Packaging structure

Abstract

The utility model discloses a packaging structure, which comprises a first base island, a second base island, a first plastic packaging body, a second plastic packaging body and a third plastic packaging body, and is characterized in that the bottom of the first base island is provided with a first material reduction area, and the first base island is provided with a first functional area; the bottom of the second base island is provided with a second subtractive material area, the second base island is not in contact with the first base island, a part of the first base island is located in the second subtractive material area, the second base island is provided with a second functional area, and the second functional area is located right above the first functional area; the first plastic package body is respectively connected with the pin of the second base island and the first base island, and the first plastic package body fills a partial area of the second subtractive material area and the first subtractive material area; the second plastic package body is respectively connected with the top surface of the first base island, the second base island and the first plastic package body; and the third plastic package body is respectively connected with the top surface of the second base island and the second plastic package body. The packaging structure is high in voltage-resistant isolation level and low in profile thickness.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a packaging structure. Background Art

[0002] Small package structures are generally realized by QFN / DFN packaging process. The package structure manufactured by QFN / DFN packaging process has a bottom carrier pad for support. However, in some products (such as planar transformers and wireless data transmission), the exposed bottom carrier pad will make the package structure fail to meet the isolation requirements. In addition, the existing package structure also has the problem of high thickness of the profile. Utility Model Content

[0003] The technical problem solved by the utility model is to provide a low-thickness packaging structure with high isolation.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a packaging structure, comprising:

[0005] A first base island, wherein a first material reduction area is provided at the bottom of the first base island, and the first base island has a first functional area;

[0006] A second base island, wherein a second material reduction area is provided at the bottom of the second base island, the second base island is arranged not in contact with the first base island and a part of the first base island is located in the second material reduction area, and the second base island has a second functional area, and the second functional area is located directly above the first functional area;

[0007] A first plastic package body, wherein the first plastic package body is respectively connected to the pins of the second base island and the first base island, and the first plastic package body fills a part of the second material reduction area and the first material reduction area;

[0008] A second plastic sealing body, wherein the second plastic sealing body is respectively connected to the top surface of the first base island, the second base island and the first plastic sealing body;

[0009] The third plastic sealing body is respectively connected to the top surface of the second base island and the second plastic sealing body.

[0010] In one embodiment, the first functional area and the second functional area are respectively subtractive structures formed by subtractive molding.

[0011] In one embodiment, the first functional area has a first antenna that is subtractively formed on the first base island, and the second functional area has a second antenna that is subtractively formed on the second base island.

[0012] In one embodiment, the first functional area has a first coil that is subtractively formed on the first base island, and the second functional area has a second coil that is subtractively formed on the second base island.

[0013] In one embodiment, the first base island has a first flat plate portion, the first functional area is arranged on the first flat plate portion, the second base island has a second flat plate portion, the second functional area is arranged on the second flat plate portion, and the second plastic package fills the gap between the first flat plate portion and the second flat plate portion.

[0014] In one embodiment, the top surface of the first plastic package body is flush with the top surface of the first flat plate portion.

[0015] In one embodiment, the top surface of the second plastic package body is flush with the top surface of the second flat plate portion.

[0016] In one embodiment, outer wall surfaces and / or bottom surfaces of the pins of the first base island are exposed to the packaging structure.

[0017] In one embodiment, outer wall surfaces and / or bottom surfaces of the pins of the second base island are exposed to the packaging structure.

[0018] The beneficial effect of the utility model is that the first base island / the second base island can be reduced in material except for the pin area, so that the creepage distance has strong support, and the structural strength of the packaging structure is ensured while the withstand voltage isolation level of the packaging structure is improved. The first base island and the second base island have a first functional area and a second functional area that are opposite in the vertical direction, which can realize the vertical transmission of data / energy, and there is no need to mount additional components on the first base island / the second base island, so that the cross-sectional thickness of the packaging structure can be further reduced, which is conducive to the miniaturization of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 It is a cross-sectional view of the packaging structure of the first embodiment of the utility model;

[0021] Figure 2 This is a simplified schematic diagram of a wireless data transmission product according to Embodiment 1 of the present utility model;

[0022] Figure 3 This is a simplified schematic diagram of a planar transformer product according to the first embodiment of the present utility model.

[0023] Description of Figure Numbers:

[0024] 1. first base island; 11. first material reduction area; 12. first functional area; 13. first flat plate portion;

[0025] 2. Second base island; 21. Second material reduction area; 22. Second functional area; 23. Second flat plate portion;

[0026] 3. The first plastic sealing body;

[0027] 4. The second plastic sealing body;

[0028] 5. The third plastic sealing body. DETAILED DESCRIPTION

[0029] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0033] In addition, if the meaning of "and / or" appears in the full text is to include three parallel solutions, taking "and / or" as an example, it includes solutions, or solutions, or solutions that are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0034] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] Embodiment 1

[0036] Please refer to Figures 1 to 3 , Embodiment 1 of the present utility model is: a packaging structure that can be applied to planar transformers and micro wireless data transmission products.

[0037] The packaging structure includes a first base island 1, a second base island 2, a first plastic package 3, a second plastic package 4 and a third plastic package 5. The first base island 1 has a first material reduction area 11 at the bottom, and the first base island 1 has a first functional area 12; the second base island 2 has a second material reduction area 21 at the bottom, the second base island 2 is not in contact with the first base island 1 and a partial area of ​​the first base island 1 is located in the second material reduction area 21, the second base island 2 has a second functional area 22, and the second functional area 22 is located directly above the first functional area 12; the first plastic package 3 respectively connects the pins of the second base island 2 and the first base island 1, and the first plastic package 3 fills a partial area of ​​the second material reduction area 21 and the first material reduction area 11; the second plastic package 4 is respectively connected to the top surface of the first base island 1, the second base island 2 and the first plastic package 3; the third plastic package 5 is respectively connected to the top surface of the second base island 2 and the second plastic package 4.

[0038] In order to further reduce the cross-sectional thickness of the packaging structure, it is preferred that the first functional area 12 and the second functional area 22 are subtractive structures respectively formed by subtractive molding. Specific means of subtractive molding include but are not limited to chemical etching, milling grooves, etc.

[0039] When the packaging structure is applied to wireless data transmission products (such as Figure 2 As shown), the first functional area 12 has a first antenna formed by subtractive molding on the first base island 1, and the second functional area 22 has a second antenna formed by subtractive molding on the second base island 2.

[0040] When this packaging structure is applied to planar transformer products (such as Figure 3 As shown), the first functional area 12 has a first coil formed by subtractive molding on the first base island 1, and the second functional area 22 has a second coil formed by subtractive molding on the second base island 2.

[0041] Specifically, the first base island 1 has a first flat plate portion 13, the first functional area 12 is arranged on the first flat plate portion 13, the second base island 2 has a second flat plate portion 23, the second functional area 22 is arranged on the second flat plate portion 23, and the second plastic package body 4 fills the gap between the first flat plate portion 13 and the second flat plate portion 23.

[0042] For the convenience of processing and manufacturing, the top surface of the first plastic package body 3 is flush with the top surface of the first flat plate portion 13, and the top surface of the second plastic package body 4 is flush with the top surface of the second flat plate portion 23. Of course, in a specific packaging structure, the top surface of the first plastic package body 3 may be slightly lower or slightly higher than the top surface of the first flat plate portion 13, and similarly, the top surface of the second plastic package body 4 may be slightly lower or slightly higher than the top surface of the second flat plate portion 23.

[0043] The pins of the first base island 1 and the pins of the second base island 2 are respectively located on opposite sides of the packaging structure, and the outer wall surface and / or bottom surface of the pins of the first base island 1 are exposed to the packaging structure, and / or the outer wall surface and / or bottom surface of the pins of the second base island 2 are exposed to the packaging structure.

[0044] When manufacturing the packaging structure of this embodiment, the non-pin area of ​​the first base island 1 of metal material / the second base island 2 of metal material is first subjected to subtractive processing to form a first subtractive area 11 and a second subtractive area 21. The specific method of subtractive processing includes but is not limited to chemical etching, controlled depth milling, etc., and then the first base island 1 is subjected to a first plastic sealing process to form a first plastic sealing body 3 to form a first prefabricated frame, and then the first prefabricated frame and the second base island 2 are subjected to a second plastic sealing process to form a second plastic sealing body 4 to form a second prefabricated frame, and finally the second prefabricated frame is subjected to a third plastic sealing process to form a third plastic sealing body 5 to obtain a packaging structure.

[0045] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: include A first base island, wherein a first material reduction area is provided at the bottom of the first base island, and the first base island has a first functional area; A second base island, wherein a second material reduction area is provided at the bottom of the second base island, the second base island is arranged not in contact with the first base island and a part of the first base island is located in the second material reduction area, and the second base island has a second functional area, and the second functional area is located directly above the first functional area; A first plastic package body, wherein the first plastic package body is respectively connected to the pins of the second base island and the first base island, and the first plastic package body fills a part of the second material reduction area and the first material reduction area; A second plastic sealing body, wherein the second plastic sealing body is respectively connected to the top surface of the first base island, the second base island and the first plastic sealing body; The third plastic sealing body is respectively connected to the top surface of the second base island and the second plastic sealing body.

2. The packaging structure according to claim 1, characterized in that: The first functional area and the second functional area are respectively subtractive structures formed by subtractive molding.

3. The packaging structure according to claim 2, characterized in that: The first functional area has a first antenna that is subtractively formed on the first base island, and the second functional area has a second antenna that is subtractively formed on the second base island.

4. The packaging structure according to claim 2, characterized in that: The first functional area has a first coil that is subtractively formed on the first base island, and the second functional area has a second coil that is subtractively formed on the second base island.

5. The packaging structure according to claim 1, characterized in that: The first base island has a first flat plate portion, the first functional area is arranged on the first flat plate portion, the second base island has a second flat plate portion, the second functional area is arranged on the second flat plate portion, and the second plastic package fills the gap between the first flat plate portion and the second flat plate portion.

6. The packaging structure according to claim 5, characterized in that: The top surface of the first plastic package body is flush with the top surface of the first flat plate portion.

7. The packaging structure according to claim 5, characterized in that: The top surface of the second plastic package body is flush with the top surface of the second flat plate portion.

8. The packaging structure according to claim 1, characterized in that: The outer wall surface and / or the bottom surface of the pins of the first base island are exposed to the packaging structure.

9. The packaging structure according to claim 1, characterized in that: The outer wall surface and / or the bottom surface of the pins of the second base island are exposed to the packaging structure.

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