Heat dissipation structure of circuit board

Abstract

The utility model discloses a heat dissipation structure of a circuit board, and relates to the technical field of heat dissipation of electronic components. Wherein the substrate is provided with an accommodating space; the heat dissipation layer is arranged in the containing space and fixedly connected with the substrate, the heat dissipation layer comprises a heat dissipation part and a first heat dissipation channel, the first heat dissipation channel is arranged on the peripheral side of the heat dissipation part in a surrounding mode, and the first heat dissipation channel is filled with a heat conduction agent. The accommodating space is arranged on the substrate, and the heat dissipation layer is fixedly connected in the accommodating space, so that the heat dissipation structure special for heat management of the circuit board is formed. The heat dissipation part in the heat dissipation layer can directly absorb heat generated by other elements, and the first heat dissipation channel surrounding the periphery of the heat dissipation part provides an additional heat dissipation path. According to the structure, the heat dissipation efficiency can be improved, heat can be quickly dissipated, and the heat conduction agent filled in the first heat dissipation channel further enhances the heat dissipation effect. And the heat conduction agent can quickly transfer heat from the heat dissipation part to each part in the channel, so that the heat distribution is more uniform.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component heat dissipation, in particular to a circuit board heat dissipation structure. Background Art

[0002] A circuit board can be called a printed circuit board or a printed circuit board, and its English name is PCB (Printed Circuit Board). Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0003] The performance of current electronic devices is largely affected by temperature. Excessively high temperatures can cause electronic components to degrade in performance or even fail. For example, integrated circuit chips may experience thermal runaway at high temperatures, resulting in unstable operation or damage. Poor heat dissipation can also cause thermal stress in components on circuit boards, leading to mechanical fatigue and damage.

[0004] With the continuous development of the industry, when more complex application requirements are met, the heat generated by the core components of the circuit board during operation continues to increase, and the circuit can also be arranged into a multi-layer structure and pressed together, and through-hole circuits are laid between the layers to connect the circuits of each layer. With the existing circuit board's heat dissipation structure, the heat may not be able to diffuse to the surroundings and the outside of the product in time, resulting in excessively high local temperatures, affecting the operating reliability of the equipment. Utility Model Content

[0005] In order to solve at least one of the above technical problems, the utility model provides a circuit board heat dissipation structure.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] The utility model provides a circuit board heat dissipation structure, comprising:

[0008] A substrate, wherein a receiving space is provided on the substrate;

[0009] The heat dissipation layer is arranged in the accommodating space and fixedly connected to the substrate. The heat dissipation layer includes a heat dissipation portion and a first heat dissipation channel. The first heat dissipation channel is arranged around the periphery of the heat dissipation portion and is filled with a thermal conductor.

[0010] In a possible implementation of the present application, the substrate further includes a second heat dissipation channel, and the second heat dissipation channel is connected to the first heat dissipation channel.

[0011] In a possible implementation of the present application, a heat sink is further included, and at least a portion of the second heat dissipation channel is disposed on the heat sink.

[0012] In a possible implementation of the present application, the first opening of the second heat dissipation channel is provided on one side of the first heat dissipation channel, and the second opening of the second heat dissipation channel is provided on the other side of the first heat dissipation channel.

[0013] In a possible implementation of the present application, the heat dissipation portion is filled with a thermally conductive material.

[0014] In a possible implementation of the present application, the thermally conductive material includes silica gel or metal.

[0015] In a possible implementation of the present application, the heat dissipation portion includes a first surface, and the first surface is used to abut against the electronic component.

[0016] In a possible implementation of the present application, the heat dissipation portion further includes a second surface, and the first surface and the second surface are respectively arranged on two sides of the heat dissipation portion.

[0017] In a possible implementation of the present application, the substrate is made of copper or aluminum.

[0018] Compared with the prior art, the utility model provides a heat dissipation structure for a circuit board, which forms a heat dissipation structure specifically for heat management of the circuit board by providing an accommodation space on the substrate and fixing a heat dissipation layer therein. The heat dissipation part in the heat dissipation layer can directly absorb the heat generated by other components, while the first heat dissipation channel surrounding the circumference provides an additional heat dissipation path. This structure can improve the heat dissipation efficiency and help to quickly dissipate the heat. The thermal conductor filled in the first heat dissipation channel further enhances the heat dissipation effect. The thermal conductor can quickly transfer heat from the heat dissipation part to various parts in the channel, making the heat distribution more uniform and avoiding local overheating. At the same time, the thermal conductor can also reduce thermal resistance and improve the heat transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0020] Figure 1 It is a structural schematic diagram of a circuit board heat dissipation structure provided by the utility model;

[0021] Figure 2 It is a structural schematic diagram of a heat dissipation channel in a circuit board heat dissipation structure provided by the utility model;

[0022] Figure 3 This is another structural schematic diagram of a heat dissipation channel in a circuit board heat dissipation structure provided by the utility model.

[0023] Description of reference numerals:

[0024] 1. Base plate; 11. Accommodating space; 2. Heat dissipation layer; 21. Heat dissipation portion; 22. First heat dissipation channel; 3. Second heat dissipation channel; 31. First opening; 32. Second opening; 4. Heat dissipation element. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0026] The terms "first", "second", etc. in the embodiments of the utility model are only used to distinguish related technical features and do not represent the order of precedence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the present application described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] In the present application, the directions or positional relationships indicated by the terms "upper", "lower", "inner", "middle", "outer", "front", "back", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0028] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0029] The utility model provides a heat dissipation structure for a circuit board, which forms a heat dissipation structure specifically for heat management of the circuit board by providing an accommodation space on a substrate and fixing a heat dissipation layer therein. The heat dissipation portion in the heat dissipation layer can directly absorb the heat generated by other components, while the first heat dissipation channel surrounding the circumference thereof provides an additional heat dissipation path. This structure can improve the heat dissipation efficiency and help to quickly dissipate the heat. The thermal conductor filled in the first heat dissipation channel further enhances the heat dissipation effect. The thermal conductor can quickly transfer heat from the heat dissipation portion to various parts in the channel, making the heat distribution more uniform and avoiding local overheating. At the same time, the thermal conductor can also reduce thermal resistance and improve the heat transfer efficiency. Example

[0030] The utility model provides a circuit board heat dissipation structure, such as Figures 1 to 3 As shown, it includes a substrate 1, on which a accommodating space 11 is provided; a heat dissipation layer 2, which is provided in the accommodating space 11 and fixedly connected to the substrate 1, and the heat dissipation layer 2 includes a heat dissipation portion 21 and a first heat dissipation channel 22, and the first heat dissipation channel 22 is arranged around the circumference of the heat dissipation portion 21, and the first heat dissipation channel 22 is filled with a thermal conductor.

[0031] Such a heat dissipation structure can ensure that the circuit board maintains a low temperature during operation, thereby reducing the risk of performance degradation and failure due to overheating. This not only ensures the stable operation of the equipment, but also extends the service life of the equipment. The heat dissipation structure integrates the heat dissipation layer 2 directly on the substrate 1, without the need for an additional heat dissipation device, making the overall structure more compact. This not only saves space, but also facilitates the lightweight and miniaturized design of the equipment. The heat dissipation structure can be applied to different types of circuit boards, especially those high-performance circuit boards with high heat dissipation requirements. By adjusting the size, shape and type of thermal conductor of the heat dissipation layer 2, precise matching of the heat dissipation requirements of different circuit boards can be achieved.

[0032] like Figure 1 and Figure 2 As shown, the substrate 1 may further include a second heat dissipation channel 3, which is connected to the first heat dissipation channel 22. More specifically, it may further include a heat dissipation element 4, and at least part of the second heat dissipation channel 3 is disposed on the heat dissipation element 4. The second heat dissipation channel 3 is connected to the first heat dissipation channel 22, so that the thermal conductive agent in the first heat dissipation channel 22 can enter the second heat dissipation channel 3 for heat energy exchange, and part or all of the second heat dissipation channel 3 passes through the heat dissipation element 4, which can further improve the heat dissipation effect.

[0033] In this way, by adding a second heat dissipation channel 3 and connecting it with the first heat dissipation channel 22, the technical solution of the circuit board heat dissipation structure further enhances the heat dissipation efficiency. Among them, the second heat dissipation channel 3 is connected with the first heat dissipation channel 22 to form a continuous heat dissipation network. This allows the thermal conductor to flow freely between the two channels, expands the heat dissipation area, and increases the efficiency and effect of heat exchange. The heat dissipation effect is further improved by adding a heat sink 4 and arranging at least part of the second heat dissipation channel 3 therein. The heat sink 4 can usually be made of a high thermal conductivity material, such as metal or special alloy, which can quickly absorb heat from the thermal conductor and dissipate it to the environment. The heat conductor circulates in the two connected heat dissipation channels, which helps to achieve temperature uniformity on the circuit board. This reduces the formation of hot spots (local high temperature areas), thereby improving the overall performance and stability of the circuit board. By adding the second heat dissipation channel 3 and the heat sink 4, the redundancy and reliability of the entire heat dissipation system are improved. Even if there is a problem with the first heat dissipation channel 22 under certain extreme conditions, the second heat dissipation channel 3 can provide additional heat dissipation support to ensure that the circuit board will not overheat. This dual-channel heat dissipation structure also provides greater flexibility and scalability. According to different heat dissipation requirements, the number, position and shape of the heat dissipation elements 4, as well as the type and flow rate of the thermal conductive agent can be flexibly adjusted to achieve the best heat dissipation effect.

[0034] like Figure 2 As shown, more specifically, the first opening 31 of the second heat dissipation channel 3 can be arranged on one side of the first heat dissipation channel 22, and the second opening 32 of the second heat dissipation channel 3 can be arranged on the other side of the first heat dissipation channel 22. In this way, the two openings are arranged on both sides of the first heat dissipation channel 22, which can promote the convection of the thermal conductive agent between the first heat dissipation channel 22 and the second heat dissipation channel 3. It can be understood that when the thermal conductive agent enters the first heat dissipation channel 22 from the second heat dissipation channel 3, it can flow through the first heat dissipation channel 22 more fully. Thermal convection is an important way of heat transfer, which can effectively remove heat from the heat source and transfer the heat to a larger heat dissipation area through the flowing medium (here, the thermal conductive agent). This structure allows the heat dissipation structure to adapt to different circuit board layouts more flexibly. Since the two openings are located on both sides, the position and shape of the heat dissipation structure can be adjusted according to the specific position of the heat source on the circuit board to achieve the best heat dissipation effect.

[0035] like Figure 2 and Figure 3As shown, the heat dissipation part 21 can be filled with a heat-conducting material. More specifically, the heat-conducting material includes silicone or metal. The heat dissipation part 21 can include a first surface, and the first surface is used to abut against the electronic component. More specifically, the heat dissipation part 21 can also include a second surface, and the first surface and the second surface are respectively arranged on both sides of the heat dissipation part 21. When the heat dissipation part 21 is filled with a heat-conducting material, especially when a high-efficiency heat-conducting material such as silicone or metal is used, the heat dissipation effect of the circuit board heat dissipation structure may be further improved. Silicone and metal are both excellent heat-conducting materials, which can quickly transfer the heat generated by the electronic components to the first surface or / and the second surface, and then dissipate it to the environment through the heat dissipation layer 2 and the heat dissipation channel. This efficient heat conduction ability effectively reduces the operating temperature of the electronic components and improves their performance and reliability. By filling with heat-conducting materials, the heat conduction efficiency can be improved. This not only improves the heat dissipation efficiency, but also prolongs the service life of the electronic components. As a soft material, silicone has good fit and adaptability, and can fit tightly on the surface of the electronic components to form a seamless heat conduction interface. Although metal is relatively hard, it can be processed into suitable shapes and sizes to adapt to different electronic components and heat dissipation requirements. The filling of thermally conductive material also enhances the structural stability of the heat dissipation portion 21, enabling it to withstand certain mechanical stresses and vibration shocks. This is of great significance for protecting electronic components from the influence of the external environment. More specifically, when the heat dissipation portion 21 includes a first surface and a second surface, the two surfaces are respectively arranged on both sides of the heat dissipation portion 21, so that heat can be conducted and dissipated from two directions at the same time. This further improves the heat dissipation efficiency and ensures that the electronic components can maintain a low temperature during operation. At the same time, this construction also makes the heat dissipation structure more compact and efficient, providing more flexibility and freedom for the design of the circuit board.

[0036] The substrate 1 in a circuit board heat dissipation structure provided by an embodiment of the utility model can be made of copper or aluminum. In the circuit board heat dissipation structure, the selection of the substrate 1 material is very important for the heat dissipation performance. Copper and aluminum, as two common metal materials, have their own advantages in the manufacture of the circuit board substrate 1. Among them, the thermal conductivity of copper is very high, which means that it can quickly transfer heat from one area on the circuit board to another area, which helps to achieve uniform heat dissipation. Copper has good electrical conductivity, which is an important advantage for circuit boards that require high current conduction. Copper has high mechanical strength and can provide good structural support. Compared with copper, aluminum has a lower density, so the aluminum substrate 1 is relatively lighter, which helps to reduce the weight of the overall device. Although the thermal conductivity of aluminum is slightly lower than that of copper, it still has good thermal conductivity, which is enough to meet the heat dissipation needs of many circuit boards. Aluminum is generally more economical than copper, which makes the aluminum substrate 1 more advantageous in cost control. Aluminum has good corrosion resistance and is suitable for some special environments. In summary, the copper substrate 1 is suitable for scenes with extremely high requirements for heat dissipation and electrical performance due to its excellent thermal and electrical conductivity. Aluminum substrate 1 is more advantageous in some applications due to its light weight, cost-effectiveness and corrosion resistance. When choosing, you need to make a decision based on the specific application scenario, budget and performance requirements.

[0037] Compared with the prior art, the heat dissipation structure of a circuit board provided in an embodiment of the utility model forms a heat dissipation structure specifically for heat management of the circuit board by setting an accommodation space on the substrate and fixing a heat dissipation layer therein. The heat dissipation part in the heat dissipation layer can directly absorb the heat generated by other components, while the first heat dissipation channel surrounding the circumference provides an additional heat dissipation path. This structure can improve the heat dissipation efficiency and help to quickly dissipate the heat. The thermal conductor filled in the first heat dissipation channel further enhances the heat dissipation effect. The thermal conductor can quickly transfer heat from the heat dissipation part to various parts in the channel, making the heat distribution more uniform and avoiding local overheating. At the same time, the thermal conductor can also reduce thermal resistance and improve the heat transfer efficiency.

[0038] The above are only preferred specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A circuit board heat dissipation structure, characterized in that: include: A substrate (1), wherein a receiving space (11) is provided on the substrate (1); A heat dissipation layer (2), the heat dissipation layer (2) being arranged in the accommodating space (11) and fixedly connected to the substrate (1), the heat dissipation layer (2) comprising a heat dissipation portion (21) and a first heat dissipation channel (22), the first heat dissipation channel (22) being arranged around the circumference of the heat dissipation portion (21), and the first heat dissipation channel (22) being filled with a thermal conductive agent.

2. The circuit board heat dissipation structure according to claim 1, characterized in that: The substrate (1) further comprises a second heat dissipation channel (3), wherein the second heat dissipation channel (3) is connected to the first heat dissipation channel (22).

3. The circuit board heat dissipation structure according to claim 2, characterized in that: It also comprises a heat sink (4), and at least a portion of the second heat sink channel (3) is arranged on the heat sink (4).

4. The circuit board heat dissipation structure according to claim 2 or 3, characterized in that: The first opening (31) of the second heat dissipation channel (3) is arranged on one side of the first heat dissipation channel (22), and the second opening (32) of the second heat dissipation channel (3) is arranged on the other side of the first heat dissipation channel (22).

5. The circuit board heat dissipation structure according to claim 1, characterized in that: The heat dissipation portion (21) is filled with heat-conducting material.

6. The circuit board heat dissipation structure according to claim 5, characterized in that: The thermally conductive material includes silica gel or metal.

7. The circuit board heat dissipation structure according to claim 1, characterized in that: The heat dissipation portion (21) comprises a first surface, and the first surface is used for abutting against an electronic component.

8. The circuit board heat dissipation structure according to claim 7, characterized in that: The heat dissipation portion (21) further comprises a second surface, and the first surface and the second surface are respectively arranged on two sides of the heat dissipation portion (21).

9. The circuit board heat dissipation structure according to claim 1, characterized in that: The substrate (1) is made of copper or aluminum.

Images