Electromagnetic shielding packaging body

Abstract

The utility model relates to the technical field of integrated circuit boards, and discloses an electromagnetic shielding packaging body which comprises a circuit board, an electronic element and an electromagnetic shielding film, the electronic element is arranged on the circuit board, the circuit board is provided with a grounding area, and the grounding area is located on the periphery of the electronic element; the electromagnetic shielding film comprises a shielding layer, an insulating layer and conductive particles, the shielding layer is attached to the insulating layer, the insulating layer is located on the side, facing the circuit board, of the shielding layer, the shielding layer and the insulating layer define a shielding cavity and form a connecting surrounding edge surrounding the shielding cavity, the connecting surrounding edge covers the grounding area, the average particle size of the conductive particles is D [mu] m, and the thickness of the shielding layer is d1 [mu] m, the thickness of the insulating layer is d2 microns, D is larger than or equal to d1 + d2, when the electromagnetic shielding film and the circuit board are pressed at high temperature, the hot pressing device applies pressure to the side face, back to the circuit board, of the electromagnetic shielding film, the conductive particles can pierce the softened insulating layer to be connected with the grounding area, in other words, the procedure of removing part of the insulating layer is not needed when the electromagnetic shielding film is processed, and the technology is simple.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit boards, in particular to an electromagnetic shielding package. Background Art

[0002] In the field of electronic devices, there are many integrated circuit chips that are sensitive to electromagnetic interference, such as radio frequency chips, especially high-frequency radio frequency chips. In practical applications, these chips need to be electromagnetically shielded to avoid electromagnetic wave interference to ensure the normal operation of electronic devices. In related technologies, the package body uses an electromagnetic shielding film to shield the interference of electromagnetic waves on the chip, and the electromagnetic shielding film includes a shielding layer and an insulating layer that are bonded to each other. The shielding layer contains conductive particles, and the insulating layer is located on the side of the shielding layer close to the electronic components. When in use, it is necessary to first remove the portion of the insulating layer corresponding to the grounding area of ​​the circuit board, and then press the electromagnetic shielding film and the circuit board at high temperature. During the hot pressing process, the conductive particles are electrically connected to the grounding area of ​​the circuit board, and then the interference charge is introduced into the grounding area of ​​the circuit board, thereby achieving shielding. However, when processing this type of electromagnetic shielding package, since the electromagnetic shielding film needs to remove part of the insulating layer before being pressed on the circuit board, the processing technology of the electromagnetic shielding package is relatively complicated. Utility Model Content

[0003] The purpose of the utility model is to provide an electromagnetic shielding package which has the advantage of simple processing technology.

[0004] In order to achieve the above object, the utility model provides an electromagnetic shielding package, including a circuit board, an electronic component and an electromagnetic shielding film, wherein the electronic component is arranged on the circuit board, the circuit board has a grounding area, and the grounding area is located at the periphery of the electronic component;

[0005] Wherein, the electromagnetic shielding film includes a shielding layer, an insulating layer and conductive particles, the shielding layer is in contact with the insulating layer, and the insulating layer is located on the side of the shielding layer facing the circuit board, the shielding layer and the insulating layer define a shielding cavity and form a connecting edge around the shielding cavity, the connecting edge covers the grounding area, the average particle size of the conductive particles is Dμm, the thickness of the shielding layer is d1μm, the thickness of the insulating layer is d2μm, D≥d1+d2, the conductive particles are arranged in the shielding layer, and in the connecting edge, some of the conductive particles pass through the insulating layer to connect to the grounding area, and the electronic components are located in the shielding cavity.

[0006] In a specific embodiment of the present invention, the shielding layer is made of a high-elasticity thermoplastic resin or a high-elasticity thermosetting resin.

[0007] In a specific embodiment of the present invention, the conductive particles are silver powder or silver-coated copper powder.

[0008] In a specific embodiment of the present invention, in the shielding layer, the content of the conductive particles is greater than 10% WT.

[0009] In a specific embodiment of the present invention, the conductive particles are evenly distributed in the shielding layer.

[0010] In a specific embodiment of the present invention, the insulating layer is a hot melt adhesive film.

[0011] In a specific embodiment of the present invention, the insulating layer is made of thermoplastic resin.

[0012] In a specific embodiment of the present invention, in the connection surrounding edge, the insulating layer extends outside the shielding layer.

[0013] The electromagnetic shielding package of the present utility model has the following advantages compared with the prior art:

[0014] In the electromagnetic shielding package of the utility model, the electromagnetic shielding film is pressed together with the circuit board at high temperature, and since the average particle size D of the conductive particles, the thickness d1 of the shielding layer, and the thickness d2 of the insulating layer satisfy: D≥d1+d2, therefore, when the electromagnetic shielding film is pressed together with the circuit board at high temperature, the hot pressing device applies pressure to the side of the electromagnetic shielding film facing away from the circuit board, and the conductive particles will pierce the softened insulating layer and connect with the grounding area, based on this, the grounding area is combined with the conductive particle network in the electromagnetic shielding film to finally form a complete Faraday cage to achieve shielding; and the conductive particles pierce the insulating layer and connect with the grounding area, therefore, when the electromagnetic shielding package is processed, the electromagnetic shielding film does not need to go through the process of removing part of the insulating layer before being pressed onto the circuit board, and the electromagnetic shielding package has the advantage of simple processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of an electromagnetic shielding package according to an embodiment of the utility model;

[0016] Figure 2 This is another structural diagram of the electromagnetic shielding package of the embodiment of the utility model.

[0017] In the figure, 1, circuit board; 11, grounding area; 2, electronic components; 3, electromagnetic shielding film; 31, shielding layer; 32, insulating layer; 33, conductive particles; 100, shielding cavity; 200, connecting edge. DETAILED DESCRIPTION

[0018] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0019] like Figure 1-2 As shown, an electromagnetic shielding package according to an embodiment of the utility model comprises a circuit board 1, an electronic component 2 and an electromagnetic shielding film 3, wherein the electronic component 2 is arranged on the circuit board 1, and the circuit board 1 has a grounding area 11, and the grounding area 11 is located at the periphery of the electronic component 2;

[0020] Among them, the electromagnetic shielding film 3 includes a shielding layer 31, an insulating layer 32 and conductive particles 33. The shielding layer 31 is in contact with the insulating layer 32, and the insulating layer 32 is located on the side of the shielding layer 31 facing the circuit board 1. The shielding layer 31 and the insulating layer 32 define a shielding cavity 100 and form a connecting edge 200 surrounding the shielding cavity 100. The connecting edge 200 covers the grounding area 11. The average particle size of the conductive particles 33 is Dμm, the thickness of the shielding layer 31 is d1μm, and the thickness of the insulating layer 32 is d2μm, D≥d1+d2, the conductive particles 33 are arranged in the shielding layer 31 and in the connecting edge 200, some of the conductive particles 33 pass through the insulating layer 32 to connect with the grounding area 11, and the electronic component 2 is located in the shielding cavity 100.

[0021] In actual applications, the electromagnetic shielding film 3 is pressed together with the circuit board 1 at high temperature. Since the average particle size D of the conductive particles 33, the thickness d1 of the shielding layer 31, and the thickness d2 of the insulating layer 32 satisfy the following condition: D≥d1+d2, when the electromagnetic shielding film 3 is pressed together with the circuit board 1 at high temperature, the hot pressing device applies pressure to the side of the electromagnetic shielding film 3 facing away from the circuit board 1, and the conductive particles 33 pierce through the softened insulating layer 32 to connect with the grounding area 11. Based on this, the grounding area 11 combines with the conductive particle 33 network in the electromagnetic shielding film 3 to finally form a complete Faraday cage to achieve shielding. The conductive particles 33 pierce through the insulating layer 32 to connect with the grounding area 11. Therefore, when the electromagnetic shielding package is processed, the electromagnetic shielding film 3 does not need to go through the process of removing part of the insulating layer 32 before being pressed onto the circuit board 1. The electromagnetic shielding package has the advantage of simple processing technology.

[0022] In actual applications, when hot pressing the electromagnetic shielding film 3, the hot pressing temperature of the grounding area of ​​the electromagnetic shielding film 3 is T, the pressure is P1, the softening temperature of the hot melt adhesive film of the insulating layer 32 is t, and the pressure of the non-grounding area of ​​the electromagnetic shielding film 3 is P2, then T>t, P1>P2, which can ensure the processing quality of the electromagnetic shielding package, wherein the grounding area of ​​the electromagnetic shielding film 3 refers to the connecting edge 200 area of ​​the electromagnetic shielding film 3, and the non-grounding area refers to other areas except the connecting edge 200. Based on the above pressure and temperature conditions, the conductive particles 33 in the grounding area of ​​the electromagnetic shielding film 3 pierce the insulating layer 32 to achieve conduction with the grounding area 11, but the non-grounding area is not sufficient to pierce the insulating layer 32 due to the pressure and temperature conditions. Therefore, the non-grounding area of ​​the electromagnetic shielding film 3 still maintains insulation.

[0023] In this embodiment, the shielding layer 31 is made of a high-elasticity thermoplastic resin or a high-elasticity thermosetting resin, that is, the shielding layer 31 has a certain elasticity, based on which the electromagnetic shielding package has a certain anti-vibration performance.

[0024] In this embodiment, the conductive particles 33 are silver powder or silver-coated copper powder. Based on this, the conductive particles 33 have good conductive properties, so that the electromagnetic shielding film 3 has good electromagnetic shielding properties.

[0025] In this embodiment, the content of the conductive particles 33 in the shielding layer 31 is greater than 10% WT, and the conductive particles 33 are evenly distributed in the shielding layer 31, ensuring that the electromagnetic shielding film 3 itself can form a good internal shielding network.

[0026] In this embodiment, the insulating layer 32 is a hot-melt adhesive film, that is, it has its own adhesiveness, which is conducive to its adhesion with the shielding layer 31 and the circuit board 1; and in the connecting edge 200, the insulating layer 32 extends beyond the shielding layer 31, that is, the bonding area between the insulating layer 32 and the circuit board 1 is relatively large, which can make the electromagnetic shielding film 3 and the circuit board 1 fit stably.

[0027] In this embodiment, the insulating layer 32 is made of thermoplastic resin so that the electromagnetic shielding film 3 can be easily disassembled without damaging the structure.

[0028] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. An electromagnetic shielding package, characterized in that: The invention comprises a circuit board (1), an electronic component (2) and an electromagnetic shielding film (3), wherein the electronic component (2) is arranged on the circuit board (1), and the circuit board (1) has a grounding area (11), and the grounding area (11) is located on the periphery of the electronic component (2); The electromagnetic shielding film (3) comprises a shielding layer (31), an insulating layer (32) and a plurality of conductive particles (33); the shielding layer (31) is in contact with the insulating layer (32), and the insulating layer (32) is located on a side of the shielding layer (31) facing the circuit board (1); the shielding layer (31) and the insulating layer (32) define a shielding cavity (100) and form a connecting edge (200) surrounding the shielding cavity (100); the connecting edge (200) covers The grounding region (11), the average particle size of the conductive particles (33) is D μm, the thickness of the shielding layer (31) is d1 μm, the thickness of the insulating layer (32) is d2 μm, D≥d1+d2, the conductive particles (33) are arranged in the shielding layer (31), and in the connecting edge (200), part of the conductive particles (33) pass through the insulating layer (32) to connect to the grounding region (11), and the electronic component (2) is located in the shielding cavity (100).

2. The electromagnetic shielding package according to claim 1, characterized in that: The material of the shielding layer (31) is a high-elasticity thermoplastic resin or a high-elasticity thermosetting resin.

3. The electromagnetic shielding package according to claim 2, characterized in that: The conductive particles (33) are silver powder or silver-coated copper powder.

4. The electromagnetic shielding package according to claim 3, characterized in that: The conductive particles (33) are evenly distributed in the shielding layer (31).

5. The electromagnetic shielding package according to claim 1, characterized in that: The insulating layer (32) is a hot melt adhesive film.

6. The electromagnetic shielding package according to claim 5, characterized in that: The insulating layer (32) is made of thermoplastic resin.

7. The electromagnetic shielding package according to claim 1, characterized in that: In the connection surrounding edge (200), the insulating layer (32) extends outside the shielding layer (31).

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