Shielding cover structure for circuit board

Abstract

The utility model relates to the technical field of shielding cover structures, and discloses a shielding cover structure used for a circuit board, comprising a first cover layer which is a rigid cover body and can shield electromagnetic interference outside the first cover layer; the second cover layer and the first cover layer are arranged in a stacked mode, the second cover layer is arranged on at least one side of the first cover layer and can shield electromagnetic interference outside the second cover layer, the second cover layer comprises a tin plating layer and a base material layer which are arranged in a stacked mode, and the tin plating layer is arranged on the side, away from the first cover layer, of the base material layer; the bonding layer is arranged between the first cover layer and the second cover layer, and the first cover layer is bonded with the base material layer through the bonding layer. According to the shielding case structure for the circuit board, the overall shielding effect of the shielding case structure can be enhanced, the shielding case structure is suitable for an automatic production line, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of shielding cover structures, in particular to a shielding cover structure for a circuit board. Background Art

[0002] At present, the demand for lightweight shielding covers on circuit boards is gradually increasing. In the prior art, shielding films are usually used to shield circuit boards. However, shielding films are flexible and relatively thin, so they are usually installed manually and cannot be used on automated production lines, resulting in low production efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a shielding cover structure for a circuit board, which can be used in an automated production line to improve production efficiency.

[0004] In order to achieve the above object, the utility model provides a shielding cover structure for a circuit board, comprising:

[0005] A first cover layer, which is configured as a rigid cover body and is capable of shielding electromagnetic interference outside the first cover layer;

[0006] A second cover layer is stacked with the first cover layer, and the second cover layer is arranged on at least one side of the first cover layer, and can shield electromagnetic interference outside the second cover layer, and the second cover layer includes a stacked tin-plated layer and a base material layer, and the tin-plated layer is arranged on a side of the base material layer away from the first cover layer;

[0007] The adhesive layer is arranged between the first cover layer and the second cover layer, and the first cover layer is bonded to the base material layer through the adhesive layer.

[0008] In some embodiments of the present application, the shielding cover structure for the circuit board further includes:

[0009] The insulating layer is disposed on the inner side and the outer side of the first cover layer. The insulating layer is disposed on the second cover layer located on the inner side of the first cover layer, and the insulating layer is disposed on the side of the second cover layer away from the first cover layer.

[0010] In some embodiments of the present application:

[0011] The edge of the insulating layer and the edge of the second cover layer connected to the insulating layer form a step structure, so that the inner wall edge of the tin-plated layer of the second cover layer is exposed.

[0012] In some embodiments of the present application:

[0013] A height difference between an edge of the insulating layer and an edge of the tin-plated layer connected to the insulating layer is greater than 0.5 mm.

[0014] In some embodiments of the present application, the shielding cover structure for the circuit board further includes:

[0015] The insulating layer is disposed on the inner side of the first cover layer, the second cover layer is disposed on the second cover layer, and the insulating layer is disposed on a side of the second cover layer away from the first cover layer.

[0016] In some embodiments of the present application:

[0017] The edge of the insulating layer and the edge of the second cover layer form a step structure, so that the inner wall edge of the tin-plated layer is exposed.

[0018] In some embodiments of the present application:

[0019] A height difference between an edge of the insulating layer and an edge of the tin-plated layer connected to the insulating layer is greater than 0.5 mm.

[0020] In some embodiments of the present application, the shielding cover structure for the circuit board further includes:

[0021] The insulating layer is arranged on the outer side of the first cover layer, the second cover layer is arranged on the first cover layer, and the insulating layer is arranged on the side of the first cover layer away from the second cover layer.

[0022] In some embodiments of the present application:

[0023] The thickness of the tin-plated layer is greater than 1.5 um.

[0024] In some embodiments of the present application:

[0025] The thickness of the first cover layer is greater than 18 um.

[0026] The utility model provides a shielding cover structure for a circuit board. Compared with the prior art, the utility model has the following beneficial effects:

[0027] The shielding cover structure for a circuit board of the utility model can form a rigid cover-like structure as a whole by setting a rigid first cover layer to play a supporting role, so as to adapt to the automated production line. In addition, the first cover layer and the second cover layer can both provide a shielding effect, and can also enhance the shielding effect of the shielding cover structure as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic structural diagram of a shielding cover according to an embodiment of the utility model.

[0029] Figure 2 It is a cross-sectional schematic diagram of the shielding cover of the embodiment of the utility model.

[0030] Figure 3 yes Figure 2 A magnified schematic diagram of center A.

[0031] Figure 4 yes Figure 2 A is a schematic diagram of another embodiment.

[0032] Figure 5 yes Figure 2 A is a schematic diagram of another embodiment.

[0033] Figure 6 It is a schematic structural diagram of the second cover layer of an embodiment of the utility model.

[0034] In the figure, 100, shielding cover structure; 1, first cover layer; 2, second cover layer; 3, bonding layer; 4, insulating layer; 21, tin-plated layer; 22, base material layer. DETAILED DESCRIPTION

[0035] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In addition, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0039] For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0040] Please refer to Figure 1 and Figure 2 A shielding cover structure 100 for a circuit board according to a preferred embodiment of the utility model comprises: a first cover layer 1, a second cover layer 2 and an adhesive layer 3.

[0041] The first cover layer 1 is configured as a rigid cover body and is capable of shielding electromagnetic interference outside the first cover layer 1 .

[0042] The second cover layer 2 is stacked with the first cover layer 1, and the second cover layer 2 is arranged on at least one side of the first cover layer 1, which can shield the electromagnetic interference outside the second cover layer 2. The second cover layer 2 includes a stacked tin-plated layer 21 and a base material layer 22. The tin-plated layer 21 is arranged on the side of the base material layer 22 away from the first cover layer 1.

[0043] The adhesive layer 3 is disposed between the first cover layer 1 and the second cover layer 2 , and the first cover layer 1 is bonded to the base material layer 22 via the adhesive layer 3 .

[0044] The first cover layer 1 and the second cover layer 2 are stacked inside and outside, and inside and outside refer to the part covered by the entire shielding cover as the inside and the part not covered as the outside, such as the electronic components are located inside the shielding cover.

[0045] The first cover layer 1 is set as a rigid cover body. The first cover layer 1 can be set as aluminum foil, or glass fiber cloth prepreg, woven cloth prepreg and carbon fiber prepreg. After hot pressing, a rigid structure can be formed. After electroplating, the glass fiber cloth, woven cloth and carbon fiber are prepreg treated. They can form a rigid structure after hot pressing to play a supporting role and also play a shielding role. Compared with aluminum foil, glass fiber cloth prepreg, woven cloth prepreg and carbon fiber prepreg are less likely to be damaged during tinning and have better processability.

[0046] Please refer to Figure 6 The second cover layer 2 is configured as a stacked tin-plated layer 21 and a base layer 22. The base layer 22 can be a nickel-plated copper-plated non-woven fabric, which is a conductive fabric. The tin-plated layer 21 can be soldered on the circuit board through solder paste, and the base layer 22 can play a shielding role. The second cover layer 2 is flexible. The second cover layer 2 is adhered to the first cover layer 1 and supported by the first cover layer 1. The shielding cover forms an integral rigid structure to adapt to the automated production line and improve production efficiency.

[0047] In the prior art, the shielding film is flexible and very thin, so it cannot adapt to the automated production line and needs to be assembled manually. The metal shielding cover in the prior art, although it can adapt to the automated production line, cannot meet the requirements for lightweight.

[0048] In the circuit board with a shielding cover of this embodiment, the first cover layer 1 is set to be rigid to support the second cover layer 2. The flexible material of the second cover layer 2 can also have a fixed geometric shape, so that the installation process of the shielding cover can adapt to the automated production line and reduce the weight of the shielding cover itself to meet the requirements of lightweight.

[0049] The second cover layer 2 is a conductive cloth electroplated layer to play a shielding role. However, at the microscopic level, the metal plating on the conductive cloth is actually not continuous, so the shielding effect is worse than that of pure metal materials such as aluminum foil. In this embodiment, the first cover layer 1 is also configured to have a shielding effect. The first cover layer 1 and the second cover layer 2 are double-layered to ensure the shielding effect of the shielding cover.

[0050] In some embodiments, please refer to Figure 3 The shielding cover structure 100 for a circuit board also includes an insulating layer 4. A second cover layer 2 is disposed on the inner and outer sides of the first cover layer 1. The insulating layer 4 is disposed on the second cover layer 2 located on the inner side of the first cover layer 1, and the insulating layer 4 is disposed on the side of the second cover layer 2 facing away from the first cover layer 1.

[0051] The provision of the insulating layer 4 can prevent a short circuit between the shielding cover and the electronic components on the circuit board.

[0052] In this case, the first cover layer 1 is between the second cover layer 2 on its inner side and the outer side, and the second cover layer 2 is arranged as two layers, which can improve the shielding effect on the one hand, and improve the welding firmness with the solder paste on the other hand, so that the shielding cover can be more firmly soldered on the circuit board.

[0053] The insulating layer 4 is located at the innermost side of the shielding case. In this case, if the second cover layer 2 located at the inner layer wants to be soldered, a part of the tinned layer 21 needs to be exposed, and cannot be completely covered by the insulating layer 4. Therefore, the edge of the insulating layer 4 and the edge of the second cover layer 2 connected to the insulating layer 4 are set to form a stepped structure, so that the inner wall edge of the tinned layer 21 of the second cover layer 2 is exposed and solder paste is applied.

[0054] Specifically, the height difference between the edge of the insulating layer 4 and the edge of the tin-plated layer 21 connected to the insulating layer 4 is greater than 0.5 mm, which is the distance indicated by L in the figure. The protruding part of the tin-plated layer 21 can be soldered with solder paste.

[0055] In some embodiments, please refer to Figure 4 The second cover layer 2 is arranged on the inner side of the first cover layer 1 , the insulating layer 4 is arranged on the second cover layer 2 , and the insulating layer 4 is arranged on the side of the second cover layer 2 facing away from the first cover layer 1 .

[0056] The second cover layer 2 is only provided with one layer, so the soldering of the shielding cover and the circuit board is achieved through the tin-plated layer 21 on the second cover layer 2. In order to ensure the connection between the shielding cover and the circuit board, a part of the tin-plated layer 21 of the second cover layer 2 must be exposed and cannot be completely covered by the insulating layer 4. Therefore, the edge of the insulating layer 4 and the edge of the second cover layer 2 are provided to form a stepped structure, so that the inner wall edge of the tin-plated layer 21 is exposed and solder paste is applied.

[0057] Specifically, the height difference between the edge of the insulating layer 4 and the edge of the tin-plated layer 21 connected to the insulating layer 4 is greater than 0.5 mm, and the protruding portion of the tin-plated layer 21 can be soldered with solder paste.

[0058] In some embodiments, please refer to Figure 5 A second cover layer 2 is arranged outside the first cover layer 1 , an insulating layer 4 is arranged on the first cover layer 1 , and the insulating layer 4 is arranged on a side of the first cover layer 1 away from the second cover layer 2 .

[0059] Since the insulating layer 4 is disposed on the first cover layer 1 , the insulating layer 4 will not interfere with the soldering between the tin-plated layer 21 on the second cover layer 2 and the solder paste.

[0060] In some embodiments, the thickness of the tin-plated layer 21 is greater than 1.5 um.

[0061] When this condition is met, the soldering of the tin-plated layer 21 and the solder paste can provide sufficient support for the overall shielding cover.

[0062] In some embodiments, the thickness of the first cover layer 1 is greater than 18 um.

[0063] Since the first cover layer 1 needs to support the second cover layer 2 and is the supporting structure of the entire shielding cover, there are certain requirements for thickness. When the thickness of the first cover layer 1 is greater than 18um, the first cover layer 1 can play a sufficient supporting role.

[0064] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A shielding cover structure for a circuit board, characterized in that: include: A first cover layer, which is configured as a rigid cover body and is capable of shielding electromagnetic interference outside the first cover layer; A second cover layer is stacked with the first cover layer, and the second cover layer is arranged on at least one side of the first cover layer, and can shield electromagnetic interference outside the second cover layer, and the second cover layer includes a stacked tin-plated layer and a base material layer, and the tin-plated layer is arranged on a side of the base material layer away from the first cover layer; The adhesive layer is arranged between the first cover layer and the second cover layer, and the first cover layer is bonded to the base material layer through the adhesive layer.

2. The shielding cover structure for a circuit board according to claim 1, characterized in that: Also includes: The insulating layer is disposed on the inner side and the outer side of the first cover layer. The insulating layer is disposed on the second cover layer located on the inner side of the first cover layer, and the insulating layer is disposed on the side of the second cover layer away from the first cover layer.

3. The shielding cover structure for a circuit board according to claim 2, characterized in that: The edge of the insulating layer and the edge of the second cover layer connected to the insulating layer form a step structure, so that the inner wall edge of the tin-plated layer of the second cover layer is exposed.

4. The shielding cover structure for a circuit board according to claim 3, characterized in that: A height difference between an edge of the insulating layer and an edge of the tin-plated layer connected to the insulating layer is greater than 0.5 mm.

5. The shielding cover structure for a circuit board according to claim 1, characterized in that: Also includes: The insulating layer is disposed on the inner side of the first cover layer, the second cover layer is disposed on the second cover layer, and the insulating layer is disposed on a side of the second cover layer away from the first cover layer.

6. The shielding cover structure for a circuit board according to claim 5, characterized in that: The edge of the insulating layer and the edge of the second cover layer form a step structure, so that the inner wall edge of the tin-plated layer is exposed.

7. The shielding cover structure for a circuit board according to claim 6, characterized in that: A height difference between an edge of the insulating layer and an edge of the tin-plated layer connected to the insulating layer is greater than 0.5 mm.

8. The shielding cover structure for a circuit board according to claim 1, characterized in that: Also includes: The insulating layer is arranged on the outer side of the first cover layer, the second cover layer is arranged on the first cover layer, and the insulating layer is arranged on the side of the first cover layer away from the second cover layer.

9. The shielding cover structure for a circuit board according to claim 1, characterized in that: The thickness of the tin-plated layer is greater than 1.5 um.

10. The shielding cover structure for a circuit board according to claim 1, characterized in that: The thickness of the first cover layer is greater than 18 um.

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