Semiconductor cleaning equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses semiconductor cleaning equipment which comprises a cleaning chamber, a filtering device and a cleaning device, the cleaning chamber is used for placing a semiconductor device, the filtering device comprises a shell, at least one positive pole adsorption piece and at least one negative pole adsorption piece, and a filtering channel is arranged in the shell. The at least one positive electrode adsorption part and the at least one negative electrode adsorption part are arranged in the filtering channel, the at least one positive electrode adsorption part is used for adsorbing negative electrode pollutants in the cleaning liquid, the at least one negative electrode adsorption part is used for adsorbing positive electrode pollutants in the cleaning liquid, and the cleaning device comprises a cleaning pipeline communicated with the filtering channel and used for providing the cleaning liquid. According to the semiconductor cleaning equipment, the filtering device comprising at least one positive pole adsorption piece and at least one negative pole adsorption piece is arranged, particle impurities in cleaning liquid and ultrapure water are removed according to the electro-adsorption principle, the filtering precision requirement is met, meanwhile, replacement is not needed, repeated use can be achieved, and the use cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor cleaning device. Background Art

[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.

[0003] Semiconductor cleaning equipment mainly uses chemical cleaning solutions and ultrapure water to wet clean semiconductor structures to remove impurities in the semiconductor structures. Therefore, the chemical cleaning solutions and ultrapure water are required to be pollution-free.

[0004] In order to ensure the cleaning effect, the existing semiconductor cleaning equipment needs to remove impurities in the chemical cleaning solution and ultrapure water. Usually, a mesh filter is used to filter the impurities in the chemical cleaning solution and ultrapure water. With the development of semiconductor sophistication, this filter cannot meet the filtration accuracy requirements, and the filter needs to be replaced regularly, resulting in excessive costs. Utility Model Content

[0005] The purpose of the utility model is to at least solve the problem that the existing semiconductor cleaning device cannot meet the filtering accuracy requirements and needs to regularly replace the filter screen, resulting in high costs. This purpose is achieved through the following technical solutions:

[0006] The utility model provides a semiconductor cleaning device, comprising:

[0007] A cleaning chamber for placing semiconductor devices;

[0008] A filter device, comprising a housing, at least one positive electrode adsorbent and at least one negative electrode adsorbent, wherein a filter channel is provided in the housing, the at least one positive electrode adsorbent and the at least one negative electrode adsorbent are provided in the filter channel, the at least one positive electrode adsorbent is used to adsorb negative electrode pollutants in a cleaning solution, and the at least one negative electrode adsorbent is used to adsorb positive electrode pollutants in a cleaning solution;

[0009] The cleaning device comprises a cleaning pipeline, wherein the cleaning pipeline is communicated with the filter channel, and the cleaning pipe is used for providing cleaning liquid.

[0010] The semiconductor cleaning equipment of the utility model is provided with a filtering device on the cleaning pipeline. The filtering device includes a shell and at least one positive electrode adsorbent and a negative electrode adsorbent arranged in the shell. The positive electrode adsorbent can adsorb the negative electrode pollutants in the cleaning liquid, and the negative electrode adsorbent can adsorb the positive electrode pollutants in the cleaning liquid. The principle of electric adsorption is used to remove particulate impurities in the cleaning liquid and ultrapure water to meet the filtering accuracy requirements. At the same time, the filtering device does not need to be replaced and can be reused, thereby reducing the use cost.

[0011] In addition, the semiconductor cleaning equipment according to the utility model may also have the following additional technical features:

[0012] In some embodiments of the present invention, the cross-sectional shapes of the shell, the at least one positive electrode adsorbent and the at least one negative electrode adsorbent are all circular, and the at least one positive electrode adsorbent and the at least one negative electrode adsorbent are arranged on the inner circumferential surface of the shell and are spaced apart along the axial direction of the shell.

[0013] In some embodiments of the present invention, a through hole is axially arranged on the at least one positive electrode adsorption component and the at least one negative electrode adsorption component, and the through hole is communicated with the filter channel.

[0014] In some embodiments of the utility model, the at least one positive electrode adsorption member includes a first iron core and a first coil, the first coil is wound around the outside of the first iron core, the first coil is connected to a power supply, the positive pole of the power supply is connected to one end of the first coil, and the negative pole of the power supply is connected to the other end of the first coil.

[0015] In some embodiments of the utility model, the at least one negative electrode adsorption member includes a second iron core and a second coil, the second coil is wound around the outside of the second iron core, the second coil is connected to a power supply, the positive pole of the power supply is connected to one end of the second coil, and the negative pole of the power supply is connected to the other end of the second coil.

[0016] In some embodiments of the present invention, the number of the positive electrode adsorbent and the number of the negative electrode adsorbent are two respectively, and the two positive electrode adsorbents and the two negative electrode adsorbents are arranged at intervals along the axis of the shell, so that the magnetism of two adjacent adsorbents is opposite.

[0017] In some embodiments of the present invention, the cleaning device further comprises a nozzle, and the nozzle is connected to the outlet end of the cleaning pipeline.

[0018] In some embodiments of the present invention, the semiconductor cleaning equipment further includes a rotating device, which is disposed inside the cleaning chamber, and the semiconductor device is disposed on the rotating device, and the rotating device is used to drive the semiconductor device to rotate inside the cleaning chamber.

[0019] In some embodiments of the present invention, the rotating device includes a rotating seat and a chuck, the rotating seat is arranged at the center of the cleaning chamber, the chuck is arranged on the rotating seat, and the chuck is used to fix the semiconductor device.

[0020] In some embodiments of the present invention, the semiconductor cleaning equipment further includes a collecting device, which is disposed outside the cleaning chamber and is used to collect pollutants flowing out of the filtering device and the cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0022] Figure 1 The structure diagram of the semiconductor cleaning equipment according to the embodiment of the utility model is schematically shown;

[0023] Figure 2 The structure diagram of the filtering device of the semiconductor cleaning equipment according to the embodiment of the utility model is schematically shown;

[0024] Figure 3 The schematic diagram of the structure of the positive electrode adsorbing member of the semiconductor cleaning equipment according to the embodiment of the utility model is schematically shown;

[0025] Figure 4 The schematic diagram of the structure of the negative electrode adsorbing member of the semiconductor cleaning equipment according to the embodiment of the utility model is schematically shown;

[0026] Figure 5 The working diagram of the semiconductor cleaning equipment according to the embodiment of the utility model is schematically shown.

[0027] The reference numerals are as follows:

[0028] 1. Cleaning room;

[0029] 2. Filter device; 20. Shell; 21. Positive electrode adsorbent; 210. First iron core; 211. First coil; 22. Negative electrode adsorbent; 220. Second iron core; 221. Second coil; 23. Filter channel;

[0030] 3. Cleaning device; 30. Cleaning pipeline; 31. Nozzle;

[0031] 4. Semiconductor devices;

[0032] 5. Rotating device; 50. Rotating seat; 51. Chuck;

[0033] 6. Collection device; 60. Collection cup. DETAILED DESCRIPTION

[0034] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0035] It should be understood that the terms used in the text are only for the purpose of describing specific example embodiments, and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used in the text may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0036] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0037] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations.

[0038] In order to ensure the cleaning effect, the semiconductor cleaning device of the related art needs to remove impurities in the chemical cleaning solution and ultrapure water. Usually, a mesh filter is used to filter the impurities in the chemical cleaning solution and ultrapure water, and the impurities after filtration will fall into the filter. With the development of semiconductor refinement, it is required to filter out tiny impurities in the cleaning solution, but the above-mentioned filter cannot meet the requirements of filtering accuracy. In addition, the price of chemical filters is also rising. The filter with this mesh structure needs to be replaced regularly, resulting in excessive cost.

[0039] In view of this, the present embodiment provides a semiconductor cleaning device, which aims to solve the above-mentioned technical problems by setting a filtering device 2 including at least one positive electrode adsorbent 21 and a negative electrode adsorbent 22, and utilizing the principle of electrosorption to remove particulate impurities in the cleaning liquid and ultrapure water, thereby meeting the requirements of filtering accuracy while reducing costs.

[0040] like Figures 1 to 5 As shown, according to an embodiment of the utility model, a semiconductor cleaning device is proposed, which includes a cleaning chamber 1, a filtering device 2 and a cleaning device 3. The cleaning chamber 1 is a structure with an open top and closed on all sides. The cleaning chamber 1 is used to place a semiconductor device 4. The filtering device 2 includes a shell 20, at least one positive adsorbent 21 and at least one negative adsorbent 22. A filtering channel 23 is provided in the shell 20. At least one positive adsorbent 21 and at least one negative adsorbent 22 are provided in the filtering channel 23. At least one positive adsorbent 21 is used to adsorb negative electrode pollutants in the cleaning liquid, and at least one negative adsorbent 22 is used to adsorb positive electrode pollutants in the cleaning liquid. The cleaning device 3 includes a cleaning pipeline 30, which is connected to the filtering channel 23 and is arranged above the semiconductor device 4. The cleaning pipe is used to provide cleaning liquid or ultrapure water, and the cleaning liquid or ultrapure water is transported to the semiconductor device 4 to clean the semiconductor device 4.

[0041] The semiconductor cleaning equipment of the present invention is provided with a filter device 2 on the cleaning pipeline 30. The filter device 2 includes a shell 20 and at least one positive electrode adsorbent 21 and a negative electrode adsorbent 22 arranged in the shell 20. The positive electrode adsorbent 21 can adsorb the negative electrode pollutants in the cleaning liquid, and the negative electrode adsorbent 22 can adsorb the positive electrode pollutants in the cleaning liquid. The principle of electric adsorption is used to remove particulate impurities in the cleaning liquid and ultrapure water to meet the filtering accuracy requirements. At the same time, the filter device 2 does not need to be replaced and can be reused, thereby reducing the use cost.

[0042] In some embodiments of the present invention, the cross-sectional shape of the shell 20, at least one positive electrode adsorbent 21 and at least one negative electrode adsorbent 22 is circular, and at least one positive electrode adsorbent 21 and at least one negative electrode adsorbent 22 are arranged on the inner circumferential surface of the shell 20 and are arranged at intervals along the axial direction of the shell 20. Specifically, the shell 20 is a cylindrical structure, and the material of the shell 20 is TEFLON material or the inner and outer surfaces of the shell 20 are sprayed with TEFLON coating. TEFLON is a polytetrafluoroethylene material, which has the characteristics of acid and alkali resistance and resistance to various organic solvents, and has good corrosion resistance, which can prevent corrosion from various chemical cleaning liquids and improve the overall service life of the filter device 2. A filter channel 23 is provided inside the shell 20 along the axis of the shell 20, and a liquid inlet and a liquid outlet are provided at both ends of the shell 20, respectively. The outer diameter of at least one positive adsorbent 21 and at least one negative adsorbent 22 is the same as the inner diameter of the shell 20, so that at least one positive adsorbent 21 and at least one adsorbent are provided on the inner circumference of the shell 20 along the axis direction of the shell 20, and a through hole is provided axially on at least one positive adsorbent 21 and at least one negative adsorbent 22, and the diameter of the through hole is the same as the diameter of the filter channel 23, and the through hole is connected to the filter channel 23 and is connected to the liquid inlet and the liquid outlet. When filtering, the cleaning liquid or ultrapure water enters the filter channel 23 from the liquid inlet, and after being adsorbed by the positive adsorbent 21 and the negative adsorbent 22, the particulate impurities are adsorbed and then flow out through the liquid outlet.

[0043] In some embodiments of the present invention, at least one positive electrode adsorbent 21 includes a first core 210 and a first coil 211, the first coil 211 is wound outside the first core 210, the first coil 211 is connected to a power source, the positive pole of the power source is connected to one end of the first coil 211, and the negative pole of the power source is connected to the other end of the first coil 211; at least one negative electrode adsorbent 22 includes a second core 220 and a second coil 221, the second coil 221 is wound outside the second core 220, the second coil 221 is connected to a power source, the positive pole of the power source is connected to one end of the second coil 221, and the negative pole of the power source is connected to the other end of the second coil 221. The adsorption force of the positive electrode adsorbent 21 and the negative electrode adsorbent 22 can be adjusted by controlling the current flowing through the positive electrode adsorbent 21 and the negative electrode adsorbent 22, and the current flowing through the positive electrode adsorbent 21 and the negative electrode adsorbent 22 is cut off at the same time, so as to have the function of blocking operation, thereby discharging the pollution adsorbed by the positive electrode adsorbent 21 and the negative electrode adsorbent 22.

[0044] In some embodiments of the present invention, the number of positive electrode adsorbents 21 and negative electrode adsorbents 22 are two respectively, and the two positive electrode adsorbents 21 and the two negative electrode adsorbents 22 are arranged at intervals along the axis of the shell 20, so that the magnetic properties of two adjacent adsorbents are opposite. In other embodiments, the number of positive electrode adsorbents 21 and negative electrode adsorbents 22 can also be set to three respectively according to actual needs, or the number of positive electrode adsorbents 21 is one, the number of negative electrode adsorbents 22 is two, or the number of positive electrode adsorbents 21 is two, the number of negative electrode adsorbents 22 is one, etc.

[0045] In some embodiments of the utility model, the cleaning device 3 further includes a nozzle 31, and the nozzle 31 is connected to the outlet end of the cleaning pipeline 30. Specifically, the nozzle 31 is arranged at the outlet end of the cleaning pipeline 30, and the filter device 2 is arranged at the inlet end of the cleaning pipeline 30. When cleaning is performed, the cleaning liquid or ultrapure water flows into the cleaning pipeline 30 and enters the filter channel 23 from the liquid inlet, and after being adsorbed by the positive electrode adsorbent 21 and the negative electrode adsorbent 22, the particulate impurities are adsorbed, and then flow out through the liquid outlet, and then the cleaning liquid or ultrapure water is sprayed through the nozzle 31, and the cleaning liquid or ultrapure water is sprayed onto the semiconductor device 4 to clean the semiconductor device 4. By setting the nozzle 31, the spraying range and the uniformity of the spraying can be increased, thereby improving the cleaning effect.

[0046] In some embodiments of the utility model, the semiconductor cleaning equipment further includes a rotating device 5, the rotating device 5 is arranged inside the cleaning chamber 1, the semiconductor device 4 is arranged on the rotating device 5, and the rotating device 5 is used to drive the semiconductor device 4 to rotate inside the cleaning chamber 1. Specifically, the rotating device 5 includes a rotating seat 50 and a chuck 51, the rotating seat 50 is arranged at the center of the cleaning chamber 1, and the chuck 51 is arranged on the rotating seat 50, and the chuck 51 is used to fix the semiconductor device 4. When cleaning, the semiconductor device 4 is first fixed on the rotating seat 50 through the chuck 51, and the rotating seat 50 is started to rotate to rotate the semiconductor device 4, and then the cleaning liquid or ultrapure water is transported through the cleaning pipeline 30, and the filtered cleaning liquid or ultrapure water is sprayed onto the semiconductor device 4 through the nozzle 31 to clean the semiconductor device 4. By setting the rotating device 5, the cleaning liquid or ultrapure water can be evenly sprayed onto the entire semiconductor device 4, thereby improving the cleaning efficiency and cleaning effect.

[0047] In some embodiments of the utility model, the semiconductor cleaning equipment further includes a collecting device 6, which is arranged outside the cleaning chamber 1, and the collecting device 6 is used to collect pollutants flowing out from the filtering device 2 and the cleaning device 3. Specifically, the collecting device 6 includes a collecting cup 60, which is arranged outside the cleaning chamber 1. After the cleaning is completed, a large amount of impurities are adsorbed on the positive electrode adsorbent 21 and the negative electrode adsorbent 22. If they are not cleaned, the adsorption effect will be affected, and then the cleaning effect and efficiency will be affected. By setting the collecting cup 60, after the cleaning is completed, the power supply connected to the first coil 211 and the second coil 221 is cut off, so that the positive electrode adsorbent 21 and the negative electrode adsorbent 22 are not charged, so that the pollutants adsorbed on the positive electrode adsorbent 21 and the negative electrode adsorbent 22 lose adsorption, and are discharged to the collecting cup 60 through the cleaning pipeline 30 for treatment. After the discharge is completed, the next cleaning cycle is carried out to improve the cleaning efficiency and cleaning effect.

[0048] During cleaning, the semiconductor device 4 to be cleaned is fixed on the rotating seat 50 through the chuck 51, and the rotating seat 50 is started to rotate, so that the semiconductor device 4 rotates, and then the cleaning liquid or ultrapure water is delivered through the cleaning pipeline 30, and the filter device 2 arranged on the cleaning pipeline 30 adsorbs the particulate impurities in the cleaning liquid or ultrapure water, thereby removing the impurities in the cleaning liquid or ultrapure water, and the cleaning liquid or ultrapure water filtered by the filter device 2 is sprayed onto the semiconductor device 4 through the nozzle 31 to clean the semiconductor device 4. After the cleaning is completed, the power supply is cut off, so that the pollutants adsorbed on the positive electrode adsorbent 21 and the negative electrode adsorbent 22 lose adsorption, and are discharged to the collection cup 60 through the cleaning pipeline 30 for processing. After the discharge is completed, the next cleaning cycle is carried out, and while meeting the filtering accuracy requirements, the filter device 2 does not need to be replaced and can be reused, thereby reducing the use cost.

[0049] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A semiconductor cleaning device, characterized in that: include: A cleaning chamber for placing semiconductor devices; A filter device, comprising a housing, at least one positive electrode adsorbent and at least one negative electrode adsorbent, wherein a filter channel is provided in the housing, the at least one positive electrode adsorbent and the at least one negative electrode adsorbent are provided in the filter channel, the at least one positive electrode adsorbent is used to adsorb negative electrode pollutants in a cleaning solution, and the at least one negative electrode adsorbent is used to adsorb positive electrode pollutants in a cleaning solution; The cleaning device comprises a cleaning pipeline, wherein the cleaning pipeline is communicated with the filter channel, and the cleaning pipe is used for providing cleaning liquid.

2. The semiconductor cleaning equipment according to claim 1, characterized in that: The cross-sectional shapes of the shell, the at least one positive electrode adsorbing member and the at least one negative electrode adsorbing member are all circular. The at least one positive electrode adsorbing member and the at least one negative electrode adsorbing member are arranged on the inner circumferential surface of the shell and are spaced apart along the axial direction of the shell.

3. The semiconductor cleaning equipment according to claim 1, characterized in that: The at least one positive electrode adsorption component and the at least one negative electrode adsorption component are provided with through holes along the axial direction, and the through holes are communicated with the filter channel.

4. The semiconductor cleaning equipment according to claim 1, characterized in that: The at least one positive electrode adsorption member includes a first iron core and a first coil, the first coil is wound around the outside of the first iron core, the first coil is connected to a power supply, the positive pole of the power supply is connected to one end of the first coil, and the negative pole of the power supply is connected to the other end of the first coil.

5. The semiconductor cleaning equipment according to claim 1, characterized in that: The at least one negative electrode adsorption member includes a second iron core and a second coil, the second coil is wound around the outside of the second iron core, the second coil is connected to a power supply, the positive pole of the power supply is connected to one end of the second coil, and the negative pole of the power supply is connected to the other end of the second coil.

6. The semiconductor cleaning equipment according to any one of claims 1 to 5, characterized in that: The number of the positive electrode adsorbing members and the number of the negative electrode adsorbing members are two respectively, and the two positive electrode adsorbing members and the two negative electrode adsorbing members are arranged at intervals along the axis of the shell, so that the magnetism of two adjacent adsorbing members is opposite.

7. The semiconductor cleaning equipment according to any one of claims 1 to 5, characterized in that: The cleaning device also includes a nozzle connected to the outlet end of the cleaning pipeline.

8. The semiconductor cleaning equipment according to any one of claims 1 to 5, characterized in that: The semiconductor cleaning equipment further comprises a rotating device, which is arranged inside the cleaning chamber, and the semiconductor device is arranged on the rotating device, and the rotating device is used to drive the semiconductor device to rotate inside the cleaning chamber.

9. The semiconductor cleaning equipment according to claim 8, characterized in that: The rotating device comprises a rotating seat and a chuck. The rotating seat is arranged at the center of the cleaning chamber. The chuck is arranged on the rotating seat. The chuck is used to fix the semiconductor device.

10. The semiconductor cleaning equipment according to any one of claims 1 to 5, characterized in that: The semiconductor cleaning equipment further comprises a collecting device, which is arranged outside the cleaning chamber and is used to collect pollutants flowing out of the filtering device and the cleaning device.

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