Substrate cleaning device

Abstract

The utility model relates to a substrate cleaning device, which is used for removing foreign matters attached to a substrate, and comprises a bracket, which comprises a first cleaning station and a second cleaning station; the bearing table is provided with a plurality of bearing parts used for bearing the substrate, and the bearing table can controllably move relative to the support to drive the substrate to pass through the first cleaning station and the second cleaning station; the first cleaning assembly is located at the first cleaning station and comprises a magnetic attraction part, and the magnetic attraction part is used for attracting metal foreign matter on the to-be-cleaned surface of the substrate; and the second cleaning assembly is located at the second cleaning station and comprises an air outlet, and the air outlet can jet airflow to remove foreign matter on the to-be-cleaned surface of the substrate. The substrate cleaning device provided by the utility model can be used for removing various foreign matters on the surface of the substrate by combining an airflow jet mode and a magnetic adsorption mode, so that the cleaning effect of the substrate cleaning device is improved.

Description

Technical Field

[0001] The present application relates to a technology for removing foreign matter on a substrate used in a manufacturing process, and more particularly to a substrate cleaning device. Background Art

[0002] In the process of substrate manufacturing and processing, the surface of the substrate is easily contaminated with various foreign matter due to the complex process, including but not limited to dust particles, metal debris, grease stains, etc., which destroys the cleanliness of the substrate surface and affects the performance and quality of the substrate. In the prior art, a common method for removing foreign matter from substrates is to use a blowing device to remove foreign matter. This method uses a high-pressure gas jet to form a strong airflow that directly acts on the surface of the substrate to blow away attached foreign matter such as dust and particles.

[0003] However, although the method of removing foreign matter on the substrate surface by blowing air can quickly remove loose foreign matter on the substrate surface, the removal effect is not ideal for foreign matter with strong adhesion, especially metal particles with high surface energy and tight adhesion to the substrate. The airflow generated by blowing air alone is difficult to overcome the adhesion of metal particles and cannot completely remove the metal foreign matter on the substrate. Utility Model Content

[0004] The embodiment of the present application discloses a substrate cleaning device, which can solve the common problem of traditional substrate foreign matter removal mechanisms being unable to remove metal foreign matter.

[0005] The embodiment of the present application discloses a substrate cleaning device, comprising: a bracket, comprising a first cleaning station and a second cleaning station; a carrying platform, movably arranged on the bracket, and provided with a plurality of carrying parts for carrying the substrate, and the carrying platform can move relative to the bracket in a controllable manner to drive the substrate to pass through the first cleaning station and the second cleaning station; a first cleaning component, located at the first cleaning station, the first cleaning component comprising a magnetic suction part, and the magnetic suction part is used to absorb metal foreign matter on the surface to be cleaned of the substrate; a second cleaning component, located at the second cleaning station, the second cleaning component comprising an air outlet, and the air outlet can spray an air flow to remove foreign matter on the surface to be cleaned of the substrate.

[0006] As an optional embodiment, the first cleaning component includes: a support member, at least one magnetic member is arranged on the support member, and at least one magnetic member is located between the support member and the carrier platform; a mounting member connected to the support member, and the mounting member is adjustably arranged on the bracket to adjust the distance between the magnetic member on the support member and the carrier platform. The mounting member is adjustably arranged on the bracket, so that the magnetic member can be as close to the substrate surface as possible, thereby enhancing the attraction of the magnetic member to the metal foreign matter.

[0007] As an optional embodiment, there are multiple magnetic elements, which are arranged at intervals along the moving path of the substrate, the distance between two adjacent magnetic elements is equal to the distance between two adjacent bearing parts, and one magnetic element corresponds to one bearing part.

[0008] As an optional embodiment, the arrangement of the magnetic components in the first cleaning component can be set according to the arrangement of the carrying part on the carrying platform. For example, the magnetic components can be arranged in a circle or in a straight line.

[0009] As an optional embodiment, the mounting member can be movably arranged on the bracket, and the mounting member can slide relative to the bracket along a first direction, the first direction being the arrangement direction of the support member and the support platform, and the first cleaning component also includes: an adjusting member, the adjusting member can adjust the relative position of the mounting member and the bracket along the first direction; a limiting member, the limiting member can limit the mounting member to the bracket to limit the mounting member along a second direction, and the second direction is perpendicular to the first direction.

[0010] In some embodiments, the adjusting member is a threaded adjusting member. Alternatively, the adjusting member includes a slide rail and a slider, and the relative position between the mounting member and the bracket is adjusted by adjusting the position of the slider on the slide rail.

[0011] As an optional embodiment, the mounting member includes a receiving groove extending along a first direction, the end of the bracket extends into the receiving groove, and the length of the bracket extending into the receiving groove is adjustable so that the mounting member slides relative to the bracket along the first direction.

[0012] As an optional embodiment, an adjustment hole connected to the receiving groove is provided on the mounting member, the adjustment member extends along the first direction and extends into the receiving groove through the adjustment hole, and the end of the adjustment member abuts against the bracket; the adjustment member and the adjustment hole are rotatably matched to adjust and fix the length of the adjustment member extending into the receiving groove, thereby adjusting the relative position of the mounting member and the bracket along the first direction.

[0013] As an optional implementation, a first thread is formed on the inner wall of the adjustment hole, and a second thread is formed on the outer surface of the adjustment member.

[0014] As an optional implementation, the mounting member further includes a limiting portion, which abuts against a side wall of the bracket to limit the movement of the mounting member relative to the bracket along a second direction perpendicular to the first direction.

[0015] As an optional implementation, a waist-shaped hole extending along the first direction is provided on the mounting member, and the limiting member passes through the waist-shaped hole and is fixed to the bracket.

[0016] As an optional embodiment, a guide member is provided on the bracket, and the mounting member further includes a slide groove, the guide member extends into the slide groove, and the guide member and the slide groove are slidably matched to guide the mounting member when adjusting its relative position relative to the bracket.

[0017] As an optional embodiment, the first cleaning component further includes a fastener, and the mounting member and the supporting member are detachably connected via the fastener.

[0018] As an optional embodiment, the mounting member includes a supporting portion, which is provided with a limiting hole or a limiting column; a limiting hole or the other of the limiting columns is provided on a side of the supporting member facing the supporting portion, the limiting column extends along a first direction, and the limiting hole and the limiting column are limitedly matched along a second direction perpendicular to the first direction.

[0019] As an optional implementation, a surface of the support member facing the support portion is provided with an avoidance groove adapted to the support portion, and the limiting hole or the limiting column is located in the avoidance groove.

[0020] As an optional embodiment, the first cleaning station includes at least two first cleaning sub-stations, and the at least two first cleaning sub-stations are located on both sides of the second cleaning station; the first cleaning components are at least two groups, and at least two groups of first cleaning components are respectively located in one first cleaning sub-station.

[0021] As an optional embodiment, the cleaning head is arranged on the bracket, and the cleaning head includes an air duct connected to the air source and the air outlet, and the air outlet is arranged on the adsorption surface of the cleaning head; the air return port is arranged on the adsorption surface, and the air return port is used to connect the suction device.

[0022] As an optional embodiment, the cleaning head further includes an air return cavity, the air outlet is at least partially located in the air return cavity, and foreign matter blown up by the air outlet can be collected in the air return cavity and swirl in the air return cavity.

[0023] As an optional implementation, there are multiple air return ports, and the multiple air return ports surround the air outlet.

[0024] As an optional implementation, the substrate cleaning device further includes: a driving device, which can drive the carrying platform to rotate relative to the bracket to drive the substrate carried on the carrying platform to pass through the first cleaning station and the second cleaning station.

[0025] Compared with the prior art, the beneficial effects of this application are:

[0026] The substrate cleaning device provided in the embodiment of the present application realizes the classification and processing of foreign matter on the surface of the substrate by configuring a first cleaning component and a second cleaning component. The first cleaning component removes metal foreign matter by magnetic attraction, while the second cleaning component removes non-metallic foreign matter by high-pressure gas jet. During the continuous movement of the carrier, the substrate cleaning device can remove multiple foreign matter at one time, thereby improving the automation level and efficiency of substrate cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the three-dimensional structure of a substrate cleaning device provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of the structure of the first cleaning station and the second cleaning station of the second cleaning component provided in an embodiment of the present application;

[0030] Figure 3 One of the partial explosion structure schematic diagrams of a substrate cleaning device is provided for an embodiment of the present application;

[0031] Figure 4 One of the structural schematic diagrams of the magnetic attraction member and the support member of the substrate cleaning device provided in the embodiment of the present application;

[0032] Figure 5 One of the structural schematic diagrams of the mounting member of the substrate cleaning device provided in the embodiment of the present application;

[0033] Figure 6 A second structural schematic diagram of a mounting member for a substrate cleaning device provided in an embodiment of the present application;

[0034] Figure 7 The second schematic diagram of the partial explosion structure of the substrate cleaning device provided in the embodiment of the present application;

[0035] Figure 8 The second structural schematic diagram of the magnetic attraction member and the support member of the substrate cleaning device provided in the embodiment of the present application;

[0036] Fig. 9 A schematic structural diagram of a second cleaning component of a substrate cleaning device provided in an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 01-substrate cleaning device; 10-bracket; 101-first bracket; 102-second bracket; 103-mounting hole; 104-guide member; 20-carrying platform; 201-carrying part; 30-first cleaning component; 301-magnetic member; 302-support member; 3021-avoidance groove; 3022-limiting column; 303-mounting member; 3031-accommodating groove; 3032-adjusting hole; 3033-slide groove; 3034-support part; 3035-limiting hole; 3036-limiting part; 3037-waist-shaped hole; 304-adjusting member; 305-limiting member; 306-fastener; 40-second cleaning component; 401-cleaning head; 402-air outlet; 403-return air outlet; 404-return air chamber; A-first cleaning station; A1-first cleaning sub-station; B-second cleaning station. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] In this application, the terms "upper", "lower", "top", "bottom", "inner", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0041] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0042] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0044] In the manufacturing and processing flow of substrates, the surface treatment of substrates needs to go through many processes, such as etching, polishing, electroplating, etc. These processes involve extreme conditions such as high temperature, high pressure, chemical corrosion, etc., and are also accompanied by microscopic operations. The substrate is easily contaminated with foreign matter during the process, including but not limited to dust particles, metal debris, grease stains, etc. The presence of foreign matter on the surface will affect the performance and quality of the substrate. For example: dust particles may cause a short circuit in the substrate circuit, metal debris may pierce the insulating layer of the substrate, and grease stains may reduce the adhesion and conductivity of the substrate. These factors affect the electrical properties, thermal conductivity, corrosion resistance, etc. of the substrate, and damage the quality and stability of the substrate. In the related art, a common method for removing foreign matter from a substrate is to use a blowing device to remove foreign matter. This method forms a strong airflow through the injection of high-pressure gas, and directly acts on the surface of the substrate through the impact force and shear force of the airflow to blow away attached foreign matter such as dust and particles.

[0045] However, although the method of removing foreign matter by blowing air can quickly remove loose foreign matter on the surface of the substrate, the removal effect is not ideal for foreign matter with strong adhesion, especially metal particles with high surface energy and tight bond to the substrate. The airflow generated by blowing air alone is difficult to overcome the adhesion of metal particles and cannot completely remove the metal foreign matter on the substrate.

[0046] In order to solve the above problems, the inventors studied the limitations of existing substrate foreign matter removal methods, improved the existing substrate foreign matter removal mechanisms, and designed a substrate cleaning device that can simultaneously remove metallic foreign matter while removing non-metallic foreign matter by jetting.

[0047] Based on this, an embodiment of the present application discloses a substrate cleaning device that can solve the common problem of traditional substrate foreign matter removal mechanisms being unable to remove metal foreign matter.

[0048] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0049] See also Figure 1 , Figure 1A schematic diagram of the three-dimensional structure of a substrate cleaning device 01 provided in an embodiment of the present application. The embodiment of the present application discloses a substrate cleaning device 01, comprising: a support 10, comprising a first cleaning station A and a second cleaning station B; a support table 20, movably arranged on the support 10, and provided with a plurality of support parts 201 for supporting substrates, and the support table 20 can be controlled to move relative to the support 10 to drive the substrate to pass through the first cleaning station A and the second cleaning station B; a first cleaning component 30, located in the first cleaning station A, the first cleaning component 30 includes a magnetic suction member 301, and the magnetic suction member 301 is used to absorb metal foreign matter on the surface to be cleaned of the substrate; a second cleaning component 40, located in the second cleaning station B, the second cleaning component 40 includes an air outlet 402, and the air outlet 402 can spray airflow to remove foreign matter on the surface to be cleaned of the substrate.

[0050] The bracket 10 includes a first bracket 101 and a second bracket 102, which can be fixedly connected to ensure that they have a consistent working reference. The first bracket 101 is used to support the first cleaning assembly 30 and the second cleaning assembly 40, and the second bracket 102 is used to support the carrier 20.

[0051] Optionally, both the first bracket 101 and the second bracket 102 may be made of materials having certain supporting properties, such as metal materials.

[0052] In order to ensure the compact structure of the substrate cleaning device 01, the first bracket 101 can be a plate-shaped structure to reduce the space occupied by the first bracket 101. The second bracket 102 is located at the bottom of the carrier platform 20 and is movably connected to the carrier platform 20 so that the carrier platform 20 can move on the second bracket 102.

[0053] The support 10 has a first cleaning station A and a second cleaning station B, and the first cleaning station A and the second cleaning station B can be arranged at intervals along a straight line or along a curve. The first cleaning station A and the second cleaning station B are not limited in the order of station arrangement, that is, the first cleaning station A can be the station before the second cleaning station B, and the first cleaning station A can be the station after the second cleaning station B. In this way, when the carrier 20 moves relative to the support 10, it can drive the substrate to pass through the first cleaning station A first and then the second cleaning station B. The carrier 20 can also drive the substrate to pass through the second cleaning station B first and then the first cleaning station A.

[0054] Optionally, the support platform 20 may be roughly circular, rectangular, linear, etc.

[0055] The carrier 20 is provided with a plurality of carriers 201 for carrying substrates, each carrier 201 being used to carry one substrate to ensure that the substrate is stably placed during the cleaning process to prevent the substrate from shaking or sliding. The carrier 201 can be in the form of a groove, a clamp or other forms to accommodate substrates of different sizes and shapes.

[0056] The carrier 20 can controllably move relative to the second bracket 102 to drive the substrate to move to complete the cleaning process of the substrate. The carrier 20 can rotate relative to the second bracket 102 or make linear motion relative to the second bracket 102 .

[0057] The carrier 20 can drive the substrate to move along a preset path. For example, when the carrier 20 rotates relative to the second bracket 102, the moving path of the substrate can be curved, and when the carrier 20 moves linearly relative to the second bracket 102, the moving path of the substrate can be linear.

[0058] The moving path of the substrate driven by the carrier 20 is adapted to the arrangement of the first cleaning station A and the second cleaning station B, so as to ensure that the carrier 20 can pass through the first cleaning station A and the second cleaning station B during the movement.

[0059] Optionally, there may be multiple carriers 201 , so that the substrate cleaning device 01 can perform cleaning operations on multiple substrates to improve the cleaning efficiency of the substrate cleaning device 01 .

[0060] like Figure 2 , Figure 2 A schematic diagram of the structure of the first cleaning station A and the second cleaning station B of the second cleaning assembly 40 provided in an embodiment of the present application. The first cleaning assembly 30 is located in the first cleaning station A, and the second cleaning assembly 40 is located in the second cleaning station B. The first cleaning assembly 30 and the second cleaning assembly 40 are installed on the first bracket 101. The first cleaning assembly 30 is used to magnetically absorb metal foreign matter on the substrate carried by the carrier 20, and the second cleaning assembly 40 sprays high-pressure gas through the gas outlet 402 to remove loose non-metallic foreign matter on the surface of the substrate. The carrier 20 can drive the substrate to move through the first cleaning station A and the second cleaning station B, so that the first cleaning assembly 30 and the second cleaning assembly 40 can clean the substrate carried by the carrier 20.

[0061] Specifically, the first cleaning component 30 includes a magnetic suction member 301, which is used to perform magnetic suction cleaning on the substrate. The magnetic suction member 301 can achieve the purpose of adsorbing metal foreign matter on the substrate. The metal foreign matter adsorbed by the magnetic suction member 301 may include: metal powder and metal particles produced by iron, cobalt, nickel and their alloys. Optionally, the magnetic suction member 301 can be made of any material of neodymium iron boron magnet, permanent magnet, and ferrite magnet.

[0062] The number of magnetic parts mainly depends on the specific conditions of the substrate to be cleaned. For example, larger substrates require more magnetic parts to ensure the coverage of the magnetic parts. In the case where the uneven distribution of metal foreign matter leads to the existence of cleaning dead corners, the number of magnetic parts can be increased accordingly according to actual needs, that is, one magnetic part can be configured for one substrate for magnetic cleaning, or multiple magnetic parts can be configured for one substrate for magnetic cleaning, or one magnetic part can be used to clean multiple substrates at the same time. Therefore, this embodiment does not specifically limit the number of magnetic parts.

[0063] Optionally, the movement rhythm of the carrier 20 can meet the cleaning needs of different numbers of substrates in one movement. In this way, the carrier 20 can drive multiple substrates to enter the first cleaning station A or the second cleaning station B synchronously through one movement rhythm. One or more magnetic suction parts work together to absorb and remove metal dust, metal particles and other metal foreign matter on the multiple substrates to ensure the high cleanliness of the substrate surface. This embodiment does not limit the number of substrates entering the first cleaning station A or the second cleaning station B at one time.

[0064] Correspondingly, the number of air outlets 402 of the second cleaning component 40 can match the number of substrates that synchronously enter the second cleaning station B to cooperate with the movement rhythm of the carrier table 20, ensuring that the carrier table 20 completes one movement rhythm and can drive multiple substrates to synchronously arrive at the second cleaning station B to remove non-metallic foreign matter through the corresponding number of air outlets 402.

[0065] The gas outlet 402 of the second cleaning component 40 is used to eject high-pressure gas to remove non-metallic foreign matter on the surface of the substrate, such as dust particles, grease stains, and some loose attachments. These foreign matter are often blown away from the surface of the substrate by the ejection of high-pressure gas, thereby achieving the purpose of cleaning the substrate. The gas ejected from the gas outlet 402 can be an inert gas such as nitrogen, argon, etc., which is not limited in this embodiment.

[0066] Thus, the substrate cleaning device 01 provided in the embodiment of the present application realizes the classification and processing of foreign matter on the surface of the substrate by configuring the first cleaning component 30 and the second cleaning component 40. The first cleaning component 30 removes metal foreign matter by magnetic attraction, while the second cleaning component 40 removes non-metallic foreign matter by high-pressure gas jet. During the continuous movement of the carrier 20, the substrate cleaning device 01 can remove multiple foreign matter at one time, thereby improving the automation level and efficiency of substrate cleaning.

[0067] For further information, see Figure 3 and Figure 4 As shown, Figure 3 One of the partial exploded structural schematic diagrams of the substrate cleaning device 01 is provided for the embodiment of the present application; Figure 4One of the structural schematic diagrams of the magnetic member 301 and the support member 302 of the substrate cleaning device 01 provided in the embodiment of the present application. The first cleaning component 30 includes: a support member 302, at least one magnetic member 301 is arranged on the support member 302, and at least one magnetic member 301 is located between the support member 302 and the carrier 20; a mounting member 303, connected to the support member 302, and the mounting member 303 is adjustably arranged on the first bracket 101 to adjust the distance between the magnetic member 301 on the support member 302 and the carrier 20.

[0068] It can be understood that the support member 302 is a carrier of the magnetic member 301, and the support member 302 is used to fix the magnetic member 301 above the carrier 20. The magnetic member 301 is located between the support member 302 and the carrier 20. By adjusting the position of the support member 302 relative to the second bracket 102, the magnetic member 301 can be as close to the substrate surface as possible, thereby enhancing the attraction of the magnetic member 301 to metal foreign matter without damaging the substrate, so that tiny or deeply embedded metal particles can also be adsorbed, thereby achieving the purpose of improving the cleaning effect of the substrate cleaning device 01.

[0069] The support member 302 can ensure that the magnetic member 301 will not loosen or fall off during operation. The support member 302 can be installed on the first bracket 101 through the mounting member 303. The mounting member 303 is adjustably mounted on the first bracket 101. This connection method allows the mounting member 303 to move within a certain range, thereby driving the movement of the support member 302, so as to adjust the distance between the magnetic member 301 on the support member 302 and the carrier 20.

[0070] As the magnetic cleaning proceeds, the accumulation of metal foreign matter on the surface of the magnetic component 301 may weaken the magnetic component 301's ability to adsorb subsequent metal foreign matter, and reduce the actual distance between the magnetic component 301 and the substrate, causing interference between the magnetic component 301 and the substrate. The interference between the magnetic component 301 and the substrate may damage the surface of the substrate and may also cause damage to the magnetic component 301 itself. The mounting member 303 is adjustably mounted on the first bracket 101, and can adjust the distance between the magnetic component 301 and the substrate when metal foreign matter accumulates on the surface of the magnetic component 301, thereby preventing the adverse effects caused by the accumulation of metal foreign matter. Therefore, when the accumulation of metal foreign matter reaches a certain level, it is necessary to adjust the distance between the magnetic component 301 and the carrier 20 to clean the magnetic component 301.

[0071] In addition, different substrates have different thicknesses. By adjusting the distance between the magnetic element 301 and the carrier 20 by the mounting element 303, the substrate cleaning device 01 can adapt to and clean substrates of different specifications. Figure 4As shown, there are multiple magnetic elements 301 , which are arranged at intervals along the moving path of the substrate. The distance between two adjacent magnetic elements 301 is equal to the distance between two adjacent bearing portions 201 , and one magnetic element 301 corresponds to one bearing portion 201 .

[0072] The arrangement of the magnetic members 301 in the first cleaning assembly 30 can be set according to the arrangement of the bearing parts 201 on the bearing platform 20. For example, the magnetic members 301 can be arranged in a circle or in a straight line. The arrangement of the magnetic members 301 is used for each bearing part 201 entering the first cleaning station A to correspond to a magnetic member 301 after the bearing platform 20 works according to the moving beat, so as to ensure the cleaning effect of the substrate cleaning device 01 during the movement of the bearing platform 20.

[0073] Optionally, the shape of each magnetic element 301 can be adapted to the shape of the substrate, so as to ensure that the magnetic element 301 can perform comprehensive magnetic cleaning on the substrate.

[0074] In order to achieve the adjustable distance between the support member 302 and the carrier platform 20, so as to adjust the distance between the magnetic member 301 and the substrate, in some embodiments, as Figure 5 As shown, Figure 5 One of the structural schematic diagrams of the mounting member 303 of the substrate cleaning device 01 provided in the embodiment of the present application, the mounting member 303 can be movably arranged on the first bracket 101, and the mounting member 303 can slide relative to the first bracket 101 along a first direction, and the first direction is the arrangement direction of the support member 302 and the carrier platform 20. The first cleaning component 30 also includes: an adjusting member 304, the adjusting member 304 can adjust the relative position of the mounting member 303 and the first bracket 101 along the first direction; a limiting member 305, the limiting member 305 can limit the mounting member 303 to the first bracket 101, so as to limit the mounting member along a second direction, and the second direction is perpendicular to the first direction.

[0075] The mounting member 303 is movably disposed on the first bracket 101. By sliding the mounting member 303 relative to the first bracket 101 along the first direction, the distance between the magnetic member 301 and the supporting platform 20 can be adjusted to avoid excessive metal foreign matter adsorbed by the magnetic member 301 and interference with the supporting platform 20, or the distance between the magnetic member 301 and the supporting platform 20 is too large, resulting in a decrease in the effect of adsorbing foreign matter.

[0076] In some embodiments, the adjusting member may be a threaded adjusting member, which changes the relative position between the mounting member and the first bracket through the thread. The adjusting member may also include a slide rail and a slider, and the relative position between the mounting member and the first bracket is adjusted by adjusting the position of the slider on the slide rail.

[0077] The position limiting member 305 can limit the mounting member 303 on the first bracket 101, preventing the mounting member 303 from moving in a second direction perpendicular to the first direction. The position limiting member 305 can be a bolt or a locking pin, or other structural members that can form a position limit, which is not limited in this embodiment.

[0078] As an alternative implementation, see Figure 5 The mounting member 303 includes a receiving groove 3031, which extends along the first direction. The end of the first bracket 101 extends into the receiving groove 3031. The length of the first bracket 101 extending into the receiving groove 3031 is adjustable so that the mounting member 303 slides relative to the first bracket 101 along the first direction.

[0079] The receiving groove 3031 is provided on the mounting member 303, and is used to cooperate with the end of the first bracket 101, so as to ensure the relative position and direction of the mounting member 303 on the first bracket 101, and to prevent the first bracket 101 from being offset or shaken by external forces during installation or use. In the process of hanging the mounting member 303 on the first bracket 101 through the receiving groove 3031, the receiving groove 3031 and the end of the first bracket 101 can be matched to perform preliminary limiting. Since the length of the first bracket 101 extending into the receiving groove 3031 is adjustable, the mounting member 303 can slide along the first direction relative to the first bracket 101, so as to achieve the purpose of adjusting the relative position of the mounting member 303 and the first bracket 101.

[0080] Further, such as Figure 5 As shown, the mounting member 303 is provided with an adjustment hole 3032 which is connected to the receiving groove 3031, the adjustment member 304 extends along the first direction and extends into the receiving groove 3031 through the adjustment hole 3032, and the end of the adjustment member 304 abuts against the first bracket 101; the adjustment member 304 and the adjustment hole 3032 are rotatably matched to adjust and fix the length of the adjustment member 304 extending into the receiving groove 3031, thereby adjusting the relative position of the mounting member 303 and the first bracket 101 along the first direction.

[0081] The mounting member 303 is provided with an adjustment hole 3032 connected with the receiving groove 3031, and the adjustment hole 3032 enables the adjustment member 304 to extend into the receiving groove 3031 and abut against the first bracket 101. Since the end of the adjustment member 304 abuts against the first bracket 101, as the adjustment member 304 moves, the distance between the end of the adjustment member 304 and the first bracket 101 changes, so that the receiving groove 3031 of the mounting member 303 slides relative to the first bracket 101, thereby changing the relative position between the mounting member 303 and the first bracket 101, so that the relative position between the mounting member 303 and the first bracket 101 can move along the first direction.

[0082] As an optional implementation, the inner wall of the adjustment hole 3032 is formed with a first thread, and the outer surface of the adjustment member 304 is formed with a second thread.

[0083] The inner wall of the adjustment hole 3032 is processed with a first thread, and the outer surface of the adjustment member 304 is processed with a second thread matching the first thread. The matching threads realize the rotational cooperation between the adjustment member 304 and the adjustment hole 3032. By rotating the adjustment member 304, the adjustment member 304 can be moved in the first direction in the adjustment hole 3032 by utilizing the interaction of the threads. When the desired position is reached, the rotation of the adjustment member 304 is stopped. At this time, due to the locking effect of the threads, the adjustment member 304 will remain in the current position, and the relative position between the mounting member 303 and the first bracket 101 is fixed by the bottom of the adjustment member 304 abutting against the first bracket 101.

[0084] Please note that Figure 5 The mounting member 303 further includes a limiting portion 3036 , which abuts against a side wall of the first bracket 101 to limit the movement of the mounting member 303 relative to the first bracket 101 along a second direction perpendicular to the first direction.

[0085] It can be understood that the limiting portion 3036 forms a limiting constraint by abutting against the side wall of the first bracket 101, and the mutual cooperation between the limiting portion 3036 and the limiting member 305 can prevent the mounting member 303 from moving along the second direction when subjected to external force.

[0086] As an alternative implementation, see Figure 6 and Figure 7 , Figure 6 The second structural schematic diagram of the mounting member 303 of the substrate cleaning device 01 provided in the embodiment of the present application; Figure 7 The second partial exploded structural diagram of the substrate cleaning device 01 provided in the embodiment of the present application. The mounting member 303 is provided with a waist-shaped hole 3037 extending along the first direction, and the limiting member 305 passes through the waist-shaped hole 3037 and is fixed to the first bracket 101 .

[0087] The waist-shaped hole 3037 is provided on the mounting member 303 and extends along the first direction, providing sufficient adjustment space for the mounting member 303 to move along the first direction. In the process of adjusting the position of the mounting member 303, the space reserved by the waist-shaped hole 3037 allows the mounting member 303 to move relative to the first bracket 101 along the first direction within a certain range, so that the position of the mounting member 303 can be adjusted by operating the adjustment member 304 without adjusting other structures.

[0088] The first bracket 101 is provided with a mounting hole 103 corresponding to the limiting member 305. The limiting member 305 passes through the waist-shaped hole on the mounting member 303 and cooperates with the mounting hole 103 on the first bracket 101. Through the cooperation between the limiting member 305 and the mounting hole 103, the mounting member 303 can be limited on the first bracket 101 along the second direction, thereby limiting the movement of the mounting member 303 relative to the first bracket 101 along the second direction.

[0089] As an optional implementation, please refer to Figure 2 A guide member 104 is provided on the first bracket 101, and the mounting member 303 also includes a slide groove 3033. The guide member 104 extends into the slide groove 3033, and the guide member 104 and the slide groove 3033 are slidably matched to guide the mounting member 303 when adjusting its relative position relative to the first bracket 101.

[0090] The guide member 104 extends into the slide groove 3033 of the mounting member 303 to form a sliding fit. The fit between the guide member 104 and the slide groove 3033 provides a path and direction for the movement of the mounting member 303, ensuring that when the mounting member 303 is adjusted in the first direction, it can slide to the desired position along the predetermined path under the guidance of the guide member 104, thereby preventing the mounting member 303 from deflecting, shaking or being unstable during the movement in the first direction. Optionally, the guide member 104 may be a pin, a stud or a screw.

[0091] Optionally, see Figure 2 The first cleaning component 30 also includes a fastener 306 , and the mounting member 303 and the supporting member 302 are detachably connected via the fastener 306 .

[0092] The fastener 306 is used to connect the mounting member 303 and the support member 302 together, ensuring stable contact between the two components and preventing loosening or separation due to factors such as vibration and impact during use. The fastener 306 fixes the mounting member 303 and the support member 302 by passing through the corresponding mounting holes 103 on the mounting member 303 and the support member 302. The fastener 306 can be a bolt, a screw, or any possible fixing locking mechanism, which is not limited in this embodiment.

[0093] When too much metal foreign matter accumulates on the magnetic member 301 during cleaning, or the adsorption force of the magnetic member 301 is weakened due to long-term use, the mounting member 303 and the support member 302 are detachably connected by the fastener 306 to simplify the maintenance process, and it is convenient to disassemble the support member 302 for quick replacement or cleaning of the magnetic member 301. Alternatively, the magnetic member 301 can be detachably connected to the support member 302, and the support member 302 can be removed from the mounting member 303 to facilitate the replacement of the magnetic member 301.

[0094] In some embodiments, see Figure 8 , Figure 8 The second structural schematic diagram of the magnetic attraction member 301 and the support member 302 of the substrate cleaning device 01 provided in the embodiment of the present application. The mounting member 303 includes a support portion 3034, and the support portion 3034 is provided with one of a limiting hole 3035 or a limiting column 3022; the support member 302 is provided with a limiting hole 3035 or the other of the limiting column 3022 on one side facing the support portion 3034, and the limiting column 3022 extends along a first direction, and the limiting hole 3035 and the limiting column 3022 are limitedly matched along a second direction perpendicular to the first direction.

[0095] The mounting member 303 includes a support portion 3034, on which a limiting hole 3035 or a limiting column 3022 is provided, that is, if the limiting hole 3035 is provided on the support portion 3034, the limiting column 3022 is provided on the support member 302, and vice versa, thereby ensuring that the two are accurately docked and firmly installed. The limiting hole 3035 and the limiting column 3022 are used in combination so that the mounting member 303 can be easily aligned to a predetermined position when connected to the support member 302, reducing the adjustment work during the installation process and improving the installation efficiency and accuracy.

[0096] The limiting hole 3035 and the limiting column 3022 are limitedly matched along a second direction perpendicular to the first direction, preventing the mounting member 303 and the supporting member 302 from shifting or shaking in the first direction, ensuring that the mounting member 303 and the supporting member 302 can remain stable during use.

[0097] As an alternative implementation, see Figure 8 A surface of the support member 302 facing the support portion 3034 is provided with an avoidance groove 3021 adapted to the support portion 3034 , and the limiting hole 3035 or the limiting column 3022 is located in the avoidance groove 3021 .

[0098] The avoidance groove 3021 is arranged on the support part 3034, and the avoidance groove 3021 provides space for the arrangement of the limiting hole 3035 or the limiting column 3022, so that the limiting hole 3035 or the limiting column 3022 can be embedded in the support member 302 without interfering with other parts of the support member 302, which helps to achieve the connection between the mounting member 303 and the support member 302. The avoidance groove 3021 is used in conjunction with the limiting hole 3035 or the limiting column 3022 to prevent the support member 302 from deviating from the normal installation position during the installation of the mounting member 303 with the support member 302.

[0099] In some embodiments, please refer to Figure 1The first cleaning station A includes at least two first cleaning sub-stations A1, and at least two first cleaning sub-stations A1 are located on both sides of the second cleaning station B; the first cleaning components 30 are at least two groups, and at least two groups of first cleaning components 30 are respectively located in one first cleaning sub-station A1.

[0100] By dividing the first cleaning station A into a plurality of first cleaning substations A1 and equipping corresponding cleaning components, multiple cleaning tasks can be performed in parallel, and the parallel processing of the plurality of first cleaning substations A1 can shorten the cleaning time and improve the cleaning efficiency. The design of the plurality of first cleaning substations A1 and the plurality of first cleaning components 30 can be adjusted according to the actual situation and the arrangement of the bearing part 201 on the bearing platform 20. As the cleaning demand increases, more first cleaning substations A1 and first cleaning components 30 can be added on the existing basis to further improve the cleaning efficiency and cleaning effect of the substrate cleaning device 01.

[0101] As an optional implementation, Fig. 9 As shown, Fig. 9 A schematic diagram of the structure of the second cleaning component 40 of the substrate cleaning device 01 provided in an embodiment of the present application. A cleaning head 401 is arranged on the first bracket 101, and the cleaning head 401 includes an air passage connected to an air source and an air outlet 402, and the air outlet 402 is arranged on the adsorption surface of the cleaning head 401; an air return port 403 is arranged on the adsorption surface, and the air return port 403 is used to connect an air suction device.

[0102] The cleaning head 401 is arranged in the second cleaning station B. The cleaning head 401 is connected to the air source through the air duct. The air outlet 402 releases high-pressure gas or airflow on the adsorption surface to blow the cleaned surface on the substrate to remove dust, debris and other foreign matter on the surface of the substrate.

[0103] Furthermore, the cleaning head 401 also includes an air return cavity 404 , and the air outlet 402 is at least partially located in the air return cavity 404 . Foreign matter blown up by the air outlet can be collected in the air return cavity 404 and swirl in the air return cavity 404 .

[0104] The air return port 403 is connected to the air return cavity 404, and the air return port 403 is arranged on the cleaning head 401. The air return port 403 is connected to the suction device to form a negative pressure area, so as to suck in and collect the foreign matter blown off the substrate, and suck away the foreign matter through the suction device, thereby realizing the blowing and suction combination of the cleaning head 401.

[0105] As an alternative implementation, see Fig. 9 There are multiple air return ports 403 , and the multiple air return ports 403 surround the air outlet 402 .

[0106] Multiple air return ports 403 are arranged around the air outlet 402. The multiple air return ports 403 can suck foreign matter into the air return ports 403 and collect it while the air outlet 402 is blowing foreign matter on the substrate, thereby improving the cleaning efficiency of the foreign matter removal mechanism. Multiple air return ports 403 can cover a wider area and reduce the occurrence of leakage. The arrangement of multiple air return ports 403 around the air outlet 402 helps to balance the airflow pressure in the cleaning head 401 and reduce the eddy current or turbulence caused by uneven airflow distribution in the cleaning head 401.

[0107] It should be noted that the substrate cleaning device 01 further includes: a driving device, which can drive the carrier 20 to rotate relative to the second bracket 102 to drive the substrate carried on the carrier 20 to pass through the first cleaning station A and the second cleaning station B.

[0108] The driving device can drive the carrier 20 to move relative to the second bracket 102. Among them, the above-mentioned driving device can be a motor, a cylinder or other possible driving parts, which is not limited in this embodiment. By driving and controlling the driving carrier 20 to move, the carrier 20 can drive the substrate in the bearing part 201 to move according to a predetermined path and speed, thereby ensuring that the substrate can pass through the first cleaning station A and the second cleaning station B to complete the entire cleaning process. Furthermore, the driving device can ensure that the substrate completes the cleaning process without manual operation, thereby improving the cleaning efficiency. The setting position of the driving device can be adjusted according to actual production needs, which is not limited in this embodiment.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A substrate cleaning device, characterized in that: include: A bracket, comprising a first cleaning station and a second cleaning station; A carrying platform, movably disposed on the support, a plurality of carrying parts for carrying substrates are disposed on the carrying platform, and the carrying platform can be controllably moved relative to the support to drive the substrate to pass through the first cleaning station and the second cleaning station; A first cleaning component is located at the first cleaning station, and the first cleaning component includes a magnetic suction component, and the magnetic suction component is used to absorb metal foreign matter on the surface to be cleaned of the substrate; The second cleaning component is located at the second cleaning station, and the second cleaning component comprises an air outlet, and the air outlet can spray air flow to remove foreign matter on the surface to be cleaned of the substrate.

2. The substrate cleaning device according to claim 1, characterized in that: The first cleaning component comprises: A support member, at least one of the magnetic members is disposed on the support member, and at least one of the magnetic members is located between the support member and the supporting platform; The mounting member is connected to the supporting member, and the mounting member is adjustably arranged on the bracket to adjust the distance between the magnetic attraction member on the supporting member and the bearing platform.

3. The substrate cleaning device according to claim 2, characterized in that: There are multiple magnetic elements, which are arranged at intervals along the moving path of the substrate. The distance between two adjacent magnetic elements is equal to the distance between two adjacent bearing parts. One magnetic element corresponds to one bearing part.

4. The substrate cleaning device according to claim 2, characterized in that: The mounting member is movably disposed on the bracket, and the mounting member can slide relative to the bracket along a first direction, wherein the first direction is an arrangement direction of the support member and the carrier platform, and the first cleaning component further includes: an adjusting member, wherein the adjusting member is capable of adjusting the relative position of the mounting member and the bracket along the first direction; A limiting member, wherein the limiting member can limit the mounting member on the bracket to limit the mounting member along a second direction, wherein the second direction is perpendicular to the first direction.

5. The substrate cleaning device according to claim 4, characterized in that: The mounting member comprises a receiving groove extending in a first direction, the end of the bracket extending into the receiving groove, and the length of the bracket extending into the receiving groove is adjustable so that the mounting member slides relative to the bracket in the first direction.

6. The substrate cleaning device according to claim 5, characterized in that: The mounting member is provided with an adjustment hole connected with the receiving groove, the adjustment member extends along the first direction and extends into the receiving groove through the adjustment hole, and the end of the adjustment member abuts against the bracket; The adjusting member is rotatably matched with the adjusting hole to adjust and fix the length of the adjusting member extending into the receiving groove, thereby adjusting the relative position of the mounting member and the bracket along the first direction.

7. The substrate cleaning device according to claim 6, characterized in that: The inner wall of the adjusting hole is formed with a first thread, and the outer surface of the adjusting member is formed with a second thread.

8. The substrate cleaning device according to claim 4, characterized in that: The mounting member further includes a limiting portion, which abuts against a side wall of the bracket to limit the movement of the mounting member relative to the bracket along a second direction perpendicular to the first direction.

9. The substrate cleaning device according to claim 8, characterized in that: The mounting member is provided with a waist-shaped hole extending along the first direction, and the limiting member passes through the waist-shaped hole and is fixed to the bracket.

10. The substrate cleaning device according to claim 4, characterized in that: The bracket is provided with a guide member, and the mounting member further comprises a slide groove, into which the guide member extends, and the guide member and the slide groove are slidably matched to guide the mounting member when adjusting its relative position relative to the bracket.

11. The substrate cleaning device according to claim 4, characterized in that: The first cleaning component also includes a fastener, and the mounting member and the supporting member are detachably connected via the fastener.

12. The substrate cleaning device according to claim 4, characterized in that: The mounting member comprises a supporting portion, and the supporting portion is provided with one of a limiting hole or a limiting column; The support member is provided with the other of the limiting hole or the limiting column on one side facing the supporting portion, the limiting column extends along the first direction, and the limiting hole and the limiting column are limitedly matched along a second direction perpendicular to the first direction.

13. The substrate cleaning device according to claim 12, characterized in that: The surface of the support member facing the support portion is provided with an avoidance groove adapted to the support portion, and the limiting hole or the limiting column is located in the avoidance groove.

14. The substrate cleaning device according to any one of claims 1 to 13, characterized in that: The first cleaning station includes at least two first cleaning sub-stations, and the at least two first cleaning sub-stations are located on both sides of the second cleaning station; The first cleaning components include at least two groups, and the at least two groups of the first cleaning components are respectively located in one of the first cleaning sub-stations.

15. The substrate cleaning device according to any one of claims 1 to 13, characterized in that: The second cleaning component comprises: A cleaning head, arranged on the bracket, the cleaning head comprising an air passage connected to an air source and the air outlet, the air outlet being arranged on the adsorption surface of the cleaning head; An air return port is arranged on the adsorption surface, and the air return port is used to connect to an air suction device.

16. The substrate cleaning device according to claim 15, characterized in that: There are multiple air return ports, and the multiple air return ports surround the air outlet.

17. The substrate cleaning device according to any one of claims 1 to 13, characterized in that: The substrate cleaning device further comprises: A driving device, wherein the driving device can drive the carrying platform to rotate relative to the bracket, so as to drive the substrate carried on the carrying platform to pass through the first cleaning station and the second cleaning station.

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