Heat dissipation device and electronic equipment

Abstract

The utility model discloses a heat dissipation device and electronic equipment. The heat dissipation device comprises a shell and a flow guide assembly. The shell is provided with an accommodating cavity. At least part of the flow guide assembly is located in the containing cavity, and the flow guide assembly is used for guiding the cooling medium to flow into the containing cavity. According to the heat dissipation device and the electronic equipment, the flow guide assembly can guide the cooling medium in the flow guide piece to flow into the containing cavity, so that the cooling medium can be prevented from splashing in the process of entering the containing cavity, the loss of the cooling medium is reduced, and the cooling and heat dissipation effects of the heat dissipation device are ensured.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and more specifically, to a heat dissipation device and an electronic device. Background Art

[0002] In the related art, the device to be cooled, such as an energy storage module or a control module, etc., will generate heat during operation. If the heat dissipation treatment is not carried out in time, the device to be cooled may be overheated and damaged, affecting the performance and service life of the device to be cooled. Usually, the device to be cooled can be placed in a housing cavity of a shell, and a cooling medium is injected into the housing cavity so that the cooling medium soaks the device to be cooled, and the heat on the device to be cooled is taken away by the circulating flow of the cooling medium to achieve immersion cooling of the device to be cooled. However, in the process of injecting the cooling medium into the housing cavity, the cooling medium is prone to splash in different directions, that is, the cooling medium is prone to splash outside the housing cavity, thereby causing the loss of the cooling medium and affecting the cooling effect of the device to be cooled. Utility Model Content

[0003] Embodiments of the present application provide a heat dissipation device and an electronic device.

[0004] The heat dissipation device of the embodiment of the present application comprises a housing and a flow guide assembly. The housing is provided with a receiving cavity. At least part of the flow guide assembly is located in the receiving cavity, and the flow guide assembly is used to guide the cooling medium to flow into the receiving cavity.

[0005] In some embodiments, the guide assembly includes a guide member and at least one guide member, the guide member is at least partially located in the accommodating cavity and is provided with a guide hole, the guide member includes a first end and a second end opposite to each other, the first end of the guide member is connected to the guide hole, the second end of the guide member extends to the inner side of the side wall of the shell, and the guide member is used to guide the cooling medium to flow from the first end of the guide member to the second end of the guide member through the guide hole and flow into the accommodating cavity.

[0006] In some embodiments, in the height direction of the shell, the height of the first end of the guide member is higher than the height of the second end of the guide member.

[0007] In some embodiments, the second end of the guide member is connected to the inner side of the side wall of the shell.

[0008] In certain embodiments, at least one connecting member is disposed on the inner side of the side wall of the shell, and the second end of the flow guide member is connected to the side wall of the shell through the connecting member.

[0009] In some embodiments, the flow guide assembly includes at least two flow guide members; at least two flow guide members are spaced apart from each other around the flow guide member.

[0010] In some embodiments, the guide member is located at the center of the accommodating cavity, and the second end of the guide member is evenly distributed around the center of the accommodating cavity.

[0011] In some embodiments, in the direction from the first end of the guide member to the second end of the guide member, the length difference between any two of the guide members is less than a preset length threshold.

[0012] In some embodiments, all of the flow guides have the same length.

[0013] In some embodiments, the guide member is a wire, and there is a gap between the first end of the guide member and the inner wall of the drainage hole.

[0014] In some embodiments, the guide member is further provided with a cavity connected to the guide hole, the guide member is a pipe, the pipe is provided with a hollow cavity passing through the first end and the second end, and there is a gap between the first end of the guide member and the inner wall of the guide hole.

[0015] In some embodiments, the guide member is also provided with a cavity connected to the drainage hole. The guide member is a pipe, and the pipe is provided with a hollow cavity passing through the first end and the second end. The first end of the guide member and the inner wall of the drainage hole are sealed without a gap, and the hollow cavity is connected to the cavity.

[0016] In some embodiments, a through hole is provided on the shell, the through hole passes through the shell and is in communication with the accommodating cavity, and the through hole is used for allowing the cooling medium in the accommodating cavity to flow out of the accommodating cavity.

[0017] In some embodiments, the through hole is provided on the side wall of the shell, and the bottom wall of the shell is recessed in a direction away from the center of the accommodating cavity to form a groove, and the groove is communicated with the through hole.

[0018] In some embodiments, the guide member also includes an inlet; the heat dissipation device also includes a first pipe assembly and a second pipe assembly, the first pipe assembly is connected to the inlet, the first pipe assembly is used for allowing the cooling medium to flow into the inlet, and the second pipe assembly is connected to the through hole of the shell, and the second pipe assembly is used for allowing the cooling medium to flow out of the through hole.

[0019] In some embodiments, the first pipe assembly includes a first pipe and a second pipe, the first pipe is used to transport the cooling medium, one end of the second pipe is connected to the first pipe, and the other end is connected to the inlet, and the second pipe is used to allow the cooling medium to flow into the inlet. The second pipe assembly includes a third pipe, the third pipe is connected to the through hole, and the third pipe is used to allow the cooling medium to flow out of the through hole.

[0020] The electronic device described in the embodiment of the present application includes the heat dissipation device and the device to be cooled described in any of the above embodiments, and the device to be cooled is accommodated in the accommodating cavity.

[0021] In some embodiments, in the height direction of the shell, the height of the shell is greater than the height of the device to be cooled.

[0022] In certain embodiments, the device to be cooled includes a housing and a functional module loaded in the housing; the guide member is disposed on the top of the housing, and the guide member of the guide assembly of the heat dissipation device is spaced apart from the housing.

[0023] In certain embodiments, the device to be cooled includes a battery pack or a control device for controlling a battery pack.

[0024] In some embodiments, the housing includes a box body and a cover body, the box body and the cover body are connected to form the accommodating cavity together. The guide member of the guide assembly of the heat dissipation device is arranged on the cover body, the inlet of the guide member is located outside the accommodating cavity, the guide hole of the guide member is located inside the accommodating cavity, and the guide member is spaced from the device to be cooled.

[0025] In certain embodiments, the electronic device is a vehicle, a drone, an energy storage device, or a battery pack, and the device to be cooled is a battery module or a control module that controls the battery module.

[0026] In the heat dissipation device and electronic device of the embodiments of the present application, the guide member is connected to the guide member, and the guide member can guide the cooling medium to flow into the accommodating cavity, thereby preventing the cooling medium from splashing when entering the accommodating cavity, thereby reducing the loss of the cooling medium and ensuring the cooling and heat dissipation effect of the heat dissipation device.

[0027] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0029] Figure 1 is a schematic diagram of the three-dimensional structure of a heat dissipation device in some embodiments of the present application;

[0030] Figure 2 yes Figure 1 A schematic structural diagram of a flow guide assembly in a heat dissipation device shown;

[0031] Figure 3 yes Figure 1 A schematic diagram of a part of the structure of the heat dissipation device shown;

[0032] Figure 4 is a three-dimensional exploded schematic diagram of an electronic device according to some embodiments of the present application;

[0033] Figure 5 It is a schematic three-dimensional exploded view of electronic devices according to other embodiments of the present application.

[0034] Description of main component symbols:

[0035] Electronic equipment 1000;

[0036] Heat dissipation device 100; device to be cooled 200, housing 210, functional module 230;

[0037] Shell 10, accommodating cavity 101, side wall 103, bottom wall 105, through hole 11, groove 13, box body 15, cover body 17, connecting member 19;

[0038] The flow guide assembly 20, the flow guide member 21, the flow guide hole 211, the inlet 213, the flow guide member 23, the first end 231, and the second end 233;

[0039] The first pipe assembly 30 , the first pipe 31 , and the second pipe 33 ; the second pipe assembly 40 , and the third pipe 41 . DETAILED DESCRIPTION

[0040] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0041] In the description of the present application, it should be understood that the terms "center", "length", "up", "down", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0043] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] See also Figure 1 and Figure 2 The heat dissipation device 100 of the embodiment of the present application includes a housing 10 and a flow guide assembly 20. The housing 10 is provided with a receiving cavity 101. At least part of the flow guide assembly 20 is located in the receiving cavity 101, and the flow guide assembly 20 is used to guide the cooling medium to flow into the receiving cavity 101.

[0046] The material of the housing 10 includes but is not limited to metal materials and non-metal materials, wherein metal materials include but are not limited to aluminum, iron, steel or aluminum alloy, and non-metal materials include but are not limited to plastic. In one example, the housing 10 can be made of metal materials, for example, the housing 10 can be made of aluminum alloy materials, thereby improving the structural strength of the housing 10, preventing the housing 10 from being damaged by collision during the operation of the heat dissipation device 100, and improving the stability and reliability of the operation of the heat dissipation device 100. In another example, the housing 10 can be made of non-metal materials, thereby making the weight of the housing 10 lighter, thereby facilitating the lightweighting of the heat dissipation device 100.

[0047] In some embodiments, the housing 10 is provided with an opening communicating with the accommodating chamber 101, and the opening is in an open state, that is, the accommodating chamber 101 is in an open state. Thus, on the one hand, it is convenient to take and place the device 200 to be cooled in the accommodating chamber 101, thereby improving the assembly efficiency; on the other hand, the accommodating chamber 101 in the open state is conducive to the cooling medium in the device 200 to be cooled ( Figure 4 The heat dissipation during cooling (as shown) can further improve the heat dissipation effect of the heat dissipation device 100.

[0048] In other embodiments, the housing 10 includes a box body 15 and a cover body 17, and the box body 15 and the cover body 17 are connected to form a receiving chamber 101, so that the possibility of leakage of the cooling medium in the receiving chamber 101 can be reduced, the loss of the cooling medium can be reduced, and the heat dissipation effect of the heat dissipation device 100 can be ensured. In one example, the housing 10 and the cover body 17 can be combined together in a detachable connection manner, and the detachable connection manner includes but is not limited to a threaded connection or a snap connection. In another example, the housing 10 and the cover body 17 can be combined together in a non-detachable connection manner, and the non-detachable connection manner includes but is not limited to welding or bonding.

[0049] In the heat dissipation device 100 of the embodiment of the present application, the guide component 20 can guide the cooling medium to flow into the accommodating cavity 101, thereby preventing the cooling medium from splashing when entering the accommodating cavity 101, thereby reducing the loss of the cooling medium and ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0050] The heat dissipation device 100 is further described below with reference to the accompanying drawings.

[0051] See also Figure 1 and Figure 2In some embodiments, the guide assembly 20 includes a guide member 21 and at least one guide member 23. The guide member 21 is at least partially located in the accommodating cavity 101 and is provided with a guide hole 211. The guide member 23 includes a first end 231 and a second end 233 opposite to each other. The first end 231 of the guide member 23 is connected to the guide hole 211, and the second end 233 of the guide member 23 extends to the inner side of the side wall 103 of the shell 10. The guide member 23 is used to guide the cooling medium to flow from the first end 231 of the guide member 23 to the second end 233 of the guide member 23 through the guide hole 211, and then flow into the accommodating cavity 101.

[0052] In the embodiment of the present application, the cooling medium can flow to the first end 231 of the guide member 23 through the guide hole 211. Under the guidance of the guide member 23, the cooling medium flows from the first end 231 of the guide member 23 to the second end 233 of the guide member 23 and flows into the accommodating chamber 101. This can prevent the cooling medium from splashing during the process of entering the accommodating chamber 101, thereby reducing the loss of the cooling medium. It should be noted that in some embodiments, the quantitative relationship between the guide holes 211 and the guide members 23 can be one-to-one, many-to-one, or one-to-many, that is, one guide hole 211 corresponds to one guide member 23, multiple guide holes 211 correspond to one guide member 23, or one guide hole 211 corresponds to multiple guide members 23. In the embodiment of the present application, only one guide hole 211 corresponds to one guide member 23 as an example for explanation.

[0053] The cooling medium includes but is not limited to water, a coolant or a cooling gas, etc. The coolant includes but is not limited to ethylene glycol, propylene glycol, a fluorinated liquid or a synthetic oil, etc. The cooling gas includes but is not limited to ammonia or hydrogen, etc. In the embodiment of the present application, only the cooling medium including water or a coolant is used as an example for description.

[0054] In some embodiments, in the height direction H of the housing 10 , the height of the first end 231 of the guide member 23 is higher than the height of the second end 233 of the guide member 23 .

[0055] Specifically, in some embodiments, the cooling medium can flow from the first end 231 of the guide member 23 to the second end 233 of the guide member 23 under the action of gravity. In this way, the heat dissipation device 100 does not need to set up an additional pump or other power device to drive the cooling medium to flow from the first end 231 of the guide member 23 to the second end 233 of the guide member 23. On the one hand, it can ensure the guiding effect of the guide member 23 on the cooling medium and prevent the cooling medium from splashing when entering the accommodating cavity 101. On the other hand, it can simplify the structure of the heat dissipation device 100 and reduce the production cost of the heat dissipation device 100.

[0056] In the heat dissipation device 100 of the embodiment of the present application, the first end 231 of the guide member 23 is connected to the drainage hole 211, and the second end 233 of the guide member 23 extends to the inner side of the side wall 103 of the shell 10, and the guide member 23 can guide the cooling medium flowing out of the drainage hole 211 from the first end 231 of the guide member 23 to the second end 233 of the guide member 23, and flow into the accommodating cavity 101, thereby preventing the cooling medium from splashing when entering the accommodating cavity 101, thereby reducing the loss of the cooling medium and ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0057] The heat dissipation device 100 is further described below with reference to the accompanying drawings.

[0058] See also Figure 1 In some embodiments, the flow guide assembly 20 includes at least two flow guides 23. Thus, the at least two flow guides 23 can jointly guide the cooling medium to flow into the accommodating cavity 101, so that the cooling medium can quickly fill the accommodating cavity 101, ensuring that the heat dissipation device 100 treats the cooling device 200 ( Figure 4 The cooling efficiency is shown in Figure 2.

[0059] If at least two guide members 23 are not spaced apart around the guide member 21, the cooling media on the two adjacent guide members 23 may come into contact and converge during the flow of the cooling media along the guide member 23, thereby causing the cooling media to directly fall off the guide member 23 and fall into the accommodating chamber 101. In this case, the cooling media falling into the accommodating chamber 101 will splash, thereby causing the loss of the cooling media and affecting the heat dissipation effect of the heat dissipation device 100. In some embodiments, at least two guide members 23 are spaced apart around the guide member 21, thereby, during the flow of the cooling media along the guide member 23, the cooling media on the two adjacent guide members 23 do not affect each other, that is, the cooling media on the two adjacent guide members 23 will not come into contact and cause the cooling media to converge, thereby preventing the cooling media from directly falling off the guide member 23 and falling into the accommodating chamber 101 and splashing, thereby reducing the loss of the cooling media and ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0060] See also Figure 1 and Figure 2 In some embodiments, the guide member 21 is located at the center of the accommodating chamber 101, and the second end 233 of the guide member 23 is evenly distributed around the center of the accommodating chamber 101, so that the water flow can flow to each position of the accommodating chamber 101 more evenly, preventing the cooling medium from being partially uneven in the accommodating chamber 101, for example, the cooling medium amount in some areas of the accommodating chamber 101 is too much, while the cooling medium amount in other areas is too little, thereby improving the cooling medium to the cooling device 200 ( Figure 4The uniformity of cooling (as shown) ensures the cooling effect of the heat dissipation device 100.

[0061] In some embodiments, in the direction from the first end 231 of the guide member 23 to the second end 233 of the guide member 23, the length difference between any two guide members 23 is less than a preset length threshold, so that the flow paths of the cooling medium on any two guide members 23 are roughly the same, thereby ensuring that the speed and flow rate of the cooling medium flowing from the guide member 23 into the accommodating cavity 101 are relatively uniform on the one hand, which is beneficial to uniformly distribute the cooling medium in the accommodating cavity 101 and improve the uniformity of cooling the cooling device 200 to be cooled by the cooling medium; on the other hand, it can allow processing errors of the guide member 23 and improve the processing efficiency of the guide member 23.

[0062] It should be noted that, in some embodiments, the preset length threshold may be a critical value for determining whether the length difference between any two flow guides 23 is too large. In the embodiment of the present application, the length difference between any two flow guides 23 is less than the preset length threshold, that is, the length difference between any two flow guides 23 is small, in other words, the lengths of any two flow guides 23 may be substantially the same.

[0063] In other embodiments, the lengths of all the guide members 23 are the same, which can ensure that the speed and flow rate of the cooling medium flowing from the guide members 23 into the accommodating cavity 101 are relatively uniform, which is beneficial to uniformly distribute the cooling medium in the accommodating cavity 101, improve the uniformity of cooling the cooling device 200 to be cooled by the cooling medium, and ensure the cooling effect of the heat dissipation device 100.

[0064] Please continue reading Figure 1 and Figure 2 In some embodiments, the guide member 23 is a thread, and there is a gap between the first end 231 of the guide member 23 and the inner wall of the drainage hole 211. It should be noted that in some embodiments, the thread can be made of a hydrophilic material, for example, the thread can be made of at least one of hydrophilic materials such as spandex, nylon, polyurethane and polyester.

[0065] Specifically, in some embodiments, when the cooling medium flows out through the guide hole 211, the cooling medium can flow from the first end 231 of the guide member 23 to the second end 233 of the guide member 23, and flow into the accommodating cavity 101, thereby preventing the cooling medium from splashing during the process of entering the accommodating cavity 101, reducing the loss of the cooling medium, and ensuring the cooling and heat dissipation effect of the heat dissipation device 100. In one example, when the guide member 23 is a wire, the first end 231 of the guide member 23 can be directly connected to a portion of the inner wall of the guide hole 211. In another example, when the guide member 23 is a wire, the first end 231 of the guide member 23 can penetrate the guide hole 211, extend into the inner cavity, and connect with the side wall of the inner cavity.

[0066] In other embodiments, the guide member 23 is a pipe, and the pipe has a hollow cavity that passes through the first end 231 and the second end 233 of the guide member 23. It should be noted that in some embodiments, the pipe can be made of materials such as plastic, rubber, glass or mica.

[0067] In some embodiments, the flow guide 21 is further provided with a cavity connected to the flow guide hole 211. There is a gap between the first end 231 of the flow guide 23 and the inner wall of the flow guide hole 211, so that when the cooling medium flows out of the cavity through the flow guide hole 211, the cooling medium can flow along the peripheral wall of the pipe, and / or the cooling medium can flow into the accommodating cavity 101 along the hollow cavity, thereby preventing the cooling medium from splashing during the process of entering the accommodating cavity 101, reducing the loss of the cooling medium, and ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0068] In other embodiments, the first end 231 of the guide member 23 is sealed without a gap against the inner wall of the drainage hole 211, and the hollow cavity is connected to the cavity body. Thus, when the cooling medium flows out of the cavity body through the drainage hole 211, the cooling medium can flow into the accommodating cavity 101 along the hollow cavity, thereby preventing the cooling medium from splashing when entering the accommodating cavity 101, reducing the loss of the cooling medium, and ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0069] See also Figures 1 to 3 In some embodiments, the second end 233 of the guide member 23 is connected to the inner side of the side wall 103 of the shell 10, so that the second end 233 of the guide member 23 is fixed relative to the shell 10 in the accommodating cavity 101. Compared with the case where the second end 233 of the guide member 23 is not connected to the inner side of the side wall 103 of the shell 10, the guide member 23 has better guiding performance for the cooling medium, so that the distribution of the cooling medium in the accommodating cavity 101 can be more controllable, thereby improving the cooling medium to the cooling device 200 ( Figure 4 The uniformity of cooling (as shown) ensures the heat dissipation effect of the heat dissipation device 100.

[0070] Further, in some embodiments, at least one connector 19 is provided on the inner side of the side wall 103 of the housing 10, and the second end 233 of the flow guide 23 is connected to the side wall 103 of the housing 10 through the connector 19. It should be noted that, in some embodiments, the quantitative relationship between the connector 19 and the flow guide 23 is one-to-one or one-to-many, that is, one connector 19 corresponds to one flow guide 23, or one connector 19 corresponds to multiple flow guides 23. In the embodiments of the present application, only one connector 19 corresponding to one flow guide 23 is used as an example for description.

[0071] In some embodiments, when the flow guide 23 is a wire, the connector 19 may be a wire buckle, which is disposed on the inner side of the side wall 103 of the housing 10, and the second end 233 of the flow guide 23 is connected to the wire buckle. In other embodiments, when the flow guide 23 is a pipe, the connector 19 may be a clamp, which is disposed on the inner side of the side wall 103 of the housing 10, and the second end 233 of the flow guide 23 is connected to the clamp. It can be understood that the specific form of the connector 19 in the above embodiment is only an exemplary description. In other embodiments, the connector 19 may also be in other forms, which are not described one by one here.

[0072] See also Figure 1 and Figure 3 In some embodiments, a through hole 11 is provided on the shell 10 , and the through hole 11 passes through the shell 10 and is connected to the accommodating cavity 101 . The through hole 11 is used to allow the cooling medium in the accommodating cavity 101 to flow out of the accommodating cavity 101 .

[0073] Specifically, in some embodiments, when the cooling medium flows into the accommodating chamber 101 through the flow guide assembly 20, the cooling medium can gradually fill the accommodating chamber 101 to achieve cooling of the device to be cooled 200 ( Figure 4 The immersion cooling method of the heat dissipation device 100 is shown in FIG. 1 , that is, the device to be cooled 200 can be completely immersed in the accommodating chamber 101, and the cooling medium can flow out of the accommodating chamber 101 through the flow guide component 20, thereby the cooling medium can directly contact the device to be cooled 200 and circulate in the accommodating chamber 101, so as to more quickly remove the heat generated by the device to be cooled 200 and improve the heat dissipation efficiency of the heat dissipation device 100. In addition, the immersion cooling method can also isolate the device to be cooled 200 from contact with the air, reduce the possibility of combustion of the device to be cooled 200, and improve the safety of the device to be cooled 200.

[0074] In some embodiments, the through hole 11 is provided on the side wall 103 of the housing 10, and the bottom wall 105 of the housing 10 is recessed in a direction away from the center of the accommodating cavity 101 to form a groove 13, and the groove 13 is connected to the through hole 11. The provision of the groove 13 can form a low-lying area on the bottom wall 105 of the housing 10, so that the cooling medium in the accommodating cavity 101 can flow to the low-lying area under the action of gravity and flow out through the through hole 11 connected to the groove 13, thereby preventing the cooling medium from being unable to flow out of the accommodating cavity 101 and forming dead water on the bottom wall 105 of the housing 10, thereby ensuring the circulation of the cooling medium and improving the heat dissipation effect of the heat dissipation device 100.

[0075] See also Figures 1 to 3In some embodiments, the flow guide 21 further includes an inlet 213. The heat dissipation device 100 further includes a first pipe assembly 30 and a second pipe assembly 40. The first pipe assembly 30 is connected to the inlet 213, and the first pipe assembly 30 is used to allow the cooling medium to flow into the inlet 213. The second pipe assembly 40 is connected to the through hole 11 of the shell 10, and the second pipe assembly 40 is used to allow the cooling medium to flow out of the through hole 11. It should be noted that, in some embodiments, the first pipe assembly 30 and the second pipe assembly 40 can be made of insulating materials, so as to improve the safety performance of the heat dissipation device 100. Among them, the insulating material includes but is not limited to plastic, rubber, glass or mica.

[0076] Specifically, in some embodiments, the inlet 213 is connected to the inner cavity. When the cooling medium in the first pipe assembly 30 flows into the inner cavity through the inlet 213, the cooling medium can flow out of the inner cavity through the drainage hole 211 and flow into the accommodating cavity 101 through the flow guide assembly 20; the cooling medium in the accommodating cavity 101 can flow into the second pipe assembly 40 through the through hole 11, so that the cooling medium can be treated by the cooling device 200 ( Figure 4 Circulation cooling (as shown).

[0077] In some embodiments, the first pipe assembly 30 and the second pipe assembly 40 can be connected through a cooling device, and the cooling device can cool the cooling medium. Specifically, the second pipe assembly 40 is connected to the input end of the cooling device, and the first pipe assembly 30 is connected to the output end of the cooling device, so that the second pipe assembly 40 can transport the cooling medium after cooling the cooling device 200 into the cooling device, so that the cooling device cools the cooling medium, and the first pipe assembly 30 can transport the cooled cooling medium to the inlet 213. It should be noted that in some embodiments, the cooling device includes but is not limited to a chiller or a liquid-cooled air conditioner.

[0078] Further, in some embodiments, the first pipe assembly 30 includes a first pipe 31 and a second pipe 33, the first pipe 31 is used to transport the cooling medium, one end of the second pipe 33 is connected to the first pipe 31, and the other end is connected to the inlet 213, and the second pipe 33 is used for the cooling medium to flow into the inlet 213. The second pipe assembly 40 includes a third pipe 41, the third pipe 41 is connected to the through hole 11, and the third pipe 41 is used for the cooling medium to flow out of the through hole 11.

[0079] Specifically, in some embodiments, when the cooling medium flows into the second pipe 33 through the first pipe 31, the cooling medium in the second pipe 33 can flow into the inner cavity through the inlet 213, and flow into the accommodating cavity 101 through the guide component 20; the cooling medium in the accommodating cavity 101 can flow into the third pipe 41 through the through hole 11, thereby realizing the circulating cooling of the cooling device 200 to be cooled by the cooling medium.

[0080] More specifically, in some embodiments, the second pipe assembly 40 may further include a fourth pipe (not shown), the fourth pipe is used to transport the cooling medium, one end of the third pipe 41 is connected to the through hole 11, and the other end is connected to the fourth pipe. It can be understood that in some embodiments, the fourth pipe can be connected to the input end of the cooling device, and the first pipe 31 can be connected to the output end of the cooling device.

[0081] See also Figure 1 , and combined with Figure 4 or Figure 5 The electronic device 1000 of the embodiment of the present application includes the heat dissipation device 100 and the device to be cooled 200 of any of the above embodiments, and the device to be cooled 200 is accommodated in the accommodating cavity 101.

[0082] In the electronic device 1000 of the embodiment of the present application, the guide component 20 can guide the cooling medium to flow into the accommodating cavity 101, thereby preventing the cooling medium from splashing when entering the accommodating cavity 101, thereby reducing the loss of the cooling medium and ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0083] See also Figure 1 , and combined with Figure 4 or Figure 5 In some embodiments, in the height direction H of the housing 10, the height of the housing 10 is greater than the height of the device to be cooled 200, so that when the cooling medium flows into the accommodating chamber 101, the cooling medium can completely cover the device to be cooled 200, so that the device to be cooled 200 can be cooled in all directions, thereby improving the heat dissipation effect of the heat dissipation device 100 on the device to be cooled 200. Moreover, after the cooling medium completely covers the device to be cooled 200, the cooling medium may still not fill the accommodating chamber 101, so that the possibility of the cooling medium overflowing from the accommodating chamber 101 can be reduced.

[0084] Please combine Figure 4 In some embodiments, the device to be cooled 200 includes a housing 210 and a functional module 230 loaded in the housing 210. The flow guide 21 is disposed on the top of the housing 210, and the flow guide 23 is spaced from the housing 210. It is understood that during the normal operation of the device to be cooled 200, the functional module 230 can generate heat.

[0085] Specifically, in some embodiments, when the cooling medium flows from the first end 231 of the guide member 23 to the second end 233 of the guide member 23 and flows into the accommodating chamber 101, the cooling medium and the functional module 230 can perform non-contact heat exchange in the accommodating chamber 101, that is, the cooling medium can cool and dissipate heat to the functional module 230 through the housing 210, thereby preventing the heat generated by the functional module 230 from accumulating and causing the functional module 230 to be overheated and damaged, thereby ensuring the normal operation of the functional module 230. The guide member 23 is spaced from the housing 210, so that when the cooling medium flows along the guide member 23, the cooling medium will not be disturbed by the housing 210 and will directly fall into the accommodating chamber 101, thereby preventing the cooling medium from sputtering when entering the accommodating chamber 101, reducing the loss of the cooling medium, and thereby ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0086] In some embodiments, the device to be cooled 200 may be a battery pack, in which case the electronic device 1000 may be a battery cabinet, and the functional module 230 may be a battery module in the battery pack. In other embodiments, the device to be cooled 200 may be a control device for controlling a battery pack, in which case the electronic device 1000 may be a battery cabinet, and the functional module 230 may be a controller in the control device.

[0087] It should be noted that, in certain embodiments, when the device to be cooled 200 is a battery pack, the device to be cooled 200 may also include a positive electrode terminal 250 and a negative electrode terminal 270. The positive electrode terminal 250 and the negative electrode terminal 270 are both arranged on the top of the outer shell 210, and pass through the outer shell 210 to be electrically connected to the functional module 230 (battery module). This can facilitate the electrical connection between the battery pack and external devices (such as other batteries including control devices, etc.), thereby improving the assembly efficiency of the electronic device 1000.

[0088] In some embodiments, the flow guide 21 and the housing 210 may be connected together in a detachable manner, including but not limited to threaded connection or snap connection, etc. In other embodiments, the flow guide 21 and the housing 210 may be connected together in a non-detachable manner, including but not limited to welding or bonding, etc.

[0089] Please combine Figure 5 In some embodiments, the guide member 21 is disposed on the cover body 17, the inlet 213 of the guide member 21 is located outside the accommodating cavity 101, the guide hole 211 of the guide member 21 is located inside the accommodating cavity 101, and the guide member 23 is spaced from the device to be cooled 200.

[0090] Specifically, in some embodiments, when the cooling medium flows from the first end 231 of the guide member 23 to the second end 233 of the guide member 23 and flows into the accommodating chamber 101, the cooling medium and the device to be cooled 200 can perform contact heat exchange in the accommodating chamber 101, that is, the cooling medium can directly contact the device to be cooled 200 to cool and dissipate heat from the device to be cooled 200, thereby preventing the heat generated by the device to be cooled 200 from accumulating and causing the device to be cooled 200 to be overheated and damaged, thereby ensuring the normal operation of the device to be cooled 200. The guide member 23 is spaced from the device to be cooled 200, so that when the cooling medium flows along the guide member 23, the cooling medium will not be disturbed by the device to be cooled 200 and will directly fall into the accommodating chamber 101, thereby preventing the cooling medium from sputtering when entering the accommodating chamber 101, reducing the loss of the cooling medium, and thereby ensuring the cooling and heat dissipation effect of the heat dissipation device 100.

[0091] In certain embodiments, the electronic device 1000 is a vehicle, a drone, an energy storage device, or a battery pack, and the device to be cooled 200 is a battery module or a control module for controlling a battery module.

[0092] Specifically, when the electronic device 1000 is a battery pack and the device to be cooled 200 is a battery module, the battery module is disposed in the accommodating cavity 101, and the cooling medium can directly contact the battery module to cool and dissipate the heat of the battery module, thereby preventing the heat generated by the battery module from accumulating and causing damage to the battery module, thereby ensuring the normal operation of the battery module. In addition, the cooling medium can directly contact the battery module and can also isolate the battery module from contact with the air, reducing the possibility of combustion of the battery module and improving the safety of the battery module.

[0093] If the cooling medium is conductive, when the cooling medium is in direct contact with the device to be cooled 200, the device to be cooled 200 is prone to short circuit problems, thereby affecting the normal operation of the device to be cooled 200. Therefore, in some embodiments, when the cooling medium is in direct contact with the device to be cooled 200, the cooling medium is an insulating cooling medium, so that the stability and reliability of the operation of the device to be cooled 200 can be improved while ensuring the cooling effect on the device to be cooled 200. It should be noted that, in some embodiments, the insulating cooling medium may include but is not limited to fluorinated liquid or synthetic oil.

[0094] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. At the same time, other implementation methods can be derived from the above-mentioned embodiments, so that structural and logical replacements and changes can be made without departing from the scope of this disclosure.

[0095] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A heat dissipation device, characterized in that: include: A housing, wherein the housing is provided with a receiving cavity; and The flow guide component includes a flow guide member and at least one flow guide member, at least a portion of the flow guide member is located in the accommodating cavity, the flow guide member is connected to the flow guide member, and the flow guide member is used to guide the cooling medium to flow into the accommodating cavity.

2. The heat dissipation device according to claim 1, characterized in that: The guide member is provided with a guide hole, and the guide member includes a first end and a second end opposite to each other. The first end of the guide member is connected to the guide hole, and the second end of the guide member extends to the inner side of the side wall of the shell. The guide member is used to guide the cooling medium to flow from the first end of the guide member to the second end of the guide member through the guide hole and flow into the accommodating cavity.

3. The heat dissipation device according to claim 2, characterized in that: In the height direction of the shell, the height of the first end of the guide member is higher than the height of the second end of the guide member.

4. The heat dissipation device according to claim 2, characterized in that: The second end of the flow guide is connected to the inner side of the side wall of the shell.

5. The heat dissipation device according to claim 4, characterized in that: At least one connecting piece is disposed on the inner side of the side wall of the shell, and the second end of the flow guide piece is connected to the side wall of the shell through the connecting piece.

6. The heat dissipation device according to claim 2, characterized in that: The flow guide assembly includes at least two flow guide members; at least two flow guide members are spaced apart from each other and surround the flow guide member.

7. The heat dissipation device according to claim 6, characterized in that: The flow guide member is located at the center of the accommodating cavity, and the second ends of the flow guide member are evenly distributed around the center of the accommodating cavity.

8. The heat dissipation device according to claim 2, characterized in that: In the direction from the first end of the guide member to the second end of the guide member, a length difference between any two of the guide members is less than a preset length threshold.

9. The heat dissipation device according to claim 8, characterized in that: All of the guides have the same length.

10. The heat dissipation device according to claim 2, characterized in that: The flow guide is a wire, and a gap is provided between the first end of the flow guide and the inner wall of the drainage hole.

11. The heat dissipation device according to claim 2, characterized in that: The flow guide member is further provided with a cavity connected to the flow guide hole, and the flow guide member is a pipe, and the pipe is provided with a hollow cavity running through the first end and the second end; There is a gap between the first end of the guide member and the inner wall of the guide hole; or, The first end of the flow guide is sealed with the inner wall of the drainage hole without any gap, and the hollow cavity is communicated with the cavity.

12. The heat dissipation device according to claim 1, characterized in that: The shell is provided with a through hole, the through hole passes through the shell and is communicated with the accommodating cavity, and the through hole is used for allowing the cooling medium in the accommodating cavity to flow out of the accommodating cavity.

13. The heat dissipation device according to claim 12, characterized in that: The through hole is arranged on the side wall of the shell, and the bottom wall of the shell is recessed in a direction away from the center of the accommodating cavity to form a groove, and the groove is communicated with the through hole.

14. The heat dissipation device according to claim 2, characterized in that: The guide member also includes an inlet; the heat dissipation device also includes a first pipe assembly and a second pipe assembly, the first pipe assembly is connected to the inlet, the first pipe assembly is used for the cooling medium to flow into the inlet, the second pipe assembly is connected to the through hole of the shell, and the second pipe assembly is used for the cooling medium to flow out of the through hole.

15. The heat dissipation device according to claim 14, characterized in that: The first pipeline assembly includes a first pipeline and a second pipeline, the first pipeline is used to transport the cooling medium, one end of the second pipeline is connected to the first pipeline, and the other end is connected to the inlet, and the second pipeline is used for the cooling medium to flow into the inlet; The second pipeline assembly includes a third pipeline, the third pipeline is communicated with the through hole, and the third pipeline is used for allowing the cooling medium to flow out of the through hole.

16. An electronic device, characterized in that: include: The heat dissipation device according to any one of claims 1 to 15; and The device to be cooled is accommodated in the accommodation cavity.

17. The electronic device according to claim 16, characterized in that: In the height direction of the shell, the height of the shell is greater than the height of the device to be cooled.

18. The electronic device according to claim 16, characterized in that: The device to be cooled comprises a shell and a functional module loaded in the shell; the flow guide member of the flow guide assembly of the heat dissipation device is arranged on the top of the shell, and the flow guide member is spaced from the shell.

19. The electronic device according to claim 18, characterized in that: The device to be cooled includes a battery pack or a control device for controlling a battery pack.

20. The electronic device according to claim 16, characterized in that: The housing comprises a box body and a cover body, wherein the box body and the cover body are connected to form the accommodating cavity together; The guide member of the guide assembly of the heat dissipation device is arranged on the cover body, the inlet of the guide member is located outside the accommodating cavity, the guide hole of the guide member is located in the accommodating cavity, and the guide member is spaced from the device to be cooled.

21. The electronic device according to claim 20, characterized in that: The electronic device is a vehicle, a drone, an energy storage device or a battery pack, and the device to be cooled is a battery module or a control module that controls the battery module.

Images