accommodating chambers 24 is basically the same, thereby improving the temperature uniformity between each of the chips 30, and the inlet and outlet of the coolant are on the same side, avoiding the influence of the coolant after heat exchange, thereby further improving the temperature uniformity of the entire module.

[0029] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A serpentine HPD uniform temperature heat dissipation base plate, characterized in that: The serpentine HPD uniform temperature heat dissipation base plate includes a heat dissipation base plate, a heat dissipation water channel arranged on one side of the heat dissipation base plate, and a plurality of chips arranged on the heat dissipation base plate. At least six heat dissipation areas are spaced apart on the side of the heat dissipation base plate facing the heat dissipation water channel. The heat dissipation area includes a heat dissipation frame, and at least two spacers spaced apart in the heat dissipation frame. A plurality of first convex strips are respectively spaced apart and protruded on two opposite inner side walls of the heat dissipation frame, and a plurality of the first convex strips on both sides are respectively staggered. A plurality of second convex strips are respectively spaced apart and protruded on two opposite outer side walls of the spacer blocks, and the second convex strips of the two spacer blocks close to the first convex strips are located between adjacent first convex strips. The second convex strips on the opposite sides of the two spacer blocks are staggered with each other, and the connecting ends of the first and second convex strips are bent. At least three curved serpentine flow channels are formed in the heat dissipation area.

2. The serpentine HPD uniform temperature heat dissipation base plate according to claim 1, characterized in that: The heat dissipation water channel comprises a body, an inlet water channel opened inside the body, two outlet water channels opened on both sides of the inlet water channel respectively, and six accommodating chambers opened on one side of the body facing the heat dissipation bottom plate.

3. The serpentine HPD uniform temperature heat dissipation base plate according to claim 2, characterized in that: The four outer side walls of the heat dissipation frame are in contact with the four inner side walls of the accommodating chamber in an interval manner, and the six heat dissipation areas are respectively accommodated in the six accommodating chambers.

4. The serpentine HPD uniform temperature heat dissipation base plate according to claim 2, characterized in that: The inlet water channel is located in the middle of the main body, and at least six first openings are opened on one side of the inlet water channel facing the accommodating chambers, and the six first openings are respectively communicated with the six accommodating chambers.

5. The serpentine HPD uniform temperature heat dissipation base plate according to claim 2, characterized in that: The two outlet water channels are arranged in parallel and at intervals with the inlet water channel, and a water outlet is provided at one end of the outlet water channel close to the inlet position of the coolant.

6. The serpentine HPD uniform temperature heat dissipation base plate according to claim 2, characterized in that: The distance between the outlet water channel and the inlet water channel is the width of one of the accommodating chambers. The two outlet water channels are respectively provided with at least three second openings on one side facing the accommodating chamber, and the six second openings are respectively connected to the six accommodating chambers.

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